Immersion type liquid cooling heat dissipation projector

Abstract

A soaking type liquid cooling heat dissipation projector belongs to the technical field of projection and comprises a rear Fresnel lens, heat insulation glass, an LCD (liquid crystal display), a front Fresnel lens, a cavity frame and a semiconductor cooling sheet. The rear Fresnel lens and the front Fresnel lens are arranged on the cavity frame, and the rear Fresnel lens, the front Fresnel lens and the cavity frame jointly form a sealed cavity in a surrounding mode. The heat insulation glass and the LCD are arranged in the sealed cavity; cooling liquid is arranged in the sealing cavity; at least one semiconductor cooling sheet is arranged on the cavity frame, and a refrigeration surface of the semiconductor cooling sheet is attached to the cavity frame. According to the invention, the heat of the LCD can be taken away and the operation at the temperature of 70 DEG C or below can be realized under the condition that the LCD is sealed by the projector shell, and meanwhile, the temperature of the LCD is relatively uniform. And the service life of the projector is maintained under the condition that the brightness and the color uniformity are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of projection, and specifically relates to an immersion liquid-cooled heat dissipation projector. Background Art

[0002] In recent years, projectors have developed rapidly in the technical fields of DMD / lcos / LCD, etc. According to authoritative data, consumers' pursuit of the comfortable viewing experience brought by projectors is still on the rise. Among them, single LCD projectors have obvious price advantages and significant growth rates. Currently, if LCD wants to improve the picture brightness to 250lm or even higher, the first problem to be solved is the LCD heat dissipation problem. Currently, the method for LCD heat dissipation is to use a fan to dissipate heat from the LCD projector. The internal part of the projector circulates through a set air duct. The fan blows cold air towards the LCD, takes the heat of the LCD to the inner wall fins of the metal radiator, and at the same time reduces the temperature of the internal circulating air. The heat is transferred to the outside of the radiator through the metal radiator, and the cold air brought by the external fan of the projector takes away the heat outside. Because the entire LCD surface generates heat relatively evenly, when the cold air flows from one side of the LCD to the other side, the overall temperature of the LCD will show uneven heat dissipation, affecting the reaction of the LCD liquid crystal to the electronic signal, and ultimately making the projection picture brightness and color uneven. Therefore, there is an urgent need for a new solution in the prior art to solve the above problems. Content of the Utility Model

[0003] The problem to be solved by the utility model is how to provide a projector with better cooling effect.

[0004] An immersion liquid-cooled heat dissipation projector includes a rear Fresnel lens, a heat-insulating glass, an LCD, a front Fresnel lens, a cavity frame, and a semiconductor cooling chip;

[0005] The rear Fresnel lens and the front Fresnel lens are arranged on the cavity frame, and the rear Fresnel lens, the front Fresnel lens, and the cavity frame jointly enclose a sealed cavity;

[0006] The heat-insulating glass and the LCD are arranged in the sealed cavity;

[0007] There is a cooling liquid arranged in the sealed cavity;

[0008] At least one semiconductor cooling chip is arranged on the cavity frame, and the refrigerating surface of the semiconductor cooling chip is attached to the cavity frame.

[0009] The heating surface of the semiconductor cooling chip is thermally connected to the heat dissipation system.

[0010] The heat dissipation system includes a first radiator, a first heat conduction pipe, and a first heat conduction substrate. One end of the first heat conduction pipe is thermally connected to the first radiator, and the other end is thermally connected to the first heat conduction substrate. The first heat conduction substrate is thermally connected to the heating surface of the semiconductor cooling sheet.

[0011] It further includes a cooling fan for dissipating heat from the first radiator.

[0012] The first heat conduction substrate has a recessed portion that fits at least part of the first heat conduction pipe.

[0013] The cavity frame is provided with a through hole for injecting coolant.

[0014] It further includes a housing, and at least part of the cavity frame is disposed inside the housing.

[0015] It further includes an LED lamp, a second heat conduction substrate, a second heat conduction pipe, and a second radiator. The LED lamp is disposed inside the housing. The second heat conduction substrate is thermally connected to the LED lamp. One end of the second heat conduction pipe is connected to the second heat conduction substrate, and the other end is thermally connected to the second radiator.

[0016] A stirring device for stirring the cooling liquid is disposed inside the sealed cavity.

[0017] The beneficial effects of this application are as follows: The heat-insulating glass and the LCD are immersed in the liquid. The cooling liquid can quickly absorb the heat of the heat-insulating glass, the LCD, the rear Fresnel lens, and the front Fresnel lens, and dissipate the heat through the semiconductor cooling sheet provided on the sealed cavity. The refrigerating surface of the semiconductor cooling sheet is closely attached to the sealed cavity. When the LCD and the heat-insulating glass generate heat during the operation of the projector, the semiconductor cooling sheet is started to refrigerate the liquid inside the cavity, effectively reducing the temperature of the LCD and the heat-insulating glass in a timely manner. This application can take away the heat of the LCD and operate at a temperature below 70° while ensuring the sealing of the LCD by the projector housing, and at the same time make the temperature of the LCD relatively uniform. While ensuring the improvement of brightness and color uniformity, the service life of the projector is maintained. Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of an immersion liquid-cooled heat dissipation projector of this application.

[0019] Figure 2 It is a schematic diagram of the Fresnel lens, heat-insulating glass, LCD, and front Fresnel lens of an immersion liquid-cooled heat dissipation projector of this application.

[0020] Figure 3 It is a schematic diagram of the sealed cavity of an immersion liquid-cooled heat dissipation projector of this application.

[0021] Figure 4It is a schematic diagram of the second radiator of an immersion liquid-cooled heat dissipation projector of the present application. Detailed implementation mode

[0022] In the following, embodiments of the present application will be described with reference to the accompanying drawings. In the following description, the same modules are denoted by the same reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, their detailed descriptions will not be repeated.

[0023] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not constitute a limitation to the present application.

[0024] An immersion liquid-cooled heat dissipation projector, as Figures 1 - 4 shown, includes a rear Fresnel lens 4, a heat-insulating glass 5, an LCD 6, a front Fresnel lens 7, a cavity frame 8 and a semiconductor cooling chip 9;

[0025] The rear Fresnel lens 4 and the front Fresnel lens 7 are arranged on the cavity frame 8, and the rear Fresnel lens 4, the front Fresnel lens 7 and the cavity frame 8 together enclose a sealed cavity 100;

[0026] The heat-insulating glass 5 and the LCD 6 are arranged in the sealed cavity 100;

[0027] There is a cooling liquid arranged in the sealed cavity 100;

[0028] At least one semiconductor cooling chip 9 is arranged on the cavity frame 8, and the refrigerating surface of the semiconductor cooling chip 9 is attached to the cavity frame 8.

[0029] There is a cooling liquid arranged in the sealed cavity 100, that is, the heat-insulating glass 5 and the LCD 6 are immersed in the liquid. The cooling liquid can quickly absorb the heat of the heat-insulating glass 5, the LCD 6, the rear Fresnel lens 4 and the front Fresnel lens 7, and dissipate the heat through the semiconductor cooling chip 9 arranged on the sealed cavity 100. The refrigerating surface of the semiconductor cooling chip 9 is closely attached to the sealed cavity. When the LCD 6 and the heat-insulating glass 5 generate heat during the operation of the projector, the semiconductor cooling chip 9 is started to refrigerate the liquid in the cavity, and the temperature of the LCD 6 and the heat-insulating glass 4 is reduced in a timely and effective manner.

[0030] The heating surface of the semiconductor cooling chip 9 is thermally connected to the heat dissipation system.

[0031] In a specific embodiment, the heat dissipation system includes a first radiator 1, a first heat conduction tube 11, and a first heat conduction substrate 12. One end of the first heat conduction tube 11 is thermally connected to the first radiator 1, and the other end is thermally connected to the first heat conduction substrate 12. The first heat conduction substrate 12 is thermally connected to the heating surface of the semiconductor cooling chip 9. The first heat conduction substrate 12 being in contact with the heating surface of the semiconductor cooling chip 9 can transfer the heat of the semiconductor cooling chip 9 to the first heat conduction tube 11 and then to the first radiator 1, and the first radiator 1 can be in full contact with the air for rapid heat dissipation.

[0032] In other embodiments, the heating surface of the semiconductor cooling chip 9 can dissipate heat through other forms of heat dissipation systems.

[0033] It further includes a cooling fan 2, as Figure 1 shown, the cooling fan 2 is used to dissipate heat from the first radiator 1. The cooling fan 2 accelerates the gas flow around the first radiator 1, enabling the first radiator to dissipate heat more quickly.

[0034] The first heat conduction substrate 12 has a recessed portion that fits at least part of the first heat conduction tube 11. The recessed portion can make the semiconductor cooling chip 9 fit more closely with the first heat conduction tube 11, enabling more sufficient heat exchange.

[0035] The cavity frame 8 is provided with through holes for injecting coolant. The through holes facilitate the injection of coolant, and are hermetically sealed after injection.

[0036] It further includes a housing 10, and at least part of the cavity frame 8 is disposed within the housing 10. The housing 10 is the housing of the projector, and various parts of the projector are disposed on the housing 10, and the cavity frame also relies on the housing 10 for setting.

[0037] It further includes an LED lamp 13, a second heat conduction substrate 14, a second heat conduction tube 15, and a second radiator 16, as Figure 4 shown, the LED lamp 13 is disposed within the housing 10, the second heat conduction substrate 14 is thermally connected to the LED lamp 13, one end of the second heat conduction tube 15 is connected to the second heat conduction substrate 14, and the other end is thermally connected to the second radiator 16.

[0038] The LED lamp 13 is the light source of the projector, and it generates a large amount of heat. The second heat conduction substrate 14 transfers the heat of the LED lamp 13 to the second heat conduction tube 15 and then to the second radiator 16, enabling it to dissipate heat quickly, thereby reducing the temperature around the LED lamp 13. The second radiator 16 is preferably disposed outside the housing 10.

[0039] A stirring device for stirring the cooling liquid is disposed within the sealed cavity 100. The stirring device can be an electric fan driven by a motor, which can make the liquid temperature within the sealed cavity 100 more uniform, thus achieving better heat dissipation.

[0040] Under the condition of ensuring the sealing of the LCD6 by the projector housing, the present application can take away the heat of the LCD6 and achieve an operation temperature below 70°C, while making the temperature of the LCD6 relatively uniform. Under the condition of ensuring the improvement of brightness and color uniformity, the service life of the projector is maintained.

[0041] Finally, it should be noted for the present utility model that the above embodiments have made a detailed description of the technical solution of the present utility model, and are not limited only to the foregoing embodiments. Those of ordinary skill in the art should understand that modifying or replacing the features and parameters in the foregoing embodiments does not deviate from the spirit and scope of the technical solution of the foregoing embodiments.

Claims

1. An immersion liquid cooling heat dissipation projector, characterized in that: It includes a rear Fresnel lens (4), a heat-insulating glass (5), an LCD (6), a front Fresnel lens (7), a cavity frame (8), and a semiconductor cooling fin (9); The rear Fresnel lens (4) and the front Fresnel lens (7) are arranged on the cavity frame (8), and the rear Fresnel lens (4), the front Fresnel lens (7), and the cavity frame (8) jointly enclose a sealed cavity (100); The heat-insulating glass (5) and the LCD (6) are arranged in the sealed cavity (100); There is cooling liquid arranged in the sealed cavity (100); At least one semiconductor cooling fin (9) is arranged on the cavity frame (8), and the refrigerating surface of the semiconductor cooling fin (9) is attached to the cavity frame (8).

2. The immersion liquid cooling heat dissipation projector according to claim 1, wherein: The heating surface of the semiconductor cooling fin (9) is thermally connected to the heat dissipation system.

3. The immersion liquid cooling projector according to claim 2, wherein: The heat dissipation system includes a first radiator (1), a first heat conduction tube (11), and a first heat conduction substrate (12). One end of the first heat conduction tube (11) is thermally connected to the first radiator (1), the other end is thermally connected to the first heat conduction substrate (12), and the first heat conduction substrate (12) is thermally connected to the heating surface of the semiconductor cooling fin (9).

4. The immersion liquid cooling heat dissipation projector according to claim 3, characterized in that: It further includes a cooling fan (2), and the cooling fan (2) is used for dissipating heat from the first radiator (1).

5. The immersion liquid cooling heat dissipation projector according to claim 3, wherein: The first heat conduction substrate (12) has a recessed portion that fits at least part of the first heat conduction tube (11).

6. The immersion liquid cooling projector according to claim 1, characterized in that: The cavity frame (8) is provided with through holes for injecting cooling liquid.

7. The immersion liquid cooling heat dissipation projector according to claim 1, wherein: It further includes a housing (10), and at least part of the cavity frame (8) is arranged in the housing (10).

8. The immersion liquid-cooled heat dissipation projector according to claim 7, wherein: It further includes an LED lamp (13), a second heat conduction substrate (14), a second heat conduction tube (15), and a second radiator (16). The LED lamp (13) is arranged in the housing (10), the second heat conduction substrate (14) is thermally connected to the LED lamp (13), one end of the second heat conduction tube (15) is connected to the second heat conduction substrate (14), and the other end is thermally connected to the second radiator (16).

9. The immersion liquid cooling heat dissipation projector according to claim 1, characterized in that: There is a stirring device for stirring the cooling liquid arranged in the sealed cavity (100).

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