Silicon wafer feeding device

Abstract

The utility model provides a silicon wafer feeding device which comprises a machine table, a feeding conveying module, a transplanting workbench and a discharging conveying module are connected to the upper side of the machine table, and the feeding conveying module and the discharging conveying module are arranged at the two ends of the transplanting workbench respectively. The transplanting workbench comprises a first moving platform and a second moving platform. The first moving platform, the second moving platform and the machine table are in driving connection through a driving module. The driving module comprises a left-right driving module and a vertical driving module, the left-right driving module is in driving connection with the vertical driving module, and the vertical driving module is in driving connection with the transplanting workbench. According to the utility model, silicon wafers are automatically fed into the roll coating device for roll coating and are automatically sent out after roll coating, personnel contact is avoided, the whole feeding process is automatic, the silicon wafers are prevented from being polluted, and the two moving platforms alternately feed and roll coating, so that the working efficiency of the feeding platform is improved, and the utilization rate of equipment is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer processing, and particularly relates to a silicon wafer feeding device. Background Art

[0002] During the silicon wafer processing, it is crucial to avoid damaging the silicon wafer. Any damage to the silicon wafer surface will directly affect the performance of the final product. At the same time, the mechanical force exerted on the silicon wafer during processing will reduce the mechanical strength of the silicon wafer, causing the silicon wafer to crack or break during subsequent processing and reducing the yield. Avoiding silicon wafer damage and reducing the mechanical force on the silicon wafer during the wafer loading process are important factors in silicon wafer processing.

[0003] Therefore, the above problems need to be solved urgently. Summary of the Utility Model

[0004] Purpose of the utility model: To overcome the above deficiencies, the utility model provides a silicon wafer feeding device, which realizes automatic wafer loading, avoids damaging the silicon wafer, and improves the performance of the final product. The feeding is stable, reducing the mechanical force on the silicon wafer, ensuring the mechanical strength of the silicon wafer, avoiding cracking or breaking of the silicon wafer during subsequent processing, and improving the product quality of the silicon wafer.

[0005] Technical solution: To achieve the above object, the utility model provides a silicon wafer feeding device, which includes a machine table. An upper feeding conveyor module, a transplanting workbench, and an outgoing material transmission module are connected to the upper side of the machine table. The upper feeding conveyor module and the outgoing material transmission module are respectively arranged at both ends of the transplanting workbench. The upper feeding conveyor module transports the silicon wafers to the top surface of the transplanting workbench, and the transplanting workbench transplants the silicon wafers to the outgoing material transmission module for discharging. The transplanting workbench includes a first moving platform and a second moving platform. The first moving platform, the second moving platform, and the machine table are drivingly connected through a driving module. The above driving module includes a left-right driving module and a vertical driving module. The left-right driving module and the vertical driving module are drivingly connected. The vertical driving module and the transplanting workbench are drivingly connected. The left-right driving module drives the first moving platform and the second moving platform to move left and right respectively. The vertical driving module drives the first moving platform and the second moving platform to move up and down respectively. A plurality of first avoidance grooves are provided on the top surface of the first moving platform. A plurality of second avoidance grooves are provided on the top surface of the second moving platform. During the roll coating process of the silicon wafers, in order to avoid the silicon wafers being contaminated by pollutants such as dust and oil stains, which may affect the subsequent processes, it is usually necessary to place the silicon wafers in a closed space for roll coating. An automatic feeding and discharging device is required. In this device, the silicon wafers are placed above the upper feeding conveyor module. The left-right driving module drives the first moving platform in the transplanting workbench to move towards the upper feeding conveyor module. The upper feeding conveyor module transports the silicon wafers to the first moving platform. The left-right driving module drives the first moving platform to move below the coating roller for roll coating. At this time, the vertical driving module drives the second moving platform to descend. When the second moving platform is lower than the first moving platform to ensure that there is no interference between the two, the left-right driving module drives the second moving platform to abut against the upper feeding conveyor module, and the upper feeding conveyor module transports the silicon wafers to the second moving platform. At the same time, the roll coating of the silicon wafers on the upper side of the first moving platform is completed. The left-right driving module drives the first moving platform to abut against the outgoing material transmission module to send out the silicon wafers. The second moving platform moves below the coating roller for roll coating. The first moving platform descends and moves to the upper feeding conveyor module to receive the silicon wafers, and so on. The utility model realizes automatically feeding the silicon wafers into the roll coating device for roll coating, and automatically sending out the silicon wafers after the roll coating is completed, avoiding human contact, making the feeding process fully automated, avoiding the silicon wafers being contaminated, and the two moving platforms alternately feed and roll coat, improving the working efficiency of the feeding platform and the equipment utilization rate.

[0006] Further, in the above-mentioned silicon wafer feeding device, there are two left-right driving modules, which are respectively arranged on both sides of the machine table. The left-right driving module includes a horizontal guide rail, a horizontal moving frame slidably connected to the horizontal guide rail, a horizontal driving motor, and a horizontal driving lead screw. There are multiple horizontal guide rails, and the horizontal guide rails are horizontally and fixedly connected to the side wall of the machine table. The horizontal driving motor is connected to the side wall of the machine table, and the horizontal driving motor is drivingly connected to the horizontal driving lead screw. The horizontal driving lead screw is drivingly connected to the horizontal moving frame. The horizontal driving motor drives the horizontal driving lead screw to rotate, and the horizontal driving lead screw drives the horizontal moving frame to slide left and right along the horizontal guide rail. The horizontal moving frame is connected to the vertical driving module.

[0007] Further, in the above-mentioned silicon wafer feeding device, the vertical driving module and the left-right driving module are correspondingly arranged. The vertical driving module includes a vertical guide rail vertically fixed to the horizontal moving frame, a vertical moving frame slidably connected to the vertical guide rail, a vertical driving motor and a vertical driving lead screw connected to the horizontal moving frame. The vertical driving motor is drivingly connected to the vertical driving lead screw, and the vertical driving lead screw is drivingly connected to the vertical moving frame. The vertical driving motor drives the vertical driving lead screw to rotate, and the vertical driving lead screw drives the vertical moving frame to slide along the vertical guide rail. The vertical moving frame is connected to the transplanting workbench.

[0008] Further, in the above-mentioned silicon wafer feeding device, the loading conveyor module includes a conveying mechanism and a loading mechanism. The conveying mechanism and the loading mechanism are arranged adjacent to each other in a straight line. The conveying mechanism transports the silicon wafers to the loading mechanism, and the loading mechanism feeds the silicon wafers onto the transplanting workbench. There are two parallel conveying mechanisms, and guide wheels are respectively arranged on both sides of the conveying mechanism. There are two parallel loading mechanisms, and guide wheels are respectively arranged on both sides of the loading mechanism.

[0009] Further, in the above-mentioned silicon wafer feeding device, the conveying mechanism includes a conveying machine frame. There are two or more conveying machine frames. V-shaped conveying roller groups are respectively connected to both sides of the conveying machine frame. The V-shaped conveying roller groups are drivingly connected to a conveying motor, and the conveying motor is connected to the conveying machine frame. A conveyor belt passes through the V-shaped conveying roller groups. An adjustable roller is provided in the V-shaped conveying roller group, and the adjustable roller is adjustably connected to the conveying machine frame. The adjustable roller can adjust the tension of the conveyor belt. During feeding, the silicon wafers are placed on the upper side of the conveyor belt. The conveying motor drives the V-shaped conveying roller groups to rotate, and the V-shaped conveying roller groups drive the conveyor belt to rotate. The silicon wafers are sent to the upper side of the loading mechanism by the conveyor belt.

[0010] Further, in the above-mentioned silicon wafer feeding device, the loading mechanism includes a loading frame. There are two or more loading frames, and the loading frames and the transfer frame are arranged correspondingly. V-shaped loading roller groups and horizontal loading roller groups are respectively arranged on both sides of the loading frame. The horizontal loading roller group includes a first loading roller arranged on the side of the loading frame away from the transplanting workbench and a second loading roller arranged at one end of the loading support arm close to the transplanting workbench. A loading motor is connected to the loading frame, and the loading motor is drivingly connected to the V-shaped loading roller group. A loading support arm is arranged on the side of the loading frame close to the transplanting workbench. During feeding, the loading support arm extends into the first avoidance groove or the second avoidance groove. The V-shaped loading roller group and the horizontal loading roller group are provided with loading conveyor belts. The V-shaped loading roller group is provided with adjustable rollers, and the adjustable rollers and the transfer frame are adjustably connected, and the adjustable rollers adjust the tension of the conveyor belt. During feeding, the loading support arm extends into the first avoidance groove or the second avoidance groove, and the loading motor drives the V-shaped loading roller group to rotate, thereby driving the loading conveyor belt. The loading conveyor belt conveys the silicon wafers to the upper side of the transplanting workbench. The transplanting workbench moves upward under the drive of the vertical drive module, and the silicon wafers are supported by the transplanting workbench. The transplanting workbench moves out under the drive of the left and right drive modules, and the loading support arm disengages from the first avoidance groove or the second avoidance groove. The transplanting workbench moves to the lower side of the coating roller for roller coating. The transfer of the silicon wafers from the loading conveyor belt to the transplanting workbench is stable, and the mechanical force on the silicon wafers is small, reducing the mechanical strength of the silicon wafers and improving the quality of the silicon wafers.

[0011] Further, in the above-mentioned silicon wafer feeding device, the discharging transmission module includes a discharging mechanism and a transmission mechanism. The discharging mechanism and the transmission mechanism are arranged adjacent to each other in a straight line, and the discharging mechanism transfers the silicon wafers from the transplanting workbench to the transmission mechanism for discharging. There are two discharging mechanisms arranged in parallel, and guide wheels are respectively arranged on both sides of the discharging mechanism. There are two transmission mechanisms arranged in parallel, and guide wheels are respectively arranged on both sides of the transmission mechanism.

[0012] Furthermore, in the above-mentioned silicon wafer feeding device, the discharging mechanism includes a discharging frame, and there are two or more discharging frames, which are arranged corresponding to the loading frame. A discharging support arm is connected to one side of the discharging frame close to the transplanting workbench. During feeding, the discharging support arm extends into the first avoidance groove or the second avoidance groove. V-shaped discharging roller groups and horizontal discharging roller groups are respectively connected to both sides of the discharging frame. The horizontal discharging roller group includes a first discharging roller arranged at one end of the discharging frame far from the transplanting workbench, and a second discharging roller arranged at one end of the discharging support arm close to the transplanting workbench. The V-shaped discharging roller groups and the horizontal discharging roller groups are provided with discharging conveyor belts, and the top surface of the discharging conveyor belt is higher than the discharging frame. A discharging motor is connected to the discharging frame, and the discharging motor is drivingly connected to the V-shaped discharging roller group. During discharging, the transplanting workbench moves towards the discharging mechanism, the discharging support arm extends into the first avoidance groove or the second avoidance groove, the vertical driving module drives the transplanting workbench to rise, the transplanting workbench supports the roll-coated silicon wafer, the left and right driving modules drive the transplanting workbench to move, and the discharging support arm disengages from the first avoidance groove or the second avoidance groove. The discharging motor drives the V-shaped discharging roller group to rotate, thereby driving the discharging conveyor belt, and the discharging conveyor belt conveys the silicon wafer to the upper side of the transmission mechanism, and the transmission mechanism discharges the silicon wafer. The silicon wafer moves smoothly from the transplanting workbench to the discharging mechanism, the mechanical force on the silicon wafer is small, the mechanical strength of the silicon wafer is reduced, and the quality of the silicon wafer is improved.

[0013] Furthermore, in the above-mentioned silicon wafer feeding device, the transmission mechanism includes a transmission frame, and there are two or more transmission frames, which are arranged corresponding to the discharging frame. V-shaped transmission roller groups are respectively arranged on both sides of the transmission frame, and the V-shaped transmission roller groups are provided with transmission belts. A transmission motor is connected to the transmission frame, and the transmission motor is drivingly connected to the V-shaped transmission roller group. During discharging, the transmission motor drives the V-shaped transmission roller group to rotate, thereby causing the transmission belt to rotate, and the transmission belt drives the silicon wafer to be discharged.

[0014] Furthermore, in the above-mentioned silicon wafer feeding device, in order to improve the utilization rate of the coating on the coating roller and reduce coating waste, the first moving platform and the second moving platform are respectively slidably connected to the vertical driving module. A transverse movement driving motor is arranged on the top surface of the vertical driving module, and the transverse movement driving motor is respectively drivingly connected to the first moving platform and the second moving platform. The transverse movement driving motor respectively drives the first moving platform and the second moving platform to move perpendicular to the movement direction of the left and right driving modules. The transverse movement driving motor drives the first moving platform and the second moving platform to move along, which can make the silicon wafer move along the axial direction of the coating roller, make full use of the coating on each part of the coating roller, reduce waste, and reduce production costs.

[0015] As can be seen from the above technical solution, the utility model has the following beneficial effects: The silicon wafer feeding device of the utility model automatically feeds the silicon wafer into the roll coating device for roll coating, and automatically sends out the silicon wafer after roll coating is completed, avoiding human contact. The whole feeding process is automated, preventing the silicon wafer from being contaminated. Moreover, the two moving platforms alternate in feeding and roll coating, improving the working efficiency of the feeding platform and the equipment utilization rate. The silicon wafer moves from the loading conveyor belt to the transplanting workbench and then to the discharging mechanism smoothly. The mechanical force on the silicon wafer is small, reducing the mechanical strength suffered by the silicon wafer and improving the quality of the silicon wafer. The silicon wafer moves along the axial direction of the coating roller, making full use of the coating on the coating roller, reducing waste and lowering the production cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the silicon wafer feeding device of the utility model;

[0017] Figure 2 for the driving module in Figure 1 partial enlarged view;

[0018] Figure 3 for the loading conveyor module in Figure 1 partial enlarged view;

[0019] Figure 4 for the discharging transmission module in Figure 1 partial enlarged view;

[0020] Figure 5 for the transplanting workbench in Figure 1 partial enlarged view.

[0021] In the figure: 1. Machine platform; 2. Loading conveyor module, 21. Conveyor mechanism, 211. Conveyor frame, 212. V-shaped conveyor roller group, 214. Conveyor motor, 213. Conveyor belt, 22. Loading mechanism, 221. Loading frame, 222. V-shaped loading roller group, 2231. First loading roller, 2232. Second loading roller, 224. Loading motor, 225. Loading support arm, 226. Loading conveyor belt, 3. Transplanting workbench, 31. First moving platform, 311. First avoidance groove, 312. Transverse movement drive motor, 32. Second moving platform, 321. Second avoidance groove, 33. Left and right drive module, 331. Horizontal guide rail, 332. Horizontal moving frame, 34. Vertical drive module, 341. Vertical guide rail, 342. Vertical moving frame, 343. Vertical drive motor, 344. Vertical drive lead screw, 4. Discharge transmission module, 41. Discharge mechanism, 411. Discharge frame, 412. Discharge support arm, 413. V-shaped discharge roller group, 4141. First discharge roller, 4142. Second discharge roller, 415. Discharge transmission belt, 416. Discharge motor, 42. Transmission mechanism, 421. Transmission frame, 422. V-shaped transmission roller group, 423. Transmission belt, 424. Transmission motor. Detailed implementation mode

[0022] Embodiment 1

[0023] As Figure 1A silicon wafer feeding device shown in the figure includes a machine table 1. On the upper side of the machine table 1, a loading conveyor module 2, a transfer workbench 3, and an unloading conveyor module 4 are connected. The loading conveyor module 2 and the unloading conveyor module 4 are respectively arranged at both ends of the transfer workbench 3. The loading conveyor module 2 includes a conveyor mechanism 21 and a loading mechanism 22. The conveyor mechanism 21 and the loading mechanism 22 are arranged adjacent to each other in a straight line. The conveyor mechanism 21 transports the silicon wafers to the loading mechanism 22, and the loading mechanism 22 feeds the silicon wafers onto the transfer workbench 3. Two conveyor mechanisms 21 are arranged in parallel, and guide wheels are respectively arranged on both sides of the conveyor mechanism 21. Two loading mechanisms 22 are arranged in parallel, and guide wheels are respectively arranged on both sides of the loading mechanism 22. The unloading conveyor module 4 includes an unloading mechanism 41 and a conveyor mechanism 42. The unloading mechanism 41 and the conveyor mechanism 42 are arranged adjacent to each other in a straight line. Two unloading mechanisms 41 are arranged in parallel, and guide wheels are respectively arranged on both sides of the unloading mechanism 41. Two conveyor mechanisms 42 are arranged in parallel, and guide wheels are respectively arranged on both sides of the conveyor mechanism 42. The unloading mechanism 41 transports the silicon wafers from the transfer workbench 3 to the conveyor mechanism 42 for unloading. The transfer workbench 3 includes a first moving platform 31 and a second moving platform 32. The first moving platform 31, the second moving platform 32 and the machine table 1 are driven and connected through a driving module. The above driving module includes a left-right driving module 33 and a vertical driving module 34. The left-right driving module 33 and the vertical driving module 34 are drivingly connected. The vertical driving module 34 and the transfer workbench 3 are drivingly connected. The left-right driving module 33 respectively drives the first moving platform 31 and the second moving platform 32 to move left and right. The vertical driving module 34 respectively drives the first moving platform 31 and the second moving platform 32 to move up and down. A plurality of first avoidance grooves 311 are provided on the top surface of the first moving platform 31. A plurality of second avoidance grooves 321 are provided on the top surface of the second moving platform 32. During the roll coating process of the silicon wafers, in order to avoid the silicon wafers being contaminated by pollutants such as dust and oil stains, which may affect the subsequent processes, the silicon wafers are usually placed in a closed space for roll coating. By placing the silicon wafers on the upper sides of the two conveyor mechanisms 21, the conveyor mechanism 21 conveys the silicon wafers to the loading mechanism 22. The left-right driving module 33 drives the first moving platform 31 in the transfer workbench 3 to move towards the loading mechanism 22. The loading mechanism 22 transports the silicon wafers to the first moving platform 31. The left-right driving module 33 drives the first moving platform 31 to move under the coating roller for roll coating. At this time, the vertical driving module 34 drives the second moving platform 32 to descend. When the second moving platform 32 is lower than the first moving platform 31 and there is no interference between the first moving platform 31 and the second moving platform, the left-right driving module 33 drives the second moving platform 32 to abut against the loading mechanism 22, and the loading mechanism 22 conveys the silicon wafers to the second moving platform 32. At the same time, the roll coating of the silicon wafers on the upper side of the first moving platform 31 is completed. The left-right driving module 33 drives the first moving platform 31 to abut against the unloading mechanism 41, and the silicon wafers are sent to the unloading mechanism 41. The unloading mechanism 41 sends the silicon wafers to the conveyor mechanism 42 for sending out.The second moving platform 32 moves to the lower side of the coating roller for roll coating, and the first moving platform 31 descends and moves to the feeding mechanism 22 to receive the silicon wafers, and this process is repeated.

[0024] As Figure 2 For the silicon wafer feeding device shown, there are two left - right driving modules 33, and the two left - right driving modules 33 are respectively arranged on both sides of the machine table 1. The left - right driving module 33 includes a horizontal guide rail 331, a horizontal moving frame 332 slidably connected to the horizontal guide rail 331, a horizontal driving motor, and a horizontal driving lead screw. There are multiple horizontal guide rails 331, and the horizontal guide rails 331 are horizontally and fixedly connected to the side wall of the machine table 1. The horizontal driving motor is connected to the side wall of the machine table 1, and the horizontal driving motor is drivingly connected to the horizontal driving lead screw. The horizontal driving lead screw is drivingly connected to the horizontal moving frame 332. The horizontal driving motor drives the horizontal driving lead screw to rotate, and the horizontal driving lead screw drives the horizontal moving frame 332 to slide left and right along the horizontal guide rail 331. The horizontal moving frame 332 is connected to the vertical driving module 34. The vertical driving module 34 is correspondingly arranged with the left - right driving module 33. The vertical driving module 34 includes a vertical guide rail 341 vertically fixed to the horizontal moving frame 332, a vertical moving frame 342 slidably connected to the vertical guide rail 341. The horizontal moving frame 332 is connected with a vertical driving motor 343 and a vertical driving lead screw 344. The vertical driving motor 343 is drivingly connected to the vertical driving lead screw 344, and the vertical driving lead screw 344 is drivingly connected to the vertical moving frame 342. The vertical driving motor 343 drives the vertical driving lead screw 344 to rotate, and the vertical driving lead screw 344 drives the vertical moving frame 342 to slide along the vertical guide rail 341. The vertical moving frame 342 is connected to the transplanting workbench 3.

[0025] As Figure 3The silicon wafer feeding device shown, the conveying mechanism 21 includes a conveying machine frame 211, V-shaped conveying roller groups 212 are respectively connected to both sides of the conveying machine frame 211, the V-shaped conveying roller groups 212 are drivingly connected to a conveying motor 214, the conveying motor 214 is connected to the conveying machine frame 211, and a conveyor belt 213 is passed through the V-shaped conveying roller groups 212. Among the V-shaped conveying roller groups 212, there is an adjustable roller, and the adjustable roller is adjustably connected to the conveying machine frame 211, and the adjustable roller can adjust the tension of the conveyor belt 213. The loading mechanism 22 includes a loading machine frame 221, V-shaped loading roller groups 222 and horizontal loading roller groups are respectively arranged on both sides of the loading machine frame 221, the loading machine frame 221 is connected to a loading motor 224, the loading motor 224 is drivingly connected to the V-shaped loading roller groups 222, and a loading support arm 225 is arranged on the loading machine frame 221 close to one side of the transplanting workbench 3. During feeding, the loading support arm 225 extends into the first avoidance groove 311 or the second avoidance groove 321. The horizontal loading roller group includes a first loading roller 2231 arranged on the side of the loading machine frame 221 away from the transplanting workbench 3 and a second loading roller 2232 arranged at one end of the loading support arm 225 close to the transplanting workbench 3. The V-shaped loading roller groups 222 and the horizontal loading roller groups are provided with a loading conveyor belt 226. The V-shaped loading roller groups 222 are provided with adjustable rollers, the adjustable rollers are adjustably connected to the conveying machine frame 211, and the adjustable rollers adjust the tension of the conveyor belt 226. During feeding, the silicon wafers are placed on the upper side of the conveyor belt 213, the conveying motor 214 drives the V-shaped conveying roller groups 212 to rotate, the V-shaped conveying roller groups 212 drive the conveyor belt 213 to rotate, and the silicon wafers are sent to the upper side of the loading mechanism 22 by the conveyor belt 213. At this time, the loading support arm 225 has extended into the first avoidance groove 311 or the second avoidance groove 321, the top surface of the loading support arm 225 is higher than the top surface of the transplanting workbench 3, the loading motor 224 drives the V-shaped loading roller groups 222 to rotate, thereby driving the loading conveyor belt 226, the loading conveyor belt 226 conveys the silicon wafers to the upper side of the transplanting workbench 3, the transplanting workbench 3 moves upward under the drive of the vertical drive module 34, the silicon wafers are supported by the transplanting workbench 3, the transplanting workbench 3 moves out under the drive of the left and right drive module 33, the loading support arm 225 disengages from the first avoidance groove 311 or the second avoidance groove 321, and the transplanting workbench 3 moves to the lower side of the coating roller for roll coating.

[0026] As Figure 4The silicon wafer feeding device shown, the discharging mechanism 41 includes a discharging machine frame 411. A discharging support arm 412 is connected to one side of the discharging machine frame 411 close to the transplanting workbench 3. A V-shaped discharging roller group 413 and a horizontal discharging roller group are respectively connected to both sides of the discharging machine frame 411. The horizontal discharging roller group includes a first discharging roller 4141 provided on the discharging machine frame 411 away from the transplanting workbench 3, and a second discharging roller 4142 provided on the discharging support arm 412 close to the transplanting workbench 3. A discharging conveyor belt 415 is provided on the V-shaped discharging roller group 413 and the horizontal discharging roller group. The top surface of the discharging conveyor belt 415 is higher than the discharging machine frame 411. The discharging machine frame 411 is connected with a discharging motor 416, and the discharging motor 416 is drivingly connected to the V-shaped discharging roller group 413. The transmission mechanism 42 includes a transmission machine frame 421. V-shaped transmission roller groups 422 are respectively provided on both sides of the transmission machine frame 421. A transmission belt 423 is provided on the V-shaped transmission roller groups 422. The transmission machine frame 421 is connected with a transmission motor 424, and the transmission motor 424 is drivingly connected to the V-shaped transmission roller groups 422.

[0027] During discharging, the transplanting workbench 3 moves towards the discharging mechanism 41. The discharging support arm 412 is lower than / higher than the top surface of the transplanting workbench 3, and the discharging support arm 412 extends into the first avoidance groove 311 or the second avoidance groove 321. The vertical driving module 34 drives the transplanting workbench 3 to rise. The transplanting workbench 3 supports the silicon wafer after roller coating. The left and right driving module 33 drives the transplanting workbench 3 to move, and the discharging support arm 412 disengages from the first avoidance groove 311 or the second avoidance groove 321. The discharging motor 416 drives the V-shaped discharging roller group 413 to rotate, thereby driving the discharging conveyor belt 415. The discharging conveyor belt 415 conveys the silicon wafer to the upper side of the transmission mechanism 42. The transmission motor 424 drives the V-shaped transmission roller group 422 to rotate, thereby causing the transmission belt 423 to rotate. The transmission belt 423 drives the silicon wafer to be discharged.

[0028] As Figure 5 For the silicon wafer feeding device shown, in order to improve the utilization rate of the coating on the coating roller and reduce coating waste, the first moving platform 31 and the second moving platform 32 are respectively slidably connected to the vertical driving module 34. A transverse movement driving motor 312 is provided on the top surface of the vertical driving module 34. The transverse movement driving motor 312 is respectively drivingly connected to the first moving platform 31 and the second moving platform 32. The transverse movement driving motor 312 respectively drives the first moving platform 31 and the second moving platform 32 to move perpendicular to the movement direction of the left and right driving module 33.

[0029] The above embodiments are exemplary. Their purpose is to illustrate the technical concept and characteristics of the present invention so that those familiar with this field can understand the content of the present invention and implement it accordingly. It cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.

Claims

1. A silicon wafer feeding device, characterized in that: It includes a machine platform (1), on the upper side of which are connected a loading conveyor module (2), a transplanting workbench (3), and an unloading conveyor module (4). The loading conveyor module (2) and the unloading conveyor module (4) are respectively arranged at both ends of the transplanting workbench (3). The loading conveyor module (2) transports silicon wafers to the top surface of the transplanting workbench (3), and the transplanting workbench (3) transplants the silicon wafers to the unloading conveyor module (4) for unloading. The transplanting workbench (3) includes a first moving platform (31) and a second moving platform (32). The first moving platform (31), the second moving platform (32) and the machine platform (1) are drivingly connected through a driving module. The above driving module includes a left-right driving module (33) and a vertical driving module (34). The left-right driving module (33) and the vertical driving module (34) are drivingly connected, and the vertical driving module (34) and the transplanting workbench (3) are drivingly connected. The left-right driving module (33) drives the first moving platform (31) and the second moving platform (32) to move left and right respectively. The vertical driving module (34) drives the first moving platform (31) and the second moving platform (32) to move up and down respectively. On the top surface of the first moving platform (31), there are provided a plurality of first avoidance grooves (311). On the top surface of the second moving platform (32), there are provided a plurality of second avoidance grooves (321).

2. The silicon wafer feeding device according to claim 1, wherein: There are two left-right driving modules (33), which are respectively arranged on both sides of the machine platform (1). The left-right driving module (33) includes a horizontal guide rail (331), a horizontal moving frame (332) slidably connected to the horizontal guide rail (331), a horizontal driving motor, and a horizontal driving lead screw. There are multiple horizontal guide rails (331), and the horizontal guide rails (331) are horizontally fixedly connected to the side wall of the machine platform (1). The horizontal driving motor is connected to the side wall of the machine platform (1), and the horizontal driving motor is drivingly connected to the horizontal driving lead screw. The horizontal driving lead screw is drivingly connected to the horizontal moving frame (332). The horizontal driving motor drives the horizontal driving lead screw to rotate, and the horizontal driving lead screw drives the horizontal moving frame (332) to slide left and right along the horizontal guide rail (331). The horizontal moving frame (332) is connected to the vertical driving module (34).

3. The silicon wafer feeding device according to claim 2, characterized in that: The vertical driving module (34) includes a vertical guide rail (341) vertically fixed to the horizontal moving frame (332). A vertical moving frame (342) is slidably connected to the vertical guide rail (341). The horizontal moving frame (332) is connected with a vertical driving motor (343) and a vertical driving lead screw (344). The vertical driving motor (343) is drivingly connected to the vertical driving lead screw (344), and the vertical driving lead screw (344) is drivingly connected to the vertical moving frame (342). The vertical driving motor (343) drives the vertical driving lead screw (344) to rotate, and the vertical driving lead screw (344) drives the vertical moving frame (342) to slide along the vertical guide rail (341). The vertical moving frame (342) is connected to the transplanting workbench (3).

4. The silicon wafer feeding device according to claim 1, wherein: The feeding and conveying module (2) includes a conveying mechanism (21) and a feeding mechanism (22); the conveying mechanism (21) and the feeding mechanism (22) are arranged adjacent to each other in a straight line; the conveying mechanism (21) transports the silicon wafers to the feeding mechanism (22), and the feeding mechanism (22) feeds the silicon wafers onto the transplanting workbench (3).

5. The silicon wafer feeding device according to claim 4, characterized in that: The conveying mechanism (21) includes a conveying frame (211), V-shaped conveying roller groups (212) are respectively connected to both sides of the conveying frame (211), a conveying motor (214) is drivingly connected to the V-shaped conveying roller groups (212), the conveying motor (214) is connected to the conveying frame (211), and a conveyor belt (213) is threaded through the V-shaped conveying roller groups (212); the conveying motor (214) drives the V-shaped conveying roller groups (212) to rotate, and the V-shaped conveying roller groups (212) drive the conveyor belt (213) to rotate.

6. The silicon wafer feeding device according to claim 4, wherein: The feeding mechanism (22) includes a feeding frame (221), V-shaped feeding roller groups (222) and horizontal feeding roller groups are respectively arranged on both sides of the feeding frame (221), and the above-mentioned horizontal feeding roller groups include a first feeding roller (2231) arranged on the side of the feeding frame (221) away from the transplanting workbench (3) and a second feeding roller (2232) arranged at one end of the feeding support arm (225) close to the transplanting workbench (3); a feeding conveyor belt (226) is wound around the V-shaped feeding roller groups (222) and the horizontal feeding roller groups (223); a feeding motor (224) is connected to the feeding frame (221), the feeding motor (224) is drivingly connected to the V-shaped feeding roller groups (222), a feeding support arm (225) is arranged on the side of the feeding frame (221) close to the transplanting workbench (3), and during feeding, the feeding support arm (225) extends into the first avoidance groove (311) or the second avoidance groove (321).

7. The silicon wafer feeding device according to claim 1, characterized in that: The discharging and conveying module (4) includes a discharging mechanism (41) and a conveying mechanism (42), the discharging mechanism (41) and the conveying mechanism (42) are arranged adjacent to each other in a straight line, and the discharging mechanism (41) transports the silicon wafers from the transplanting workbench (3) to the conveying mechanism (42) for discharging.

8. The silicon wafer feeding device according to claim 7, wherein: The discharging mechanism (41) includes a discharging frame (411), a discharging support arm (412) is connected to the side of the discharging frame (411) close to the transplanting workbench (3), and during feeding, the discharging support arm (412) extends into the first avoidance groove (311) or the second avoidance groove (321); V-shaped discharging roller groups (413) and horizontal discharging roller groups are respectively connected to both sides of the discharging frame (411), the horizontal discharging roller groups include a first discharging roller (4141) arranged at one end of the discharging frame (411) away from the transplanting workbench (3) and a second discharging roller (4142) arranged at one end of the discharging support arm (412) close to the transplanting workbench (3), and a discharging conveyor belt (415) is wound around the V-shaped discharging roller groups (413) and the horizontal discharging roller groups; a discharging motor (416) is connected to the discharging frame (411), and the discharging motor (416) is drivingly connected to the V-shaped discharging roller groups (413).

9. The silicon wafer feeding device according to claim 7, wherein: The transmission mechanism (42) includes a transmission frame (421). On both sides of the transmission frame (421), there are respectively V-shaped transmission roller groups (422), and a transmission belt (423) is provided on the V-shaped transmission roller groups (422); the transmission frame (421) is connected with a transmission motor (424), and the transmission motor (424) is drivingly connected to the V-shaped transmission roller groups (422).

10. The silicon wafer feeding device according to claim 1, wherein: The first moving platform (31) and the second moving platform (32) are respectively slidably connected to the vertical driving module (34). On the top surface of the vertical driving module (34), there is a lateral movement driving motor (312). The lateral movement driving motor (312) is respectively drivingly connected to the first moving platform (31) and the second moving platform (32). The lateral movement driving motor (312) respectively drives the first moving platform (31) and the second moving platform (32) to move perpendicular to the movement direction of the left and right driving module (33).

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