Server case with overheating heat dissipation protection function

Abstract

The utility model provides a server case with overheating heat dissipation protection, which relates to the technical field of camera shooting and comprises a server case body, a rotating block arranged on one side of the server case body, a cooling box arranged on one side of the server case body and a heat conduction copper block b arranged on one side of the server case body. The heat dissipation assembly is arranged between the server case and the cooling box and used for dissipating heat of the server case, and the heat dissipation assembly comprises a temperature sensor, a heat conduction copper block b, the cooling box, a heat conduction copper block a, a semiconductor chilling plate, a heat dissipation block b, a heat dissipation fan b, a water suction pump and a heat conduction copper pipe. According to the server case, through the arrangement of the heat dissipation assembly, cooling liquid can be cooled, the heat exchange efficiency is improved, performance reduction or faults caused by server overheating are avoided, through the arrangement of the damp-proof assembly, a drying agent can be replaced in time, and server hardware is prevented from being affected with damp.

Description

Technical Field

[0001] The utility model relates to the technical field of camera, in particular to a server chassis with overheat dissipation protection. Background Technique

[0002] A server is a high-performance computer system, mainly used to provide data storage, processing and distribution services in a network environment. Servers are usually designed to have the characteristics of high availability, high reliability and powerful computing capabilities to meet the business needs of enterprises and organizations. A server chassis is a casing used to house and protect server hardware components.

[0003] However, when the existing server chassis is in use, there are still certain disadvantages. For example, most of the existing server chassis increase the air circulation speed inside the chassis through fans to discharge the hot air inside the chassis, so as to achieve heat dissipation. This heat dissipation method has a poor heat dissipation effect. Most of the existing server chassis use desiccants to absorb the moisture in the air inside the chassis for moisture-proofing. However, the water absorption capacity of the desiccants is limited. Once it reaches the saturation state, it cannot continue to absorb the moisture in the air. Therefore, it needs to be replaced manually regularly. This replacement method has the possibility that workers may neglect to replace the desiccant inside the server chassis in time, resulting in hardware failures inside the server chassis. Content of the Utility Model

[0004] The purpose of the utility model is to solve the disadvantages existing in the background technique, and provide a server chassis with overheat dissipation protection. To solve the above problems, through the setting of the heat dissipation component, the coolant can be cooled down, the heat exchange efficiency can be improved, and the server can be prevented from overheating and causing performance degradation or failure. And through the setting of the moisture-proof component, the desiccant can be replaced in time to prevent the server hardware from being affected by moisture.

[0005] To achieve the above object, the utility model provides the following technical solution: a server chassis with overheat dissipation protection, including: a server chassis, a rotating block is arranged on one side of the server chassis, a cooling box is arranged on one side of the server chassis, a heat conducting copper block b is arranged on one side of the server chassis, a heat dissipation component arranged between the server chassis and the cooling box for dissipating heat from the server chassis, and the heat dissipation component includes a heat conducting copper block b, a cooling box, a heat conducting copper block a, a semiconductor refrigeration sheet, a heat dissipation block b, a heat dissipation fan b, a water pump and a heat conducting copper pipe.

[0006] Further, a cooling chamber a is provided inside the cooling box, a cooling chamber b is provided inside the cooling box, a water pump is provided inside the cooling box, one side of the water pump is connected to a main water suction pipe, one end of the main water suction pipe is connected to a water suction pipe b through a three-way pipe, one end of the main water suction pipe is connected to a water suction pipe a through a three-way pipe, the top of the water pump is connected to a heat-conducting copper pipe, there are a plurality of heat-conducting strips on one side of the heat-conducting copper block b, and a temperature sensor is provided on one side of the heat-conducting copper block b. There are two partition plates inside the server chassis, and a plurality of through holes a are provided at the tops of the two partition plates. A bracket is provided on one side of the cooling box. Through the setting of the temperature sensor, when the conventional water-cooling heat dissipation effect is poor in high-temperature weather, the semiconductor refrigeration sheet can be turned on to cool the coolant inside the cooling chamber a.

[0007] Further, the water suction pipe b extends into the cooling chamber b, one end of the water suction pipe a extends into the cooling chamber a, and electromagnetic valves are provided on both the water suction pipe a and the water suction pipe b. One end of the heat-conducting copper pipe is connected to a return pipe a through a three-way pipe, and one end of the return pipe a extends into the cooling chamber b. One end of the heat-conducting copper pipe is connected to a return pipe b through a three-way pipe, and one end of the return pipe b extends into the cooling chamber a. Electromagnetic valves are provided on both the return pipe b and the return pipe a.

[0008] Further, a heat dissipation block a is provided on one side of the inner wall of the cooling chamber b, a heat-conducting copper block a is provided on one side of the inner wall of the cooling chamber a, a semiconductor refrigeration sheet is provided on one side of the heat-conducting copper block a, a heat dissipation block b is provided on one side of the semiconductor refrigeration sheet, a plurality of heat dissipation fans a are provided on one side of the bracket, and a plurality of heat dissipation fans b are provided on one side of the bracket. Through the setting of the semiconductor refrigeration sheet, the coolant inside the cooling chamber a can be cooled.

[0009] Further, a moisture-proof component is provided on one side of the server chassis. The moisture-proof component includes: two through holes b opened in the server chassis, a plurality of placement cavities are opened on one side of the rotating block, desiccants are provided inside the plurality of placement cavities, a rotating rod is provided on one side of the rotating block, and one end of the rotating rod is connected to the server chassis through a bearing. A cover plate provided on one side of the rotating block, and a humidity sensor is provided inside the server chassis. Through the setting of the humidity sensor, the humidity inside the server chassis can be monitored, so as to replace the desiccant in time.

[0010] Further, a knob is provided on one side of the cover plate, and a threaded column is fixedly connected to one end of the knob. When it is necessary to replace the desiccants inside the plurality of placement cavities, the user can turn the knob to remove the cover plate from the rotating block, and then the desiccants inside the placement cavities can be replaced.

[0011] Furthermore, a plurality of teeth are provided on the outer side of the rotating block, a servo motor is provided inside the server chassis, a driving gear is connected to one side of the servo motor through a rotating shaft, and the driving gear is meshed with the teeth on the outer side of the rotating block. When in use, the servo motor is started to rotate the driving gear, thereby rotating the rotating block, so that the desiccant saturated in the placement cavity is turned away from one side of the two through holes b, and the unused desiccant is rotated to one side of the two through holes b, thereby realizing the replacement of the desiccant.

[0012] The advantages of the present utility model are that through the setting of the heat dissipation component, the coolant can be cooled down, so that the coolant can more effectively absorb heat from the heat generating components of the server, improve the heat exchange efficiency, and avoid the performance degradation or failure caused by the overheating of the server;

[0013] Secondly, through the setting of the moisture-proof component, the humidity inside the chassis can be detected, and when the humidity inside the chassis reaches a certain level, the desiccant can be replaced in time to ensure that the desiccant always remains in an effective state. At the same time, it also avoids the problems of corrosion and oxidation of the server hardware caused by the failure to replace the desiccant in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a schematic diagram of the overall structure of the present utility model.

[0015] Figure 2 is a cross-sectional view of the overall structure of the present utility model.

[0016] Figure 3 is a side cross-sectional view of the overall structure of the present utility model.

[0017] Figure 4 is a cross-sectional view of the structure of the heat conducting copper block b of the present utility model.

[0018] Figure 5 is a cross-sectional view of the structure of the bracket of the present utility model.

[0019] Figure 6 is a schematic diagram of the structure of the rotating block of the present utility model.

[0020] Figure 7 is a schematic diagram of the structure of the heat conducting copper block b of the present utility model.

[0021] Figure 8 is of the present utility model Figure 2 enlarged view of A.

[0022] Figures 1-8Chinese: 1. Server chassis; 101. Partition; 102. Through hole a; 103. Through hole b; 2. Cooling box; 201. Cooling chamber a; 202. Cooling chamber b; 203. Water suction pipe a; 204. Main water suction pipe; 205. Water suction pump; 206. Heat conduction copper pipe; 207. Return pipe a; 208. Return pipe b; 209. Water suction pipe b; 3. Bracket; 301. Cooling fan a; 302. Cooling fan b; 303. Heat dissipation block a; 304. Heat conduction copper block a; 305. Thermoelectric cooler; 306. Heat dissipation block b; 4. Heat conduction copper block b; 401. Heat conduction strip; 402. Temperature sensor; 5. Cover plate; 501. Knob; 502. Threaded column; 503. Rotating block; 504. Placing cavity; 505. Rotating rod; 6. Servo motor; 601. Humidity sensor; 602. Driving gear; 7. Desiccant. Detailed implementation manners

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Apparently, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present application.

[0024] The following disclosure provides many different implementation manners or examples for implementing different structures of the present application. To simplify the disclosure of the present application, components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present application. In addition, the present application may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various implementation manners and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those skilled in the art may be aware of the application of other processes and / or the use of other materials.

[0025] The embodiment of the present application provides a server chassis with overheat dissipation protection. The server chassis with overheat dissipation protection can realize the cooling of the coolant through the setting of the heat dissipation component, improve the heat exchange efficiency, avoid the performance degradation or failure caused by server overheating, and through the setting of the moisture-proof component, can timely replace the desiccant to avoid the server hardware from being affected by moisture. The server chassis with overheat dissipation protection is described in detail below. It should be noted that the description order of the following embodiments does not limit the preferred order of the embodiments.

[0026] The present application will be described in detail below with reference to the accompanying drawings and specific implementation manners.

[0027] Please refer to Figures 1-8In the present embodiment, a server chassis with overheating heat dissipation protection is provided, including: a server chassis 1, a rotating block 503 is provided on one side of the server chassis 1, a cooling box 2 is provided on one side of the server chassis 1, and a heat-conducting copper block b4 is provided on one side of the server chassis 1; a heat dissipation component is provided between the server chassis 1 and the cooling box 2, and is used to dissipate heat for the server chassis 1, and the heat dissipation component includes a temperature sensor 402, a heat-conducting copper block b4, a cooling box 2, a heat-conducting copper block a304, a semiconductor refrigeration sheet 305, a heat dissipation block b306, a heat dissipation fan b302, a water pump 205 and a heat-conducting copper pipe 206.

[0028] Furthermore, when in use, the temperature sensor 402 generates an electrical signal and transmits it to the control terminal, which energizes the semiconductor refrigeration plate 305 to cool the coolant, and then takes away the heat on the thermal copper block b4 through the cooling, thereby cooling the server chassis 1.

[0029] Among them, a cooling chamber a201 is opened inside the cooling box 2, a cooling chamber b202 is opened inside the cooling box 2, a water pump 205 is arranged inside the cooling box 2, one side of the water pump 205 is connected to a water pumping pipe 204, one end of the water pumping pipe 204 is connected to a water pumping pipe b209 through a three-way pipe, one end of the water pumping pipe 204 is connected to a water pumping pipe a203 through a three-way pipe, a heat-conducting copper pipe 206 is connected to the top of the water pump 205, a plurality of heat-conducting strips 401 are arranged on one side of the heat-conducting copper block b4, a temperature sensor 402 is arranged on one side of the heat-conducting copper block b4, two partitions 101 are arranged inside the server chassis 1, and the tops of the two partitions 101 are both opened A plurality of through holes a102 are provided, and a bracket 3 is provided on one side of the cooling box 2; a water pumping pipe b209 extends into the interior of the cooling chamber b202, one end of the water pumping pipe a203 extends into the interior of the cooling chamber a201, and solenoid valves are provided on the water pumping pipe a203 and the water pumping pipe b209, one end of the heat-conducting copper tube 206 is connected to the return pipe a207 through a three-way pipe, and one end of the return pipe a207 extends into the interior of the cooling chamber b202, one end of the heat-conducting copper tube 206 is connected to the return pipe b208 through a three-way pipe, and one end of the return pipe b208 extends into the interior of the cooling chamber a201, and battery valves are provided on the return pipe b208 and the return pipe a207.

[0030] When the server is running normally and the electronic components inside the server chassis 1 generate heat, the water pump 205 is started, and the solenoid valves on the water suction pipe b209 and the return pipe a207 are opened. The coolant inside the cooling chamber b202 is pumped by the water pump 205, so that the coolant enters the heat conduction copper pipe 206 through the water suction pipe b209 and the main water suction pipe 204. Since the heat on the electronic components is transferred to the heat conduction copper block b4 through the heat conduction strip 401 and then to the heat conduction copper pipe 206 through the heat conduction copper block b4, when the coolant flows to the heat conduction copper pipe 206 located in the heat conduction copper block b4, it will absorb the heat on the heat conduction copper block b4 and drive this heat to flow into the return pipe a207, thus flowing back into the cooling chamber b202. At this time, the heat of the coolant inside the cooling chamber b202 is absorbed by the heat dissipation block a303, and the heat dissipation fan a301 is started to dissipate heat from the heat dissipation block a303, so as to realize the heat dissipation of the server chassis.

[0031] In addition, the temperature sensor 402 can be a thermistor temperature sensor of model MF52D-503-3. The temperature sensor 402 is a sensor that measures temperature using special semiconductor materials. The resistance value of the thermistor material inside it will increase or decrease with the change of the ambient temperature. The temperature sensor 402 is a mature conventional technology in this technical field, and this solution does not make improvements to the circuit or program of the temperature sensor 402. Therefore, the circuit and signal connection relationship of the temperature sensor 402 will not be described in detail.

[0032] Among them, a heat dissipation block a303 is provided on one side of the inner wall of the cooling chamber b202, a heat conduction copper block a304 is provided on one side of the inner wall of the cooling chamber a201, a semiconductor refrigeration sheet 305 is provided on one side of the heat conduction copper block a304, a heat dissipation block b306 is provided on one side of the semiconductor refrigeration sheet 305, a plurality of heat dissipation fans a301 are provided on one side of the bracket 3, and a plurality of heat dissipation fans b302 are provided on one side of the bracket 3.

[0033] When encountering high-temperature weather, the coolant temperature approaches or equals the ambient temperature under the influence of the ambient temperature, making it difficult to effectively dissipate the heat generated inside the server chassis 1. At this time, the temperature inside the server chassis 1 rises. The temperature sensor 402 detects the temperature rise and reaches the preset value. At this time, the temperature sensor 402 generates an electrical signal and transmits it to the control terminal. The control terminal powers on the semiconductor refrigeration sheet 305. The refrigerating surface of the semiconductor refrigeration sheet 305 absorbs the heat on the heat conduction copper block a304, so that the temperature of the coolant inside the cooling chamber a201 decreases. At the same time, the heat dissipation surface of the semiconductor refrigeration sheet 305 is dissipated by the heat dissipation block b306 and the heat dissipation fan b302.

[0034] Among them, a moisture-proof component is provided on one side of the server chassis 1. The moisture-proof component includes: two through holes b103 opened in the server chassis 1, a plurality of placement cavities 504 are opened on one side of the rotating block 503, desiccants 7 are provided inside each of the plurality of placement cavities 504, a rotating rod 505 is provided on one side of the rotating block 503, and one end of the rotating rod 505 is connected to the server chassis 1 through a bearing; a cover plate 5 provided on one side of the rotating block 503, and a humidity sensor 601 is provided inside the server chassis 1; a knob 501 is provided on one side of the cover plate 5, and a threaded column 502 is fixedly connected to one end of the knob 501.

[0035] When encountering humid air, the humidity sensor 601 detects an increase in the moisture content of the air inside the server chassis 1, generates an electrical signal, and transmits it to the control terminal. The servo motor 6 is controlled by the control terminal to start, causing the driving gear 602 to rotate, thereby rotating the rotating block 503, so that the desiccant 7 that has absorbed saturation inside the placement cavity 504 is rotated away from one side of the two through holes b103, and the unused desiccant 7 is rotated to one side of the two through holes b103, thereby realizing the replacement of the desiccant 7.

[0036] Furthermore, when it is necessary to replace the desiccant 7 inside the plurality of placement cavities 504, the user can turn the knob 501 to remove the cover plate 5 from the rotating block 503, and then the desiccant 7 inside the placement cavity 504 can be replaced.

[0037] In addition, the model of the humidity sensor 601 can be HRTM030. The working principle of the humidity sensor 601 is to measure the relative humidity by detecting the moisture content in the air. It usually uses a resistive or capacitive sensing element. When the moisture in the air adheres to the sensing element, it will cause a change in the resistance or capacitance value of the element and generate an electrical signal. The humidity sensor 601 is a mature and conventional technology in the technical field, and this solution does not make improvements to the circuit or program of the humidity sensor 601. Therefore, the circuit and signal connection relationship of the humidity sensor 601 will not be elaborated.

[0038] Among them, a plurality of teeth are provided on the outer side of the rotating block 503, a servo motor 6 is provided inside the server chassis 1, a driving gear 602 is connected to one side of the servo motor 6 through a rotating shaft, and the driving gear 602 is meshed with the teeth on the outer side of the rotating block 503. During use, the servo motor 6 is started to cause the driving gear 602 to rotate, thereby rotating the rotating block 503, so that the desiccant 7 that has absorbed saturation inside the placement cavity 504 is rotated away from one side of the two through holes b103, and the unused desiccant 7 is rotated to one side of the two through holes b103, thereby realizing the replacement of the desiccant 7.

[0039] The working principle is as follows:

[0040] When the server is running normally and the electronic components inside the server chassis 1 generate heat, the water pump 205 is started, and the solenoid valves on the water extraction pipe b209 and the return pipe a207 are opened. The coolant inside the cooling chamber b202 is extracted by the water pump 205, and the coolant passes through the water extraction pipe b209 and the main water extraction pipe 204 into the heat conduction copper pipe 206. Since the heat on the electronic components is transferred to the heat conduction copper block b4 through the heat conduction strip 401 and then to the heat conduction copper pipe 206 through the heat conduction copper block b4, when the coolant flows to the heat conduction copper pipe 206 located inside the heat conduction copper block b4, it will absorb the heat on the heat conduction copper block b4 and drive this heat into the return pipe a207, thereby flowing back into the cooling chamber b202. At this time, the heat of the coolant inside the cooling chamber b202 is absorbed by the heat dissipation block a303, and the heat dissipation fan a301 is started to dissipate heat from the heat dissipation block a303, so as to achieve the heat dissipation of the server chassis 1.

[0041] Furthermore, when encountering high-temperature weather, the coolant temperature approaches or equals the ambient temperature under the influence of the ambient temperature, making it difficult to effectively dissipate the heat generated inside the server chassis 1. The temperature inside the server chassis 1 rises, and the temperature sensor 402 detects the temperature rise and reaches the preset value. At this time, the temperature sensor 402 generates an electrical signal and transmits it to the control terminal. The control terminal powers on the semiconductor refrigeration sheet 305. The refrigerating surface of the semiconductor refrigeration sheet 305 absorbs the heat on the heat conduction copper block a304, reducing the temperature of the coolant inside the cooling chamber a201. At the same time, the heat dissipation surface of the semiconductor refrigeration sheet 305 is dissipated through the heat dissipation block b306 and the heat dissipation fan b302.

[0042] Meanwhile, the temperature sensor 402 closes the solenoid valves on the water extraction pipe b209 and the return pipe a207 through the control terminal and opens the solenoid valves on the water extraction pipe a203 and the return pipe b208. At this time, the cooled coolant inside the cooling chamber a201 is extracted by the water pump 205, and the coolant passes through the water extraction pipe a203 and the heat conduction copper pipe 206 to absorb the heat on the heat conduction copper block b4, and then flows back to the cooling chamber a201 through the return pipe b208 to achieve the heat dissipation efficiency of the server chassis 1 under abnormal temperature conditions.

[0043] When encountering humid air, the humidity sensor 601 detects an increase in the moisture content of the air inside the server chassis 1, generates an electrical signal, and transmits it to the control terminal. The control terminal controls the servo motor 6 to start, causing the driving gear 602 to rotate, thereby rotating the rotating block 503, so that the desiccant 7 that has absorbed saturation inside the placement chamber 504 is turned away from one side of the two through holes b103, and the unused desiccant 7 is rotated to one side of the two through holes b103, thus realizing the replacement of the desiccant 7.

[0044] Further, when it is necessary to replace the desiccant 7 inside multiple placement cavities 504, the user can turn the knob 501 to remove the cover plate 5 from the rotating block 503, and then the desiccant 7 inside the placement cavity 504 can be replaced.

[0045] In addition, a control panel is provided on one side of the server chassis 1. The control panel can control the on-off power supply of the water pump 205, the cooling fan a 301, the cooling fan b 302, the semiconductor refrigeration sheet 305, the temperature sensor 402, the humidity sensor 601 and the servo motor 6, and the electric energy of the device is provided by an external power supply.

[0046] Regarding the control program involved in the present utility model, those skilled in the art can implement it according to the same or similar principles in the prior art. This part is not the innovation of the present utility model.

[0047] In the above embodiments, the descriptions of each embodiment have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0048] The above has introduced in detail a server chassis with overheat dissipation protection provided by the embodiments of the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The descriptions of the above embodiments are only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A server chassis with overheat dissipation protection, characterized in that, Including: A server chassis (1), on one side of the server chassis (1) there is a rotating block (503), on one side of the server chassis (1) there is a cooling box (2), and on one side of the server chassis (1) there is a heat-conducting copper block b (4); A heat dissipation component disposed between the server chassis (1) and the cooling box (2) for dissipating heat from the server chassis (1). The heat dissipation component includes a temperature sensor (402), a heat-conducting copper block b (4), a cooling box (2), a heat-conducting copper block a (304), a semiconductor refrigeration sheet (305), a heat dissipation block b (306), a heat dissipation fan b (302), a water pump (205) and a heat-conducting copper pipe (206).

2. The server chassis with overheat dissipation protection according to claim 1, wherein Inside the cooling box (2), there is a cooling chamber a (201) and a cooling chamber b (202). Inside the cooling box (2), there is a water pump (205). One side of the water pump (205) is connected to a main water suction pipe (204). One end of the main water suction pipe (204) is connected to a water suction pipe b (209) through a three-way pipe, and one end of the main water suction pipe (204) is connected to a water suction pipe a (203) through a three-way pipe. The top of the water pump (205) is connected to a heat-conducting copper pipe (206). On one side of the heat-conducting copper block b (4), there are a plurality of heat-conducting strips (401), and on one side of the heat-conducting copper block b (4), there is a temperature sensor (402). Inside the server chassis (1), there are two partition plates (101), and a plurality of through holes a (102) are opened at the tops of the two partition plates (101). On one side of the cooling box (2), there is a bracket (3).

3. The server chassis with overheat dissipation protection according to claim 2, wherein, The water suction pipe b (209) extends into the cooling chamber b (202), and one end of the water suction pipe a (203) extends into the cooling chamber a (201). And electromagnetic valves are provided on both the water suction pipe a (203) and the water suction pipe b (209). One end of the heat-conducting copper pipe (206) is connected to a return pipe a (207) through a three-way pipe, and one end of the return pipe a (207) extends into the cooling chamber b (202). One end of the heat-conducting copper pipe (206) is connected to a return pipe b (208) through a three-way pipe, and one end of the return pipe b (208) extends into the cooling chamber a (201). And electromagnetic valves are provided on both the return pipe b (208) and the return pipe a (207).

4. The server chassis with overheat dissipation protection according to claim 2, characterized in that, On one side of the inner wall of the cooling chamber b (202), there is a heat dissipation block a (303). On one side of the inner wall of the cooling chamber a (201), there is a heat-conducting copper block a (304). On one side of the heat-conducting copper block a (304), there is a semiconductor refrigeration sheet (305). On one side of the semiconductor refrigeration sheet (305), there is a heat dissipation block b (306). On one side of the bracket (3), there are a plurality of heat dissipation fans a (301), and on one side of the bracket (3), there are a plurality of heat dissipation fans b (302).

5. The server chassis with overheat dissipation protection according to claim 1, characterized in that, On one side of the server chassis (1), there is a moisture-proof component, and the moisture-proof component includes: Two through holes b (103) are provided in the server chassis (1). A plurality of placement cavities (504) are provided on one side of the rotating block (503). Desiccants (7) are provided inside each of the plurality of placement cavities (504). A rotating rod (505) is provided on one side of the rotating block (503), and one end of the rotating rod (505) is connected to the server chassis (1) through a bearing; A cover plate (5) is provided on one side of the rotating block (503). A humidity sensor (601) is provided inside the server chassis (1).

6. The server chassis with overheat dissipation protection according to claim 5, characterized in that A knob (501) is provided on one side of the cover plate (5). A threaded column (502) is fixedly connected to one end of the knob (501).

7. The server chassis with overheat dissipation protection according to claim 1, characterized in that A plurality of teeth are provided on the outer side of the rotating block (503). A servo motor (6) is provided inside the server chassis (1). A driving gear (602) is connected to one side of the servo motor (6) through a rotating shaft, and the driving gear (602) is meshed with the teeth on the outer side of the rotating block (503).

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