Livestock non-contact edge computing device

By designing non-contact edge computing equipment for livestock, the problem of insufficient environmental information collection in traditional breeding mode is solved, real-time processing and transmission of environmental data is realized, the monitoring and regulation capabilities of the breeding environment are improved, and the impact of natural conditions on breeding is reduced.

CN223092423UActive Publication Date: 2025-07-11ANHUI AGRICULTURAL UNIVERSITY +1
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Patent Information

Application Number
CN202421737373.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-07-22
Publication Date
2025-07-11
Estimated Expiration
2034-07-22

AI Technical Summary

Technical Problem

The lack of complete environmental information collection, intelligent computing and wireless transmission systems in the traditional breeding model has led to the inability to effectively respond to environmental changes, affecting the risks and efficiency of breeding.

Method used

Design a contactless edge computing device for livestock, including core development board modules and expansion board modules, which have environmental data acquisition, processing and transmission functions. It is connected to external sensors through the core development board module. The expansion board module expands the peripheral interface to collect more data.

Benefits of technology

Real-time collection, processing and transmission of environmental data is realized, the monitoring and regulation capabilities of the breeding environment are improved, the impact of natural conditions is reduced, and the risk management and efficiency of breeding is improved.

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Patent Text Reader

Abstract

The utility model relates to the technical field of information transmission, in particular to non-contact edge computing equipment for livestock. The equipment comprises a core development board module 1 which is connected with external sensor equipment so as to receive, process and transmit environment acquisition data; and the expansion board module 2 is connected with the core development board module 1 and is used for expanding a large number of peripheral interfaces for the core development board module 1 so as to collect more environmental data. The device is connected with an external sensor device through a core development plate to receive external environment acquisition data and can process and transmit the data. The expansion board module can be connected with the core development board module, so that a large number of peripheral interfaces can be expanded for the core development board module, and the expansion board module can be connected with more external sensor devices to collect more environmental data.
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Description

Technical Field

[0001] The utility model relates to the technical field of information transmission, and particularly relates to a non-contact edge computing device for livestock. Background Art

[0002] The traditional breeding mode is an uncertain breeding method, which will inevitably be affected and restricted by natural conditions such as climate, water quality, and weather. Both the breeding scale and breeding risk will be affected by natural conditions. In the modern breeding process, environmental monitoring of breeding objects is an important field. During the breeding process, the environmental changes of breeding objects are monitored at any time, so as to generate coping plans according to environmental changes and automatically adjust indicators such as temperature and humidity to make the breeding objects in the most suitable environment. During the breeding process, a large amount of multimedia information and deep learning intelligent recognition of the breeding environment need to be collected to cope with the changes in the breeding environment. In the prior art, there is no complete system with functions such as collection, intelligent operation, network, and wireless transmission to cope with environmental information changes. Summary of the Utility Model

[0003] An object of an embodiment of the utility model is to provide a non-contact edge computing device for livestock, which can be connected to an external acquisition device to receive external environmental data and process and transmit it.

[0004] To achieve the above object, the utility model adopts the following technical solutions:

[0005] A non-contact edge computing device for livestock, the device includes:

[0006] A core development board module 1, which is connected to an external sensor device to receive environmental acquisition data and process and transmit it;

[0007] An expansion board module 2, which is connected to the core development board module 1 to expand a large number of peripheral interfaces for the core development board module 1 to collect more environmental data.

[0008] For further optimization of this technical solution, the core development board module 1 includes a main control module 10, the main control module 10 is used to realize the normal operation of the operating system, and the main control module 10 includes: a main control chip 100 and a memory module 101 and a storage module 102 connected thereto. The main control chip 100 is used to run the operating system to process the environmental acquisition data.

[0009] For further optimization of this technical solution, the main control chip 100 includes a first circuit diagram, a second circuit diagram, and a third circuit diagram;

[0010] The first circuit diagram includes microcontroller U5.2, resistor R5, resistor R27, and lamp LED2; the D2 pin of microcontroller U5.2 is grounded through resistor R5, the F5 pin is connected to the 3.3V VCC voltage, the B2 pin is connected to one end of lamp LED2 to control the lighting and extinguishing of LED2, the other end of LED2 is connected to the 3.3V power supply through resistor R27, the D7 pin is connected to the 3.3V VCC voltage, and the J6 pin is connected to the 3.3V VCC voltage;

[0011] The second circuit diagram includes microcontroller U5.3, capacitor C46, capacitor C41, resistor R25, resistor R26, capacitor C52, capacitor C54, resistor R23, capacitor C53, capacitor C55, capacitor C56, capacitor C57, crystal oscillator X1, resistor R15, switch SW1, capacitor C44, resistor R16, switch SW2, capacitor C45; the F18 pin of microcontroller U5.3 is connected to the 1.8V VCC voltage, the J18 pin is grounded through capacitor C46, the J17 pin is grounded through capacitor C41, the K18 pin is grounded through resistor R25, the H17 pin and H20 pin are both connected to the 1.8V VCC voltage, the H18 pin is grounded, the D18 pin is grounded through capacitor C52, the C17 pin is grounded through capacitor C54, one end of resistor R26 is grounded and the other end is connected to the H18 pin of microcontroller U5.3, the B19 pin is grounded through resistor R23, the E18 pin is connected to the 3.3V VCC voltage, the M18 pin is connected to the 3.3V VCC voltage, the A16 pin is grounded through switch SW2, capacitor C44 is connected in parallel with switch SW2, the A16 pin is connected to the 3.3V VCC voltage through resistor R15, the B17 pin is grounded through switch SW1, capacitor C45 is connected in parallel with switch SW1, the B17 pin is connected to the 1.8V VCC voltage through resistor R16, the D12 pin is connected to the 1.8V VCC voltage, the B11 pin is grounded through capacitor C57, the C12 pin is connected to one end of capacitor C56 and the third pin of crystal oscillator X1, the second pin of crystal oscillator X1 is connected to the other end of capacitor C56, a capacitor C57 is connected in series between the first pin and the fourth pin of crystal oscillator X1, the B11 pin is connected to the first pin of crystal oscillator X1, the second pin and the fourth pin of crystal oscillator X1 are grounded, the D13 pin is grounded through capacitor C53, and the D11 pin is grounded through capacitor C55;

[0012] The third circuit includes a microcontroller U5.1, a resistor R10, capacitors C30, C31, C32, C33, C34, C35, C36, C37, C58, and C59. The L15 pin of the microcontroller U5.1 is grounded through the resistor R10. The L9, L10, L11, L12, and L13 pins are interconnected and grounded through the parallel-connected capacitors C30, C31, C32, C33, C34, C35, C36, C37, C58, and C59. The L14 pin is connected to the 1.8V VCC voltage.

[0013] For a further optimization of this technical solution, the memory module 101 includes a storage chip U2, resistors R7, R8, R9, R11, R12, capacitors C27, C28, and C29. The N3 pin of the storage chip U2 is connected to the P18 pin of the microcontroller U5.1, the P7 pin is connected to the R15 pin of the microcontroller U5.1, the P3 pin is connected to the T18 pin of the microcontroller U5.1, the N2 pin is connected to the R19 pin of the microcontroller U5.1, the P8 pin is connected to the U16 pin of the microcontroller U5.1, the P2 pin is connected to the R20 pin of the microcontroller U5.1, the R8 pin is connected to the N13 pin of the microcontroller U5.1, the R2 pin is connected to the T21 pin of the microcontroller U5.1, the T8 pin is connected to the V17 pin of the microcontroller 5.1, the R3 pin is connected to the T20 pin of the microcontroller 5.1, the L7 pin is connected to the U19 pin of the microcontroller 5.1, the R7 pin is connected to the U17 pin of the microcontroller 5.1, the N7 pin is connected to the P16 pin of the microcontroller 5.1, the T3 pin is connected to the R18 pin of the microcontroller 5.1, the T7 pin is connected to the P15 pin of the microcontroller 5.1, the M7 pin is connected to the U18 pin of the microcontroller 5.1, the M2 pin is connected to the P20 pin of the microcontroller 5.1, the N8 pin is connected to the U15 pin of the microcontroller 5.1, the M3 pin is connected to the U20 pin of the microcontroller 5.1, the L3 pin is connected to the V20 pin of the microcontroller 5.1, the J3 pin is connected to the T16 pin of the microcontroller 5.1, the K3 pin is connected to the N16 pin of the microcontroller 5.1, the L2 pin is connected to the P21 pin of the microcontroller 5.1, the L1 pin is connected to the N19 pin of the microcontroller 5.1, the K1 pin is connected to the N20 pin of the microcontroller 5.1, the J1 pin is connected to the N21 pin of the microcontroller 5.1, the K9 pin is connected to the V15 pin of the microcontroller 5.1, the J9 pin is connected to the P13 pin of the microcontroller 5.1, the J7 pin is connected to the T14 pin of the microcontroller 5.1, the K7 pin is connected to the U14 pin of the microcontroller 5.1. A resistor R7 is connected in series between the J7 pin and the K7 pin. The T2 pin is connected to the U21 pin of the microcontroller 5.1. The A1 pin, A8 pin, D2 pin, C9 pin, C1 pin, H2 pin, H9 pin, F1 pin, E9 pin, R1 pin, R9 pin, N1 pin, N9 pin, K2 pin, K8 pin, G7 pin, D9 pin, and B2 pin are connected to each other and connected to the L13 pin of the third circuit diagram. The E3 pin is connected to the R4 pin of the microcontroller 5.1, the F7 pin is connected to the V3 pin of the microcontroller 5.1, the F2 pin is connected to the P4 pin of the microcontroller 5.1, the F8 pin is connected to the P6 pin of the microcontroller 5.1, the H3 pin is connected to the N4 pin of the microcontroller 5.1, the H8 pin is connected to the microcontroller 5.The R6 pin of 1 is connected to the P5 pin of the microcontroller 5.1, the G2 pin is connected to the P5 pin of the microcontroller 5.1, the H7 pin is connected to the N5 pin of the microcontroller 5.1, the E7 pin is connected to the R3 pin of the microcontroller 5.1, the F3 pin is connected to the U2 pin of the microcontroller 5.1, the G3 pin is connected to the V2 pin of the microcontroller 5.1, the D7 pin is connected to the T4 pin of the microcontroller 5.1, the C3 pin is connected to the P1 pin of the microcontroller 5.1, the C8 pin is connected to the U4 pin of the microcontroller 5.1, the C2 pin is connected to the N2 pin of the microcontroller 5.1, the A7 pin is connected to the T2 pin of the microcontroller 5.1, the A2 pin is connected to the N3 pin of the microcontroller 5.1, the B8 pin is connected to the U3 pin of the microcontroller 5.1, the A3 pin is connected to the P2 pin of the microcontroller 5.1, the D3 pin is connected to the U1 pin of the microcontroller 5.1, the C7 pin is connected to the R2 pin of the microcontroller 5.1, the B7 pin is connected to the R1 pin of the microcontroller 5.1,.

[0014] The M8 pin is grounded through the parallel-connected resistors R12, capacitors C28 and C29. The M8 pin is connected to the A1 pin through the parallel-connected resistors R11 and capacitor C27. The H1 pin is connected to the M8 pin. The L9 pin is grounded through the resistor R9. The L8 pin is grounded through the resistor R8. The G1 pin, G9 pin, B1 pin, B9 pin, D1 pin, D8 pin, E8 pin, E2 pin, F9 pin, A9 pin, B3 pin, J8 pin, J2 pin, M9 pin, E1 pin, M1 pin, G8 pin, P9 pin, P1 pin, T9 pin, T1 pin are connected to each other and grounded.

[0015] For further optimization of this technical solution, the storage module 102 includes a memory chip U4, a capacitor C43, a resistor R13, a resistor R14, and a resistor R24. The A3 pin of the memory chip U4 is connected to the F2 pin of the microcontroller U5.2, the A4 pin is connected to the G3 pin of the microcontroller U5.2, the A5 pin is connected to the H2 pin of the microcontroller U5.2, the A6 pin is grounded, the B2 pin is connected to the E3 pin of the microcontroller U5.2, the B3 pin is connected to the F1 pin of the microcontroller U5.2, the B4 pin is connected to the F3 pin of the microcontroller U5.2, the B5 pin is connected to the H1 pin of the microcontroller U5.2, the B6 pin is connected to the H3 pin of the microcontroller U5.2, the C2 pin is grounded through the capacitor C43, the C4 pin is grounded, the C6 pin is connected to the 3.3V VCC voltage, the E6 pin is connected to the 3.3V VCC voltage, the E7 pin is grounded, the F5 pin is connected to the 3.3V VCC voltage, the G5 pin, the P6 pin, the P4 pin, the N5 pin, and the N2 pin are all grounded, the P5 pin, the P3 pin, and the N4 pin are all connected to the 3.3V VCC voltage, the M6 pin is connected to the D3 pin of the microcontroller U5.2 through the resistor R14, the M5 pin is connected to the E2 pin of the microcontroller U5.2, the M5 pin is connected to the 3.3V VCC voltage through the resistor R13, the M4 pin is connected to the 3.3V VCC voltage, the K9 pin is connected to the 3.3V VCC voltage, the K8 pin is grounded, the K5 pin is connected to the C2 pin of the microcontroller U5.2, the J10 pin is connected to the 3.3V VCC voltage, the J5 pin is grounded, the H10 pin is grounded, the H5 pin is connected to the B1 pin of the microcontroller U5.2, and the H5 pin is connected to the 3.3V VCC voltage through the resistor R24.

[0016] For further optimization of this technical solution, it further includes a power supply management module. The power supply management module includes a power management chip U1, a capacitor C1, a capacitor C3, a capacitor C5, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a capacitor C42, a capacitor C2, an inductor L4, a capacitor C4, a capacitor C6, a capacitor C7, an inductor L1, a capacitor C8, a capacitor C9, and an inductor L2. The 15th pin of the power management chip U1 is connected to the 1.8V VCC voltage, and the 15th pin is also grounded through the capacitor C1. The 12th pin is connected to the 3.3V VCC voltage, and the 12th pin is also grounded through the capacitor C3. The 7th pin is grounded through the parallel-connected capacitor C5 and resistor R28. The 5th pin is connected to the B18 pin of the microcontroller U5.2, and the 5th pin is also connected to the 1.8V VCC voltage through the resistor R1. The 6th pin is connected to the C18 pin of the microcontroller U5.2, and the 6th pin is also connected to the 1.8V VCC voltage through the resistor R2. The 11th pin is connected to the C1 pin of the microcontroller U5.2 through the resistor R3. The 13th pin is connected to the A16 pin of the microcontroller U5.3 through the resistor R4. The 8th pin is grounded through the capacitor C42. The 17th pin, 20th pin, and 2nd pin are all connected to the 5V VCC voltage. The 17th pin is grounded through the capacitor C2. The 18th pin is sequentially connected to the inductor L4 and the capacitor C4 and then grounded. The 16th pin is connected to the common terminal of the inductor L4 and the capacitor C4. The 20th pin is grounded through the capacitor C6. The 19th pin is sequentially connected to the inductor L1 and the capacitor C7 and then grounded. The 1st pin is connected to the common terminal of the inductor L1 and the capacitor C7. The 2nd pin is grounded through the capacitor C8. The 3rd pin is sequentially connected to the inductor L2 and the capacitor C9 and then grounded. The 4th pin is connected to the common terminal of the inductor L2 and the capacitor C9. The 9th pin and 21st pin are both grounded.

[0017] For further optimization of this technical solution, it further includes a wireless communication module. The wireless communication module includes a Bluetooth chip U7, resistors R29, R30, R31, R36, R32, R33, R34, R35, capacitor C63, resistor R37, capacitors C73, C74, C68, C69, C62, C64, C65, C66, C67, C70, C71, C72, crystal oscillator X2, capacitor C60, interface JP1, and capacitor C61. The 20th pin of this Bluetooth chip U7 is connected to the C8 pin of microcontroller U5.2. The 20th pin is connected to the 3.3V VCC voltage via resistor R29. The 3.3V VCC voltage is grounded via capacitor C63. The 3rd pin is connected to the third pin of crystal oscillator X2. The 4th pin is connected to the second pin of crystal oscillator X2. The first pin and the fourth pin of crystal oscillator X2 are grounded. A capacitor C60 is connected in series between the third pin and the fourth pin. A capacitor C61 is connected in series between the second pin and the fourth pin. The 6th pin is connected to the 3.3V VCC voltage via resistor R30. The 5th pin is connected to the 3.3V VCC voltage via resistor R31. The 23rd pin is connected to the C10 pin of microcontroller U5.2. The 10th pin is connected to the B4 pin of microcontroller U5.2. The 9th pin is connected to the A4 pin of microcontroller U5.2. The 8th pin is connected to the C4 pin of microcontroller U5.2. The 7th pin is connected to the B3 pin of microcontroller U5.2. The 12th pin is connected to the C7 pin of microcontroller U5.2. The 12th pin is connected to the 3.3V VCC voltage via resistor R36. The 13th pin is connected to the C6 pin of microcontroller U5.2. The 13th pin is connected to the 3.3V VCC voltage via resistor R32. The 14th pin is connected to the B5 pin of microcontroller U5.2. The 14th pin is connected to the 3.3V VCC voltage via resistor R33. The 17th pin is connected to the C5 pin of microcontroller U5.2. The 17th pin is connected to the 3.3V VCC voltage via resistor R34. The 15th pin is connected to the B7 pin of microcontroller U5.2. The 15th pin is connected to the 3.3V VCC voltage via resistor R35. The 16th pin is connected to the A6 pin of microcontroller U5.2. The 24th pin is connected to the B10 pin of microcontroller U5.2. The 35th pin is connected to the C9 pin of microcontroller U5.2. The 40th pin is connected to the first pin of interface JP1 via resistor R37. The second pin and the third pin of interface JP1 are grounded. Capacitors C73 and C74 are connected in series and then connected in parallel across resistor R37. The common terminal of capacitors C73 and C74 is grounded. The 11th pin, 30th pin, 37th pin, and 25th pin are all connected to 3.The VCC voltage is 3V. The 30th pin is grounded through capacitor C68, the 37th pin is grounded through capacitor C69, the 38th pin is grounded through capacitor C62, the 2nd pin is grounded through capacitor C64, the 21st pin is grounded through capacitor C65, the 26th pin is grounded through capacitor C66, the 28th pin, 36th pin, 1st pin, and 22nd pin are interconnected. The 28th pin is grounded through capacitor C67, the 36th pin is grounded through capacitor C70, the 1st pin is grounded through capacitor C71, the 22nd pin is grounded through capacitor C72, and the 19th pin and 41st pin are grounded.

[0018] For a further optimization of this technical solution, the core development board module 1 further includes a core board interface module. The core board interface module is connected to the main control module 10, and the core board interface module includes two USB-C interfaces.

[0019] For a further optimization of this technical solution, the core development board module 1 further includes a TF expansion module connected to the main control module 10. The TF expansion module includes a storage chip TF, resistors R18, R19, and capacitor C47. The 7th pin of the storage chip TF is connected to the J3 pin of the microcontroller U5.2, the 8th pin is connected to the J2 pin of the microcontroller U5.2, the 1st pin is connected to the L3 pin of the microcontroller U5.2, the 2nd pin is connected to the L2 pin of the microcontroller U5.2, the 3rd pin is connected to the K3 pin of the microcontroller U5.2, the 5th pin is connected to the K1 pin of the microcontroller U5.2 through resistor R18, the 10th pin and 11th pin are grounded, the 12th pin and 13th pin are grounded, the 4th pin is connected to the 3.3V VCC voltage, the 4th pin is grounded through capacitor C47, a resistor R19 is connected in series between the 9th pin and the 4th pin, the 9th pin is connected to the K2 pin of the microcontroller U5.2, and the 6th pin is grounded.

[0020] For a further optimization of this technical solution, it further includes a first BTB connection module connected to the main control module and a second BTB connection module connected to the first BTB connection module.

[0021] Through the above technical solution, a livestock non-contact edge computing device provided by the present utility model can be connected to external sensor devices through the core development board to receive external environmental acquisition data and can process and transmit this data. The expansion board module can be connected to the core development board module, thereby expanding a large number of peripheral interfaces for the core development board module, and thus can be connected to more external sensor devices to collect more environmental data.

[0022] Other features and advantages of the embodiments of the present utility model will be described in detail in the subsequent specific implementation part. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings are used to provide a further understanding of the embodiments of the present utility model, and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the embodiments of the present utility model, but do not constitute a limitation to the embodiments of the present utility model. In the accompanying drawings:

[0024] Figure 1 It is a schematic structural diagram of a livestock non-contact edge computing device;

[0025] Figure 2 It is a schematic structural diagram of the main control module of a livestock non-contact edge computing device;

[0026] Figure 3 It is a schematic connection diagram of the core development board module and the expansion board module of a livestock non-contact edge computing device;

[0027] Figure 4 It is the first circuit diagram of the main control chip;

[0028] Figure 5 It is the second circuit diagram of the main control chip;

[0029] Figure 6 It is the third circuit diagram of the main control chip;

[0030] Figure 7 It is the circuit diagram of the memory module of a livestock non-contact edge computing device;

[0031] Figure 8 It is the circuit diagram of the storage module of a livestock non-contact edge computing device;

[0032] Figure 9 It is the circuit diagram of the power supply management module of a livestock non-contact edge computing device;

[0033] Figure 10 It is the circuit diagram of the wireless communication module of a livestock non-contact edge computing device;

[0034] Figure 11 It is the circuit diagram of the TF expansion module of a livestock non-contact edge computing device;

[0035] Figure 12 It is the circuit diagram of the first BTB connection module of a livestock non-contact edge computing device;

[0036] Figure 13 It is the circuit diagram of the second BTB connection module of a livestock non-contact edge computing device;

[0037] Figure 14 It is the circuit diagram of the GPIO interface unit of a livestock non-contact edge computing device.

[0038] Description of the reference numerals:

[0039] 1. Core development board module; 2. Expansion board module; 10. Main control module; 100. Main control chip;

[0040] 101. Memory module; 102. Storage module; 11. Power supply management module; 12. Wireless communication module; 13. Core board interface module; 14. TF expansion module; 15. First BTB connection module; 20. Second BTB connection module; 21. RJ45 network cable interface; 22. HDMI video output interface; 23. GPIO interface unit; 24. UCB interface. Detailed implementation manners

[0041] The following will describe in detail the specific implementation manners of the embodiments of the present utility model with reference to the accompanying drawings. It should be understood that the specific implementation manners described herein are only for the purpose of illustration and explanation of the embodiments of the present utility model and are not used to limit the embodiments of the present utility model.

[0042] Refer to Figure 1 As shown in the figure, it is a schematic structural diagram of a preferred embodiment of a livestock non-contact edge computing device of the present utility model. The device includes: a core development board module 1 and an expansion board module 2. The core development board module 1 can be connected to an external sensor device, so as to receive external environmental acquisition data, process the received data, and transmit the processed data. The expansion board module 2 is connected to the core development board module 1, so as to expand a large number of peripheral interfaces for the core development board module 1, so as to collect more environmental data. The core development board module 1 of the device can run a complete linux operating system and can implement multiple functions such as acquisition, processing, analysis, and control of multimedia information. The device is connected to each multimedia information acquisition module through the expansion board module 2. After the multimedia information is obtained in real time and processed and analyzed by the operating system of the core development board module 1, a judgment is made in real time, a preset command is executed, and the data after operation can be transmitted for subsequent parameter reference.

[0043] In this embodiment, the core development board module 1 includes a main control module 10. The main control module 10 can be used to realize the normal operation of the operating system. For example, it can realize the normal operation of the operating system 1inuxARM. Refer to Figure 2 As shown in the figure, it is a schematic structural diagram of the main control module. The main control module 10 includes a main control chip 100 and a memory module 101 and a storage module 102 connected thereto. The main control chip 100 can be used to run the operating system to process the acquired environmental acquisition data.

[0044] Refer to Figures 4 - 6As shown, they are respectively the first circuit diagram, the second circuit diagram, and the third circuit diagram of the main control chip. The first circuit diagram includes microcontroller U5.2 and resistor R5. The second circuit diagram includes microcontroller U5.3, capacitor C46, capacitor C41, resistor R25, resistor R26, capacitor C52, capacitor C54, resistor R23, capacitor C53, capacitor C55, capacitor C56, capacitor C57, and crystal oscillator X1. The third circuit includes microcontroller U5.1 and resistor R10. The storage module includes storage chip U2, resistor R7, resistor R8, and resistor R9.

[0045] The B1 pin of the microcontroller U5.2 is connected to the H5 pin of the storage chip U4, the C2 pin is connected to the K5 pin of the storage chip U4, the C1 pin is connected to the 11th pin of the power management chip U1 via the resistor R3, the D2 pin is grounded via the resistor R5, the D3 pin is connected to the M6 pin of the storage chip U4 via the resistor R14, the E2 pin is connected to the M5 pin of the storage chip U4, the E3 pin is connected to the B2 pin of the storage chip U4, the F1 pin is connected to the B3 pin of the storage chip U4, the F2 pin is connected to the A3 pin of the storage chip U4, the F3 pin is connected to the B4 pin of the storage chip U4, the G3 pin is connected to the A4 pin of the storage chip U4, the H1 pin is connected to the B5 pin of the storage chip U4, the H2 pin is connected to the A5 pin of the storage chip U4, the H3 pin is connected to the B6 pin of the storage chip U4, the F5 pin is connected to the 3.3V VCC voltage, the J2 pin is connected to the 8th pin of the storage chip TF, the J3 pin is connected to the 7th pin of the storage chip TF, the K1 pin is connected to the 5th pin of the storage chip TF via the resistor R18, the K3 pin is connected to the 3rd pin of the storage chip TF, the L2 pin is connected to the 2nd pin of the storage chip TF, the L3 pin is connected to the 1st pin of the storage chip TF, the K2 pin is connected to the 9th pin of the storage chip TF, the A6 pin is connected to the 16th pin of the Bluetooth chip U7 in the wireless communication module 12, C7 is connected to the 12th pin of the Bluetooth chip U7 in the wireless communication module 12, the C6 pin is connected to the 13th pin of the Bluetooth chip U7 in the wireless communication module 12, the B5 pin is connected to the 14th pin of the Bluetooth chip U7 in the wireless communication module 12, the C5 pin is connected to the 17th pin of the Bluetooth chip U7 in the wireless communication module 12, the B7 pin is connected to the 15th pin of the Bluetooth chip U7 in the wireless communication module 12, the A4 pin is connected to the 9th pin of the Bluetooth chip U7 in the wireless communication module 12, the B4 pin is connected to the 10th pin of the Bluetooth chip U7 in the wireless communication module 12, the C4 pin is connected to the 8th pin of the Bluetooth chip U7 in the wireless communication module 12, the B3 pin is connected to the 7th pin of the Bluetooth chip U7 in the wireless communication module 12, the C8 pin is connected to the 20th pin of the Bluetooth chip U7 in the wireless communication module 12, the B10 pin is connected to the 24th pin of the Bluetooth chip U7 in the wireless communication module 12, the C9 pin is connected to the 35th pin of the Bluetooth chip U7 in the wireless communication module 12, the C10 pin is connected to the 23rd pin of the Bluetooth chip U7 in the wireless communication module 12, the A2 pin is connected to the resistor R17 and then connected in series to one end of the diode D1, the other end of the diode D1 is connected to the B5 pin of the core board interface module 13, the B2 pin is connected to one end of the LED2 to control the on and off of the LED2, the other end of the LED2 is connected to the 3.3V power supply via the resistor R27, the D7 pin is connected to 3.The VCC voltage is 3V. The D16 pin is connected to the 7th pin of the USB-to-serial chip U6, and the D15 pin is connected to the 6th pin of the USB-to-serial chip U6, which are used to send and receive serial signals. The B15 pin is connected to the 9th pin of the 15-pin socket CN1 of the first BTB connection module, the C15 pin is connected to the 13th pin of the 15-pin socket CN1 of the first BTB connection module, the A14 pin is connected to the 15th pin of the 15-pin socket CN1 of the first BTB connection module, the B14 pin is connected to the 10th pin of the 15-pin socket CN1 of the first BTB connection module, the C14 pin is connected to the 12th pin of the 15-pin socket CN1 of the first BTB connection module, the B12 pin is connected to the 14th pin of the 15-pin socket CN1 of the first BTB connection module, the C13 pin is connected to the 16th pin of the 15-pin socket CN1 of the first BTB connection module, the A12 pin is connected to the 18th pin of the 15-pin socket CN1 of the first BTB connection module, the B13 pin is connected to the 20th pin of the 15-pin socket CN1 of the first BTB connection module, the H6 pin is connected to the 9th pin of the second BTB connection module 20, the D4 pin is connected to the 13th pin of the socket CN2 of the second BTB connection module 20, the G6 pin is connected to the 17th pin of the socket CN2 of the second BTB connection module 20, the E4 pin is connected to the 21st pin of the socket CN2 of the second BTB connection module 20, the G5 pin is connected to the 25th pin of the socket CN2 of the second BTB connection module 20, the H4 pin is connected to the 29th pin of the socket CN2 of the second BTB connection module 20, the H5 pin is connected to the 33rd pin of the socket CN2 of the second BTB connection module 20, the G4 pin is connected to the 37th pin of the socket CN2 of the second BTB connection module 20, the E6 pin is connected to the 41st pin of the socket CN2 of the second BTB connection module 20, the D5 pin is connected to the 26th pin of the socket CN2 of the second BTB connection module 20, the L5 pin is connected to the 30th pin of the socket CN2 of the second BTB connection module 20, the K4 pin is connected to the 9th pin of the socket CN2 of the second BTB connection module 20 34, the K5 pin is connected to the 38th pin of the socket CN2 of the second BTB connection module 20, the E5 pin is connected to the 42nd pin of the socket CN2 of the second BTB connection module 20, the L6 pin is connected to the 46th pin of the socket CN2 of the second BTB connection module 20, the J6 pin is connected to the 3.3V VCC voltage, the C18 pin is connected to the 6th pin of the power supply management module 11U1, and the B18 pin is connected to the 5th pin of the power supply management module 11U1.

[0046] The E19 pin of the microcontroller U5.3 in the second circuit is connected to the 39th pin of the first BTB connection module 15, the E20 pin is connected to the 37th pin of the socket CN1 of the first BTB connection module 15, the D20 pin is connected to the 33rd pin of the socket CN1 of the first BTB connection module 15, the D21 pin is connected to the 31st pin of the socket CN1 of the first BTB connection module 15, the C19 pin is connected to the 27th pin of the socket CN1 of the first BTB connection module 15, the C20 pin is connected to the 25th pin of the socket CN1 of the first BTB connection module 15, the F20 pin is connected to the 45th pin of the socket CN1 of the first BTB connection module 15, the F21 pin is connected to the 43rd pin of the socket CN1 of the first BTB connection module 15, the F19 pin is connected to the 49th pin of the socket CN1 of the first BTB connection module 15, the G21 pin is connected to the 51st pin of the socket CN1 of the first BTB connection module 15, the G17 pin is connected to the 19th pin of the socket CN1 of the first BTB connection module 15, the G18 pin is connected to the 21st pin of the socket CN1 of the first BTB connection module 15, the F18 pin is connected to the 1.8V VCC voltage, the J18 pin is connected to one end of the capacitor C46, and the other end of the capacitor C46 is grounded. The J17 pin is connected to the capacitor C41, and the other end of the capacitor C41 is grounded. The K18 pin is connected to one end of the resistor R25, and the other end of the resistor R25 is grounded. The H17 pin is connected to the 1.8V VCC voltage. The G19 pin is connected to the 16th pin of the socket CN2 of the second BTB connection module 20, the G20 pin is connected to the 20th pin of the socket CN2 of the second BTB connection module 20, the H18 pin is grounded, the J21 pin is connected to the 12th pin of the socket CN2 of the second BTB connection module 20, the H20 pin is connected to the 1.8V VCC voltage, the D18 pin is grounded through the capacitor C52, the C17 pin is grounded through the capacitor C54, one end of the resistor R26 is grounded, and the other end is connected to the H18 pin of the microcontroller U5.3. The B19 pin is grounded through the resistor R23. The A19 pin is connected to the 50th pin of the socket CN1 of the first BTB connection module 15, the A20 pin is connected to the 52nd pin of the socket CN1 of the first BTB connection module 15, the B20 pin is connected to the 44th pin of the socket CN1 of the first BTB connection module 15, the B21 pin is connected to the 46th pin of the socket CN1 of the first BTB connection module 15, and the E18 pin is connected to 3.The VCC voltage is 3V. The J19 pin is connected to the B7 and A7 pins of the USB1 interface of the core board interface module 13. The J20 pin is connected to the B6 and A6 pins of the USB1 interface of the core board interface module 13. The M19 pin is connected to the 26th pin of the first BTB connection module 15. The M20 pin is connected to the 28th pin of the socket CN1 of the first BTB connection module 15. The K19 pin is connected to the 32nd pin of the socket CN1 of the first BTB connection module 15. The K20 pin is connected to the 34th pin of the first BTB connection module 15. The L19 pin is connected to the 38th pin of the socket CN1 of the first BTB connection module 15. The L20 pin is connected to the 40th pin of the socket CN1 of the first BTB connection module 15. The M18 pin is connected to the 3.3V VCC voltage. The A16 pin is grounded through the switch SW2, and a capacitor C44 is connected in parallel to the switch SW2. The A16 pin is connected to the 3.3V VCC voltage through the resistor R15. The B17 pin is grounded through the switch SW1, and a capacitor C45 is connected in parallel to the switch SW1. The B17 pin is connected to the 1.8V VCC voltage through the resistor R16. The D12 pin is connected to the 1.8V VCC voltage. The B11 pin is grounded through the capacitor C57. The C12 pin is connected to one end of the capacitor C56 and the third pin of the crystal oscillator X1. The second pin of the crystal oscillator X1 is connected to the other end of the capacitor C56. A capacitor C57 is connected in series between the first pin and the fourth pin of the crystal oscillator X1. The B11 pin is connected to the first pin of the crystal oscillator X1. The second pin and the fourth pin of the crystal oscillator X1 are grounded. The D13 pin is grounded through the capacitor C53. The D11 pin is grounded through the capacitor C55.

[0047] The T21 pin of the microcontroller U5.1 in the third circuit is connected to the R2 pin of the memory module 101, the U17 pin is connected to the R7 pin of the memory module 101, the T18 pin is connected to the P3 pin of the memory module 101, the T16 is connected to the J3 pin of the memory module 101, the R18 pin is connected to the T3 pin of the memory module 101, the P15 pin is connected to the T7 pin of the memory module 101, the U20 pin is connected to the M3 pin of the memory module 101, the N19 pin is connected to the L1 pin of the memory module 101, the U19 pin is connected to the L7 pin of the memory module 101, the N16 pin is connected to the K3 pin of the memory module 101, the R19 pin is connected to the N2 pin of the memory module 101, the U15 pin is connected to the N8 pin of the memory module 101, the U16 pin is connected to the P8 pin of the memory module 101, the P16 pin is connected to the N7 pin of the memory module 101, the V20 pin is connected to the L3 pin of the memory module 101, the N13 pin is connected to the R8 pin of the memory module 101, the U18 pin is connected to the M7 pin of the memory module 101, the N21 pin is connected to the J1 pin of the memory module 101, the R15 pin is connected to the P7 pin of the memory module 101, the P20 pin is connected to the M2 pin of the memory module 101, the P21 pin is connected to the L2 pin of the memory module 101, the P18 pin is connected to the N3 pin of the memory module 101, the V17 pin is connected to the T8 pin of the memory module 101, the R20 pin is connected to the P2 pin of the memory module 101, the T20 pin is connected to the R3 pin of the memory module 101, the N20 pin is connected to the K1 pin of the memory module 101, the T14 pin is connected to the J7 pin of the memory module 101, the U14 pin is connected to the K7 pin of the memory module 101, the V15 pin is connected to the K9 pin of the memory module 101, the P13 pin is connected to the J9 pin of the memory module 101, the U21 pin is connected to the T2 pin of the memory module 101,The R2 pin is connected to the C7 pin of the memory module 101, the R1 pin is connected to the B7 pin of the memory module 101, the U2 pin is connected to the F3 pin of the memory module 101, the V2 pin is connected to the G3 pin of the memory module 101, the U1 pin is connected to the D3 pin of the memory module 101, the R3 pin is connected to the E7 pin of the memory module 101, the N3 pin is connected to the A2 pin of the memory module 101, the U4 pin is connected to the C8 pin of the memory module 101, the N2 pin is connected to the C2 pin of the memory module 101, the T4 pin is connected to the D7 pin of the memory module 101, the U3 pin is connected to the B8 pin of the memory module 101, the P1 pin is connected to the C3 pin of the memory module 101, the T2 pin is connected to the A7 pin of the memory module 101, the P2 pin is connected to the A3 pin of the memory module 101, the P5 pin is connected to the G2 pin of the memory module 101, the V3 pin is connected to the F7 pin of the memory module 101, the P4 pin is connected to the F2 pin of the memory module 101 of the memory module 101, the R4 pin is connected to the E3 pin of the memory module 101, the R6 pin is connected to the H8 pin of the memory module 101, the N4 pin is connected to the H3 pin of the memory module 101, the P6 pin is connected to the F8 pin of the memory module 101, the N5 pin is connected to the H7 pin of the memory module 101, the L15 pin is grounded through the resistor R10, the L9 pin, L10 pin, L11 pin, L12 pin, L13 pin are interconnected and grounded through the parallel-connected capacitors C30, C31, C32, C33, C34, C35, C36, C37, C58, C59, and the L14 pin is connected to the 1.8V VCC voltage.,

[0048] See Figure 7As shown, it is the circuit diagram of the memory module of the livestock non-contact edge computing device. The memory module 101 can be connected to the main control chip 100, so that the main control chip 100 can conveniently operate the operating system in this memory module 101. The N3 pin of the storage chip U2 is connected to the P18 pin of the microcontroller 5.1, the P7 pin is connected to the R15 pin of the microcontroller U5.1, the P3 pin is connected to the T18 pin of the microcontroller U5.1, the N2 pin is connected to the R19 pin of the microcontroller U5.1, the P8 pin is connected to the U16 pin of the microcontroller 5.1, the P2 pin is connected to the R20 pin of the microcontroller 5.1, the R8 pin is connected to the N13 pin of the microcontroller 5.1, the R2 pin is connected to the T21 pin of the microcontroller 5.1, the T8 pin is connected to the V17 pin of the microcontroller 5.1, the R3 pin is connected to the T20 pin of the microcontroller 5.1, the L7 pin is connected to the U19 pin of the microcontroller 5.1, the R7 pin is connected to the U17 pin of the microcontroller 5.1, the N7 pin is connected to the P16 pin of the microcontroller 5.1, the T3 pin is connected to the R18 pin of the microcontroller 5.1, the T7 pin is connected to the P15 pin of the microcontroller 5.1, the M7 pin is connected to the U18 pin of the microcontroller 5.1, the M2 pin is connected to the P20 pin of the microcontroller 5.1, the N8 pin is connected to the U15 pin of the microcontroller 5.1, the M3 pin is connected to the U20 pin of the microcontroller 5.1, the L3 pin is connected to the V20 pin of the microcontroller 5.1, the J3 pin is connected to the T16 pin of the microcontroller 5.1, the K3 pin is connected to the N16 pin of the microcontroller 5.1, the L2 pin is connected to the P21 pin of the microcontroller 5.1, the L1 pin is connected to the N19 pin of the microcontroller 5.1, the K1 pin is connected to the N20 pin of the microcontroller 5.1, the J1 pin is connected to the N21 pin of the microcontroller 5.1, the K9 pin is connected to the V15 pin of the microcontroller 5.1, the J9 pin is connected to the P13 pin of the microcontroller 5.1, the J7 pin is connected to the T14 pin of the microcontroller 5.1 and is connected to one end of the resistor R7, the K7 pin is connected to the U14 pin of the microcontroller 5.1 and is connected to the other end of the resistor R7, the T2 pin is connected to the U21 pin of the microcontroller 5.1, the A1 pin, A8 pin, D2 pin, C9 pin, C1 pin, H2 pin, H9 pin, F1 pin, E9 pin, R1 pin, R9 pin, N1 pin, N9 pin, K2 pin, K8 pin, G7 pin, D9 pin, B2 pin are connected to each other and are connected to the L13 pin of the third circuit diagram, the E3 pin is connected to the R4 pin of the microcontroller 5.1, the F7 pin is connected to the V3 pin of the microcontroller 5.1, the F2 pin is connected to the P4 pin of the microcontroller 5.1, the F8 pin is connected to the P6 pin of the microcontroller 5.1, the H3 pin is connected to the N4 pin of the microcontroller 5.1, the H8 pin is connected to the microcontroller 5.The R6 pin of 1 is connected to the P5 pin of the microcontroller 5.1, the G2 pin is connected to the P5 pin of the microcontroller 5.1, the H7 pin is connected to the N5 pin of the microcontroller 5.1, the E7 pin is connected to the R3 pin of the microcontroller 5.1, the F3 pin is connected to the U2 pin of the microcontroller 5.1, the G3 pin is connected to the V2 pin of the microcontroller 5.1, the D7 pin is connected to the T4 pin of the microcontroller 5.1, the C3 pin is connected to the P1 pin of the microcontroller 5.1, the C8 pin is connected to the U4 pin of the microcontroller 5.1, the C2 pin is connected to the N2 pin of the microcontroller 5.1, the A7 pin is connected to the T2 pin of the microcontroller 5.1, the A2 pin is connected to the N3 pin of the microcontroller 5.1, the B8 pin is connected to the U3 pin of the microcontroller 5.1, the A3 pin is connected to the P2 pin of the microcontroller 5.1, the D3 pin is connected to the U1 pin of the microcontroller 5.1, the C7 pin is connected to the R2 pin of the microcontroller 5.1, the B7 pin is connected to the R1 pin of the microcontroller 5.1, the M8 pin is grounded through the parallel-connected resistors R12, capacitors C28 and C29, the M8 pin is connected to the A1 pin through the parallel-connected resistors R11 and capacitor C27, the H1 pin is connected to the M8 pin, the L9 pin is grounded through the resistor R9, the L8 pin is grounded through the resistor R8, the G1 pin, G9 pin, B1 pin, B9 pin, D1 pin, D8 pin, E8 pin, E2 pin, F9 pin, A9 pin, B3 pin, J8 pin, J2 pin, M9 pin, E1 pin, M1 pin, G8 pin, P9 pin, P1 pin, T9 pin, T1 pin are interconnected and grounded.

[0049] Refer to Figure 8As shown, it is the circuit diagram of the storage module of the livestock non-contact edge computing device. The storage module 102 can be connected to the main control chip 100, so as to store the environmental acquisition data. The A3 pin of the memory chip U4 is connected to the F2 pin of the microcontroller U5.2, the A4 pin is connected to the G3 pin of the microcontroller U5.2, the A5 pin is connected to the H2 pin of the microcontroller U5.2, the A6 pin is grounded, the B2 pin is connected to the E3 pin of the microcontroller U5.2, the B3 pin is connected to the F1 pin of the microcontroller U5.2, the B4 pin is connected to the F3 pin of the microcontroller U5.2, the B5 pin is connected to the H1 pin of the microcontroller U5.2, the B6 pin is connected to the H3 pin of the microcontroller U5.2, the C2 pin is connected to one end of the capacitor C43, the other end of the capacitor C43 is grounded, the C4 pin is grounded, the C6 pin is connected to the 3.3V VCC voltage, the E6 pin is connected to the 3.3V VCC voltage, the E7 pin is grounded, the F5 pin is connected to the 3.3V VCC voltage, the G5 pin is grounded, the P6 pin is grounded, the P5 pin is connected to the 3.3V VCC voltage, the P4 pin is grounded, the P3 pin is connected to the 3.3V VCC voltage, the N5 pin is grounded, the N4 pin is connected to the 3.3V VCC voltage, the N2 pin is grounded, the M6 pin is connected to one end of the resistor R14, the other end of the resistor R14 is connected to the D3 pin of the microcontroller U5.2, the M5 pin is connected to the E2 pin of the microcontroller U5.2 and is connected to one end of the resistor R13, the other end of the resistor R13 is connected to the 3.3V VCC voltage, the M4 pin is connected to the 3.3V VCC voltage, the K9 pin is connected to the 3.3V VCC voltage, the K8 pin is grounded, the K5 pin is connected to the C2 pin of the microcontroller U5.2, the J10 pin is connected to the 3.3V VCC voltage, the J5 pin is grounded, the H10 pin is grounded, the H5 pin is connected to the B1 pin of the microcontroller U5.2 and is connected to one end of the resistor R24, the other end of the resistor R24 is connected to the 3.3V VCC voltage.

[0050] The core development board 1 may include a power supply management module 11, which can be connected to the main control module 10 to supply power to the main control module 10. Refer to Figure 9As shown, it is the circuit diagram of the power supply management module of the livestock non-contact edge computing device. The 15th pin of the power management chip U1 is connected to the 1.8V VCC voltage, and the 15th pin is also grounded through the capacitor C1. The 12th pin is connected to the 3.3V VCC voltage, and the 12th pin is also grounded through the capacitor C3. The 7th pin is grounded through the parallel-connected capacitor C5 and resistor R28. The 5th pin is connected to the B18 pin of the microcontroller U5.2, and the 5th pin is also connected to the 1.8V VCC voltage through the resistor R1. The 6th pin is connected to the C18 pin of the microcontroller U5.2, and the 6th pin is also connected to the 1.8V VCC voltage through the resistor R2. The 11th pin is connected to the C1 pin of the microcontroller U5.2 through the resistor R3. The 13th pin is connected to the A16 pin of the microcontroller U5.3 through the resistor R4. The 8th pin is grounded through the capacitor C42. The 17th pin, 20th pin, and 2nd pin are all connected to the 5V VCC voltage. The 17th pin is grounded through the capacitor C2. The 18th pin is sequentially connected to the inductor L4 and the capacitor C4 and grounded. The 16th pin is connected to the common end of the inductor L4 and the capacitor C4. The 20th pin is grounded through the capacitor C6. The 19th pin is sequentially connected to the inductor L1 and the capacitor C7 and grounded. The 1st pin is connected to the common end of the inductor L1 and the capacitor C7. The 2nd pin is grounded through the capacitor C8. The 3rd pin is sequentially connected to the inductor L2 and the capacitor C9 and grounded. The 4th pin is connected to the common end of the inductor L2 and the capacitor C9. The 9th pin and the 21st pin are both grounded.

[0051] In this embodiment, the core development board module 1 may include a wireless communication module 12. Refer to Figure 10As shown, it is the circuit diagram of the wireless communication module of the livestock non-contact edge computing device. The wireless communication module 12 can be connected to the main control module 10 and the power supply management module 11, so as to realize the wireless network connection of the device. The 20th pin of the Bluetooth chip U7 is connected to the C8 pin of the microcontroller U5.2. The 20th pin is connected to the 3.3V VCC voltage through the resistor R29. The 3.3V VCC voltage is grounded through the capacitor C63. The 3rd pin is connected to the third pin of the crystal oscillator X2. The 4th pin is connected to the second pin of the crystal oscillator X2. The first pin and the fourth pin of the crystal oscillator X2 are grounded. A capacitor C60 is connected in series between the third pin and the fourth pin. A capacitor C61 is connected in series between the second pin and the fourth pin. The 6th pin is connected to the 3.3V VCC voltage through the resistor R30. The 5th pin is connected to the 3.3V VCC voltage through the resistor R31. The 23rd pin is connected to the C10 pin of the microcontroller U5.2. The 10th pin is connected to the B4 pin of the microcontroller U5.2. The 9th pin is connected to the A4 pin of the microcontroller U5.2. The 8th pin is connected to the C4 pin of the microcontroller U5.2. The 7th pin is connected to the B3 pin of the microcontroller U5.2. The 12th pin is connected to the C7 pin of the microcontroller U5.2. The 12th pin is connected to the 3.3V VCC voltage through the resistor R36. The 13th pin is connected to the C6 pin of the microcontroller U5.2. The 13th pin is connected to the 3.3V VCC voltage through the resistor R32. The 14th pin is connected to the B5 pin of the microcontroller U5.2. The 14th pin is connected to the 3.3V VCC voltage through the resistor R33. The 17th pin is connected to the C5 pin of the microcontroller U5.2. The 17th pin is connected to the 3.3V VCC voltage through the resistor R34. The 15th pin is connected to the B7 pin of the microcontroller U5.2. The 15th pin is connected to the 3.3V VCC voltage through the resistor R35. The 16th pin is connected to the A6 pin of the microcontroller U5.2. The 24th pin is connected to the B10 pin of the microcontroller U5.2. The 35th pin is connected to the C9 pin of the microcontroller U5.2. The 40th pin is connected to the first pin of the interface JP1 through the resistor R37. The second pin and the third pin of the interface JP1 are grounded. The capacitors C73 and C74 are connected in series and then connected in parallel across the resistor R37. The common terminal of the capacitors C73 and C74 is grounded. The 11th pin, 30th pin, 37th pin, and 25th pin are all connected to the 3.3V VCC voltage. The 30th pin is grounded through the capacitor C68. The 37th pin is grounded through the capacitor C69. The 38th pin is grounded through the capacitor C62. The 2nd pin is grounded through the capacitor C64. The 21st pin is grounded through the capacitor C65. The 26th pin is grounded through the capacitor C66. The 28th pin, 36th pin, 1st pin, and 22nd pin are connected to each other. The 28th pin is grounded through the capacitor C67. The 36th pin is grounded through the capacitor C70. The 1st pin is grounded through the capacitor C71. The 22nd pin is grounded through the capacitor C72. The 19th pin and the 41st pin are grounded.

[0052] In an embodiment of the present utility model, the core development board module 1 may include a core board interface module 13. The core board interface module 13 may be connected to the main control module 10. The core board interface module 13 may include two USB-C interfaces. One of the USB-C interfaces may be used as a power supply interface to charge the device, and the other USB-C interface may be used as a data output interface to receive external environmental acquisition data for the device.

[0053] In an embodiment of the present utility model, the core development board module 1 may include a TF expansion module 14. Refer to Figure 11 As shown, it is the circuit diagram of the TF expansion module of the livestock non-contact edge computing device. The TF expansion module 14 may be connected to the main control module 10, so as to expand the storage space of the main control module 10, and an operating system may be flashed into the TF expansion module 14. The core development board module 1 may start the operating system through the TF expansion module 14. The 7th pin of the storage chip TF is connected to the J3 pin of the microcontroller U5.2, the 8th pin is connected to the J2 pin of the microcontroller U5.2, the 1st pin is connected to the L3 pin of the microcontroller U5.2, the 2nd pin is connected to the L2 pin of the microcontroller U5.2, the 3rd pin is connected to the K3 pin of the microcontroller U5.2, the 5th pin is connected to the K1 pin of the microcontroller U5.2 through the resistor R18, the 10th pin and the 11th pin are grounded, the 12th pin and the 13th pin are grounded, the 4th pin is connected to the 3.3V VCC voltage, the 4th pin is grounded through the capacitor C47, a resistor R19 is connected in series between the 9th pin and the 4th pin, the 9th pin is connected to the K2 pin of the microcontroller U5.2, and the 6th pin is grounded.

[0054] In an embodiment of the present utility model, the core development board module 1 may further include a first BTB connection module 15. Refer to Figure 12As shown, it is the circuit diagram of the first BTB connection module of the livestock non-contact edge computing device. The first BTB connection module 15 can be connected to the main control module 10. The first BTB connection module 15 can be provided with multiple sockets and plugs, so that it can be connected to external interfaces. Pin 1 and pin 2 of a socket CN1 of the first BTB connection module 15 are connected to each other and connected to the 5V VCC voltage. Pin 3 and pin 4 are respectively connected to pin 1 and pin 2. Pin 5 and pin 7 are connected to each other and grounded. Pin 6 and pin 8 are connected to each other and grounded. Pin 9 is connected to pin B15 of the microcontroller U5.2. Pin 11 is grounded. Pin 13 is connected to pin C15 of the microcontroller U5.2. Pin 15 is connected to pin A14 of the microcontroller U5.2. Pin 17 is grounded. Pin 19 is connected to pin G17 of the microcontroller U5.3. Pin 21 is connected to pin G18 of the microcontroller U5.3. Pin 23 is grounded. Pin 25 is connected to pin C20 of the microcontroller U5.3. Pin 27 is connected to pin C19 of the microcontroller U5.3. Pin 29 is grounded. Pin 31 is connected to pin D21 of the microcontroller U5.3. Pin 33 is connected to pin D20 of the microcontroller U5.3. Pin 35 is grounded. Pin 37 is connected to pin E20 of the microcontroller U5.3. Pin 39 is connected to pin E19 of the microcontroller U5.3. Pin 41 is grounded. Pin 43 is connected to pin F21 of the microcontroller U5.3. Pin 45 is connected to pin F20 of the microcontroller U5.3. Pin 47 is grounded. Pin 49 is connected to pin F19 of the microcontroller U5.3. Pin 51 is connected to pin G21 of the microcontroller U5.3. Pin 53 and pin 55 are connected to each other and grounded. Pin 57 and pin 59 are connected and connected to the 5V VCC voltage. Pin 54 and pin 56 are connected to each other and grounded. Pin 58 and pin 60 are connected to each other and connected to the 5V VCC voltage.Pin 10 is connected to pin B14 of microcontroller U5.2, pin 12 is connected to pin C14 of microcontroller U5.2, pin 14 is connected to pin B12 of microcontroller U5.2, pin 16 is connected to pin C13 of microcontroller U5.2, pin 18 is connected to pin A12 of microcontroller U5.2, pin 20 is connected to pin B13 of microcontroller U5.2, pins 22 and 24 are grounded, pin 26 is connected to pin M19 of microcontroller U5.3, pin 28 is connected to pin M20 of microcontroller U5.3, pin 30 is connected to ground, pin 32 is connected to pin K19 of microcontroller U5.3, pin 34 is connected to pin K20 of microcontroller U5.3, pin 36 is grounded, pin 38 is connected to pin L19 of microcontroller U5.3, pin 40 is connected to pin L20 of microcontroller U5.3, pin 42 is grounded, pin 44 is connected to pin B20 of microcontroller U5.3, pin 46 is connected to pin B21 of microcontroller U5.3, pin 48 is grounded, pin 50 is connected to pin A19 of microcontroller U5.3, and pin 52 is connected to pin A20 of microcontroller U5.3.

[0055] In an embodiment of the present utility model, the expansion board module 2 may include a second BTB connection module 20. Refer to Figure 13As shown in the figure, it is the circuit diagram of the second BTB connection module of the livestock non-contact edge computing device. The second BTB connection module 20 can be connected to the first BTB connection module 15, so that the expansion board module 2 and the core development board module 1 can be connected. Pin 1 and pin 2 of the socket CN2 of the second BTB connection module 20 are connected to each other and connected to the 5V VCC voltage. Pin 3 and pin 4 are respectively connected to pin 1 and pin 2. Pin 5 and pin 7 are connected to each other and grounded. Pin 6 and pin 8 are connected to each other and grounded. Pin 9 is connected to pin H6 of the microcontroller U5.2. Pin 11 is grounded. Pin 13 is connected to pin D4 of the microcontroller U5.2. Pin 15 is grounded. Pin 17 is connected to pin G6 of the microcontroller U5.2. Pin 19 is grounded. Pin 21 is connected to pin E4 of the microcontroller U5.2. Pin 23 is grounded. Pin 25 is connected to pin G5 of the microcontroller U5.2. Pin 27 is grounded. Pin 29 is connected to pin H4 of the microcontroller U5.2. Pin 31 is grounded. Pin 33 is connected to pin H5 of the microcontroller U5.2. Pin 35 is grounded. Pin 37 is connected to pin G4 of the microcontroller U5.2. Pin 39 is grounded. Pin 41 is connected to pin E6 of the microcontroller U5.2. Pin 43, pin 45, pin 47, pin 49, and pin 51 are grounded. Pin 53 and pin 55 are connected to each other and grounded. Pin 57 and pin 59 are connected and connected to the 5V VCC voltage. Pin 54 and pin 56 are connected to each other and grounded. Pin 58 and pin 60 are connected to each other and connected to the 5V VCC voltage. Pin 10 is connected to pin H18 of the microcontroller U5.3. Pin 12 is connected to pin J21 of the microcontroller U5.3. Pin 14 is connected to pin H18 of the microcontroller U5.3. Pin 16 is connected to pin G19 of the microcontroller U5.3. Pin 18 is connected to pin H18 of the microcontroller U5.3. Pin 20 is connected to pin G20 of the microcontroller U5.3. Pin 22 is connected to pin H18 of the microcontroller U5.3. Pin 24 is grounded. Pin 26 is connected to pin D5 of the microcontroller U5.2. Pin 28 is grounded. Pin 30 is connected to pin L5 of the microcontroller U5.2. Pin 32 is grounded. Pin 34 is connected to pin K4 of the microcontroller U5.2. Pin 36 is grounded. Pin 38 is connected to pin K5 of the microcontroller U5.2. Pin 40 is grounded. Pin 42 is connected to pin E5 of the microcontroller U5.2. Pin 44 is grounded. Pin 46 is connected to pin L6 of the microcontroller U5.2. Pin 48, pin 50, and pin 52 are grounded.

[0056] In an embodiment of the present invention, the expansion board module 2 may include a plurality of USB interfaces 24. The USB interface 24 can be connected to the second BTB connection module 20, and can be used for power supply and signal transmission of the device, thereby improving the connection ability of the core development board module 1.

[0057] In an embodiment of the present utility model, the expansion board module 2 may include an RJ45 network cable interface 21 and an HDMI video output interface 22. Both of these interfaces may be connected to the second BTB connection module 20, thereby solving the defects that the core development board module 1 only has a wireless communication function, has a relatively small communication distance, and is easily affected by external electromagnetic interference, realizing the limited network connection of the core development board module 1 and reducing the influence of external interference on the core development board module 1. The core development board module 1 may output information such as graphics during operation in real time through the HDMI video output interface 22, making the development and operation and maintenance of the core development board module 1 more convenient.

[0058] In an embodiment of the present utility model, the expansion board module 2 may include a GPIO interface unit 23. Refer to Figure 14As shown, it is the circuit diagram of the GPIO interface unit of the livestock non-contact edge computing device. The GPIO interface unit 23 can be connected to the first BTB connection module 15 and the second BTB connection module 20. The GPIO interface unit 23 can lead out all the unused GPIO interfaces of the core development board module 1 and connect them to external devices, enabling functions such as customized development of the core development board module 1. The 1st pin of the GPIO H1 is connected to the 5V voltage, the 3rd pin is connected to the 1st pin, the 5th pin and the 7th pin are connected to each other and connected to the GND terminal, the 9th pin is connected to the 9th pin of the first BTB connection module 15, the 11th pin is connected to the 9th pin of the first BTB connection module 13, the 13th pin is connected to the 15th pin of the first BTB connection module 15, the 15th pin is connected to the 10th pin of the first BTB connection module 15, the 17th pin is connected to the 16th pin of the first BTB connection module 15, the 19th pin is connected to the 14th pin of the first BTB connection module 15, the 21st pin is connected to the 16th pin of the first BTB connection module 15, the 23rd pin is connected to the 18th pin of the first BTB connection module 15, the 25th pin is connected to the 20th pin of the first BTB connection module 15, the 27th pin is connected to the 34th pin of the second BTB connection module 20, the 29th pin is connected to the 30th pin of the second BTB connection module 20, the 31st pin is connected to the 26th pin of the second BTB connection module 20, the 33rd pin and the 35th pin are connected to each other and grounded, the 37th pin and the 39th pin are connected to each other and connected to the 5V voltage, the 2nd pin and the 4th pin are connected to each other and connected to the 5V voltage, the 6th pin and the 8th pin are connected to each other and grounded, the 10th pin is connected to the 46th pin of the second BTB connection module 20, the 12th pin is connected to the 42nd pin of the second BTB connection module 20, the 14th pin is connected to the 38th pin of the second BTB connection module 20, the 16th pin is connected to the 41st pin of the second BTB connection module 20, the 18th pin is connected to the 37th pin of the second BTB connection module 20, the 20th pin is connected to the 33rd pin of the second BTB connection module 20, the 22nd pin is connected to the 29th pin of the second BTB connection module 20, the 24th pin is connected to the 25th pin of the second BTB connection module 20, the 26th pin is connected to the 21st pin of the second BTB connection module 20, the 28th pin is connected to the 17th pin of the second BTB connection module 20, the 30th pin is connected to the 13th pin of the second BTB connection module 20, the 32nd pin is connected to the 9th pin of the second BTB connection module 20, the 34th pin and the 36th pin are connected to each other and connected to the GND terminal, the 38th pin and the 40th pin are connected to each other and connected to the 5V voltage.

[0059] Through the above technical solution, a non-contact edge computing device for livestock provided by the utility model is connected to an external sensor device through a core development board to receive external environmental acquisition data and can process and transmit the data. The expansion board module can be connected to the core development board module, so that a large number of peripheral interfaces can be expanded for the core development board module, and thus more external sensor devices can be connected to collect more environmental data.

[0060] It should also be noted that the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, commodity or device. Without further limitation, an element defined by the statement "including one..." does not exclude the presence of additional identical elements in the process, method, commodity or device including the element.

[0061] The above are only examples of this application and are not intended to limit this application. For those skilled in the art, various changes and modifications can be made to this application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the scope of the claims of this application.

Claims

1. A non-contact edge computing device for livestock, characterized in that, The device includes: A core development board module (1), which is connected to an external sensor device to receive, process, and transmit environmental acquisition data; An expansion board module (2), which is connected to the core development board module (1) to expand a large number of peripheral interfaces for the core development board module (1) to collect more environmental data; The core development board module (1) includes a main control module (10), and the main control module (10) is used to realize the normal operation of the operating system. The main control module (10) includes: a main control chip (100) and a memory module (101) and a storage module (102) connected thereto. The main control chip (100) is used to run the operating system to process the environmental acquisition data; The main control chip (100) includes a first circuit diagram, a second circuit diagram, and a third circuit diagram; The first circuit diagram includes a microcontroller U5.2, a resistor R5, a resistor R27, and a lamp LED2. The D2 pin of the microcontroller U5.2 is grounded through the resistor R5, the F5 pin is connected to the 3.3V VCC voltage, the B2 pin is connected to one end of the lamp LED2 to control the lighting and extinguishing of the LED2. The other end of the LED2 is connected to the 3.3V power supply through the resistor R27, the D7 pin is connected to the 3.3V VCC voltage, and the J6 pin is connected to the 3.3V VCC voltage; The second circuit diagram includes microcontroller U5.3, capacitor C46, capacitor C41, resistor R25, resistor R26, capacitor C52, capacitor C54, resistor R23, capacitor C53, capacitor C55, capacitor C56, capacitor C57, crystal oscillator X1, resistor R15, switch SW1, capacitor C44, resistor R16, switch SW2, capacitor C45; the F18 pin of microcontroller U5.3 is connected to the 1.8V VCC voltage, the J18 pin is grounded through capacitor C46, the J17 pin is grounded through capacitor C41, the K18 pin is grounded through resistor R25, the H17 pin and the H20 pin are both connected to the 1.8V VCC voltage, the H18 pin is grounded, the D18 pin is grounded through capacitor C52, the C17 pin is grounded through capacitor C54, one end of resistor R26 is grounded and the other end is connected to the H18 pin of microcontroller U5.3, the B19 pin is grounded through resistor R23, the E18 pin is connected to the 3.3V VCC voltage, the M18 pin is connected to the 3.3V VCC voltage, the A16 pin is grounded through switch SW2, capacitor C44 is connected in parallel with switch SW2, the A16 pin is connected to the 3.3V VCC voltage through resistor R15, the B17 pin is grounded through switch SW1, capacitor C45 is connected in parallel with switch SW1, the B17 pin is connected to the 1.8V VCC voltage through resistor R16, the D12 pin is connected to the 1.8V VCC voltage, the B11 pin is grounded through capacitor C57, the C12 pin is connected to one end of capacitor C56 and the third pin of crystal oscillator X1, the second pin of crystal oscillator X1 is connected to the other end of capacitor C56, a capacitor C57 is connected in series between the first pin and the fourth pin of crystal oscillator X1, the B11 pin is connected to the first pin of crystal oscillator X1, the second pin and the fourth pin of crystal oscillator X1 are grounded, the D13 pin is grounded through capacitor C53, and the D11 pin is grounded through capacitor C55; The third circuit includes microcontroller U5.1, resistor R10, capacitor C30, capacitor C31, capacitor C32, capacitor C33, capacitor C34, capacitor C35, capacitor C36, capacitor C37, capacitor C58, capacitor C59. The L15 pin of microcontroller U5.1 is grounded through resistor R10, the L9 pin, L10 pin, L11 pin, L12 pin, and L13 pin are connected to each other and grounded through the parallel-connected capacitors C30, C31, C32, C33, C34, C35, C36, C37, C58, and C59, and the L14 pin is connected to the 1.8V VCC voltage.

2. The livestock non-contact edge computing device according to claim 1, wherein The memory module (101) includes a memory chip U2, resistors R7, R8, R9, R11, R12, capacitors C27, C28, and C29. The N3 pin of the memory chip U2 is connected to the P18 pin of the microcontroller U5.1, the P7 pin is connected to the R15 pin of the microcontroller U5.1, the P3 pin is connected to the T18 pin of the microcontroller U5.1, the N2 pin is connected to the R19 pin of the microcontroller U5.1, the P8 pin is connected to the U16 pin of the microcontroller U5.1, the P2 pin is connected to the R20 pin of the microcontroller U5.1, the R8 pin is connected to the N13 pin of the microcontroller U5.1, the R2 pin is connected to the T21 pin of the microcontroller U5.1, the T8 pin is connected to the V17 pin of the microcontroller 5.1, the R3 pin is connected to the T20 pin of the microcontroller 5.1, the L7 pin is connected to the U19 pin of the microcontroller 5.1, the R7 pin is connected to the U17 pin of the microcontroller 5.1, the N7 pin is connected to the P16 pin of the microcontroller 5.1, the T3 pin is connected to the R18 pin of the microcontroller 5.1, the T7 pin is connected to the P15 pin of the microcontroller 5.1, the M7 pin is connected to the U18 pin of the microcontroller 5.1, the M2 pin is connected to the P20 pin of the microcontroller 5.1, the N8 pin is connected to the U15 pin of the microcontroller 5.1, the M3 pin is connected to the U20 pin of the microcontroller 5.1, the L3 pin is connected to the V20 pin of the microcontroller 5.1, the J3 pin is connected to the T16 pin of the microcontroller 5.1, the K3 pin is connected to the N16 pin of the microcontroller 5.1, the L2 pin is connected to the P21 pin of the microcontroller 5.1, the L1 pin is connected to the N19 pin of the microcontroller 5.1, the K1 pin is connected to the N20 pin of the microcontroller 5.1, the J1 pin is connected to the N21 pin of the microcontroller 5.1, the K9 pin is connected to the V15 pin of the microcontroller 5.1, the J9 pin is connected to the P13 pin of the microcontroller 5.1, the J7 pin is connected to the T14 pin of the microcontroller 5.1, the K7 pin is connected to the U14 pin of the microcontroller 5.1, a resistor R7 is connected in series between the J7 pin and the K7 pin, the T2 pin is connected to the U21 pin of the microcontroller 5.1, the A1 pin, A8 pin, D2 pin, C9 pin, C1 pin, H2 pin, H9 pin, F1 pin, E9 pin, R1 pin, R9 pin, N1 pin, N9 pin, K2 pin, K8 pin, G7 pin, D9 pin, B2 pin are connected to each other and connected to the L13 pin of the third circuit diagram. The E3 pin is connected to the R4 pin of the microcontroller 5.1, the F7 pin is connected to the V3 pin of the microcontroller 5.1, the F2 pin is connected to the P4 pin of the microcontroller 5.1, the F8 pin is connected to the P6 pin of the microcontroller 5.1, the H3 pin is connected to the N4 pin of the microcontroller 5.1, the H8 pin is connected to the R6 pin of the microcontroller 5.1, the G2 pin is connected to the microcontroller 5.The P5 pin of 1 is connected to the N5 pin of microcontroller 5.1, the H7 pin is connected to the N5 pin of microcontroller 5.1, the E7 pin is connected to the R3 pin of microcontroller 5.1, the F3 pin is connected to the U2 pin of microcontroller 5.1, the G3 pin is connected to the V2 pin of microcontroller 5.1, the D7 pin is connected to the T4 pin of microcontroller 5.1, the C3 pin is connected to the P1 pin of microcontroller 5.1, the C8 pin is connected to the U4 pin of microcontroller 5.1, the C2 pin is connected to the N2 pin of microcontroller 5.1, the A7 pin is connected to the T2 pin of microcontroller 5.1, the A2 pin is connected to the N3 pin of microcontroller 5.1, the B8 pin is connected to the U3 pin of microcontroller 5.1, the A3 pin is connected to the P2 pin of microcontroller 5.1, the D3 pin is connected to the U1 pin of microcontroller 5.1, the C7 pin is connected to the R2 pin of microcontroller 5.1, the B7 pin is connected to the R1 pin of microcontroller 5.1, the M8 pin is grounded through the parallel-connected resistors R12, capacitors C28 and C29, the M8 pin is connected to the A1 pin through the parallel-connected resistors R11 and capacitor C27, the H1 pin is connected to the M8 pin, the L9 pin is grounded through resistor R9, the L8 pin is grounded through resistor R8, the G1 pin, G9 pin, B1 pin, B9 pin, D1 pin, D8 pin, E8 pin, E2 pin, F9 pin, A9 pin, B3 pin, J8 pin, J2 pin, M9 pin, E1 pin, M1 pin, G8 pin, P9 pin, P1 pin, T9 pin, T1 pin are interconnected and grounded.

3. The non-contact edge computing device for livestock according to claim 1, characterized in that, The storage module (102) includes a memory chip U4, a capacitor C43, a resistor R13, a resistor R14, and a resistor R24. The A3 pin of the memory chip U4 is connected to the F2 pin of the microcontroller U5.2, the A4 pin is connected to the G3 pin of the microcontroller U5.2, the A5 pin is connected to the H2 pin of the microcontroller U5.2, the A6 pin is grounded, the B2 pin is connected to the E3 pin of the microcontroller U5.2, the B3 pin is connected to the F1 pin of the microcontroller U5.2, the B4 pin is connected to the F3 pin of the microcontroller U5.2, the B5 pin is connected to the H1 pin of the microcontroller U5.2, the B6 pin is connected to the H3 pin of the microcontroller U5.2, the C2 pin is grounded through the capacitor C43, the C4 pin is grounded, the C6 pin is connected to the 3.3V VCC voltage, the E6 pin is connected to the 3.3V VCC voltage, the E7 pin is grounded, the F5 pin is connected to the 3.3V VCC voltage, the G5 pin, the P6 pin, the P4 pin, the N5 pin, and the N2 pin are all grounded, the P5 pin, the P3 pin, and the N4 pin are all connected to the 3.3V VCC voltage, the M6 pin is connected to the D3 pin of the microcontroller U5.2 through the resistor R14, the M5 pin is connected to the E2 pin of the microcontroller U5.2, the M5 pin is connected to the 3.3V VCC voltage through the resistor R13, the M4 pin is connected to the 3.3V VCC voltage, the K9 pin is connected to the 3.3V VCC voltage, the K8 pin is grounded, the K5 pin is connected to the C2 pin of the microcontroller U5.2, the J10 pin is connected to the 3.3V VCC voltage, the J5 pin is grounded, the H10 pin is grounded, the H5 pin is connected to the B1 pin of the microcontroller U5.2, and the H5 pin is connected to the 3.3V VCC voltage through the resistor R24.

4. The livestock non-contact edge computing device according to claim 1, characterized in that, It further includes a power supply management module, and the power supply management module includes a power management chip U1, a capacitor C1, a capacitor C3, a capacitor C5, a resistor R1, a resistor R2, a resistor R3, a resistor R4, a capacitor C42, a capacitor C2, an inductor L4, a capacitor C4, a capacitor C6, a capacitor C7, an inductor L1, a capacitor C8, a capacitor C9, and an inductor L2; the 15th pin of the power management chip U1 is connected to the 1.8V VCC voltage, and the 15th pin is also grounded through the capacitor C1, the 12th pin is connected to the 3.3V VCC voltage, and the 12th pin is also grounded through the capacitor C3, the 7th pin is grounded through the parallel-connected capacitor C5 and resistor R28, the 5th pin is connected to the B18 pin of the microcontroller U5.2, the 5th pin is also connected to the 1.8V VCC voltage through the resistor R1, the 6th pin is connected to the C18 pin of the microcontroller U5.2, the 6th pin is also connected to the 1.8V VCC voltage through the resistor R2, the 11th pin is connected to the C1 pin of the microcontroller U5.2 through the resistor R3, the 13th pin is connected to the A16 pin of the microcontroller U5.3 through the resistor R4, the 8th pin is grounded through the capacitor C42, the 17th pin, the 20th pin, and the 2nd pin are all connected to the 5V VCC voltage, the 17th pin is grounded through the capacitor C2, the 18th pin is sequentially connected to the inductor L4 and the capacitor C4 and then grounded, the 16th pin is connected to the common terminal of the inductor L4 and the capacitor C4, the 20th pin is grounded through the capacitor C6, the 19th pin is sequentially connected to the inductor L1 and the capacitor C7 and then grounded, the 1st pin is connected to the common terminal of the inductor L1 and the capacitor C7, the 2nd pin is grounded through the capacitor C8, the 3rd pin is sequentially connected to the inductor L2 and the capacitor C9 and then grounded, the 4th pin is connected to the common terminal of the inductor L2 and the capacitor C9, and the 9th pin and the 21st pin are both grounded.

5. The non-contact edge computing device for livestock according to claim 1, characterized in that, It further includes a wireless communication module, and the wireless communication module includes a Bluetooth chip U7, resistors R29, R30, R31, R36, R32, R33, R34, R35, a capacitor C63, a resistor R37, capacitors C73, C74, C68, C69, C62, C64, C65, C66, C67, C70, C71, C72, a crystal oscillator X2, a capacitor C60, an interface JP1, and a capacitor C61. The 20th pin of the Bluetooth chip U7 is connected to the C8 pin of the microcontroller U5.

2. The 20th pin is connected to the 3.3V VCC voltage via the resistor R29. The 3.3V VCC voltage is grounded via the capacitor C63. The 3rd pin is connected to the third pin of the crystal oscillator X2. The 4th pin is connected to the second pin of the crystal oscillator X2. The first pin and the fourth pin of the crystal oscillator X2 are grounded. A capacitor C60 is connected in series between the third pin and the fourth pin. A capacitor C61 is connected in series between the second pin and the fourth pin. The 6th pin is connected to the 3.3V VCC voltage via the resistor R30. The 5th pin is connected to the 3.3V VCC voltage via the resistor R31. The 23rd pin is connected to the C10 pin of the microcontroller U5.

2. The 10th pin is connected to the B4 pin of the microcontroller U5.

2. The 9th pin is connected to the A4 pin of the microcontroller U5.

2. The 8th pin is connected to the C4 pin of the microcontroller U5.

2. The 7th pin is connected to the B3 pin of the microcontroller U5.

2. The 12th pin is connected to the C7 pin of the microcontroller U5.

2. The 12th pin is connected to the 3.3V VCC voltage via the resistor R36. The 13th pin is connected to the C6 pin of the microcontroller U5.

2. The 13th pin is connected to the 3.3V VCC voltage via the resistor R32. The 14th pin is connected to the B5 pin of the microcontroller U5.

2. The 14th pin is connected to the 3.3V VCC voltage via the resistor R33. The 17th pin is connected to the C5 pin of the microcontroller U5.

2. The 17th pin is connected to the 3.3V VCC voltage via the resistor R34. The 15th pin is connected to the B7 pin of the microcontroller U5.

2. The 15th pin is connected to the 3.3V VCC voltage via the resistor R35. The 16th pin is connected to the A6 pin of the microcontroller U5.

2. The 24th pin is connected to the B10 pin of the microcontroller U5.

2. The 35th pin is connected to the C9 pin of the microcontroller U5.

2. The 40th pin is connected to the first pin of the interface JP1 via the resistor R37. The second pin and the third pin of the interface JP1 are grounded. The capacitors C73 and C74 are connected in series and then connected in parallel across the resistor R37. The common terminal of the capacitors C73 and C74 is grounded. The 11th pin, 30th pin, 37th pin, and 25th pin are all connected to 3.The VCC voltage is 3V. The 30th pin is grounded through capacitor C68, the 37th pin is grounded through capacitor C69, the 38th pin is grounded through capacitor C62, the 2nd pin is grounded through capacitor C64, the 21st pin is grounded through capacitor C65, the 26th pin is grounded through capacitor C66, the 28th pin, 36th pin, 1st pin, and 22nd pin are interconnected. The 28th pin is grounded through capacitor C67, the 36th pin is grounded through capacitor C70, the 1st pin is grounded through capacitor C71, the 22nd pin is grounded through capacitor C72, and the 19th pin and 41st pin are grounded.

6. The livestock non-contact edge computing device according to claim 1, characterized in that, The core development board module (1) further includes a core board interface module, and the core board interface module is connected to the main control module (10), and the core board interface module includes two USB C interfaces.

7. The non-contact edge computing device for livestock according to claim 1, characterized in that, The core development board module (1) further includes a TF expansion module connected to the main control module (10), and the TF expansion module includes a storage chip TF, a resistor R18, a resistor R19, and a capacitor C47. The 7th pin of the storage chip TF is connected to the J3 pin of the microcontroller U5.2, the 8th pin is connected to the J2 pin of the microcontroller U5.2, the 1st pin is connected to the L3 pin of the microcontroller U5.2, the 2nd pin is connected to the L2 pin of the microcontroller U5.2, the 3rd pin is connected to the K3 pin of the microcontroller U5.2, the 5th pin is connected to the K1 pin of the microcontroller U5.2 through the resistor R18, the 10th pin and the 11th pin are grounded, the 12th pin and the 13th pin are grounded, the 4th pin is connected to the 3.3V VCC voltage, the 4th pin is grounded through the capacitor C47, the 9th pin is connected in series with the resistor R19 before the 4th pin, the 9th pin is connected to the K2 pin of the microcontroller U5.2, and the 6th pin is grounded.

8. The livestock non-contact edge computing device according to claim 1, characterized in that It further includes a first BTB connection module connected to the main control module and a second BTB connection module connected to the first BTB connection module.