Electroplating processing equipment suitable for PCB (Printed Circuit Board) thin plate
By designing PCB thin plate electroplating equipment for connecting rods, positioning slots and placing frames, the problems of occlusion and liquid accumulation of support frames are solved, and the unblocked electroplating and uniform electroplating are achieved, which is suitable for sheets of different widths, improving the electroplating effect and operation convenience.
Patent Information
- Application Number
- CN202422108442.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-29
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-29
AI Technical Summary
In existing PCB thin plate electroplating equipment, the contact between the support frame and the side of the board causes the electroplating surface to be blocked, and the electroplating solution is easily gathered inside the support frame, affecting the electroplating effect and operation convenience.
A device including connecting rods, positioning grooves, and placing frames is designed to support the plates through the base plate and the limiting plate to avoid blocking the plating surfaces, and to adapt to the plates of different widths through the adjustment grooves and fixing bolts to ensure support stability and plating uniformity.
The unblocked electroplating surface is achieved, which avoids the accumulation of electroplating solution, improves the electroplating effect and operation convenience, adapts to different widths of boards, and expands the scope of use.
Smart Images
Figure CN223087973U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB board processing, in particular to a plating processing device suitable for thin PCB boards. Background Art
[0002] A PCB board, i.e., a printed circuit board, is a technology that connects electronic components into a mechanical whole through wires. This technology can be traced back to the early 20th century. At that time, in order to simplify the production of electronic devices, reduce the wiring between electronic components, and lower the production cost, people began to explore ways to replace traditional wiring methods with printing. The PCB board electroplating support structure is a device used to fix and protect thin PCB (printed circuit board) boards. During the electroplating process, the thin PCB board needs to be fixed on a frame to prevent it from moving or flipping in the electroplating solution, thereby ensuring the uniformity and quality of electroplating. This fixing frame is usually made of corrosion-resistant materials such as plastic or stainless steel to resist the erosion of the electroplating solution. It usually has one or more slots or clamps for inserting and fixing the thin PCB board.
[0003] Currently, before electroplating a PCB board, the board needs to be placed in a support frame or a support groove. To avoid affecting the electroplating effect of the board, the support frame is located on the outer side of the board and contacts the side of the board. Due to the structural setting, it will still cause unnecessary blockage to the board, and the electroplating solution is likely to accumulate inside the support frame, which is not conducive to actual processing operations.
[0004] Therefore, it is necessary to provide a plating processing device suitable for thin PCB boards to solve the above technical problems. Summary of the Utility Model
[0005] In view of the above situation, in order to overcome the defects of the prior art, the utility model provides a plating processing device suitable for thin PCB boards to solve the problem that before electroplating a PCB board, the board needs to be placed in a support frame or a support groove. To avoid affecting the electroplating effect of the board, the support frame is located on the outer side of the board and contacts the side of the board. Due to the structural setting, it will still cause unnecessary blockage to the board, and the electroplating solution is likely to accumulate inside the support frame, which is not conducive to actual processing operations.
[0006] To achieve the above object, the technical solution adopted by the utility model is as follows:
[0007] A plating processing device suitable for thin PCB boards includes: a connecting rod, a board, and a placement frame;
[0008] A positioning groove is formed at the bottom of the connecting rod, the board is placed inside the positioning groove, the top edge of the board is located inside the positioning groove, and the bottom edge of the board abuts against the placement frame.
[0009] In one embodiment, the top of the connecting rod is connected to an external lifting mechanism. On both sides of the bottom surface of the connecting rod, connecting plates are installed. In the middle of the bottom surface of the connecting plate, a support groove is formed. The overall shape of the support groove is a T-shaped structure.
[0010] In one embodiment, the placement frame is composed of a bottom plate, support rods, support blocks, and limit plates. On both side surfaces of the bottom plate, support rods are installed. There are four support rods, and the support rods are arranged in an L-shaped structure. On the top surfaces of the support rods, support blocks are installed. The support blocks are inserted into the support grooves. On both ends of the bottom plate, limit plates are installed. The two sides of the limit plate are open, and the limit plate is inclined. The inner wall surface of the limit plate fits with the two bottom corners of the plate.
[0011] In one embodiment, a protective rod extends from the support rod towards the middle of the plate. There is a gap between the protective rod and the plate. On the side surface of the protective rod facing the plate, a protective head is installed. The protective head is in a frustum structure.
[0012] In one embodiment, the bottom plate is composed of two plate bodies combined. On the opposite surfaces of the bottom plate, adjustment grooves are formed. Inside the adjustment grooves, adjustment plates are installed. On the opposite surfaces of the adjustment plates and the adjustment grooves, adjustment holes are formed. Fixing bolts are inserted into the adjustment holes.
[0013] The beneficial effects of the present utility model are as follows:
[0014] (1) In the present utility model, by placing the bottom surface of the plate on the top surface of the bottom plate, the two bottom corners of the plate are inserted into the limit plates. Due to the structural settings of the bottom plate and the limit plates, the electroplated surface of the plate will not be blocked, and there will be no liquid storage situation. The plate is supported by the bottom plate, and the lateral position of the plate is limited by the limit plates. After the installation is completed, the support blocks of the support rods are inserted into the support grooves to complete the installation of the plate.
[0015] (2) In the present utility model, by separating the bottom plates and pulling apart the distance between them, it can adapt to plates of different widths. After the adjustment is completed, the adjustment plates corresponding to the width are inserted into the adjustment grooves, and fixing bolts are inserted into the adjustment holes on the opposite surfaces of the two, so that the overall device can adapt to plates of different widths and improve the scope of use. Description of the Drawings
[0016] Figure 1 is the overall structure diagram of the present utility model;
[0017] Figure 2 is the detailed rear view of each component of the present utility model after disassembly;
[0018] Figure 3 is the detailed diagram of the placement frame of the present utility model;
[0019] Figure 4 This is the detailed view after the bottom structure of the placement frame of the present utility model is disassembled.
[0020] Among them, the names corresponding to the reference numerals are: connecting rod 1, positioning groove 11, connecting plate 12, support groove 13, plate 2, placement frame 3, bottom plate 31, support rod 32, support block 33, limit plate 34, protection rod 35, protection head 36, adjustment groove 37, adjustment plate 38, adjustment hole 39. Specific embodiments
[0021] The present utility model will be further described below in conjunction with the accompanying drawings and embodiments. The embodiments of the present utility model include but are not limited to the following embodiments.
[0022] As Figure 1 - Figure 2 shown, a PCB thin plate electroplating processing device provided by the present utility model includes: a connecting rod 1, a plate 2, and a placement frame 3;
[0023] As Figure 1 - Figure 2 shown, a positioning groove 11 is opened at the bottom of the connecting rod 1, the plate 2 is placed inside the positioning groove 11, the top edge of the plate 2 is located inside the positioning groove 11, and the bottom edge of the plate 2 abuts against the placement frame 3. Since the placement frame 3 contacts the bottom surface of the plate 2, it does not block the electroplating surfaces around the plate 2, avoiding affecting the electroplating effect of the plate during electroplating.
[0024] Preferably, in one embodiment, as Figure 1 - Figure 2 shown, the top of the connecting rod 1 is connected to an external lifting mechanism, both sides of the bottom surface of the connecting rod 1 are provided with connecting plates 12, and a support groove 13 is opened in the middle of the bottom surface of the connecting plate 12. The support groove 13 is a T-shaped structure as a whole.
[0025] Preferably, in one embodiment, as Figure 3 - Figure 4As shown in the figure, the placement frame 3 is composed of a bottom plate 31, support rods 32, support blocks 33, and limit plates 34. Support rods 32 are installed on both side surfaces of the bottom plate 31. There are four support rods 32, which are arranged in an L-shaped structure. Support blocks 33 are installed on the top surfaces of the support rods 32. The support blocks 33 are connected to the support grooves 13 in an insertion manner. Limit plates 34 are installed at both ends of the bottom plate 31. Both sides of the limit plates 34 are open. The limit plates 34 are inclined. The inner wall surfaces of the limit plates 34 are attached to the two bottom corners of the plate 2. During operation, by placing the bottom surface of the plate 2 on the top surface of the bottom plate 31, the two bottom corners of the plate 2 are inserted into the limit plates 34. Due to the structural settings of the bottom plate 31 and the limit plates 34, the electroplated surface of the plate 2 will not be blocked, and there will be no liquid storage situation. The bottom plate 31 supports the plate 2, and the limit plates 34 limit the lateral position of the plate 2. After installation, the support blocks 33 of the support rods 32 are inserted into the support grooves 13 to complete the installation of the plate.
[0026] Preferably, in one embodiment, as Figure 3 - Figure 4 shown, a protective rod 35 extends from the support rod 32 towards the middle of the plate 2. There is a gap between the protective rod 35 and the plate 2. A protective head 36 is installed on the side of the protective rod 35 facing the plate 2. The protective head 36 is in a frustum structure. During operation, if the plate 2 is bent by the impact of liquid flow, the protective head 36 and the protective rod 35 can provide protective limitation to the plate 2 to prevent the plate 2 from being bent and damaged.
[0027] Preferably, in one embodiment, as Figure 3 - Figure 4 shown, the bottom plate 31 is composed of two plate bodies. Adjustment grooves 37 are provided on the opposite surfaces of the bottom plate 31. An adjustment plate 38 is installed inside the adjustment grooves 37. Adjustment holes 39 are provided on the opposite surfaces of the adjustment plate 38 and the adjustment grooves 37. Fixing bolts are inserted into the adjustment holes 39. During operation, by separating the bottom plate 31 and pulling apart the distance between them, it can adapt to plates 2 of different widths. After adjustment, the adjustment plate 38 corresponding to the width is inserted into the adjustment grooves 37, and fixing bolts are inserted into the adjustment holes 39 on their opposite surfaces, so that the overall device can adapt to plates 2 of different widths and improve the scope of use.
[0028] The working principle of the present utility model:
[0029] During operation, by placing the bottom surface of the plate 2 on the top surface of the bottom plate 31, inserting the two bottom corners of the plate 2 into the limit plates 34, supporting the plate 2 by the bottom plate 31, and limiting the lateral orientation of the plate 2 by the limit plates 34. After the installation is completed, insert the support block 33 of the support rod 32 into the support groove 13 to complete the installation of the plate. By separating the bottom plate 31 and pulling apart the distance between them, it can adapt to plates 2 of different widths. After the adjustment is completed, insert the adjustment plate 38 corresponding to the width into the adjustment groove 37 and insert fixing bolts into the adjustment holes 39 on the opposite surfaces of the two, so that the overall device can adapt to plates 2 of different widths and improve the scope of use.
[0030] The above embodiments are only one of the preferred embodiments of the present invention and should not be used to limit the protection scope of the present invention. Any meaningless modifications or polishings made on the main design concept and spirit of the present invention, as long as the technical problems solved are still the same as those of the present invention, should be included in the protection scope of the present invention.
Claims
1. A PCB thin plate electroplating processing equipment, characterized in that Including: Connecting rod, plate, placement frame; A positioning groove is formed at the bottom of the connecting rod, a plate is placed inside the positioning groove, the top edge of the plate is located inside the positioning groove, and the bottom edge of the plate abuts against the placement frame.
2. The electroplating processing equipment applicable to PCB thin plates according to claim 1, characterized in that, The top of the connecting rod is connected to an external lifting mechanism, connecting plates are installed on both sides of the bottom surface of the connecting rod, and a support groove is formed in the middle of the bottom surface of the connecting plate. The support groove is of a T-shaped structure as a whole.
3. An electroplating processing device applicable to PCB thin plates according to claim 1, characterized in that, The placement frame is composed of a bottom plate, support rods, support blocks, and limit plates. Support rods are installed on both side surfaces of the bottom plate. There are four support rods, which are arranged in an L-shaped structure. Support blocks are installed on the top surfaces of the support rods. The support blocks are connected to the support grooves in an inserted manner. Limit plates are installed at both ends of the bottom plate. Both sides of the limit plates are open. The limit plates are inclined, and the inner wall surfaces of the limit plates are attached to the two bottom corners of the plate.
4. The electroplating processing equipment applicable to PCB thin plates according to claim 3, characterized in that, The support rod extends towards the middle of the plate to form a protective rod. There is a gap between the protective rod and the plate. A protective head is installed on the side of the protective rod facing the plate. The protective head is of a frustum structure.
5. An electroplating processing device applicable to PCB thin plates according to claim 3, characterized in that, The bottom plate is composed of two plate bodies. Adjustment grooves are formed on the opposite surfaces of the bottom plate. An adjustment plate is installed inside the adjustment grooves. Adjustment holes are formed on the opposite surfaces of the adjustment plate and the adjustment grooves. Fixing bolts are inserted into the adjustment holes.