Heat sink for laser sensor and laser sensor thereof

Abstract

The utility model discloses a heat sink for a laser sensor and the laser sensor thereof, and the heat sink for the laser sensor is characterized in that a sealed accommodating cavity is formed in a heat sink main body and is filled with phase change cooling liquid, and when heat generated during working of a laser chip is conducted to a heat absorption surface of the heat sink main body, the heat absorption surface of the heat sink main body can be cooled; the phase change cooling liquid absorbs the heat and is vaporized. Afterwards, the vaporized cooling liquid is tightly connected with the base through the heat dissipation face of the heat sink body, and heat is transmitted to the base and further conducted out. And under the action of the base or the external environment, the vaporized cooling liquid can be condensed back to the liquid state, and a heat dissipation cycle is completed. The process not only improves the heat dissipation efficiency, but also remarkably improves the heat dissipation capability. The laser sensor is provided with the heat sink, so that the heat dissipation efficiency of the laser chip is improved, the cooling speed of the laser chip is increased, heat dissipation of the high-power laser chip is facilitated, and the product performance of the laser sensor is further improved.

Description

Technical Field

[0001] The present application relates to the technical field of sensors, and particularly relates to a heat sink for a laser sensor and the laser sensor thereof. Background Art

[0002] In a laser sensor, a heat sink is usually used to dissipate heat for a chip to ensure the use effect of the chip. In related technologies, the heat sink is mostly made of copper, tungsten copper, silicon, ceramic, kovar or various other synthetic materials. Usually, the chip is welded or glued to a ceramic transition block, and the ceramic transition block plays a role in lateral heat dissipation to prevent the local temperature of the chip from being too high during the process of emitting laser. However, in a high-power laser sensor, the heat dissipation efficiency of this type of heat sink is relatively low, resulting in poor product performance. Summary of the Utility Model

[0003] The present application provides a heat sink for a laser sensor and the laser sensor thereof, which is used to solve the problem of relatively low heat dissipation efficiency of the heat sink of a high-power laser sensor.

[0004] In one embodiment, a heat sink for a laser sensor is provided. The laser sensor includes a base and a laser chip thereon. The heat sink includes: a heat sink body made of a heat-conducting material;

[0005] The heat sink body is provided with a sealed accommodation cavity, and the accommodation cavity is filled with a phase-change coolant; one side surface of the heat sink body is a heat absorption surface for mounting the laser chip thereon; the other side surface of the heat sink body is a heat dissipation surface, which is in close heat-conducting connection with the base; the phase-change coolant absorbs the heat introduced by the heat absorption surface and vaporizes, and the heat is exported through the base and then condensed.

[0006] In one embodiment, the heat sink further includes a reflux plate, and the reflux plate is communicated with the accommodation cavity for guiding the phase-change coolant.

[0007] In one embodiment, the heat sink further includes a capillary structure, and the capillary structure is arranged on the inner wall of the accommodation cavity.

[0008] In one embodiment, the capillary structure is further arranged on the reflux plate. Wherein, the accommodation cavity includes a hot section between the reflux plate and the heat absorption surface, and further includes a cold section between the reflux plate and the heat dissipation surface. The phase-change coolant absorbs heat and evaporates to generate gas in the hot section, the gas enters the cold section and releases heat and condenses to form a liquid, and the liquid returns to the hot section through the capillary mechanism on the reflux plate.

[0009] In one embodiment, the reflux plate is in an arc-shaped plate shape.

[0010] In one embodiment, the heat sink further includes a support structure located in the accommodation cavity, and the support structure is supported on the inner wall surface of the heat sink.

[0011] In one embodiment, there are a plurality of the support structures, and the plurality of support structures are spaced apart.

[0012] This application also provides a laser sensor, including a low-melting-point glass, a glass cover plate, a metal cap, a base, a laser chip, a photodiode, and the heat sink according to any one of the above.

[0013] The metal cap includes a first horizontal body, a vertical body, and a second horizontal body. One end of the vertical body is connected to the first horizontal body, and the other end is connected to the second horizontal body.

[0014] One end of the low-melting-point glass is connected to the first horizontal body, and the other end is connected to the glass cover plate.

[0015] The base is connected to the second horizontal body.

[0016] The photodiode is arranged directly below the laser chip and is connected to the base.

[0017] In one embodiment, the contact area between the laser chip and the heat sink is smaller than the contact area between the base and the heat sink.

[0018] In one embodiment, the base is a metal material part.

[0019] The beneficial effects of implementing the present utility model are as follows: By providing a sealed accommodation cavity in the heat sink body and filling it with a phase-change coolant, when the heat generated by the laser chip during operation is conducted to the heat absorption surface of the heat sink body, the phase-change coolant absorbs this heat and vaporizes. Subsequently, the vaporized coolant is in close connection with the base through the heat dissipation surface of the heat sink body, transfers the heat to the base and is further exported. Under the action of the base or the external environment, the vaporized coolant will condense back into a liquid state, completing a heat dissipation cycle. This process not only improves the heat dissipation efficiency but also significantly enhances the heat dissipation capacity. Description of the Drawings

[0020] Figure 1 It is a schematic structural diagram of a heat sink for a laser sensor in one embodiment;

[0021] Figure 2 It is a partial cross-sectional schematic diagram of a laser sensor in one embodiment;

[0022] The accompanying reference numerals are as follows: 11 - base, 12 - heat sink, 121 - accommodation cavity, 1211 - hot section, 1212 - cold section, 122 - capillary structure, 123 - support structure, 124 - heat absorption surface, 125 - heat dissipation surface, 126 - reflux plate, 13 - chip, 14 - low melting point glass, 15 - glass cover plate, 16 - metal tube cap, 161 - first horizontal body, 162 - vertical body, 163 - second horizontal body, 17 - photodiode. Detailed implementation manners

[0023] The present application will be further described in detail below in conjunction with the accompanying drawings by way of specific implementation manners. Similar elements in different implementation manners are denoted by related similar reference numerals. In the following implementation manners, many detailed descriptions are provided to enable a better understanding of the present application. However, those skilled in the art can readily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification, which is to avoid the core part of the present application being overwhelmed by excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the descriptions in the specification and their general technical knowledge in the art.

[0024] In addition, the features, operations, or characteristics described in the specification can be combined in any appropriate manner to form various implementation manners. At the same time, the steps or actions in the method description can also be reordered or adjusted in an obvious manner by those skilled in the art. Therefore, the various sequences in the specification and the drawings are only for clearly describing a certain embodiment and do not mean that they are the necessary sequences, unless it is stated that a certain sequence must be followed.

[0025] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meaning. The "connection" and "coupling" mentioned in the present application, unless otherwise specified, both include direct and indirect connection (coupling).

[0026] As Figure 1As shown, in one embodiment, a heat sink 12 for a laser sensor is provided. The laser sensor includes a base 11 and its laser chip 13. The heat sink 12 includes: a heat sink 12 body made of a heat-conducting material; the heat sink 12 body is provided with a sealed accommodation cavity 121, and the accommodation cavity 121 is filled with a phase-change coolant; one side surface of the heat sink 12 body is a heat-absorbing surface 124 for the laser chip 13 to be mounted thereon; the other side surface of the heat sink 12 body is a heat-dissipating surface 125, which is in close heat-conducting connection with the base 11; the phase-change coolant absorbs the heat introduced by the heat-absorbing surface 124 and vaporizes, and the heat is exported through the base 11 and then condensed.

[0027] Among them, the base 11 can be a cylindrical structure, a trapezoidal structure or other shaped structures. For example, the base 11 is a rectangular structure.

[0028] The accommodation cavity 121 is defined inside the heat sink 12. The inside of the accommodation cavity 121 is a closed and vacuum environment. The accommodation cavity 121 can be a circular structure, a trapezoidal structure or other shaped structures. For example, the accommodation cavity 121 is a rectangular structure. The accommodation cavity 121 is used to carry the phase-change coolant, and the accommodation cavity 121 is filled with the phase-change coolant. The initial state of the phase-change coolant is liquid, and the phase-change coolant evaporates into gas after absorbing heat.

[0029] The types of the phase-change coolant can include but are not limited to fluorinated liquid, mineral oil or specially synthesized phase-change coolant.

[0030] Among them, the connection method between the laser chip 13 and the heat sink 12 can be direct welding or indirect connection through a heat-conducting adhesive; the connection method between the base 11 and the heat sink 12 can be mechanical fixation combined with a heat-conducting material or welding connection.

[0031] In one embodiment, the heat sink 12 further includes a reflux plate 126. The reflux plate 126 communicates with the accommodation cavity 121 and is used to direct the phase-change coolant. Among them, the reflux plate 126 can be a flat plate, a segmented type or other shaped structures. For example, the reflux plate 126 is an arc-shaped plate.

[0032] In one embodiment, the heat sink 12 further includes a capillary structure 122, and the capillary structure 122 is arranged on the inner wall of the accommodation cavity 121.

[0033] In one embodiment, the capillary structure 122 is also arranged on the reflux plate 126. Among them, the accommodation cavity includes a hot section 127 between the reflux plate 126 and the heat-absorbing surface 124, and also includes a cold section 128 between the reflux plate 126 and the heat-dissipating surface 125; the phase-change coolant absorbs heat and evaporates to generate gas in the hot section 127, the gas enters the cold section 128 and releases heat and condenses to form liquid, and the liquid returns to the hot section 127 through the capillary mechanism on the reflux plate 126.

[0034] The specific implementation process is as follows: When the laser sensor starts to work, the laser chip 13 generates a large amount of heat. This heat is introduced into the phase change coolant in the accommodation cavity 121 through the heat absorption surface 124 of the main body of the heat sink 12. As the heat is continuously introduced, the phase change coolant evaporates into a gas after absorbing heat in the hot section 127. The gas flows in the accommodation cavity 121 towards the cold section 128, and during this process, it exchanges heat with the base 11 and releases heat. Subsequently, the gas condenses into a liquid in the cold section 128 and is guided back to the hot section 127 through the capillary structure 122 on the reflux plate 126 to prepare for absorbing heat again. Through such a cyclic process, the heat sink 12 can continuously absorb the heat generated by the laser chip 13, thereby ensuring that the laser sensor works in a stable temperature environment, effectively extending the service life of the laser chip 13 and improving the overall performance.

[0035] Among them, the capillary structure 122 is arranged on the inner wall of the accommodation cavity 121, enabling the coolant to more evenly cover the inner wall of the accommodation cavity 121, avoiding the occurrence of local overheating phenomena. This not only improves the heat exchange efficiency between the coolant and the inner wall but also makes the heat conduction more balanced and effective.

[0036] In one embodiment, the heat sink 12 further includes a support structure 123. The support structure 123 is located in the accommodation cavity 121 and supports on the inner wall surface of the heat sink 12. The support structure 123 can be slender, and its length is much greater than its width or diameter. The slender design can minimize the obstruction to the flow of the coolant.

[0037] In one embodiment, there are multiple support structures 123, and the multiple support structures 123 can be evenly distributed, spaced apart, or cross-distributed. As Figure 1 shown, the multiple support structures 123 are spaced apart.

[0038] As Figure 2 shown, the present application also provides a laser sensor, including a low-melting-point glass 14, a glass cover plate 15, a metal tube cap 16, a base 11, a laser chip 13, a photodiode 17, and the heat sink 12 according to any one of the above;

[0039] The metal tube cap 16 includes a first horizontal body 161, a vertical body 162, and a second horizontal body 163. One end of the vertical body 162 is connected to the first horizontal body 161, and the other end is connected to the second horizontal body 163. One end of the low-melting-point glass 14 is connected to the first horizontal body 161, and the other end is connected to the glass cover plate 15; the base 11 is connected to the second horizontal body.

[0040] The photodiode 17 is arranged directly below the laser chip 13 and is connected to the base 11.

[0041] The specific implementation process of the laser sensor is as follows: When the laser chip 13 is powered on, it generates a laser beam. This laser beam then penetrates the highly light-transmissive glass cover 15 and shoots towards the target object for distance measurement, positioning, or to meet other application requirements. Once the laser beam interacts with the target object and is reflected or scattered back, the photodiode 17 located on the receiving path will capture these optical signals. The photodiode converts the received optical signals into electrical signals and transmits this electrical signal to the subsequent circuit for further processing and analysis, thus completing the entire process of laser signal emission, reception, and conversion.

[0042] In one embodiment, the contact area between the laser chip 13 and the heat sink 12 is smaller than the contact area between the base 11 and the heat sink 12.

[0043] In one embodiment, the base 11 is a metal material part. Among them, the material of the base 11 can include but is not limited to stainless steel, aluminum alloy, or other alloy materials. For example, the base 11 is made of stainless steel material, which can improve the corrosion resistance and high-temperature resistance of the base 11, or the base 11 is made of aluminum alloy material, which can reduce the overall weight of the base 11 and improve the strength and processing performance of the base 11.

[0044] Since heat conduction needs to be carried out between the base 11 and the heat sink 12, and the heat conduction efficiency of metal materials is higher than that of non-metal materials, setting the base 11 as a metal material part can improve the heat conduction efficiency between the base 11 and the heat sink 12, thereby improving the heat dissipation efficiency and heat dissipation effect of the heat sink 12.

[0045] The present utility model relates to a heat sink for a laser sensor and the laser sensor. The heat sink for the laser sensor is provided with a sealed accommodation cavity in the heat sink body and filled with a phase change coolant. When the heat generated by the laser chip during operation is conducted to the heat absorption surface of the heat sink body, the phase change coolant absorbs this heat and vaporizes. Subsequently, these vaporized coolants are tightly connected to the base through the heat dissipation surface of the heat sink body, transfer the heat to the base and further export it. Under the action of the base or the external environment, the vaporized coolant will condense back into a liquid state, completing a heat dissipation cycle. This process not only improves the heat dissipation efficiency but also significantly enhances the heat dissipation capacity. By setting the above heat sink in the laser sensor, the heat dissipation efficiency of the laser chip is improved, the cooling speed of the laser chip is increased, it is convenient for the high-power laser chip to dissipate heat, and thus the product performance of the laser sensor is improved.

[0046] The above uses specific examples to elaborate on the present application, which is only used to help understand the present application and is not intended to limit the present application. For those skilled in the art of the present application, based on the idea of the present application, several simple deductions, deformations, or substitutions can also be made.

Claims

1. A heat sink for a laser sensor, the laser sensor comprising a base and a laser chip thereof, characterized in that, The heat sink includes: a heat sink body made of a heat-conducting material; The heat sink body is provided with a sealed accommodation cavity, and the accommodation cavity is filled with a phase-change coolant; one side surface of the heat sink body is a heat absorption surface for mounting the laser chip thereon; the other side surface of the heat sink body is a heat dissipation surface, which is tightly thermally connected to the base; the phase-change coolant absorbs the heat introduced by the heat absorption surface and vaporizes, and the heat is exported through the base and then condensed.

2. The heat sink for a laser sensor according to claim 1, wherein, The heat sink further includes a reflux plate, which is communicated with the accommodation cavity and is used for guiding the phase-change coolant.

3. The heat sink for a laser sensor according to claim 2, characterized in that, The heat sink further includes a capillary structure, which is arranged on the inner wall of the accommodation cavity.

4. The heat sink for a laser sensor according to claim 3, characterized in that, The capillary structure is also arranged on the reflux plate, wherein the accommodation cavity includes a hot section between the reflux plate and the heat absorption surface, and also includes a cold section between the reflux plate and the heat dissipation surface; The phase-change coolant absorbs heat and evaporates to generate gas in the hot section, the gas enters the cold section and releases heat to condense into liquid, and the liquid returns to the hot section through the capillary mechanism on the reflux plate.

5. The heat sink for a laser sensor according to claim 2, characterized in that, The reflux plate is in an arc-shaped plate form.

6. The heat sink for a laser sensor according to claim 1, characterized in that, The heat sink further includes a support structure, the support structure is located in the accommodation cavity, and the support structure supports on the inner wall surface of the heat sink.

7. The heat sink for a laser sensor according to claim 6, characterized in that, There are multiple support structures, and the multiple support structures are distributed at intervals.

8. A laser sensor, characterized in that, It includes a low-melting-point glass, a glass cover plate, a metal tube cap, a base, a laser chip, a photodiode and the heat sink according to any one of claims 1-7; The metal tube cap includes a first horizontal body, a vertical body and a second horizontal body, one end of the vertical body is connected to the first horizontal body, and the other end is connected to the second horizontal body; One end of the low-melting-point glass is connected to the first horizontal body, and the other end is connected to the glass cover plate; The base is connected to the second horizontal body; The photodiode is arranged directly below the laser chip and is connected to the base.

9. The laser sensor according to claim 8, wherein, The contact area between the laser chip and the heat sink is smaller than the contact area between the base and the heat sink.

10. The laser sensor according to claim 8, characterized in that, The base is a metal material part.

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