Wafer transfer device
By using the combination of sliders and deformation drivers in the wafer transfer device, the risk of friction and lag is reduced, and the safety and stability of the wafer during the transfer process are ensured.
Patent Information
- Application Number
- CN202422279660.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-19
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-19
AI Technical Summary
During the wafer transfer process, how to ensure the safety of the wafer and avoid lag and damage.
A guide rail with a slider is adopted, and the carrier member slides with the slider. The drive member drives the carrier in the direction of the extension of the guide rail, and the deformation of the drive member is related to the force between the carrier member, and a buffer is provided to reduce the risk of friction and lag.
It effectively reduces the friction between the guide rail and the carrier, reduces the chance of lag, and ensures the safety and stability of the wafer during the transfer process.
Smart Images
Figure CN223092844U_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present utility model relate to the field of semiconductor technology, and in particular, to a wafer transfer device. Background Art
[0002] The semiconductor packaging process includes the wafer-level packaging (WLP) process. During the WLP process, the wafer after film pasting needs to be transferred to other equipment for the next step.
[0003] During the wafer transfer process, the safety of the wafer is of utmost importance. Therefore, how to provide a technical solution to provide a basis for ensuring the safety of the wafer during the wafer transfer process has become a technical problem to be solved urgently. Summary of the Utility Model
[0004] In view of this, the embodiments of the present utility model provide a wafer transfer device, which can provide a basis for ensuring the safety of the wafer during the wafer transfer process.
[0005] The embodiments of the present utility model provide a wafer transfer device, including:
[0006] A guide rail with a sliding member, along the extension direction of the guide rail, a carrier for carrying a wafer is in sliding fit with the sliding member;
[0007] A driving member for driving the carrier along the extension direction of the guide rail, wherein along the extension direction of the guide rail, the driving member has a deformation, and the amount of deformation of the driving member is positively correlated with the acting force between the driving member and the carrier.
[0008] Optionally, the number of the sliding members is multiple, and the multiple sliding members are sequentially distributed along the extension direction of the guide rail.
[0009] Optionally, the guide rail is provided with a groove, and along the driving direction of the driving member, the guide rail forms a first guide rail section and a second guide rail section in sequence through the groove;
[0010] Wherein, sliding members are arranged on both the first guide rail section and the second guide rail section.
[0011] Optionally, the wafer transfer device further includes:
[0012] A first monitoring member for monitoring the position of the carrier on the guide rail.
[0013] Optionally, the number of the guide rails is two, and sliding members are arranged on both of the two guide rails.
[0014] Optionally, the sliding member includes: a roller.
[0015] Optionally, the driving member includes:
[0016] A first driving member for driving the carrier along the extending direction of the guide rail;
[0017] An elastic member connecting the first driving member;
[0018] A second driving member connecting the elastic member and driving the elastic member along the extending direction of the guide rail;
[0019] Under the action of the first driving member and the second driving member, the elastic member generates a deformation amount along the extending direction of the guide rail;
[0020] The deformation amount of the driving member is composed of the deformation amount of the elastic member.
[0021] Optionally, the wafer transfer device further includes:
[0022] A second monitoring member for monitoring the deformation amount of the driving member.
[0023] Optionally, the deformation amount of the driving member is represented by the relative distance between the first driving member and the second driving member;
[0024] The second monitoring member remains relatively stationary with the second driving member.
[0025] Optionally, the wafer transfer device further includes:
[0026] An alarming member for sending out a warning signal according to the monitoring result of the second monitoring member.
[0027] With the above technical solution, by providing a guide rail with a sliding member, along the extending direction of the guide rail, the carrier carrying the wafer can be slidably engaged with the sliding member, reducing the friction between the guide rail and the carrier, thereby reducing the driving force for driving the carrier, providing a basis for ensuring the safety of the wafer during the wafer transfer process; by providing along the extending direction of the guide rail, the driving member has a deformation amount positively correlated with the acting force between the driving member and the carrier, a buffer can be set during the driving process, providing a basis for ensuring the safety of the wafer during the wafer transfer process. Description of the Drawings
[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the embodiments of the present invention or the description of the prior art. Obviously, the following described drawings are only some embodiments of this specification. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0029] Figure 1 A schematic structural diagram showing an example of a carrier;
[0030] Figure 2 shows Figure 1 a schematic cross-sectional view of the carrier in
[0031] Figure 3 shows a schematic structural view of an example of a wafer transfer device in an embodiment of the present invention;
[0032] Figure 4 shows a schematic structural view of an example of a guide rail in an embodiment of the present invention. Detailed implementation manners
[0033] As described in the background art, the wafer-level packaging (WLP) process is a type of semiconductor back-end packaging process. In actual use, the WPL process generally includes the following steps: depositing a thin film on a carrier; attaching a wafer to the thin film of the carrier; depositing another thin film around the wafer; and patterning the thin film using photolithography and etching processes.
[0034] In some examples, referring to Figure 1 and Figure 2 , Figure 1 shows a schematic structural view of a carrier in a WLP process, Figure 2 shows Figure 1 a schematic cross-sectional view of the carrier in , the carrier M is an annular thin sheet having a hole structure M1. In addition to covering one end surface of the carrier M, the thin film N also plugs the hole structure M1 at this end. The wafer O is attached to the side of the thin film N away from the carrier M and is located at the position corresponding to the hole structure M1 on this side of the thin film N.
[0035] The different steps involved in the WPL process are completed on different devices. After the wafer is attached to the thin film of the carrier, the wafer cannot move independently. At this time, it is necessary to move the carrier to transfer the wafer to other devices for the next step. Therefore, how to move the carrier to provide a basis for ensuring the safety of the wafer during the wafer transfer process has become an urgent technical problem to be solved.
[0036] To solve the above technical problem, an embodiment of the present invention provides a wafer transfer device. The wafer transfer device includes: a guide rail having a sliding member, along the extension direction of the guide rail, a carrier carrying a wafer is slidably engaged with the sliding member; a driving member for driving the carrier along the extension direction of the guide rail, wherein, along the extension direction of the guide rail, the driving member is deformed, and the amount of deformation of the driving member is positively correlated with the acting force between the driving member and the carrier.
[0037] With the above technical solution, by providing a guide rail with a slider, along the extending direction of the guide rail, a carrier carrying a wafer can be slidably engaged with the slider, reducing the friction between the guide rail and the carrier, thereby reducing the probability of jamming of the carrier during driving and providing a basis for ensuring the safety of the wafer; by providing that along the extending direction of the guide rail, the driving member has a deformation amount positively correlated with the acting force between the driving member and the carrier, a buffer can be provided during driving, providing a basis for ensuring the safety of the wafer during wafer transfer.
[0038] To enable those skilled in the art to better understand and implement the embodiments of the present invention, the concepts, solutions, principles, advantages, etc. of the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings and through specific application examples.
[0039] In some embodiments of the present invention, referring to Figure 3 , Figure 3 FIG. shows a schematic structural diagram of an example of a wafer transfer device in an embodiment of the present invention. The wafer transfer device 10 may include: a guide rail 11 and a driving member 12, wherein:
[0040] The guide rail 11 may be provided with a slider 13. Along the extending direction of the guide rail 11, a carrier M carrying a wafer is slidably engaged with the slider 13.
[0041] In some examples, a thin film is deposited on the carrier, and the wafer is mounted on a side of the thin film away from the carrier. A side of the carrier away from the thin film is slidably engaged with the slider.
[0042] The driving member 12 may drive the carrier M along the extending direction of the guide rail 11.
[0043] In some examples, the driving member abuts against an edge of the carrier along the extending direction of the guide rail. While the driving member moves along the extending direction of the guide rail, it drives the carrier to move along the extending direction of the guide rail.
[0044] Along the extending direction of the guide rail 11, the driving member 12 may have a deformation, and the deformation amount of the driving member 12 is positively correlated with the acting force between the driving member 12 and the carrier M.
[0045] In some examples, the greater the acting force between the driving member and the carrier, the greater the deformation amount of the driving member; the smaller the acting force between the driving member and the carrier, the smaller the deformation amount of the driving member.
[0046] In actual use, by setting a guide rail with a slider, along the extension direction of the guide rail, a carrier carrying a wafer can be slidably engaged with the slider, reducing the friction between the guide rail and the carrier, thereby reducing the probability of jamming of the carrier during driving and providing a basis for ensuring the safety of the wafer; by setting that along the extension direction of the guide rail, the driving member has a deformation amount positively correlated with the acting force between the driving member and the carrier, a buffer can be set during driving to prevent the driving member from pushing the carrier hard, thereby providing a basis for ensuring the safety of the wafer during the wafer transfer process.
[0047] In some embodiments, with reference to Figure 3 and Figure 4 , Figure 4 FIG. shows a schematic structural diagram of an example of a guide rail in an embodiment of the present invention. The number of the sliders 13 can be multiple, and the multiple sliders 13 are sequentially distributed along the extension direction of the guide rail 11.
[0048] In some examples, the guide rail 11 can be provided with a groove a. Along the driving direction of the driving member 12, the guide rail 11 forms a first guide rail section 111 and a second guide rail section 112 in sequence through the groove a; wherein, the first guide rail section 111 corresponds to the initial placement area of the carrier M on the guide rail 11, the second guide rail section 112 corresponds to the conveying area of the carrier M on the guide rail 11, and the length of the first guide rail section 111 along the extension direction of the guide rail 11 is adapted to the radial dimension of the carrier M.
[0049] In some examples, sliders are provided on both the first guide rail section 111 and the second guide rail section 112.
[0050] As an example, the number of sliders provided on the second guide rail section 112 can be multiple.
[0051] It can be understood that the above implementation manners are only for illustrative purposes, used to illustrate the number of guide rail sections included in the guide rail, and should not be construed as a limitation on the number of guide rail sections included in the guide rail in the present disclosure. For example, in some examples, the guide rail can also be provided with two grooves. Along the driving direction of the driving member, the guide rail forms a first guide rail section, a second guide rail section, and a third guide rail section in sequence through the two grooves; wherein, sliders are provided on all of the first guide rail section, the second guide rail section, and the third guide rail section.
[0052] In some examples, the number of the guide rails is two, and multiple sliders are provided on both of the two guide rails.
[0053] As an example, two guide rails are arranged in parallel, and the distribution positions of multiple sliding members on the two guide rails are symmetrically arranged. When the wafer transfer device transfers the carrier, the carrier contacts the two guide rails simultaneously, and the center of gravity of the carrier is located between the two guide rails, providing a basis for ensuring the safety of the wafer during the wafer transfer process.
[0054] It can be understood that the above implementation manners are only for illustrative purposes to illustrate the relationship between the distribution positions of multiple sliding members on two guide rails, and should not be construed as a limitation on the distribution positions of multiple sliding members on the two guide rails in the present disclosure. For example, in some examples, along the extension direction of the guide rail, multiple sliding rail members on the two guide rails can be alternately distributed.
[0055] In some examples, the sliding member may include a roller, and the axis of the roller is perpendicular to the extension direction of the guide rail, so that the carrier carrying the wafer can slide in cooperation with the roller along the extension direction of the guide rail.
[0056] In some embodiments, continuing to refer to Figure 3 and Figure 4 , the wafer transfer device 10 may further include a first monitoring member 14, and the first monitoring member 14 can monitor the position of the carrier M on the guide rail 11, thereby providing a basis for ensuring the safety of the wafer during the wafer transfer process.
[0057] In some examples, the first monitoring member may be disposed on the side surface of the second guide rail section to monitor the position of the carrier on the second guide rail section.
[0058] As an example, the number of the first monitoring members 14 may be multiple, and the multiple first monitoring members 14 are sequentially distributed along the extension direction of the second guide rail section 112 and are installed on the same side of the second guide rail section 112.
[0059] In some examples, the first monitoring member may include one or more of a Hall effect sensor, an optoelectronic sensor, or an ultrasonic sensor.
[0060] In some embodiments, continuing to refer to Figure 3 , the driving member 12 may include: a first driving member 121, an elastic member 122, and a second driving member 123, where:
[0061] The first driving member 121 can drive the carrier M along the extension direction of the guide rail 11.
[0062] In some examples, the first driving member can abut against the carrier along the extension direction of the guide rail.
[0063] As an example, the first driving member has a claw-like structure and has two abutting positions with the carrier member, and the two abutting positions are distributed along the circumferential direction of the carrier member to reduce the probability of the carrier member rotating during the process of driving the carrier member along the extending direction of the guide rail.
[0064] The elastic member 122 can be connected to the first driving member 121, the second driving member 123 can be connected to the elastic member 122, and the elastic member 122 is driven along the extending direction of the guide rail 11.
[0065] In some examples, along the extending direction of the guide rail, the elastic member is clamped between the first driving member and the second driving member, and two ends of the elastic member are respectively connected to the first driving member and the second driving member; wherein, along the extending direction of the guide rail, the dimensions of the first driving member, the elastic member, and the second driving member along the extending direction of the guide rail constitute the dimension of the driving member along the extending direction of the guide rail.
[0066] Under the action of the first driving member 121 and the second driving member 123, the elastic member 122 generates a deformation amount along the extending direction of the guide rail 11, and the deformation amount of the driving member 12 is constituted by the deformation amount of the elastic member 122.
[0067] In some examples, the elastic member may include a spring.
[0068] The elastic member can generate a deformation amount along the extending direction of the guide rail under the extrusion of the first driving member and the second driving member, so that the relative distance between the first driving member and the second driving member is reduced, thereby causing the driving member to deform, and the deformation amount of the driving member along the extending direction of the guide rail is constituted by the deformation amount of the elastic member.
[0069] In some examples, the first driving member and the second driving member can be slidably mated along the extending direction of the guide rail to relatively slide along the extending direction of the guide rail under the action of the elastic member and the carrier member.
[0070] As an example, a guide groove extending along the direction of the guide rail is formed on the outer side of the second driving member, and one end of the first driving member close to the second driving member is located in the guide groove and is slidably mated with the guide groove.
[0071] In some embodiments, with continued reference to Figure 3 , the wafer transfer device 10 may further include a second monitoring member 15, and the second monitoring member 15 can monitor the deformation amount of the driving member 12 and output a corresponding monitoring result.
[0072] The deformation of the driving member can be represented by the relative distance between the first driving member and the second driving member. When the driving member drives the carrier along the extension direction of the guide rail, by monitoring the deformation of the driving member through the monitoring member, the change in the deformation of the driving member can be determined, so that the change in the acting force between the driving member and the carrier can be determined. Furthermore, the stability of the carrier during the wafer transfer process can be monitored, and thus a basis for ensuring the safety of the wafer during the wafer transfer process can be provided.
[0073] In some examples, the second monitoring member remains relatively stationary with respect to the second driving member, and along the extension direction of the guide rail, the second monitoring member is located between the first driving member and the second driving member. Along the direction perpendicular to the extension direction of the guide rail, the second monitoring member is located on one side of the first driving member and the second driving member.
[0074] As an example, continue to refer to Figure 3 , the second monitoring member 15 is fixedly connected to the second driving member 123 through a connecting member 16. Along the extension direction of the guide rail 11, the second monitoring member 15 is located at a preset position between the first driving member 121 and the second driving member 123, where the preset position corresponds to the safety threshold of the acting force between the driving member and the carrier; along the direction perpendicular to the extension direction of the guide rail 11, the second monitoring member 15 is located on one side of the first driving member 121 and the second driving member 123; the detection direction of the second monitoring member 15 is perpendicular to the extension direction of the guide rail 11.
[0075] During the driving process, when the second monitoring member does not detect the first driving member, the acting force between the driving member and the carrier is lower than the safety threshold; when the second monitoring member detects the first driving member, the acting force between the driving member and the carrier is not lower than the safety threshold.
[0076] In some examples, the second monitoring member may include one or more of a Hall effect sensor, an optoelectronic sensor, or an ultrasonic sensor.
[0077] In some examples, the wafer transfer device may further include an alarm member, and the alarm member can receive the monitoring result of the second monitoring member and issue an alarm signal according to the monitoring result.
[0078] During the driving process, when the second monitoring member does not detect the first driving member, the alarm member is in a silent state; when the second monitoring member detects the first driving member, the alarm member issues an alarm signal, and the control member controls the second driving member to stop moving.
[0079] In some embodiments, the wafer transfer device may further include a control member, and the control member can be electrically connected to the monitoring member.
[0080] In some examples, the control member may also be electrically connected to the first monitoring member, and the position of the carrier on the guide rail and the motion state parameters may be obtained according to the monitoring result of the first monitoring member.
[0081] In some examples, with continued reference to Figure 3 , the wafer transfer device 10 may further include a hanger 17, the hanger 17 is arranged parallel to the guide rail 11, the second driving member 123 is located on the hanger 17 and can move along the extending direction of the hanger 17; wherein, the control member is electrically connected to the second monitoring member 15, and the motion state of the second driving member 123 on the hanger 17 can be controlled according to the monitoring result of the second monitoring member 15.
[0082] During the driving process, when the second monitoring member does not detect the first driving member, the second driving member continues to move along the extending direction of the hanger on the hanger; when the second monitoring member detects the first driving member, the control member controls the second driving member to stop moving.
[0083] It can be understood that the above embodiments provide multiple implementation schemes, and each implementation scheme can be combined and cross-referenced with each other without conflict, so as to extend multiple possible implementation schemes, all of which can be regarded as the implementation schemes disclosed in the embodiments of the present application and the embodiments of the utility model.
[0084] It should be noted that the "example" or "embodiment" referred to in this specification refers to specific features, structures or characteristics that can be included in at least one implementation manner of the embodiments of the present utility model. And in the description of this specification, terms such as "first", "second", "third", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with terms such as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. Moreover, terms such as "first", "second", "third", etc. are used to distinguish similar objects and do not necessarily need to be used to describe a specific order or indicate importance. It can be understood that such terms can be interchanged under appropriate circumstances so that the embodiments of the present utility model described here can be implemented in an order other than those illustrated or described here.
[0085] Although the embodiments of the present utility model are disclosed as above, the present utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present utility model. Therefore, the protection scope of this specification should be subject to the scope defined by the claims.
Claims
1. A wafer transfer device, characterized in that, Comprising: A guide rail having a slider, along the extending direction of the guide rail, a carrier carrying a wafer is slidably engaged with the slider; A driving member for driving the carrier along the extending direction of the guide rail, wherein, along the extending direction of the guide rail, the driving member is deformed, and the amount of deformation of the driving member is positively correlated with the acting force between the driving member and the carrier.
2. The wafer transfer device according to claim 1, wherein The number of the sliders is plural, and the plural sliders are sequentially distributed along the extending direction of the guide rail.
3. The wafer transfer device according to claim 2, wherein The guide rail is provided with a groove, along the driving direction of the driving member, the guide rail forms a first guide rail section and a second guide rail section in sequence through the groove; Wherein, sliders are provided on both the first guide rail section and the second guide rail section.
4. The wafer transfer device according to claim 1, wherein Further comprising: A first monitoring member for monitoring the position of the carrier on the guide rail.
5. The wafer transfer device according to claim 1, wherein, The number of the guide rails is two, and sliders are provided on both of the two guide rails.
6. The wafer transfer device according to claim 1, wherein The slider comprises: a roller.
7. The wafer transfer device according to claim 1, wherein The driving member comprises: A first driving member for driving the carrier along the extending direction of the guide rail; An elastic member connected to the first driving member; A second driving member connected to the elastic member and driving the elastic member along the extending direction of the guide rail; The elastic member generates a deformation amount along the extending direction of the guide rail under the action of the first driving member and the second driving member; The deformation amount of the driving member is composed of the deformation amount of the elastic member.
8. The wafer transfer device according to claim 7, characterized in that, Further comprising: A second monitoring member for monitoring the deformation amount of the driving member.
9. The wafer transfer device according to claim 8, wherein, The deformation amount of the driving member is represented by the relative distance between the first driving member and the second driving member; The second monitoring member remains relatively stationary with the second driving member.
10. The wafer transfer device according to claim 8, wherein Further comprising: An alarming member for sending out a warning signal according to the monitoring result of the second monitoring member.