Wafer counting device circuit board

Abstract

The utility model relates to a circuit board of a wafer counting device, which comprises an IC control circuit board and a 2 * n short-distance correlation type sensor array: in two columns, each column is arranged in a manner that transmitting ends and receiving ends are staggered and uniformly spaced, and the transmitting ends and the receiving ends in each column are pairwise paired to form a group of correlation type sensors; in the n rows, the first row is provided with a transmitting end, the tail row is provided with a receiving end, and the other rows are respectively provided with a transmitting end and a receiving end; and the transmitting end and the receiving end are connected with the IC control circuit board. The wafer storage device has the advantages that the wafer storage device can automatically detect and judge whether wafers exist in each layer of storage position in the wafer conveying box or not and record the wafers, then automatic storage and taking operation can be correspondingly carried out according to internal records of the wafers, the workload of operators is greatly reduced, and wafer damage caused by human factors in the storage and taking process is avoided.

Description

Technical Field

[0001] The utility model relates to the field of wafer processing, in particular to a circuit board of a wafer counting device. Background Art

[0002] A wafer is a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. The wafer is circular in shape and has various diameter specifications, including 2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, 12 inches, etc. The main processing methods of wafers include single-wafer processing and batch processing, that is, processing 1 wafer or multiple wafers simultaneously.

[0003] During the transportation process of the above wafers during processing, they are usually placed in a wafer transport box. Grooves are evenly arranged on the opposite side walls of this wafer transport box, and a cavity for inserting wafers is formed between the two side walls, and at least one side of the cavity is open.

[0004] When this wafer transport box is loaded into the next process, it is necessary to automatically count the number of wafers inside. Currently, it is usually manually judged and then the wafer fork mechanism is controlled to operate. Since the wafers in the wafer transport box are stacked densely, it not only increases the work intensity of the operators, but also if the operator misjudges that there are no wafers in a certain layer of the wafer transport box, it may also cause wafer damage and economic losses.

[0005] Therefore, it is necessary to improve and optimize the existing wafer counting method of the wafer transport box so that it can better meet the user's needs. Summary of the Utility Model

[0006] The purpose of the embodiment of the utility model is to overcome the structural defects of the prior art and propose a circuit board of a wafer counting device, which can automatically detect and judge the presence or absence of wafers in each storage position in the wafer transport box and record them, and then can perform automatic access operations according to the internal records, greatly reducing the workload of the operators and avoiding wafer damage caused by human factors during the access process.

[0007] In order to achieve the above utility model purpose, a circuit board of a wafer counting device proposed by the embodiment of the utility model is realized through the following technical solutions:

[0008] A circuit board for a wafer counting device, including an IC control circuit board, is characterized in that: the circuit board further includes a 2*n proximity opposed sensor array. In two columns, each column is arranged in a way that the transmitting end and the receiving end are staggered and evenly spaced, and in each column, the transmitting end and the receiving end are paired in pairs to form a set of opposed sensors. In n rows, a transmitting end is set in the first row, a receiving end is set in the last row, and a transmitting end and a receiving end are set in the remaining rows. In addition, when the lifting drive mechanism drives the lifting table to rise, the wafers in the wafer transfer box on the turntable in the second position just enter between the rows of the proximity opposed sensor array. The transmitting end and the receiving end are connected to the IC control circuit board.

[0009] The circuit board further includes a column of wedge-shaped blocks fixed on the IC control circuit board. The wedge-shaped blocks and the proximity opposed sensor array form a 3*n array. A transmitting end and a wedge-shaped block are set in the first row, a receiving end and a wedge-shaped block are set in the last row, and the wedge-shaped blocks in the remaining rows are arranged between the transmitting end and the receiving end. The wedge-shaped blocks are set higher than the tops of the transmitting end and the receiving end.

[0010] The wedge-shaped blocks are in the shape of double-sloped roofs.

[0011] Compared with the prior art, the beneficial effects of the present utility model are: it can automatically detect and judge the presence or absence of wafers in each storage position in the wafer transfer box and record them, and then can perform automatic access operations according to the internal records, greatly reducing the workload of operators and avoiding wafer damage caused by human factors during the access process.

[0012] Moreover, this device also has the advantages of simple structure, simple and convenient operation, high precision, etc., greatly improving the product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Through the description of its exemplary embodiments in conjunction with the following drawings, the above features and advantages of the present utility model will become clearer and easier to understand.

[0014] Figure 1 is a three-dimensional structural schematic diagram of a wafer counting device according to an embodiment of the present utility model;

[0015] Figure 2 is a top view of a wafer counting device according to an embodiment of the present utility model; DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The following specific embodiments illustrate the implementation manners of the present utility model. Those skilled in this technology can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope protected by the present utility model.

[0017] Terms such as "front", "rear", "left", "right", "inside", "outside", etc. cited in this specification are only for the convenience of clear narration, rather than to limit the scope of implementation of the present utility model. The change or adjustment of their relative relationships, without substantial change in technical content, should also be regarded as the scope of implementation of the present utility model.

[0018] In the description of the following embodiments, unless otherwise clearly specified and limited, terms such as "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0019] See Figure 1-2 As shown, an embodiment of the present utility model provides a circuit board for a wafer counting device, including an IC control circuit board 1, a near-infrared opposed sensor array, and a row of wedge blocks 2.

[0020] The near-infrared opposed sensor array is a 2*n rectangular array:

[0021] In the two columns, each column is arranged in a way that the transmitting end 3 and the receiving end 4 are staggered and evenly spaced, and the transmitting end 3 and the receiving end 4 in each column form a pair of opposed sensors in pairs;

[0022] In the n rows, a transmitting end 3 is arranged in the first row, a receiving end 4 is arranged in the last row, and a transmitting end 3 and a receiving end 4 are arranged in the remaining rows. The first row and the last row are in the same column. Therefore, one column has n transmitting ends plus receiving ends, and the other column has n-2 transmitting ends plus receiving ends.

[0023] Both the transmitting end 3 and the receiving end 4 are set on the circuit board 1 through support columns 5 and are electrically connected to the circuit board 1.

[0024] The wedge-shaped blocks 2 are also fixed on the circuit board 1, and the number of them is n. The wedge-shaped blocks 2 and the proximity opposed beam sensor array form a 3*n array: one transmitting end 3 and one wedge-shaped block 2 are arranged in the first row, one receiving end 4 and one wedge-shaped block 2 are arranged in the last row, and the wedge-shaped blocks 2 in the remaining rows are arranged between the transmitting end 3 and the receiving end 4. The wedge-shaped block 4 is in the shape of a double-sloped roof and is arranged higher than the tops of the transmitting end and the receiving end, and is used to guide the wafer into the rows of the proximity opposed beam sensor array.

[0025] A typical application method is that the wafer transfer box is fixedly placed on the storage position, the circuit board of the wafer counting device is arranged on a linear drive module, and the linear drive module drives the circuit board of the wafer counting device to approach the wafer transfer box, so that the wafers in the wafer transfer box just enter between the rows of the proximity opposed beam sensor array, and whether there are wafers between the paired transmitting end 53 and receiving end 54 is detected, so as to detect the wafer distribution in the wafer transfer box batch by batch.

[0026] Compared with the prior art, the beneficial effects of the present utility model are as follows: the wafer picking and placing device can automatically detect and judge whether there are wafers in each storage position layer in the wafer transfer box and record them, and then can perform automatic access operations correspondingly according to the internal records, greatly reducing the workload of operators and avoiding wafer damage caused by human factors during the access process.

[0027] Moreover, the device also has the advantages of simple structure, simple and convenient operation, high precision, etc., greatly improving the product quality.

[0028] The above details the inventive concept and implementation manner of the present utility model through embodiments. However, those of ordinary skill in the art to which the present utility model pertains can understand that the above embodiments of the present utility model are only one of the preferred embodiments of the present utility model. Due to space limitations, all implementation manners cannot be listed one by one here. Any implementation that can embody the technical solution of the claims of the present utility model is within the protection scope of the present utility model.

[0029] It should be noted that the above content is a further detailed description of the present utility model in combination with specific implementation manners, and it cannot be determined that the specific implementation manner of the present utility model is limited to this. Under the guidance of the above embodiments, those skilled in the art can make various improvements and deformations on the basis of the above embodiments, and these improvements or deformations fall within the protection scope of the present utility model.

Claims

1. A circuit board of a wafer counting device, comprising an IC control circuit board, characterized in that: The circuit board further includes a 2*n proximity opposed sensor array: in the two columns, each column is arranged in a way that the transmitting ends and receiving ends are staggered and evenly spaced, and in each column, the transmitting ends and receiving ends are paired up to form a set of opposed sensors; in the n rows, a transmitting end is arranged in the first row, a receiving end is arranged in the last row, and a transmitting end and a receiving end are arranged in each of the remaining rows; the transmitting ends and receiving ends are connected to the IC control circuit board.

2. The circuit board of a wafer counting device according to claim 1, wherein: The circuit board further includes a column of wedge-shaped blocks fixed on the IC control circuit board, and the wedge-shaped blocks and the proximity opposed sensor array form a 3*n array: a transmitting end and a wedge-shaped block are arranged in the first row, a receiving end and a wedge-shaped block are arranged in the last row, and the wedge-shaped blocks in the remaining rows are arranged between the transmitting ends and the receiving ends; the wedge-shaped blocks are set higher than the tops of the transmitting ends and the receiving ends.

3. A circuit board of a wafer counting device according to claim 2, characterized in that: The wedge-shaped blocks are in the shape of a double-sloped roof.

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