Heat dissipation device for LED lamp

Abstract

The utility model relates to the technical field of lamps, and discloses a heat dissipation device for an LED lamp, which comprises a shell, a light-emitting plate, a heat dissipation plate, a clamping piece, an LED back plate, a heat dissipation piece and a semiconductor block, the light-emitting plate is arranged at the bottom inside the shell, the heat dissipation plate is arranged on one side of the shell, the clamping piece is arranged at one end of the heat dissipation plate, and the semiconductor block is arranged on the other end of the heat dissipation plate. The LED back plate is installed at the top of the light-emitting plate, the heat dissipation piece is arranged at the top of the LED back plate, the semiconductor block is installed at one end of the heat dissipation piece, the heat dissipation piece comprises a heat conduction shell, a cooling conduction box and a circulating heat dissipation pipe, the heat conduction shell is fixedly connected to the top of the LED back plate, and the cooling conduction box is arranged at one end in the heat conduction shell. According to the heat dissipation device for the LED lamp, refrigeration liquid moves on the LED back plate through the circulating heat dissipation pipe, heat dissipation is conducted on the LED lamp, the refrigeration liquid is cooled by the semiconductor block in the cooling conduction box, and the circulating heat dissipation effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of lamps, in particular to a heat dissipation device for an LED lamp. Background Technique

[0002] An LED lamp, which is the abbreviation of Light Emitting Diode, is a semiconductor solid-state light-emitting device. The LED lamp directly converts electrical energy into light energy, with high conversion efficiency. Under the same brightness, the power consumption is much lower than that of traditional incandescent lamps and fluorescent lamps, which can significantly save energy. Under appropriate current and voltage, the service life of the LED lamp can reach tens of thousands of hours, far exceeding that of ordinary incandescent lamps and fluorescent lamps. The LED lamp does not contain harmful substances such as mercury, the waste treatment is relatively safe and environmentally friendly, and the LED lamp can be recycled.

[0003] According to the authorized announcement number CN212644367U, a heat dissipation device for an LED lamp is disclosed. A base is provided under the LED lamp tube. A heat absorption cavity is provided in the middle of the base. A plurality of heat conduction rods are provided on the inner upper surface of the heat absorption cavity. A heat exchange plate is connected under the heat conduction rods. A coolant is provided in the cavity of the heat absorption cavity. Air flow cavities are provided on both sides of the base. A fan is provided in the air flow cavity. An air inlet is provided on the inner wall of one side of the air flow cavity, and an air outlet is provided on the inner wall of the other side of the air flow cavity. The above-mentioned utility model can dissipate heat from the LED lamp tube well and extend the service life of the LED lamp tube.

[0004] However, the above application still has deficiencies. The heat conduction rod is used to transfer heat into the heat exchange plate, and then the fan is used to dissipate heat from the heat exchange plate. However, air-cooled heat dissipation will generate relatively large noise and is also prone to dust accumulation inside the heat dissipation, affecting the subsequent heat dissipation effect, and it is difficult to clean the internal dust during long-term use. Content of the Utility Model

[0005] The purpose of the utility model is to provide a heat dissipation device for an LED lamp to solve the problems raised in the above background technique.

[0006] To achieve the above purpose, the utility model provides the following technical solution: A heat dissipation device for an LED lamp, including a housing, a light-emitting plate, a heat dissipation plate, a clamping member, an LED back plate, a heat dissipation member, and a semiconductor block. The light-emitting plate is arranged at the bottom inside. The heat dissipation plate is arranged on one side of the housing. The clamping member is arranged at one end of the heat dissipation plate. The LED back plate is installed on the top of the light-emitting plate. The heat dissipation member is arranged on the top of the LED back plate. The semiconductor block is installed at one end of the heat dissipation member.

[0007] Preferably, the heat dissipation component includes a heat conduction shell, a cooling conduction box, and a circulating heat dissipation pipe. The heat conduction shell is fixedly connected to the top of the LED backplane. The cooling conduction box is arranged at one end inside the heat conduction shell. The circulating heat dissipation pipe is flange-connected to one side of the cooling conduction box. One end of the cooling conduction box is attached to the cold end of the semiconductor block. The refrigerating liquid is moved on the LED backplane through the circulating heat dissipation pipe to dissipate heat from the LED lamp. The refrigerating liquid is cooled by the semiconductor block inside the cooling conduction box to achieve the effect of circulating heat dissipation.

[0008] Preferably, the clamping component includes a mounting block, a clamping block, a fixing plate, an adjusting plate, and a spring. The mounting block is fixedly connected to one end of the heat dissipation plate. The clamping block is fixedly connected to one side of the mounting block. The fixing plate is fixedly connected to one end of the clamping block. The adjusting plate is installed on one side of the fixing plate. The spring is fixedly connected to the inner sides of the fixing plate and the adjusting plate. By using the adjusting plate and utilizing the elasticity of the spring, the adjusting plate is clamped to fix the heat dissipation plate. By quickly disassembling and assembling the heat dissipation plate, the dust adhered to the heat dissipation plate can be cleaned to ensure the heat dissipation effect.

[0009] Preferably, a hole groove is formed in the top of the heat conduction shell for dissipating heat from the LED backplane. At the same time, the hole groove increases the contact area with the air, facilitating the improvement of the heat conduction effect and enabling the circulating heat dissipation pipe to achieve a better heat dissipation effect.

[0010] Preferably, the number of the heat dissipation plates is two, which are respectively installed on both sides of the housing. The two heat dissipation plates are used to dissipate heat from two groups of semiconductor blocks, and the heat dissipation plates face the hot ends of the semiconductor blocks.

[0011] Preferably, the size of the heat dissipation plate is larger than that of the semiconductor block to ensure that the heat dissipation plate can dissipate heat from the semiconductor block.

[0012] Preferably, a clamping groove is formed in the inner wall of the housing, and one end of the adjusting plate is clamped and connected to the clamping groove. The clamping groove is used to firmly fix the heat dissipation plate.

[0013] Preferably, a use groove is formed inside the mounting block, and one end of the adjusting plate penetrates through the clamping block and extends into the use groove, and the adjusting plate is adjusted and used in the use groove.

[0014] Preferably, the number of the heat dissipation components is divided into two groups to ensure the heat dissipation effect on the LED backplane and avoid the reduction of the heat dissipation effect caused by the overlong size of the circulating heat dissipation pipe.

[0015] Preferably, the circulating heat dissipation pipes are connected in multiple U shapes to ensure that they can be evenly distributed above the LED backplane and improve the heat dissipation effect on the LED lamp.

[0016] Compared with the prior art, the beneficial effects of the present utility model are:

[0017] 1. The heat dissipation device for LED lights moves the refrigerating liquid on the LED backplane through a circulating heat dissipation pipe to dissipate heat from the LED lights. The refrigerating liquid is cooled by a semiconductor block in the temperature reduction conduction box to achieve the effect of circulating heat dissipation.

[0018] 2. The heat dissipation device for LED lights can clean the dust adhered to the heat dissipation plate by quickly disassembling and assembling the heat dissipation plate to ensure the heat dissipation effect. Description of the Drawings

[0019] Figure 1 It is a schematic structural diagram of the whole of the present utility model;

[0020] Figure 2 It is a schematic structural diagram inside the shell of the present utility model;

[0021] Figure 3 It is a schematic structural diagram of the heat dissipation member of the present utility model;

[0022] Figure 4 It is a schematic structural diagram of the clamping member of the present utility model.

[0023] In the figure: 1, shell; 2, light-emitting plate; 3, heat dissipation plate; 4, clamping member; 5, LED backplane; 6, heat dissipation member; 7, semiconductor block; 101, heat conduction shell; 102, temperature reduction conduction box; 103, circulating heat dissipation pipe; 401, mounting block; 402, clamping block; 403, fixing plate; 404, adjusting plate; 405, spring. Detailed Embodiment

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0025] Please refer to Figures 1 - 4, the present utility model provides a technical solution: a heat dissipation device for an LED lamp, which includes a housing 1, a light-emitting board 2, a heat dissipation board 3, a clamping member 4, an LED backplane 5, a heat dissipation member 6, and a semiconductor block 7. The light-emitting board 2 is arranged at the bottom inside, the heat dissipation board 3 is arranged on one side of the housing 1, the clamping member 4 is arranged at one end of the heat dissipation board 3, the LED backplane 5 is installed on the top of the light-emitting board 2, the heat dissipation member 6 is arranged on the top of the LED backplane 5, the semiconductor block 7 is installed at one end of the heat dissipation member 6. The number of the heat dissipation boards 3 is two, which are respectively installed on both sides of the housing 1. The two heat dissipation boards 3 are used to dissipate heat from two groups of semiconductor blocks 7. The heat dissipation board 3 faces the hot end of the semiconductor block 7. The size of the heat dissipation board 3 is larger than that of the semiconductor block 7 to ensure that the heat dissipation board 3 can dissipate heat from the semiconductor block 7.

[0026] The heat dissipation member 6 includes a heat conduction shell 101, a temperature reduction conduction box 102, and a circulating heat dissipation pipe 103. The heat conduction shell 101 is fixedly connected to the top of the LED backplane 5. The temperature reduction conduction box 102 is arranged at one end inside the heat conduction shell 101. The circulating heat dissipation pipe 103 is flange-connected to one side of the temperature reduction conduction box 102. One end of the temperature reduction conduction box 102 is in contact with the cold end of the semiconductor block 7. The refrigerating liquid is moved on the LED backplane 5 through the circulating heat dissipation pipe 103 to dissipate heat from the LED lamp. The refrigerating liquid is cooled by the semiconductor block 7 inside the temperature reduction conduction box 102 to achieve the effect of circulating heat dissipation. A hole groove is opened at the top of the heat conduction shell 101 for dissipating heat from the LED backplane 5. At the same time, the hole groove increases the contact area with the air, which is convenient for improving the heat conduction effect and enables the circulating heat dissipation pipe 103 to play a better heat dissipation effect. The number of the heat dissipation members 6 is divided into two groups to ensure the heat dissipation effect on the LED backplane 5 and avoid the reduction of the heat dissipation effect caused by the overlong size of the circulating heat dissipation pipe 103. The circulating heat dissipation pipe 103 is connected in a multi-group U shape to ensure that it can be evenly distributed above the LED backplane 5 and improve the heat dissipation effect on the LED lamp.

[0027] The snap-in part 4 includes a mounting block 401, a snap block 402, a fixing plate 403, an adjusting plate 404 and a spring 405. The mounting block 401 is fixedly connected to one end of the heat dissipation plate 3. The snap block 402 is fixedly connected to one side of the mounting block 401. The fixing plate 403 is fixedly connected to one end of the snap block 402. The adjusting plate 404 is mounted on one side of the fixing plate 403. The spring 405 is fixedly connected to the inner sides of the fixing plate 403 and the adjusting plate 404. By using the adjusting plate 404 and utilizing the elasticity of the spring 405, the adjusting plate 404 is snap-connected for fixing the heat dissipation plate 3. By quickly disassembling and assembling the heat dissipation plate 3, the dust adhered to the heat dissipation plate 3 can be cleaned to ensure the heat dissipation effect. A card slot is provided on the inner wall of the housing 1, and the card slot is snap-connected to one end of the adjusting plate 404. The card slot is used to firmly fix the heat dissipation plate 3. A use slot is provided inside the mounting block 401, and one end of the adjusting plate 404 penetrates through the snap block 402 and extends into the use slot for adjusting and using the adjusting plate 404 in the use slot.

[0028] When in use, the LED lamp generates heat from the LED backplane 5. Subsequently, the semiconductor block 7 is energized, and the cold end starts to cool down, cooling the coolant passing through the cooling conduction box 102. Then, heat dissipation and cooling are carried out through the circulating heat dissipation pipe 103 to achieve the effect of dissipating heat from the LED lamp. By using the snap-in part 4, the heat dissipation plate 3 can be quickly disassembled to clean the dust that may adhere to the heat dissipation plate 3 and ensure the heat dissipation effect.

[0029] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for an LED lamp, comprising a housing (1), a light-emitting panel (2), a heat dissipation plate (3), a clamping member (4), an LED backplane (5), a heat dissipation member (6) and a semiconductor block (7), characterized in that: The light-emitting panel (2) is arranged at the bottom inside, the heat dissipation plate (3) is arranged on one side of the outer shell (1), the clamping member (4) is arranged at one end of the heat dissipation plate (3), the LED backplane (5) is installed on the top of the light-emitting panel (2), the heat dissipation member (6) is arranged on the top of the LED backplane (5), and the semiconductor block (7) is installed at one end of the heat dissipation member (6).

2. The heat dissipation device for an LED lamp according to claim 1, characterized in that: The heat dissipation member (6) includes a heat conduction shell (101), a cooling conduction box (102) and a circulating heat dissipation pipe (103). The heat conduction shell (101) is fixedly connected to the top of the LED backplane (5). The cooling conduction box (102) is arranged at one end inside the heat conduction shell (101). The circulating heat dissipation pipe (103) is flange-connected to one side of the cooling conduction box (102). One end of the cooling conduction box (102) is attached to the cold end of the semiconductor block (7).

3. The heat dissipation device for an LED lamp according to claim 2, characterized in that: The clamping member (4) includes a mounting block (401), a clamping block (402), a fixing plate (403), an adjusting plate (404) and a spring (405). The mounting block (401) is fixedly connected to one end of the heat dissipation plate (3). The clamping block (402) is fixedly connected to one side of the mounting block (401). The fixing plate (403) is fixedly connected to one end of the clamping block (402). The adjusting plate (404) is installed on one side of the fixing plate (403). The spring (405) is fixedly connected to the inner sides of the fixing plate (403) and the adjusting plate (404).

4. The heat dissipation device for an LED lamp according to claim 3, wherein: Hole grooves are formed in the top of the heat conduction shell (101).

5. The heat dissipation device for an LED lamp according to claim 4, characterized in that: The number of the heat dissipation plates (3) is two, which are respectively installed on both sides of the outer shell (1).

6. The heat dissipation device for an LED lamp according to claim 5, characterized in that: The size of the heat dissipation plate (3) is larger than the size of the semiconductor block (7).

7. The heat dissipation device for an LED lamp according to claim 6, wherein: A clamping groove is formed in the inner wall of the outer shell (1), and the clamping groove is clamped and connected to one end of the adjusting plate (404).

8. The heat dissipation device for an LED lamp according to claim 7, wherein: A use groove is formed in the mounting block (401), and one end of the adjusting plate (404) penetrates through the clamping block (402) and extends into the use groove.

9. The heat dissipation device for an LED lamp according to claim 8, wherein: The number of the heat dissipation members (6) is divided into two groups.

10. The heat dissipation device for an LED lamp according to claim 9, wherein: The circulating heat dissipation pipes (103) are connected in multiple U shapes.

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