Semiconductor temperature control device

Abstract

The utility model provides a semiconductor temperature control device which comprises a refrigerating system and a circulating system, the refrigerating system comprises a compressor, a superheater, a condenser, a subcooler, an evaporator and a first electronic expansion valve, and an outlet of the compressor, the cooling end of the superheater and the condenser are sequentially connected. An outlet of the condenser is connected with a heating end inlet of the subcooler and a cooling end inlet of the subcooler, a cooling end outlet of the subcooler is connected with an inlet of the evaporator, and an outlet of the evaporator and the heating end outlet of the subcooler are both connected with a heating end inlet of the superheater and an inlet of the compressor. A heating end outlet of the superheater is connected with an inlet of the compressor, the first electronic expansion valve is arranged between a cooling end outlet of the supercooler and the evaporator, and the circulating system is provided with a load and connected with the evaporator. According to the semiconductor temperature control device, accurate temperature control can be achieved, output is stable, and energy consumption is small.

Description

Technical Field

[0001] This application relates to the field of temperature control technology. Specifically, it relates to a semiconductor temperature control device. Background Art

[0002] During the production process of chips, it is necessary to provide a coolant with stable temperature to the load end. At the same time, due to the different temperature requirements of the coolant required in the chip processing process according to different processes, and the load changes are also diverse in specific processes, a temperature control system that can quickly switch the temperature and stably output the supply liquid temperature is required. The temperature control devices of the prior art cannot achieve stable, low-energy consumption, and precise temperature control. Summary of the Utility Model

[0003] The objectives of this application include, for example, providing a semiconductor temperature control device that can achieve precise temperature control, stable output, and low energy consumption.

[0004] This application can be implemented as follows:

[0005] This application provides a semiconductor temperature control device, including a refrigeration system and a circulation system. The refrigeration system includes a compressor, a superheater, a condenser, a subcooler, an evaporator, and a first electronic expansion valve. The outlet of the compressor, the cooling end of the superheater, and the condenser are connected in sequence. The outlet of the condenser is respectively connected to the inlet of the heating end and the inlet of the cooling end of the subcooler. The outlet of the cooling end of the subcooler is connected to the inlet of the evaporator. The outlets of the evaporator and the heating end of the subcooler are both connected to the inlet of the heating end of the superheater and the inlet of the compressor. The outlet of the heating end of the superheater is connected to the inlet of the compressor. The first electronic expansion valve is arranged between the outlet of the cooling end of the subcooler and the evaporator. The circulation system is provided with a load and is connected to the evaporator.

[0006] Thus, for the semiconductor temperature control device according to the embodiments of this application, by setting the subcooler and the superheater, the refrigerant flowing out of the condenser can respectively flow to the heating end and the cooling end of the subcooler. By controlling the amount of refrigerant flowing to the heating end and the cooling end of the subcooler, the cooling effect can be controlled. Moreover, through further subcooling at the cooling end of the subcooler, it can not only provide favorable conditions for subsequent throttling and pressure reduction, but also quickly reduce the evaporation temperature of the evaporator during instantaneous switching, providing a larger heat transfer temperature difference. At the same time, heat exchange between the heating end and the cooling end of the subcooler can also reduce energy consumption. Through the cooling end of the superheater, the refrigerant discharged from the compressor can be cooled first to reduce the condensation load of the subsequent condenser. Moreover, heat exchange between the cooling end and the heating end of the superheater can also absorb heat and exchange heat with the refrigerant flowing to the inlet of the compressor, increasing the refrigerant vapor content and reducing the liquid content, which is beneficial for subsequent gas-liquid separation and preventing liquid slugging of the compressor.

[0007] Thus, the semiconductor temperature control device according to the embodiments of the present application can achieve further precise temperature control, so that the difference between the temperature reaching the load end and the target temperature is controlled within ±0.1°C; it can also achieve rapid temperature switching, and can switch from the previous target value to the current target value within a short time, such as about 3 minutes, when the target temperature of the load demand changes; and it operates stably with low energy consumption.

[0008] According to some embodiments of the present application, the semiconductor temperature control device further includes a control valve. The control valve is at least provided with an inlet, a first outlet and a second outlet. The outlet of the heating end of the subcooler and the outlet of the evaporator are both connected to the inlet. The first outlet is connected to the inlet of the heating end of the superheater, and the second outlet and the outlet of the heating end of the superheater are both connected to the inlet of the compressor. Thus, the refrigerant flowing out from the outlet of the heating end of the subcooler and the evaporator can converge and flow to the inlet of the control valve, and can flow to the inlet of the heating end of the superheater through the first outlet, and then to the inlet of the compressor, or flow to the inlet of the compressor through the second outlet. Through the control valve, the connection between the outlet of the heating end of the subcooler, the outlet of the evaporator, the inlet of the heating end of the superheater and the inlet of the compressor can be realized.

[0009] According to some examples of the present application, the openings of both the first outlet and the second outlet are adjustable. Thus, the amount of refrigerant flowing through the first outlet and the second outlet can be adjusted, and further the amount of refrigerant flowing through the heating end of the superheater to the compressor and the amount of refrigerant flowing to the compressor without passing through the superheater can be controlled, thereby improving the temperature control effect.

[0010] According to some embodiments of the present application, the control valve is a three-way valve, and the inlet is selectively communicated with the first outlet and the second outlet. The three-way valve has a simple structure and is convenient to control.

[0011] According to some embodiments of the present application, the semiconductor temperature control device further includes a gas-liquid separator. The outlet of the heating end of the superheater and the second outlet are both connected to the gas-liquid separator, and are connected to the inlet of the compressor through the gas-liquid separator. Thus, the gas-liquid separation of the refrigerant can be realized by the gas-liquid separator, so that the gaseous refrigerant flows to the inlet of the compressor, preventing the problem of liquid slugging of the compressor.

[0012] According to some embodiments of the present application, the semiconductor temperature control device further includes a second electronic expansion valve. The second electronic expansion valve is arranged between the condenser and the inlet of the heating end of the subcooler to adjust the refrigerant flowing to the heating end of the subcooler. It can quickly control the refrigerant flow rate to control the temperature control effect during instantaneous switching, which can not only reduce the complexity of the semiconductor temperature control device, but also improve the utilization rate of the refrigerant and reduce unnecessary energy consumption.

[0013] According to some embodiments of the present application, the opening degree of the second electronic expansion valve is adjustable. Thus, the refrigerant amount at the heating end of the subcooler can be adjusted according to the actual working conditions, and further, the refrigerant amount that does not flow through the evaporator and the subcooling effect at the cooling end of the superheater can be controlled and adjusted, thereby further improving the temperature control effect.

[0014] According to some embodiments of the present application, the semiconductor temperature control device further includes a first temperature sensor and a first pressure sensor, and both the first temperature sensor and the first pressure sensor are arranged adjacent to the inlet of the compressor. For detecting the pressure and temperature of the refrigerant flowing into the inlet of the compressor, so as to be used as parameters for the semiconductor temperature control device to perform temperature control.

[0015] According to some embodiments of the present application, the semiconductor temperature control device further includes at least one of a second temperature sensor and a second pressure sensor, and both the second temperature sensor and the second pressure sensor are arranged between the outlet at the cooling end of the superheater and the condenser; for measuring the temperature and pressure of the refrigerant flowing into the condenser, as the parameter basis for the semiconductor device to perform temperature control.

[0016] According to some embodiments of the present application, the circulation system includes a water tank, a water pump, a heat exchanger and the load, the evaporator is connected between the load and the water tank, a third temperature sensor is arranged at the outlet of the water tank, and a fourth temperature sensor is arranged at the outlet of the heat exchanger. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application, and thus should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic structural diagram of a semiconductor temperature control device according to an embodiment of the present application;

[0019] Figure 2 It is a schematic flowchart of a temperature control method of a semiconductor temperature control device according to an embodiment of the present application;

[0020] Reference Numerals:

[0021] 1000: Semiconductor temperature control device;

[0022] 100: Refrigeration system, 200: Circulation system;

[0023] 11: Compressor, 12: Superheater, 121: Cooling-end inlet of the superheater, 122: Cooling-end outlet of the superheater, 123: Heating-end inlet of the superheater, 124: Heating-end outlet of the superheater, 13: Condenser, 14: Liquid receiver, 15: Subcooler, 151: Cooling-end inlet of the subcooler, 152: Cooling-end outlet of the subcooler, 153: Heating-end inlet of the subcooler, 154: Heating-end outlet of the subcooler, 16: Evaporator, 161: Inlet of the evaporator, 162: Outlet of the evaporator, 17: Gas-liquid separator, 18: Control valve, 181: Inlet, 182: First outlet, 183: Second outlet;

[0024] 21: First electronic expansion valve, 22: Second electronic expansion valve;

[0025] 31: First temperature sensor, 32: First pressure sensor, 33: Second temperature sensor, 34: Second pressure sensor, 35: Third temperature sensor, 36: Fourth temperature sensor;

[0026] 41: Water tank, 42: Water pump, 43: Heat exchanger, 44: Load. Detailed implementation manners

[0027] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Usually, the components of the embodiments of the present application described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the claimed present application, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the scope of protection of the present application.

[0029] It should be noted that: Similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0030] In the description of the present application, it should be noted that if terms such as "upper", "lower", "inner", "outer", etc. are used to indicate the orientation or positional relationship, it is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the utility model product is usually placed during use. This is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application.

[0031] In addition, if terms such as "first", "second", etc. are only used for distinguishing descriptions, they cannot be understood as indicating or implying relative importance.

[0032] It should be noted that, without conflict, the features in the embodiments of the present application can be combined with each other.

[0033] As Figure 1 shown, the semiconductor temperature control device 1000 according to an embodiment of the present application includes a refrigeration system 100 and a circulation system 200. The circulation system 200 is provided with a load 44. The refrigeration system 100 is used for temperature control of the coolant of the load 44. The semiconductor temperature control device 1000 can achieve precise temperature control, stable output and low energy consumption.

[0034] As Figure 1 shown, the refrigeration system 100 may include a compressor 11, a superheater 12, a condenser 13, a subcooler 15 and an evaporator 16. The outlet of the compressor 11 is sequentially connected to the cooling end of the superheater 12 and the condenser 13. The outlet of the condenser 13 is respectively connected to the heating end inlet 153 and the cooling end inlet 151 of the subcooler 15. The cooling end outlet 152 of the subcooler 15 is connected to the evaporator 16. Both the evaporator 16 and the heating end outlet 154 of the subcooler 15 are respectively connected to the heating end inlet 123 of the superheater 12 and the inlet of the compressor 11. The heating end outlet 124 of the superheater 12 is connected to the inlet of the compressor 11. The circulation system 200 is provided with a load 44 and is connected to the evaporator 16.

[0035] Specifically, the superheater 12 has a cooling end and a heating end. Heat exchange can be carried out between the cooling end and the heating end of the superheater 12. Among them, the outlet of the compressor 11 is connected to the cooling end inlet 121 of the superheater 12, and the cooling end outlet 122 of the superheater 12 is connected to the inlet of the condenser 13. In this way, the refrigerant discharged from the compressor 11 flows to the condenser 13 after being cooled by the cooling end of the superheater 12. Therefore, before the refrigerant discharged from the compressor 11 flows to the condenser 13, it can be cooled by the superheater 12, so as to reduce the condensation load of the condenser 13, ensure the condensation effect and the service life of the condenser 13, and reduce energy consumption.

[0036] The subcooler 15 also has a heating end and a cooling end. Heat exchange can be carried out between the heating end and the cooling end of the subcooler 15. The outlet of the condenser 13 is respectively connected to the heating end inlet 153 and the cooling end inlet 151 of the subcooler 15. The cooling end outlet 152 of the subcooler 15 is connected to the inlet 161 of the evaporator 16. The outlet 162 of the evaporator 16 and the heating end outlet 154 of the subcooler 15 are respectively connected to the heating end inlet 123 of the superheater 12 and the inlet of the compressor 11, that is, the outlet 162 of the evaporator 16 is respectively connected to the heating end of the superheater 12 and at the same time connected to the inlet of the compressor 11. The heating end outlet 154 of the subcooler 15 is also respectively connected to the heating end inlet 123 of the superheater 12 and at the same time connected to the inlet of the compressor 11. The refrigerant flowing out of the heating ends of the evaporator 16 and the subcooler 15 converges and then flows to the heating end inlet 123 of the superheater 12 and / or the inlet of the compressor 11.

[0037] In this way, part of the refrigerant flowing out of the condenser 13 can flow through the cooling end of the subcooler 15 for further subcooling and then flow to the evaporator 16; part flows to the heating end of the subcooler 15, exchanges heat with the cooling end of the subcooler 15 and then flows out, and converges with the refrigerant flowing out of the evaporator 16. The converged refrigerant can partly flow to the heating end of the superheater 12, exchange heat with the cooling end of the superheater 12 and then flow to the inlet of the compressor 11, and part directly flows to the inlet of the compressor 11. Thus, through the cooling end of the subcooler 15, further subcooling of the refrigerant flowing to the evaporator 16 can be realized, providing favorable conditions for subsequent throttling and pressure reduction, being able to rapidly reduce the evaporation temperature of the evaporator 16 during instantaneous switching, providing a larger heat exchange temperature difference to further improve the refrigeration effect and increase the refrigeration rate. At the same time, using the refrigerant to exchange heat between the heating end and the cooling end of the subcooler 15 can also reduce energy consumption, and by adjusting the amount of refrigerant flowing to the heating end and the cooling end of the subcooler 15, the amount of refrigerant flowing through the evaporator 16 and the temperature of the refrigerant flowing to the compressor 11 can also be controlled to achieve further temperature control.

[0038] Moreover, part of the refrigerant passing through the heating ends of the evaporator 16 and the subcooler 15 converges and then flows to the heating end of the superheater 12 for endothermic heat exchange, and then flows to the inlet of the compressor 11, which can also increase the content of refrigerant vapor flowing to the inlet of the compressor 11, reduce the liquid in the refrigerant, prevent the liquid hammer phenomenon of the compressor 11, and can also exchange heat for cooling with the refrigerant flowing through the cooling end of the superheater 12 by the exhaust gas of the compressor 11 to reduce energy consumption.

[0039] The amount of refrigerant flowing from the condenser 13 to the heating end and the cooling end of the subcooler 15 can be adjusted according to the actual working conditions, and the refrigerant flowing to the heating end of the superheater 12 and directly flowing to the compressor 11 can also be adjusted according to the actual working conditions, so as to not only achieve precise control of the refrigeration effect, but also meet the refrigeration demand with lower energy consumption.

[0040] The first electronic expansion valve 21 is provided between the outlet 152 of the cooling end of the subcooler 15 and the evaporator 16 to throttle and depressurize the refrigerant flowing to the evaporator 16. The refrigerant flowing out of the condenser 13 can be further subcooled at the cooling end of the subcooler 15 before flowing to the first electronic expansion valve 21, which can also provide favorable conditions for the throttling and depressurization of the first electronic expansion valve 21.

[0041] Thus, in the semiconductor temperature control device 1000 according to the embodiment of the present application, by providing the subcooler 15 and the superheater 12, the refrigerant flowing out of the condenser 13 can flow to the heating end and the cooling end of the subcooler 15 respectively. By controlling the amount of refrigerant flowing to the heating end and the cooling end of the subcooler 15, the cooling effect can be controlled. Moreover, through further subcooling at the cooling end of the subcooler 15, it can not only provide favorable conditions for subsequent throttling and depressurization, but also rapidly reduce the evaporation temperature of the evaporator 16 during instantaneous switching, providing a larger heat transfer temperature difference. At the same time, heat exchange occurs between the heating end and the cooling end of the subcooler 15, which can also reduce energy consumption.

[0042] The cooling end of the superheater 12 can cool the refrigerant discharged by the compressor 11 first to reduce the condensation load of the subsequent condenser 13. Moreover, heat exchange occurs between the cooling end and the heating end of the superheater 12, which can also absorb heat and exchange heat with the refrigerant flowing into the inlet of the compressor 11, increasing the refrigerant vapor content and reducing the liquid content, which is beneficial to subsequent gas-liquid separation and preventing liquid slugging of the compressor 11.

[0043] Thus, the semiconductor temperature control device 1000 according to the embodiment of the present application can achieve further precise temperature control, so that the difference between the temperature reaching the load 44 end and the target temperature is controlled within ±0.1 °C; it can also achieve rapid temperature switching, and when the load 44 demands a target temperature switch, it can switch from the previous target value to the current target value within a short time, such as about 3 minutes; and it operates stably with low energy consumption.

[0044] In some embodiments of the present application, as Figure 1 shown, the semiconductor temperature control device 1000 according to the embodiment of the present application may further include a control valve 18. The control valve 18 is at least provided with an inlet 181 and a first outlet 182 and a second outlet 183 communicating with the inlet. The outlet 154 of the heating end of the subcooler 15 and the outlet 162 of the evaporator 16 are both connected to the inlet 181. The first outlet 182 is connected to the inlet 123 of the heating end of the superheater 12, and the second outlet 183 and the outlet 124 of the heating end of the superheater 12 are both connected to the inlet of the compressor 11.

[0045] Thus, the refrigerant flowing out from the heating end outlet 154 of the subcooler 15 and the evaporator 16 can converge and flow towards the inlet 181 of the control valve 18, and can flow towards the heating end of the superheater 12 through the first outlet 182, and then flow towards the inlet of the compressor 11, or directly flow towards the inlet of the compressor 11 through the second outlet 183. By means of the control valve 18, the connection among the heating end outlet 154 of the subcooler 15, the outlet 162 of the evaporator 16, the heating end inlet 123 of the superheater 12, and the inlet of the compressor 11 can be realized.

[0046] Optionally, the opening degrees of the first outlet 182 and the second outlet 183 are adjustable. By adjusting the opening degrees of the first outlet 182 and the second outlet 183, the amount of refrigerant flowing through the first outlet 182 and the second outlet 183 can be adjusted, thereby controlling the amount of refrigerant flowing through the heating end of the superheater 12 to the compressor 11 and the amount of refrigerant flowing to the compressor 11 without passing through the superheater 12, so as to improve the temperature control effect. The opening degrees of the first outlet 182 and the second outlet 183 can be adjusted between the fully open state and the fully closed state, and the opening degrees of the first outlet 182 and the second outlet 183 can be adjusted according to the actual working conditions. For example, at low load, the refrigerant can mainly flow through the heating end of the subcooler 15, the inlet 181 of the control valve 18, the first outlet 182, and the heating end of the superheater 12 to the compressor 11.

[0047] In some specific examples of the present application, the control valve 18 can be a three-way valve, and the inlet 181 is selectively communicated with the first outlet 182 and the second outlet 183. That is, when the first outlet 182 is opened, the second outlet 183 is closed, and the inlet 181 is communicated with the first outlet 182; when the second outlet 183 is opened, the first is closed, and the inlet 181 is communicated with the second outlet 183. The three-way valve has a simple structure and is convenient to control.

[0048] According to some embodiments of the present application, the semiconductor temperature control device 1000 of the present application can further include a gas-liquid separator 17. The heating end outlet 124 of the superheater 12 and the second outlet are both connected to the gas-liquid separator 17, and are connected to the inlet of the compressor 11 through the gas-liquid separator 17. In this way, the refrigerant flowing through the superheater 12 and the second outlet all flows towards the gas-liquid separator 17. After gas-liquid separation by the gas-liquid separator 17, the gaseous refrigerant flows towards the inlet of the compressor 11, preventing the liquid hammer problem of the compressor 11.

[0049] As Figure 1 shown, the semiconductor temperature control device 1000 can further include a liquid storage device 14. The liquid storage device 14 is arranged between the condenser 13 and the subcooler 15. The refrigerant condensed by the condenser 13 can be stored in the liquid storage device 14. By providing the liquid storage device 14, the refrigerant circulation amount can be adjusted, and the excess refrigerant does not need to be stored in the condenser 13 to affect the condensation of the condenser 13, so as to improve the condensation effect of the condenser 13, reduce energy consumption and load.

[0050] In some embodiments of the present application, the semiconductor temperature control device 1000 may further include a second electronic expansion valve 22. The second electronic expansion valve 22 is disposed between the condenser 13 and the inlet 153 of the heating end of the subcooler 15. That is, part of the refrigerant condensed by the condenser 13 can flow to the cooling end of the subcooler 15, and then flow to the evaporator 16. Part of the refrigerant can flow to the heating end of the subcooler 15 after throttling and pressure reduction by the second electronic expansion valve 22. This is beneficial to the heat exchange between the heating end and the cooling end of the subcooler 15, and can also control the amount of refrigerant flowing through. The refrigerant flow rates at the heating end and the cooling end of the subcooler 15 can be adjusted in a timely manner according to the actual working conditions. When switching instantaneously, the refrigerant flow rate can be quickly controlled to control the temperature control effect. This can not only reduce the complexity of the semiconductor temperature control device 1000, but also improve the utilization rate of the refrigerant and reduce unnecessary energy consumption. The opening degree of the second electronic expansion valve 22 is adjustable, so that the amount of refrigerant at the heating end of the subcooler 15 can be adjusted according to the actual working conditions, and further control the amount of refrigerant that does not flow through the evaporator 16 and the subcooling effect at the cooling end of the superheater 12, and further improve the temperature control effect.

[0051] In some embodiments of the application, the semiconductor temperature control device 1000 may further include a first temperature sensor 31 and a first pressure sensor 32. Both the first temperature sensor 31 and the first pressure sensor 32 are disposed adjacent to the inlet of the compressor 11 for detecting the pressure and temperature of the refrigerant flowing into the inlet of the compressor 11, which are used as parameters for the semiconductor temperature control device 1000 to perform temperature control; in Figure 1 In the illustrated example, both the first temperature sensor 31 and the second temperature sensor 33 are disposed on the connecting pipeline between the compressor 11 and the gas-liquid separator 17.

[0052] In some embodiments, the semiconductor temperature control device 1000 may further include at least one of a second temperature sensor 33 and a second pressure sensor 34. For example, the semiconductor temperature device may be provided with a second temperature sensor 33 or a second pressure sensor 34, or as Figure 1 shown, the semiconductor temperature control device 1000 may be provided with both a second temperature sensor 33 and a second pressure sensor 34 at the same time; wherein both the second temperature sensor 33 and the second pressure sensor 34 are disposed between the outlet 122 of the cooling end of the superheater 12 and the condenser 13 for measuring the temperature and pressure of the refrigerant flowing into the condenser 13, which are used as the parameter basis for the semiconductor device to perform temperature control.

[0053] In some embodiments of the present application, the circulation system 200 may include a water tank 41, a water pump 42, a heat exchanger 43 and a load 44. Both the load 44 and the water tank 41 are connected to the evaporator 16, as Figure 1As shown, a water tank 41, a water pump 42, a heat exchanger 43, a load 44, and an evaporator 16 are connected in sequence. The water pump 42 is arranged between the water tank 41 and the heat exchanger 43. It can be understood that the water pump 42 can also be arranged at other positions in the circulation system 200. For example, the water pump 42 can also be arranged between the evaporator 16 and the water tank 41, as long as the water pump 42 can provide power for the circulating flow of the coolant.

[0054] After the coolant is heat-exchanged and cooled by the evaporator 16, it flows to the water tank 41 and can be stored in the water tank 41. The coolant in the water tank 41 can flow through the heat exchanger 43 to the load 44. Among them, the heat exchanger 43 can be used to cool or heat the coolant. In some examples, the heat exchanger 43 can be a heating device to be able to heat the coolant to reach the required temperature of the load 44. In this way, by setting the heat exchanger 43, the temperature of the coolant can be further controlled, so as to realize precise temperature control of the coolant flowing to the load 44.

[0055] As Figure 1 shown, a third temperature sensor 35 is provided at the outlet of the water tank 41, and a fourth temperature sensor 36 is provided at the outlet of the heat exchanger 43. The third temperature sensor 35 is used to detect the temperature of the coolant at the outlet of the water tank 41, and the fourth temperature sensor 36 is used to detect the temperature of the coolant after heat exchange by the heat exchanger 43. The temperature values detected by the third temperature sensor 35 and the fourth temperature sensor 36 can be used as the parameter basis for the adjustment and control of the refrigeration system 100 and the heat exchanger 43. For example, the temperature value detected by the third temperature sensor 35 can be compared with a preset temperature value to adjust the refrigerant flowing through the evaporator 16, and then adjust the refrigeration effect of the evaporator 16 on the coolant to reach the required temperature of the load 44. According to the detected temperature value of the fourth temperature sensor 36, the heat exchange power or heat exchange area of the heat exchanger 43 can be adjusted to realize the temperature adjustment of the coolant flowing through the heat exchanger 43, so that the coolant flowing to the load 44 via the heat exchanger 43 reaches the set required temperature.

[0056] Next, in combination with the attached Figure 1 and Figure 2 describe the semiconductor temperature control method according to an embodiment of the present application. The semiconductor temperature control method can be used for the semiconductor temperature control device 1000 in the above embodiment.

[0057] Specifically, as Figure 1 and Figure 2 shown, the semiconductor temperature control method according to an embodiment of the present application may include the following steps:

[0058] Detect the outlet temperature of the water tank 41, and judge whether the difference X between the outlet temperature of the water tank 41 and the set temperature satisfies a ≤ X ≤ b. Specifically, the temperature detector can be used to detect the temperature of the coolant at the outlet of the water tank 41 to obtain the measured temperature value PV0. AsFigure 1 As shown, a third temperature sensor 35 is provided on the connecting pipeline at the outlet of the water tank 41 to detect the temperature and obtain the measured temperature value PV0; X is the difference between the measured temperature value PV0 and the set temperature value SV0, and it is determined whether the difference X is within the temperature range of a ≤ X ≤ b, where a ≤ 0 and b ≥ 0.

[0059] When X satisfies a ≤ X ≤ b, the intake pressure and intake temperature of the compressor 11 are detected, and according to the pressure-enthalpy diagram, the intake pressure is converted into the suction temperature, and the suction temperature is compared with the intake temperature value, and it is determined whether the difference Y satisfies c ≤ Y ≤ d, where c ≤ 0 and d ≥ 0; specifically, when the difference X between the outlet temperature of the water tank 41 and the set temperature is within a suitable temperature range, the intake pressure and intake temperature at the inlet of the compressor 11 are detected to judge the suction superheat degree of the refrigerant. There is a one-to-one correspondence between the pressure and temperature of the refrigerant in the refrigeration system 100. For a specific refrigerant, at a determined pressure, there is a specific saturated suction temperature. According to the embedded pressure-enthalpy diagram, the intake pressure can be converted into the suction temperature PV2. Here, the intake temperature is the actual temperature of the detected refrigerant, and there is a certain difference between the intake temperature and the suction temperature. The difference between the suction temperature PV2 and the intake temperature PV1 is Y, that is, the suction superheat degree, and it is determined whether Y satisfies c ≤ Y ≤ d.

[0060] When Y satisfies c ≤ Y ≤ d, the opening of the first electronic expansion valve 21 is corrected step by step to further achieve precise temperature control of the refrigeration effect; in some examples, the steps of gradient correction of the first electronic expansion valve 21 may include: when the temperature value detected by the third temperature sensor 35 is lower than the set temperature value, the opening of the first electronic expansion valve 21 is reduced; when the temperature value detected by the third temperature sensor 35 is higher than the set temperature value, the opening of the first electronic expansion valve 21 is increased.

[0061] When Y does not satisfy c ≤ Y ≤ d and Y > d, the amount of refrigerant flowing from the condenser 13 to the heating end of the subcooler 15 is increased. For example, a second electronic expansion valve 22 is provided between the condenser 13 and the inlet 153 of the heating end of the subcooler 15. When Y > d, it means that the suction superheat degree is relatively large. At this time, the opening of the second electronic expansion valve 22 is controlled to increase to increase the amount of refrigerant flowing to the heating end of the subcooler 15. On the one hand, this can reduce the amount of refrigerant flowing to the evaporator 16 to reduce the supply amount entering the evaporator 16. On the other hand, the temperature of the refrigerant flowing to the heating end of the subcooler 15 is low. After flowing out from the heating end of the subcooler 15, it converges with the high-temperature refrigerant flowing out of the evaporator 16, and can also increase the amount of low-temperature refrigerant after mixing, thereby being able to reduce the suction temperature and superheat degree.

[0062] When Y < c, the amount of refrigerant flowing to the heating end of the superheater 12 is adjusted. For example, the amount of refrigerant flowing to the heating end of the superheater 12 can be increased, and the amount of refrigerant flowing directly to the intake port of the compressor 11 without passing through the superheater 12 can be reduced, so as to increase the suction temperature and superheat degree, thereby achieving the purpose of adjusting the suction superheat degree, so that Y can satisfy c ≤ Y ≤ d.

[0063] Further, the outlet 162 of the evaporator 16 and the heating end outlet 154 of the subcooler 15 are both connected to the inlet 181 of the three-way valve. The two outlets of the three-way valve (i.e., the first outlet 182 and the second outlet 183 as shown) are respectively connected to the heating end inlet 123 of the superheater 12 and the inlet of the compressor 11. The inlet 181 of the three-way valve can be communicated with any one of the two outlets. When Y < c, the inlet 181 is communicated with the first outlet 182 connected to the heating end inlet 123 of the superheater 12. In other cases, the inlet 181 of the three-way valve is communicated with the second outlet 183. Figure 1 When X does not satisfy a ≤ X ≤ b, the opening degree of the first electronic expansion valve 21 is adjusted so that X satisfies a ≤ X ≤ b. Specifically, it can be adjusted by comparing the temperature at the outlet of the water tank 41 detected by the third temperature sensor 35 with the set temperature value and controlling the opening degree of the first electronic expansion valve 21 through the first PID controller, or it can also be adjusted by controlling the rotational speed of the compressor 11 through the second PID controller. For example, when the temperature value detected by the third temperature sensor 35 is lower than the set temperature, the rotational speed of the compressor 11 decreases, and vice versa, the rotational speed of the compressor 11 increases.

[0064] In some embodiments of the present application, when X > b, the opening degree of the second electronic expansion valve 22 is adjusted. When X > U, the opening degree of the second electronic expansion valve 22 is increased, and heat exchange occurs between the heating end and the cooling end of the subcooler 15. The second electronic expansion valve 22 has a throttling effect. Increasing its opening degree can increase the further subcooling effect on the refrigerant flowing to the evaporator 16. When X < U, the opening degree of the second electronic expansion valve 22 is decreased, reducing the heat exchange between the heating end and the cooling end of the subcooler 15 and reducing the subcooling effect on the refrigerant flowing to the evaporator 16. U > b. In this way, on the basis of the adjustment of the first electronic expansion valve 21, the opening degree of the second electronic expansion valve 22 is controlled and adjusted by the third PID controller at the same time for further temperature adjustment to meet specific temperature control requirements.

[0065]

[0066] ​According to the specific application of the semiconductor temperature control method according to the embodiments of the present application, under high-temperature working conditions, most of the refrigerant returns to the inlet of the compressor 11 through the second electronic expansion valve 22. At this time, the second electronic expansion valve 22 is in an open state, but the opening degree of the first electronic expansion valve 21 is small. By adjusting the opening degree of the second electronic expansion valve 22, the evaporation temperature of the refrigerant reaching the evaporator 16 will decrease, but the flow rate is small, so the operation of the system under high-temperature working conditions can still be ensured;

[0067] When operating under low-temperature working conditions, the second electronic expansion valve 22 and the first electronic expansion valve 21 are both opened. That is, a part of the refrigerant flows through the second electronic expansion valve 22 and returns to the compressor 11, and most of it enters the evaporator 16 through the first electronic expansion valve 21 for evaporation heat exchange. Although the second electronic expansion valve 22 will divert the refrigerant at this time, due to its throttling effect, the refrigerant entering the first electronic expansion valve 21 will be subcooled, so that a refrigerant with a lower temperature can be provided to the evaporator 16 while ensuring a certain amount of refrigerant. By adjusting its opening degree, the degree of subcooling of the refrigerant flowing through the first electronic expansion valve 21 can also be adjusted.

[0068] Thus, the opening degrees of the first electronic expansion valve 21 and the second electronic expansion valve 22 can be adjusted under both high-temperature and low-temperature working conditions, which can ensure the operation of the system working conditions and can also achieve further fine-tuning.

[0069] As Figure 1 shown, a fourth temperature sensor 36 is also provided between the heat exchanger 43 and the load 44. According to the comparison between the measured value PV3 of the fourth temperature sensor 36 and the set temperature value SV1, the heating power of the heat exchanger 43 is controlled through the fourth PID control. For example, when the difference is larger, the heating power output of the heat exchanger 43 is controlled to increase by keeping the regulator voltage unchanged and increasing the current, and vice versa, the heating power output of the heat exchanger 43 decreases.

[0070] Thus, according to the semiconductor temperature control method according to the embodiments of the present application, by detecting the temperature and pressure, obtaining the difference between the detected value and the preset value, and judging according to the comparison of the difference with the set difference range and the detected value and the preset value, the opening degree of the first electronic expansion valve 21 and the refrigerant amounts at the heating end of the superheater 12, the heating end and the cooling end of the subcooler 15 are adjusted to achieve precise temperature control. At the same time, according to the analysis and judgment of the data values of the temperature and pressure, the rotation speed of the compressor 11 and the power of the heat exchanger 43 are controlled to further precisely control the temperature.

[0071] As described above, it is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claimed rights.

Claims

1. A semiconductor temperature control device (1000), characterized in that, It includes a refrigeration system (100) and a circulation system (200). The refrigeration system (100) includes a compressor (11), a superheater (12), a condenser (13), a subcooler (15), an evaporator (16) and a first electronic expansion valve (21). The outlet of the compressor (11), the temperature reduction end of the superheater (12) and the condenser (13) are connected in sequence. The outlet of the condenser (13) is respectively connected to the temperature increase end inlet (153) and the temperature reduction end inlet (151) of the subcooler. The temperature reduction end outlet (152) of the subcooler is connected to the inlet (161) of the evaporator. The outlet (162) of the evaporator and the temperature increase end outlet (154) of the subcooler are both connected to the temperature increase end inlet (123) of the superheater and the inlet of the compressor (11). The temperature increase end outlet (124) of the superheater is connected to the inlet of the compressor (11). The first electronic expansion valve (21) is arranged between the temperature reduction end outlet (152) of the subcooler and the evaporator (16). The circulation system (200) is provided with a load (44) and is connected to the evaporator (16).

2. The semiconductor temperature control device (1000) according to claim 1, characterized in that, It further includes a control valve (18). The control valve (18) is at least provided with an inlet (181), a first outlet (182) and a second outlet (183). The temperature increase end outlet (154) of the subcooler and the outlet (162) of the evaporator are both connected to the inlet (181). The first outlet (182) is connected to the temperature increase end inlet (123) of the superheater. The second outlet (183) and the temperature increase end outlet (124) of the superheater are both connected to the inlet of the compressor (11).

3. The semiconductor temperature control device (1000) according to claim 2, wherein The opening degrees of both the first outlet (182) and the second outlet (183) are adjustable.

4. The semiconductor temperature control device (1000) according to claim 2, characterized in that, The control valve (18) is a three-way valve, and the inlet (181) is selectively conducted with the first outlet (182) and the second outlet (183).

5. The semiconductor temperature control device (1000) according to claim 2, wherein, It further includes a gas-liquid separator (17). The temperature increase end outlet (124) of the superheater and the second outlet (183) are both connected to the gas-liquid separator (17), and are connected to the inlet of the compressor (11) through the gas-liquid separator (17).

6. The semiconductor temperature control device (1000) according to claim 1, characterized in that, It further includes a second electronic expansion valve (22). The second electronic expansion valve (22) is arranged between the condenser (13) and the temperature increase end inlet (153) of the subcooler to adjust the refrigerant flowing to the temperature increase end of the subcooler.

7. The semiconductor temperature control device (1000) according to claim 6, characterized in that, The opening degree of the second electronic expansion valve (22) is adjustable.

8. The semiconductor temperature control device (1000) according to claim 1, characterized in that, It further includes a first temperature sensor (31) and a first pressure sensor (32). The first temperature sensor (31) and the first pressure sensor (32) are both arranged adjacent to the inlet of the compressor (11).

9. The semiconductor temperature control device (1000) according to claim 1, characterized in that, It further includes at least one of a second temperature sensor (33) and a second pressure sensor (34). The second temperature sensor (33) and the second pressure sensor (34) are both arranged between the temperature reduction end outlet (122) of the superheater and the condenser (13).

10. The semiconductor temperature control device (1000) according to claim 1, characterized in that, The circulation system (200) includes a water tank (41), a water pump (42), a heat exchanger (43) and the load (44). The evaporator (16) is connected between the load (44) and the water tank (41). A third temperature sensor (35) is provided at the outlet of the water tank (41), and a fourth temperature sensor (36) is provided at the outlet of the heat exchanger (43).

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