Cotton film connection adhesive tape
By using tensile substrate and PET bonding layer in the cotton film joint tape, the problem of tape peeling caused by expansion or contraction of the cotton film during transportation is solved, and the high pull resistance and stable joint effect of the tape is achieved.
Patent Information
- Application Number
- CN202421857194.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-01
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-01
AI Technical Summary
Cotton is prone to dissipation or contraction during transportation, and the existing tapes are insufficient in pull resistance.
The tensile substrate, the first bonding layer and the second bonding layer are respectively coated on both sides of the tensile substrate. The bonding layer material is PET and the adhesive layer material is hot melt adhesive to ensure that the adhesive layer is firmly connected to the tensile substrate and enhance the tension resistance of the tape.
It improves the tape's pull resistance, ensures that the cotton film is not easily disengaged due to pulling force during transportation, and enhances the stability and adhesion of the tape.
Smart Images
Figure CN223087775U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of tapes, and particularly to a cotton film connecting tape. Background Art
[0002] During the cotton picking process, it is necessary to wrap the picked cotton with a cotton film for easy transportation and storage. In the existing related technologies, after wrapping the cotton with the cotton film, it is also necessary to use a tape to connect the head and tail ends of the cotton film so that the cotton film is not easily damaged due to the expansion and contraction deformation of the cotton during transportation.
[0003] In view of the above related technologies, the cotton is prone to large expansion or contraction during transportation, which causes the tape to bear a large pulling force and is prone to the problem of tape detachment. Summary of the Invention
[0004] In order to increase the tensile strength of the tape, this application provides a cotton film connecting tape.
[0005] The cotton film connecting tape provided by this application adopts the following technical solutions:
[0006] A cotton film connecting tape includes a tensile substrate, a first bonding layer, a second bonding layer, a first adhesive layer, and a second adhesive layer. The first bonding layer and the second bonding layer are respectively disposed on both sides of the tensile substrate. The first adhesive layer is disposed on the first bonding layer, and the second adhesive layer is disposed on the second bonding layer.
[0007] By adopting the above technical solutions, the tensile substrate bears the pulling force, and the first bonding layer and the second bonding layer respectively and firmly connect the first adhesive layer and the second adhesive layer to the tensile substrate, so that the cotton film connecting tape is not easily detached from the cotton film due to the pulling force.
[0008] Optionally, the material of the first bonding layer is PET.
[0009] By adopting the above technical solutions, PET enables the first bonding layer to have high tensile strength and impact resistance, which is conducive to increasing the tensile strength of the first bonding layer.
[0010] Optionally, the material of the second bonding layer is PET.
[0011] By adopting the above technical solutions, PET enables the second bonding layer to have high tensile strength and impact resistance, which is conducive to increasing the tensile strength of the second bonding layer.
[0012] Optionally, the material of the first adhesive layer is hot melt adhesive.
[0013] By adopting the above technical solutions, it is beneficial to ensure the adhesiveness of the first adhesive layer, thereby ensuring the stable connection of the cotton film.
[0014] Optionally, the material of the second adhesive layer is hot melt adhesive.
[0015] By adopting the above technical solution, it is beneficial to ensure the adhesiveness of the second adhesive layer, thereby ensuring the stable connection of the cotton film.
[0016] Optionally, the material of the tensile substrate is aluminum or copper.
[0017] By adopting the above technical solution, it is beneficial to improve the thermal conductivity of the tensile substrate, so that the cotton film connecting tape is not easily peeled off due to local heating under the sun during the cotton collection process.
[0018] Optionally, the thickness of the first bonding layer is 0.1 - 0.2 mm.
[0019] By adopting the above technical solution, it is beneficial to transfer the heat of the first adhesive layer to the tensile substrate in time, thereby ensuring uniform heat transfer.
[0020] Optionally, the thickness of the second bonding layer is 0.1 - 0.2 mm.
[0021] By adopting the above technical solution, it is beneficial to transfer the heat of the second adhesive layer to the tensile substrate in time, thereby ensuring uniform heat transfer.
[0022] Optionally, the tensile substrate includes a plurality of first wire rods and a plurality of second wire rods, and the plurality of first wire rods are respectively wound around the second wire rods.
[0023] By adopting the above technical solution, it is beneficial to increase the tensile property of the tensile substrate through the interaction between the first wire rod and the second wire rod.
[0024] In summary, the present application includes at least one of the following beneficial technical effects:
[0025] 1. The tensile substrate bears the pulling force, and the first bonding layer and the second bonding layer respectively and firmly connect the first adhesive layer and the second adhesive layer to the tensile substrate, so that the cotton film connecting tape is not easily separated from the cotton film due to the pulling force. Description of the Drawings
[0026] Figure 1 is a schematic structural diagram of the overall structure of Embodiment 1 of the present application.
[0027] Figure 2 is a schematic structural diagram of the tensile substrate of Embodiment 2 of the present application.
[0028] Description of the reference numerals: 1, tensile substrate; 11, first wire rod; 12, second wire rod; 2, first bonding layer; 3, second bonding layer; 4, first adhesive layer; 5, second adhesive layer. Detailed implementation mode
[0029] The following will further elaborate on this application in conjunction with the attached Figure 1-2 drawings.
[0030] Example 1:
[0031] Example 1 of this application discloses a cotton film connection tape. Referring to Figure 1 , the cotton film connection tape includes a tensile substrate 1, a first bonding layer 2, a second bonding layer 3, a first adhesive layer 4, and a second adhesive layer 5.
[0032] Referring to Figure 1 , the thickness dimension of the tensile substrate 1 is 0.2 - 0.3 mm, and the material of the tensile substrate 1 is aluminum or copper to ensure that the tensile substrate 1 has good tensile and heat conduction properties. The first bonding layer 2 is coated on one side of the tensile substrate 1, and the material of the first bonding layer 2 is PET. The thickness dimension of the first bonding layer 2 is 0.1 - 0.2 mm to ensure the tensile strength of the first bonding layer 2 and the bonding strength with the tensile substrate 1. The second bonding layer 3 is coated on the other side of the tensile substrate 1, and the material of the second bonding layer 3 is PET. The thickness dimension of the second bonding layer 3 is 0.1 - 0.2 mm to ensure the tensile strength of the second bonding layer 3 and the bonding strength with the tensile substrate 1. Additionally, by restricting the thickness dimensions of the first bonding layer 2 and the second bonding layer 3, heat can be quickly transferred to the tensile substrate 1 through the first bonding layer 2 and the second bonding layer 3.
[0033] Referring to Figure 1 , the first adhesive layer 4 is coated on the first bonding layer 2, and the material of the first adhesive layer 4 is hot melt adhesive. Additionally, the second adhesive layer 5 is coated on the second bonding layer 3, and the material of the first adhesive layer 4 is also hot melt adhesive to facilitate ensuring the adhesiveness of the first adhesive layer 4 and the second adhesive layer 5, so that the cotton film is not easily detached from the first adhesive layer 4 or the second adhesive layer 5.
[0034] The implementation principle of the cotton film connection tape in Example 1 of this application is: using the tensile substrate 1 to ensure the tensile and heat conduction properties of the tape, and through the first bonding layer 2 and the second bonding layer 3, both the first adhesive layer 4 and the second adhesive layer 5 are firmly bonded to the tensile substrate 1, thereby increasing the tensile and heat conduction properties of the tape and the stability of the layer structure.
[0035] Example 2:
[0036] Example 2 of this application discloses a cotton film connection tape, which, in addition to including all the technical features of Example 1, further includes the following technical features:
[0037] Referring to Figure 2The tensile substrate 1 includes a plurality of first wires 11 and a plurality of second wires 12, wherein the plurality of first wires 11 are respectively wound around the second wires 12. Specifically, the first wires 11 and the second wires 12 are mutually wound through a braiding process to form a planar structure, so that the mechanical strength of the tensile substrate 1 is increased through the interaction between the first wires 11 and the second wires 12.
[0038] The implementation principle of a cotton film splicing tape in Example 2 of the present application is as follows: on the basis of Example 1, the mechanical strength of the tensile substrate 1 is further increased by further limiting the structure of the tensile substrate 1.
[0039] Embodiment 3:
[0040] Example 3 of the present application discloses a cotton film splicing tape, which includes all the technical features of Example 1 and also includes the following technical features:
[0041] The first adhesive layer 4 includes components of PIB (polyisobutylene), an antioxidant, SIS (styrene-isoprene-styrene block copolymer), a petroleum resin, and a UV absorber.
[0042] The molecular weight of PIB is 1300, and the proportion of PIB is 15%; the antioxidant is specifically BASF antioxidant 1010, and the proportion of the antioxidant is 1%; the SIS is specifically QUINTACSIS 3280, and the proportion of SIS is 38%; the petroleum resin is specifically Exxon 5380, and the proportion of petroleum resin is 44%; the proportion of UV ultraviolet absorber is 2%.
[0043] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A cotton film connecting tape, characterized in that: It includes a tensile substrate (1), a first bonding layer (2), a second bonding layer (3), a first adhesive layer (4) and a second adhesive layer (5). The first bonding layer (2) and the second bonding layer (3) are respectively disposed on both sides of the tensile substrate (1). The first adhesive layer (4) is disposed on the first bonding layer (2), and the second adhesive layer (5) is disposed on the second bonding layer (3).
2. The cotton film splicing tape according to claim 1, characterized in that: The material of the first bonding layer (2) is PET.
3. A cotton film connecting tape according to claim 1 or 2, characterized in that: The material of the second bonding layer (3) is PET.
4. A cotton film connecting tape according to claim 1, characterized in that: The material of the first adhesive layer (4) is hot melt adhesive.
5. A cotton film splicing tape according to claim 1 or 4, characterized in that: The material of the second adhesive layer (5) is hot melt adhesive.
6. The cotton film splicing tape according to claim 1, wherein: The material of the tensile substrate (1) is aluminum or copper.
7. A cotton film splicing tape according to claim 6, characterized in that: The thickness dimension of the first bonding layer (2) is 0.1 - 0.2 mm.
8. A cotton film connecting tape according to claim 6 or 7, characterized in that: The thickness dimension of the second bonding layer (3) is 0.1 - 0.2 mm.
9. A cotton film connecting tape according to claim 1, characterized in that: The tensile substrate (1) includes a plurality of first wire rods (11) and a plurality of second wire rods (12), and the plurality of first wire rods (11) are respectively wound around the second wire rods (12).