Etching apparatus
By designing an etching device that is suitable for plate-shaped components in different sizes, using the combination of limiting components and sensing components, the problem that the etching device in the prior art cannot thin large plates of different sizes is solved, and higher versatility and flexibility are achieved.
Patent Information
- Application Number
- CN202421876848.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-05
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-05
AI Technical Summary
Existing etching devices cannot thin large plates of different sizes and lack versatility.
An etching device is designed, including a first chamber, a first limiting assembly, a second limiting assembly and a first sensing assembly. Through different thinning modes, the limiting and transmission of plate-shaped elements of different sizes is realized by using the combination of limiting assembly and sensing assembly.
The equilibrium and flexibility of the etching device are improved, and it can be thinned with plate-shaped components of different sizes.
Smart Images
Figure CN223092818U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of displays, and in particular to an etching device used in the thinning process. Background Art
[0002] At present, display panels are widely used in many electronic products, such as mobile phones, tablet computers, watches, in-vehicle displays, etc. As users' requirements for electronic products are getting higher and higher, electronic products are now developing towards thinner and lighter directions. Taking display panels as an example, after the cell formation, the chemical reaction between the glass substrate and the acid solution can be utilized to etch and thin the upper and lower glass substrates, so that the overall thickness of the display panel is reduced. In the prior art, an etching device usually can only thin a large board of one size (i.e., the mother board that has not been cut into single display panels), and does not have universality.
[0003] Therefore, how to design an etching device that can thin large boards of different sizes to improve universality is one of the technical problems that the industry needs to solve. Summary of the Utility Model
[0004] The purpose of the utility model is to provide an etching device to solve the aforementioned technical problems.
[0005] To achieve the above object, the present utility model provides an etching device for thinning a first plate-shaped element and / or a second plate-shaped element. The size of the first plate-shaped element is smaller than that of the second plate-shaped element. The etching device includes a first chamber, a first limiting component, a second limiting component and a first sensing component. The first chamber has an inlet. A plurality of first conveying shafts arranged along a first direction and extending along a second direction are provided in the first chamber. The first direction is perpendicular to the second direction. The plurality of first conveying shafts are used to convey the first plate-shaped element or the second plate-shaped element along the first direction. The first limiting component and the second limiting component are arranged in the first chamber corresponding to the plurality of first conveying shafts. The first limiting component includes multiple pairs of first limiting columns, and the second limiting component includes multiple pairs of second limiting columns. The multiple pairs of first limiting columns and the multiple pairs of second limiting columns are all arranged along the first direction. Each pair of first limiting columns has a first spacing in the second direction, and each pair of second limiting columns has a second spacing in the second direction. The first spacing is smaller than the second spacing. The first sensing component is arranged in the first chamber adjacent to the inlet and does not exceed the top surface of the plurality of first conveying shafts. In the first thinning mode, the first sensing component is turned on to detect whether a first plate-shaped element enters the first chamber. If so, the multiple pairs of first limiting columns protrude and rise above the top surface of the plurality of first conveying shafts to limit the first plate-shaped element between each pair of first limiting columns. In the second thinning mode, the multiple pairs of first limiting columns do not exceed the top surface of the plurality of first conveying shafts, and at the same time, the multiple pairs of second limiting columns exceed the top surface of the plurality of first conveying shafts to limit the second plate-shaped element between each pair of second limiting columns.
[0006] As an optional technical solution, in the first thinning mode, if the first sensing component detects that a first plate-shaped element enters the first chamber, the plurality of first conveying shafts start to rotate to convey the first plate-shaped element along the first direction.
[0007] As an optional technical solution, the etching device further has a second sensing component arranged adjacent to the inlet. In the second thinning mode, the second sensing component is turned on to detect whether a second plate-shaped element enters the first chamber.
[0008] As an optional technical solution, when the first sensing component is turned on and the second sensing component is turned off, the etching device enters the first thinning mode. When the first sensing component is turned off and the second sensing component is turned on, the etching device enters the second thinning mode.
[0009] As an alternative technical solution, the etching device further includes a recording component and a transfer shaft driving component. The recording component is electrically connected to the first sensing component and the transfer shaft driving component. In the first thinning mode, the first sensing component detects whether a first plate-shaped element enters the first chamber. If so, each time the first sensing component detects a first plate-shaped element, the recording component correspondingly records a virtual material account information, and the transfer shaft driving component drives the plurality of first transfer shafts to start rotating accordingly.
[0010] As an alternative technical solution, the etching device further includes a limit driving component. The limit driving component is electrically connected to the recording component. When the recording component records virtual material account information, the limit driving component drives the plurality of pairs of first limit posts to extend beyond the top surfaces of the plurality of first transfer shafts accordingly.
[0011] As an alternative technical solution, the first chamber further has an outlet, and the etching device further has a third sensing component. The third sensing component is disposed adjacent to the outlet and electrically connected to the recording component. In the first thinning mode, the third sensing component is turned on and detects whether a first plate-shaped element leaves the etching device from the outlet. If so, each time the third sensing component detects a first plate-shaped element, the recording component correspondingly deletes a virtual material account information.
[0012] As an alternative technical solution, in the first thinning mode, the recording component further determines whether all virtual material account information has been deleted. If so, the plurality of first transfer shafts stop rotating.
[0013] As an alternative technical solution, the first chamber includes an adjacent first sub-chamber and a second sub-chamber. The first limiting component, the second limiting component, and the first sensing component are located in the first sub-chamber. A plurality of second transfer shafts arranged in the third direction and extending in the fourth direction are provided in the second sub-chamber, and a third limiting component is provided in the second sub-chamber. The third limiting component includes a plurality of pairs of third limit posts. The plurality of third limit posts are arranged in the third direction, and each pair of third limit posts has a third spacing in the fourth direction. The third spacing is equal to the first spacing. The third direction is perpendicular to the fourth direction, and the first direction intersects the third direction.
[0014] As an alternative technical solution, a fourth limiting component is further provided in the second sub-chamber. The fourth limiting component includes a plurality of pairs of fourth limit posts. The plurality of fourth limit posts are arranged in the third direction, and each pair of fourth limit posts has a fourth spacing in the fourth direction. The fourth spacing is equal to the first spacing.
[0015] The etching device of the present utility model can etch plate-shaped components of different sizes. A first limiting component, a second limiting component and a first sensing component are arranged in the first chamber. When the etching device enters the first thinning mode, the first sensing component is turned on to detect whether a first plate-shaped component enters the first chamber. If so, multiple pairs of first limiting posts of the first limiting component rise to limit the first plate-shaped component. When the etching device enters the second thinning mode, multiple pairs of second limiting posts of the second limiting component are used to limit the second plate-shaped component, thus improving the versatility and flexibility of use of the etching device.
[0016] The present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments, but it is not intended to limit the present utility model. Description of the Drawings
[0017] Figure 1 is a partial schematic view of an embodiment of the etching device of the present utility model;
[0018] Figure 2 is a partial schematic view of the etching device of the present utility model in the first thinning mode from another perspective;
[0019] Figure 3 is a partial schematic view of the etching device of the present utility model in the second thinning mode from another perspective;
[0020] Figure 4 is a partial schematic view of another embodiment of the etching device of the present utility model. Detailed Embodiment
[0021] In order to further understand the purpose, structure, features and functions of the present utility model, the following is a detailed description in conjunction with the embodiments.
[0022] The descriptions of the following embodiments refer to the attached drawings to illustrate specific embodiments in which the present utility model can be implemented. The directional terms mentioned in the present utility model, such as "up", "down", "front", "back", "left", "right", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for explaining and understanding the present utility model, rather than for limiting the present utility model.
[0023] Please refer to Figures 1 to 3 , Figure 1 is a partial schematic view of an embodiment of the etching device of the present utility model, Figure 2 is a partial schematic view of another perspective of the etching device of the present utility model in the first thinning mode, Figure 3This is a partial schematic view of another perspective of the etching device of the present utility model in the second thinning mode. The etching device 10 of this embodiment can be used to thin the first plate-like element A or the second plate-like element B. The first plate-like element A and the second plate-like element B have different sizes. For example, the size of the first plate-like element A is smaller than that of the second plate-like element B. The first plate-like element A and the second plate-like element B can be display substrates of different generations after the cell formation, but this is not limited thereto.
[0024] As Figures 1 to 3 shown, the etching device 10 includes a first chamber 100, a first limiting component 200, a second limiting component 300, and a first sensing component 400. The first chamber 100 has an inlet 101. A plurality of first transfer shafts 110 are arranged in the first chamber 100 along a first direction F1 and extend along a second direction F2. The first direction F1 is perpendicular to the second direction F2. The plurality of first transfer shafts 110 are used to transfer the first plate-like element A or the second plate-like element B from the inlet 101 along the first direction F1. In an embodiment, the first chamber 100 may include a plurality of sub-chambers, and the plurality of first transfer shafts 110 are located in one of the sub-chambers, such as the sub-chamber closest to the inlet of the first chamber 100. As Figure 2 and Figure 3 shown, a spraying component 120 is further arranged in the first chamber 100. When the first plate-like element A or the second plate-like element B is being transferred on the plurality of first transfer shafts 110, the spraying component 120 can spray etching liquid onto the surface of the first plate-like element A or the second plate-like element B to thin it, or the spraying component 120 can spray cleaning liquid onto the surface of the first plate-like element A or the second plate-like element B to clean its surface. In this embodiment, the spraying component 120 is respectively arranged adjacent to the top and bottom of the first chamber 100, and the plurality of first transfer shafts 110 are located in the middle of the first chamber. The spraying component 120 can spray liquid onto the upper and lower surfaces of the first plate-like element A or the second plate-like element B. In other embodiments, the spraying component 120 is, for example, arranged adjacent to the top of the first chamber 100, and the plurality of first transfer shafts 110 are adjacent to the bottom of the first chamber 100, but this is not limited thereto.
[0025] As Figure 1As shown, the first limiting component 200 is arranged in the first chamber 100 corresponding to a plurality of first conveying shafts 110. The first limiting component 200 includes multiple pairs of first limiting posts 210. The multiple pairs of first limiting posts 210 are arranged along the first direction F1, and each pair of first limiting posts 210 has a first spacing d1 in the second direction F2. The second limiting component 300 is arranged in the first chamber 100 corresponding to a plurality of first conveying shafts 110. The second limiting component 200 includes multiple pairs of second limiting posts 310. The multiple pairs of second limiting posts 310 are arranged along the first direction F1, and each pair of second limiting posts 210 has a second spacing d2 in the second direction F2. The first spacing d1 is smaller than the second spacing d2. The first sensing component 400 is arranged in the first chamber 100 adjacent to the entrance 101. For example, the first sensing component 400 is arranged between the entrance 101 and the first first conveying shaft 110 adjacent to the entrance 101 or the first sensing component 400 is arranged between two adjacent first conveying shafts 110 adjacent to the entrance 101. Further, the first sensing component 400 does not exceed the top surface of the multiple first conveying shafts 110 to avoid affecting the normal conveyance of the first plate-like element A or the second plate-like element B.
[0026] In the first thinning mode, the etching device 10 is used to thin the first plate-like element A. The first sensing component 400 is turned on to detect whether the first plate-like element A enters the first chamber 100. If it is detected that the first plate-like element A enters the first chamber 100, then the multiple pairs of first limiting posts 210 protrude and rise beyond the top surface of the multiple first conveying shafts 110 to limit the first plate-like element A between each pair of first limiting posts 210. In the second thinning mode, the etching device 10 is used to thin the second plate-like element B. The multiple pairs of first limiting posts 210 do not exceed the top surface of the multiple first conveying shafts 110, and at the same time, the multiple pairs of second limiting posts 310 exceed the top surface of the multiple first conveying shafts 110 to limit the second plate-like element B between each pair of second limiting posts 310.
[0027] The etching device 10 of the present utility model can etch plate-like elements of different sizes. The first chamber 100 thereof is provided with a first limiting component 200, a second limiting component 300 and a first sensing component 400. When the etching device 10 enters the first thinning mode, the first sensing component 400 is turned on and detects whether the first plate-like element A enters the first chamber 100. If so, the multiple pairs of first limiting posts 210 of the first limiting component 200 rise and limit the first plate-like element A. When the etching device 10 enters the second thinning mode, the multiple pairs of second limiting posts 310 of the second limiting component 300 are used to limit the second plate-like element A, thereby improving the versatility and flexibility of use of the etching device 10.
[0028] In one embodiment, each pair of first limit posts 210 can be limit posts having a contracted state and an extended state. When each pair of first limit posts 210 is in the contracted state, each first limit post 210 does not protrude beyond the top surface of the plurality of first conveyor shafts 110. When it is detected that a first plate-like element A enters the first chamber 100, then each pair of first limit posts 210 extends to the extended state. When in the extended state, each first limit post 210 protrudes beyond the top surface of the plurality of first conveyor shafts 110 to limit the first plate-like element A on the first conveyor shafts 110, ensuring that the first plate-like element A does not skew during the conveying process. Further, in the first thinning mode, if the first sensing component 400 detects that a first plate-like element A enters the first chamber 100, the plurality of first conveyor shafts 110 start to rotate to convey the first plate-like element A along the first direction F1. At this time, each pair of first limit posts 210 limits the first plate-like element A in the second direction F2. In actual operation, after entering the first thinning mode, the plurality of first conveyor shafts 110 may not rotate first until the first sensing component 400 detects that a first plate-like element A enters the first chamber 100, and then each first conveyor shaft 110 starts to rotate.
[0029] In one embodiment, the etching device 10 further has a second sensing component 500. The second sensing component 500 is disposed adjacent to the inlet 101, for example, the second sensing component 500 is disposed outside the first chamber 100 adjacent to the inlet 101. In the second thinning mode, the second sensing component 500 is turned on to detect whether a second plate-like element B enters the first chamber 100. In actual operation, when the first sensing component 400 is turned on and the second sensing component 500 is turned off at the same time, the etching device 10 enters the first thinning mode; when the first sensing component 400 is turned off and the second sensing component 500 is turned on at the same time, the etching device 10 enters the second thinning mode.
[0030] As Figure 1 And Figure 2As shown, the etching device 10 further includes a recording component 600 and a transfer shaft driving component (not shown). The transfer shaft driving component is used to drive each first transfer shaft 110 to rotate. The recording component 600 is electrically connected to the first sensing component 400, the second sensing component 500, and the transfer shaft driving component. In the first thinning mode, the first sensing component 400 detects whether a first plate-shaped element A enters the first chamber 100. If so, each time the first sensing component 400 detects a first plate-shaped element A, the recording component 600 automatically records a virtual material account information correspondingly, and the transfer shaft driving component drives a plurality of first transfer shafts 110 to start rotating accordingly. Further, the etching device 10 further includes a limit driving component (not shown). The limit driving component is used to drive each first limit post 210 to switch between a contracted state and an extended state. The limit driving component is electrically connected to the recording component 600. When the recording component 600 records virtual material account information, the limit driving component drives multiple pairs of first limit posts 210 to protrude beyond the top surface of the plurality of first transfer shafts 110 accordingly, so as to limit the first plate-shaped element A in the second direction F2 when the plurality of first transfer shafts 110 transfer the first plate-shaped element A and prevent it from skewing.
[0031] In an embodiment, the first chamber 100 further has an outlet. The etching device 10 further has a third sensing component (not shown). The third sensing component is disposed adjacent to the outlet and is electrically connected to the recording component 600. In the first thinning mode, the third sensing component is turned on and detects whether a first plate-shaped element leaves the etching device 10 from the outlet. If so, each time the third sensing component detects a first plate-shaped element A, the recording component 600 deletes a corresponding virtual material account information. The recording component 600 also continuously determines whether all virtual material account information has been deleted. If so, the plurality of first transfer shafts 110 stop rotating.
[0032] When the etching device 10 enters the first thinning mode, the first sensing component 400 is activated and detects whether a first plate-shaped element A enters the first chamber 100. If so, the first sensing component 400 sends a recording signal to the recording component 600, and the recording component 600 can automatically record a virtual inventory information according to the recording signal. At this time, the etching device 10 enters the etching state in the first thinning mode. The transfer shaft driving component drives a plurality of first transfer shafts 110 to start rotating according to the record of the recording component 600. At the same time, the limit driving component drives each pair of first limit posts 210 to protrude and rise beyond the top surface of the plurality of first transfer shafts 110 according to the record of the recording component 600. The first plate-shaped element A is thinned in the first chamber 100 under the transfer of the plurality of first transfer shafts 110 and the limit of the first limiting component 200. After thinning is completed, when the first plate-shaped element A leaves the etching device 10 and the third sensing component senses the first plate-shaped element A at the outlet, it can send a deletion signal to the recording component 600, and the recording component 600 can automatically delete the corresponding virtual inventory information previously recorded according to the deletion signal. In an embodiment, multiple first plate-shaped elements A usually enter the etching device 10 at intervals. In other words, at the same time, there can be multiple first plate-shaped elements A at different positions (i.e., in different thinning steps) in the etching device 10. Each first plate-shaped element A enters the etching device 10, and the recording component 600 automatically records a virtual inventory information. Each first plate-shaped element A leaves the etching device 10, and the recording component 600 deletes the corresponding virtual inventory information in the recorded order of each virtual inventory information. The recording component 600 also continuously confirms the number of first plate-shaped elements A in the current etching device 10. When it is confirmed that the number of first plate-shaped elements A in the current etching device 10 is 0, that is, all the virtual inventory information recorded in the recording component 600 is deleted, the recording component 600 transmits this information to the transfer shaft driving component, and the transfer shaft driving component controls the plurality of first transfer shafts 110 to stop rotating accordingly. At this time, the etching device 10 enters the standby state in the first thinning mode. In an embodiment, the recording component 600 can also send a lowering signal to the limit driving component, and the limit driving component drives each first limit post 210 to descend to the contracted state and not exceed the top surface of the first transfer shaft 110 according to this lowering signal.
[0033] In an embodiment, the first thinning mode can be a manual loading mode. After the operator places the first plate-shaped element A at the entrance 101, the first sensing component 400 detects the first plate-shaped element A and enters the etching state. The second thinning mode can be an automatic loading mode. When the etching device 10 enters the second thinning mode, the second plate-shaped element B can be automatically transferred to the first chamber 100 via other transfer devices (not shown).
[0034] In one embodiment, since each pair of second limiting posts 310 has a relatively large second spacing d2 in the second direction F2, each pair of second limiting posts 310 can protrude beyond the top surface of the plurality of first transfer shafts 110 in the first thinning mode. At this time, the first plate-shaped element A is limited between the first limiting components 200 with a relatively small first spacing d1, and the second limiting posts 310 that protrude beyond the top surface of the first transfer shafts 110 will not affect the transfer of the first plate-shaped element A. In this way, each pair of second limiting posts 310 can only have a natural state. In this natural state, each second limiting post protrudes beyond the top surface of the plurality of first transfer shafts 110 in both the first thinning mode and the second thinning mode. However, this is not a limitation. Each pair of second limiting posts 310 can also refer to the design of each pair of first limiting posts 210. In the first thinning mode, each pair of second limiting posts 210 is in a contracted state and does not protrude beyond the top surface of the plurality of first transfer shafts 110; in the second thinning mode, each pair of second limiting posts 310 extends to an extended state and protrudes beyond the top surface of the plurality of first transfer shafts 110 to limit the second plate-shaped element B on the first transfer shafts 110, ensuring that the second plate-shaped element B does not skew during the transfer process.
[0035] In one embodiment, when the second sensing component 500 is turned on and the first sensing component 400 is turned off at the same time, the etching device 10 enters the second thinning mode. Each second plate-shaped element B has identification information. The second sensing component 500 detects whether a second plate-shaped element B enters the first chamber 100. If so, the second sensing component 500 identifies the identification information of this second plate-shaped element B and transmits it to the recording component 600, and the recording component 600 automatically records an actual account material information, and the plurality of first transfer shafts 110 start to rotate. When the second plate-shaped element B leaves the etching device 10, the recording component 600 retains this actual account material information.
[0036] Specifically, when the etching device 10 enters the second thinning mode, the first sensing component 400 is turned off while the second sensing component 500 is turned on to detect whether a second plate-shaped element B enters the first chamber 100. If so, the second sensing component 500 identifies the identity information of this second plate-shaped element B and transmits it to the recording component 600. The recording component 600 automatically records the corresponding actual account material information. At this time, the etching device 10 enters the etching state in the second thinning mode. The transmission shaft driving component drives a plurality of first transmission shafts 110 to start rotating according to the record of the recording component 600. Thus, the second plate-shaped element B is thinned under the transmission of the plurality of first transmission shafts 110 and the limitation of the second limiting component 300. After the thinning is completed, the second plate-shaped element B leaves the etching device 10. For example, a fourth sensing component (not shown) is provided at the outlet of the etching device 10. When the fourth sensing component senses the second plate-shaped element B at the outlet, it can send a discharging signal to the recording component 600. The recording component 600 can automatically retain the previously recorded actual account material information according to the discharging signal and update the state of the corresponding second plate-shaped element B to being discharged from the etching device 10. In an embodiment, multiple second plate-shaped elements B usually enter the etching device 10 sequentially at a certain time interval. In other words, at the same time, there may be multiple second plate-shaped elements B at different positions (i.e., in different thinning steps) in the etching device 10. The recording component 600 also continuously confirms the number of second plate-shaped elements B in the current etching device 10. When it is confirmed that the number of second plate-shaped elements B in the current etching device 10 is 0, that is, all the actual account material information recorded by the recording component 600 corresponds to a discharging signal, the recording component transmits this information to the transmission shaft driving component. The transmission shaft driving component controls the plurality of first transmission shafts 110 to stop rotating accordingly. At this time, the etching device 10 enters the standby state in the second thinning mode.
[0037] In an embodiment, the rotation speed of the first transmission shaft 110 can be adjusted according to the etching rate of the first plate-shaped element A or the second plate-shaped element B. For example, in the first thinning mode and the second thinning mode, the rotation speeds of the plurality of first transmission shafts 110 are different, but this is not limiting.
[0038] Please refer to Figure 4 , Figure 4A partial schematic diagram of another embodiment of the etching device of the present utility model. The first chamber 100 may include a first sub-chamber 130 and a second sub-chamber 140. The second sub-chamber 140 is adjacent to the first sub-chamber 130. The plurality of first transfer shafts 110, the first limiting component 200, the second limiting component 300, and the first sensing component 400 are located in the first sub-chamber 130. A plurality of second transfer shafts 710 arranged along the third direction F3 and extending along the fourth direction F4 are provided in the second sub-chamber 140. The plurality of second transfer shafts 710 are used to transfer the first plate-shaped element A or the second plate-shaped element B. A third limiting component 800 is provided in the second sub-chamber 140. The third limiting component 800 includes a plurality of pairs of third limiting posts 810. The plurality of third limiting posts 810 are arranged along the third direction F3, and each pair of third limiting posts 810 has a third spacing d3 in the fourth direction F4. The third spacing d3 is equal to the first spacing d1. The third direction F3 is perpendicular to the fourth direction F4, and the first direction F1 intersects with the third direction F3. A fourth limiting component 900 is further provided in the second sub-chamber 140. The fourth limiting component 900 includes a plurality of pairs of fourth limiting posts 910. The plurality of fourth limiting posts 910 are arranged along the third direction F3, and each pair of fourth limiting posts 910 has a fourth spacing d4 in the fourth direction F4. The fourth spacing d4 is equal to the first spacing d1.
[0039] In this embodiment, the first direction F1 is parallel to the fourth direction F4, and the second direction F2 is parallel to the third direction F3. The first direction F1 is perpendicular to the third direction F3, but not limited thereto. In actual operation, the thinning process has multiple steps. The first chamber 100 may have multiple sub-chambers, and different steps are completed in different sub-chambers. The first sub-chamber 130 and the second sub-chamber 140 are two of them. Different steps can be completed during the thinning process of the first plate-shaped element A or the second plate-shaped element B. For example, the first sub-chamber 130 can be used for pre-etching the first plate-shaped element A or the second plate-shaped element B, and the second sub-chamber 140 can be only used for transferring the first plate-shaped element A or the second plate-shaped element B, or for cleaning, main etching, etc. of the first plate-shaped element A or the second plate-shaped element B, not limited thereto. In one embodiment, the first sub-chamber 130 is arranged adjacent to the inlet 101 of the first chamber 100, and the second sub-chamber 140 is arranged adjacent to the outlet of the first chamber 100. In one embodiment, a plurality of thickness sensing components are further arranged adjacent to the outlet of the first chamber 100. The plurality of thickness sensing components can measure the thickness of the first plate-shaped element A or the second plate-shaped element B after thinning is completed.
[0040] The etching device of the present utility model can etch plate-shaped components of different sizes. A first limiting component, a second limiting component and a first sensing component are arranged in the first chamber. When the etching device enters the first thinning mode, the first sensing component is turned on to detect whether a first plate-shaped component enters the first chamber. If so, multiple pairs of first limiting posts of the first limiting component rise to limit the first plate-shaped component. When the etching device enters the second thinning mode, multiple pairs of second limiting posts of the second limiting component are used to limit the second plate-shaped component, thus improving the versatility and flexibility of use of the etching device.
[0041] Certainly, the present utility model can also have many other embodiments. Without departing from the spirit and essence of the present utility model, those skilled in the art can make various corresponding changes and deformations according to the present utility model. However, these corresponding changes and deformations should all fall within the protection scope of the appended claims of the present utility model.
Claims
1. An etching device, characterized in that, The etching device is used for thinning the first plate-shaped element and / or the second plate-shaped element. The size of the first plate-shaped element is smaller than that of the second plate-shaped element. The etching device includes a first chamber having an inlet. A plurality of first transfer shafts arranged along a first direction and extending along a second direction are provided in the first chamber. The first direction is perpendicular to the second direction. The plurality of first transfer shafts are used for transferring the first plate-shaped element or the second plate-shaped element along the first direction. a first limiting component and a second limiting component. The first limiting component and the second limiting component are arranged in the first chamber corresponding to the plurality of first transfer shafts. The first limiting component includes multiple pairs of first limiting posts, and the second limiting component includes multiple pairs of second limiting posts. The multiple pairs of first limiting posts and the multiple pairs of second limiting posts are all arranged along the first direction. Each pair of first limiting posts has a first spacing in the second direction, and each pair of second limiting posts has a second spacing in the second direction. The first spacing is smaller than the second spacing. And a first sensing component, which is arranged in the first chamber adjacent to the inlet and does not exceed the top surface of the plurality of first transfer shafts. In the first thinning mode, the first sensing component is turned on to detect whether a first plate-shaped element enters the first chamber. If so, the multiple pairs of first limiting posts protrude and rise above the top surface of the plurality of first transfer shafts to limit the first plate-shaped element between each pair of first limiting posts. In the second thinning mode, the multiple pairs of first limiting posts do not exceed the top surface of the plurality of first transfer shafts, and at the same time, the multiple pairs of second limiting posts exceed the top surface of the plurality of first transfer shafts to limit the second plate-shaped element between each pair of second limiting posts.
2. The etching device according to claim 1, wherein In the first thinning mode, if the first sensing component detects that a first plate-shaped element enters the first chamber, the plurality of first transfer shafts start to rotate to transfer the first plate-shaped element along the first direction.
3. The etching apparatus according to claim 1, wherein The etching device further has a second sensing component, which is arranged adjacent to the inlet. In the second thinning mode, the second sensing component is turned on to detect whether a second plate-shaped element enters the first chamber.
4. The etching device according to claim 3, wherein When the first sensing component is turned on and the second sensing component is turned off, the etching device enters the first thinning mode. When the first sensing component is turned off and the second sensing component is turned on, the etching device enters the second thinning mode.
5. The etching device according to claim 1, characterized in that, The etching device further includes a recording component and a transfer shaft driving component. The recording component is electrically connected to the first sensing component and the transfer shaft driving component. In the first thinning mode, the first sensing component detects whether a first plate-shaped element enters the first chamber. If so, every time the first sensing component detects a first plate-shaped element, the recording component correspondingly records a virtual material account information, and the transfer shaft driving component drives the plurality of first transfer shafts to start rotating accordingly.
6. The etching device according to claim 5, wherein The etching device further includes a limiting driving component, which is electrically connected to the recording component. When the recording component records the virtual material account information, the limiting driving component drives the multiple pairs of first limiting posts to exceed the top surface of the plurality of first transfer shafts accordingly.
7. The etching apparatus according to claim 5, wherein The first chamber further has an outlet, and the etching device further has a third sensing component, which is disposed adjacent to the outlet and electrically connected to the recording component. In the first thinning mode, the third sensing component is turned on to detect whether a first plate-shaped element leaves the etching device from the outlet. If so, for each first plate-shaped element detected by the third sensing component, the recording component correspondingly deletes one virtual account material information.
8. The etching apparatus according to claim 7, wherein In the first thinning mode, the recording component further determines whether all the virtual account material information has been deleted. If so, the plurality of first transmission shafts stop rotating.
9. The etching apparatus according to claim 1, wherein The first chamber includes an adjacent first sub-chamber and second sub-chamber. The first limiting component, the second limiting component, and the first sensing component are located in the first sub-chamber. A plurality of second transmission shafts arranged along a third direction and extending along a fourth direction are disposed in the second sub-chamber, and a third limiting component is disposed in the second sub-chamber. The third limiting component includes multiple pairs of third limiting posts, the multiple third limiting posts are arranged along the third direction, and each pair of third limiting posts has a third spacing in the fourth direction, and the third spacing is equal to the first spacing. The third direction is perpendicular to the fourth direction, and the first direction intersects the third direction.
10. The etching device according to claim 9, characterized in that, A fourth limiting component is further disposed in the second sub-chamber. The fourth limiting component includes multiple pairs of fourth limiting posts, the multiple fourth limiting posts are arranged along the third direction, and each pair of fourth limiting posts has a fourth spacing in the fourth direction, and the fourth spacing is equal to the first spacing.