Overvoltage protection device

Abstract

The utility model relates to the technical field of surge protection, and provides an overvoltage protection device which is used for solving the technical problem that an existing surge protection device is low in assembly efficiency. The overvoltage protection device comprises a core assembly, a leading-out piece and an insulating packaging piece, wherein the core assembly comprises a voltage limiting type device and a switch type device which are electrically connected; the leading-out piece comprises a first leading-out piece and a second leading-out piece, the first leading-out piece is electrically connected with the voltage limiting type device, and the second leading-out piece is electrically connected with the switching type device; the inner core assembly is embedded in the insulation packaging piece. Wherein one end, far away from the voltage limiting type device, of the first leading-out piece and one end, far away from the switch type device, of the second leading-out piece are respectively provided with a connecting part, each connecting part is provided with a connecting surface exposed out of the insulating packaging piece, and the connecting surfaces of the two leading-out pieces are arranged on the same plane at intervals, so that the overvoltage protection device forms an SMD. The core assembly has the advantages of a voltage limiting device and a switch device, an SMD is formed, the core assembly can be attached to a PCB, and the assembly efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of surge protection, and in particular to an overvoltage protection device. Background Art

[0002] Both voltage-limiting devices and switch-type devices can be used as surge protection devices. In the prior art, a single voltage-limiting device and a single switch-type device are both configured as pin structures. When assembling the voltage-limiting device and the switch-type device on a printed circuit board (PCB), the pins usually need to be inserted into the board holes of the PCB for welding. After welding, the redundant pins need to be trimmed, resulting in problems with the assembly efficiency of the surge protection device and the PCB. Utility Model Content

[0003] The present application provides an overvoltage protection device, aiming to solve the technical problem of low assembly efficiency of existing surge protection devices.

[0004] In some embodiments of the present application, an overvoltage protection device is provided, including:

[0005] A core component, comprising a voltage limiting device and a switch device, wherein the voltage limiting device is electrically connected to the switch device;

[0006] A lead-out member, comprising a first lead-out member and a second lead-out member, wherein the first lead-out member is electrically connected to the voltage-limiting device, and the second lead-out member is electrically connected to the switch device; and

[0007] an insulating package, wherein the core assembly is embedded in the insulating package;

[0008] Among them, the end of the first lead-out component away from the voltage-limiting device and the end of the second lead-out component away from the switching device are both provided with a connecting portion, and the connecting portion has a connecting surface that exposes the insulating package. The connecting surfaces of the first lead-out component and the second lead-out component are arranged at intervals on the same plane so that the overvoltage protection device forms an SMD.

[0009] In some embodiments, the insulating package has a first surface, and when the overvoltage protection device is connected to the PCB, the first surface faces the PCB;

[0010] The connecting portion is arranged on the first surface, the connecting surface is located at a side of the connecting portion away from the insulating package, and the connecting surfaces of the first lead-out member and the second lead-out member are arranged on the first surface at intervals.

[0011] In some embodiments, the insulating package is cylindrical in shape, and the insulating package further has a second surface connected to the first surface;

[0012] One end of the first lead-out component and the second lead-out component away from the inner core component is bent to form an exposed portion and the connecting portion, and the exposed portion exposes the second surface.

[0013] In some embodiments, the shape of the first surface is rectangular, and the extending direction of the connecting portion of the first lead-out component and the second lead-out component faces the short side of the first surface, or the extending direction of the connecting portion of the first lead-out component and the second lead-out component faces the long side of the first surface.

[0014] In some embodiments, the insulating encapsulation has a first surface, and when the overvoltage protection device is connected to the PCB, the first surface faces the PCB;

[0015] The connecting portion protrudes out of the first surface, and the connecting surfaces of the first lead-out component and the second lead-out component are spaced outside the first surface.

[0016] In some embodiments, the first lead-out component and the second lead-out component are arranged on both sides of the first surface, and the first lead-out component and the second lead-out component are bent and formed in a direction away from the first surface.

[0017] In some embodiments, the first lead-out component and the second lead-out component are respectively bent to form an L shape, a C shape or a Z shape.

[0018] In some embodiments, the voltage-limiting device is a MOV or a TVS, and the switching device is a GDT or an SPG.

[0019] In some embodiments, the insulating encapsulation is injection-molded into a prismatic shape.

[0020] In some embodiments, the material of the insulating encapsulation is ceramic, glass, heat-resistant polymer, liquid polymer or epoxy resin.

[0021] According to the overvoltage protection device in the above-mentioned embodiment, the voltage-limiting device has the advantages of low residual voltage, fast response or no continuous current, but also has the disadvantages of leakage current. The switch type device has the advantages of no leakage current, but also has the disadvantages of continuous current and slow response. The present application electrically connects the voltage-limiting device with the switch type device so that the core component can have the advantages of both the voltage-limiting device and the switch type device to make up for the disadvantages of the single voltage-limiting device or the single switch type device, thereby better playing the role of surge protection for the circuit. At the same time, compared with the voltage-limiting device and the switch type device being arranged separately on the PCB, after the voltage-limiting device and the switch type device are connected, the PCB occupied space can be reduced by 20%-30%, which is conducive to the miniaturization, integration and modular product positioning of the overvoltage protection device. In addition, the connection surfaces on the first lead-out member and the second lead-out member are arranged on the same plane, so that the overvoltage protection device can also be formed into SMD. During assembly, the overvoltage protection device can be sucked up at high speed by the placement machine and transferred to the PCB for soldering, and can be reflow soldered and formed at the same time with other SMDs on the PCB, thereby reducing the processes of transporting the PCB back and forth between reflow soldering and wave soldering, adjusting the process, inserting pins, cutting pins, etc., and improving the assembly efficiency of the overvoltage protection device. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the three-dimensional structure of an overvoltage protection device in one embodiment of the present application;

[0023] Figure 2 for Figure 1 Schematic diagram of the exploded structure of the overvoltage protection device;

[0024] Figure 3 for Figure 1 Schematic diagram of the explosion structure of the overvoltage protection device;

[0025] Figure 4 for Figure 1 A schematic diagram of the structure of the connection between the core component and the lead-out component in the overvoltage protection device;

[0026] Figure 5 This is a schematic diagram of the three-dimensional structure of an overvoltage protection device in another embodiment of the present application;

[0027] Figure 6 for Figure 5 Schematic diagram of the exploded structure of the overvoltage protection device;

[0028] Figure 7 for Figure 5 A schematic diagram of the structure of the connection between the core component and the lead-out component in the overvoltage protection device;

[0029] Figure 8 This is a schematic diagram of the three-dimensional structure of an overvoltage protection device in another embodiment of the present application;

[0030] Figure 9 is Figure 8 Schematic diagram of the exploded structure of the overvoltage protection device in China;

[0031] Figure 10 is Figure 8 Schematic diagram of the structure of the connection between the core component and the lead-out component in the overvoltage protection device;

[0032] Figure 11 Schematic diagram of the exploded structure of the core component in an embodiment of the present application;

[0033] Figure 12 Schematic diagram of the three-dimensional structure of the insulation package in another embodiment of the present application.

[0034] Wherein:

[0035] 1 - core component; 11 - voltage-limiting device; 111 - first electrode; 112 - second electrode; 12 - switching device; 121 - third electrode; 122 - fourth electrode; 123 - connecting pipe; 2 - lead-out component; 2a - first lead-out component; 2b - second lead-out component; 21 - connecting part; 210 - connecting surface; 22 - exposed part; 3 - insulation package; 30 - installation groove; 31 - first surface; 32 - second surface; 33 - cut corner. Specific embodiments

[0036] The present application will be further described in detail below through specific embodiments in conjunction with the accompanying drawings. Similar elements in different embodiments are labeled with related similar element numbers. In the following embodiments, many detailed descriptions are provided to enable a better understanding of the present application. However, those skilled in the art can easily recognize that some of the features can be omitted in different situations, or can be replaced by other elements, materials, or methods. In some cases, some operations related to the present application are not shown or described in the specification to avoid overwhelming the core part of the present application with excessive descriptions. For those skilled in the art, it is not necessary to describe these related operations in detail, and they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0037] In addition, the features, operations, or characteristics described in the specification can be combined in any appropriate manner to form various embodiments, and the operation steps involved in each embodiment can also be reordered or adjusted in an obvious manner by those skilled in the art. Therefore, the specification and drawings are only for clearly describing a certain embodiment, and do not mean to be the necessary composition and / or sequence.

[0038] The serial numbers assigned to components in this document itself, such as "first", "second", etc., are only used to distinguish the described objects and do not have any sequential or technical meaning. And as used in this application, "connection" and "coupling", unless otherwise specified, both include direct and indirect connection (coupling).

[0039] Surface mounted devices (SMD) have become the trend of electronic component configuration due to their small size, high assembly efficiency with PCB, and easy automation. When both the voltage-limiting device and the switching device adopt a pin structure, not only do the pins need to be inserted into the holes of the PCB before soldering and the pins need to be trimmed after soldering, but also since most of the other components on the PCB are SMD, during soldering, the PCB also needs to be transported back and forth between reflow soldering and wave soldering and the process needs to be adjusted, which not only affects the assembly efficiency of electronic components and the PCB, but also increases the production cost.

[0040] This application provides an overvoltage protection device, such as Figures 1 to 4 shown, the overvoltage protection device may include a core component 1, a lead-out component 2, and an insulating encapsulation component 3. The core component 1 may include a voltage-limiting device 11 and a switching device 12, and the voltage-limiting device 11 is electrically connected to the switching device 12; the lead-out component 2 may include a first lead-out component 2a and a second lead-out component 2b. The first lead-out component 2a may be electrically connected to the voltage-limiting device 11, and the second lead-out component 2b may be electrically connected to the switching device 12; the core component 1 is embedded in the insulating encapsulation component 3. Wherein, a connection portion 21 is provided at one end of the first lead-out component 2a away from the voltage-limiting device 11 and at one end of the second lead-out component 2b away from the switching device 12. The connection portion 21 has a connection surface 210 exposed from the insulating encapsulation component 3. The connection surfaces 210 of the first lead-out component 2a and the second lead-out component 2b are spaced apart on the same plane so that the overvoltage protection device forms an SMD.

[0041] The voltage-limiting device 11 has advantages such as low residual voltage, fast response, or no freewheeling current, but also has disadvantages such as leakage current. The switching device 12 has advantages such as no leakage current, but also has disadvantages such as freewheeling current and slow response. In this application, by electrically connecting the voltage-limiting device 11 and the switching device 12, the core component 1 can have both the advantages of the voltage-limiting device 11 and the switching device 12 to make up for the disadvantages of the single voltage-limiting device 11 or the single switching device 12, so as to better protect the circuit against surges. At the same time, compared with the voltage-limiting device 11 and the switching device 12 arranged separately on the PCB, after the voltage-limiting device 11 and the switching device 12 are connected, the PCB occupied space can be reduced by 20%-30%, which is beneficial to the product positioning of miniaturization, integration, and modularization of the overvoltage protection device. In addition, the connection surfaces 210 on the first lead 2a and the second lead 2b are spaced apart on the same plane, which also enables the overvoltage protection device to form an SMD. During assembly, the overvoltage protection device can be quickly sucked and transferred to the PCB by a pick-and-place machine for soldering, and can be formed by one-time reflow soldering with other SMDs on the PCB, thus reducing the processes of transporting the PCB back and forth between reflow soldering and wave soldering, adjusting the process, inserting pins, and trimming pins, and improving the assembly efficiency of the overvoltage protection device.

[0042] In addition, according to the design requirements of the PCB, one or more first leads 2a can be provided, and one or more first leads 2a are all electrically connected to the voltage-limiting device 11. One or more second leads 2b can also be provided, and one or more second leads 2b are all electrically connected to the switching device 12. This application does not make special restrictions on the specific number of the first lead 2a and the second lead 2b. Among them, the surface of the connecting portion 21 can be plated with metal materials such as tin, silver, gold, nickel, or copper to ensure the reliability of soldering between the overvoltage protection device and the PCB.

[0043] In some embodiments, as Figure 2 and Figure 3 shown, the insulating package 3 can have a first surface 31. When the overvoltage protection device is connected to the PCB, the first surface 31 faces the PCB; the connecting portion 21 is arranged on the first surface 31, the connecting surface 210 is located on the side of the connecting portion 21 away from the insulating package 3, and the connecting surfaces 210 of the first lead 2a and the second lead 2b are spaced apart on the first surface 31.

[0044] For example, an installation groove 30 may be provided on the first surface 31 of the insulation package 3, so that the connection portion 21 can be installed in the installation groove 30, and the connection surface 210 is exposed on the first surface 31. When the overvoltage protection device is soldered to the PCB, it can be electrically connected to the PCB through the two connection surfaces 210, and both connection surfaces 210 are located on the first surface 31, so that the overvoltage protection device can be placed on the PCB by surface mounting and electrically connected to the PCB through reflow soldering.

[0045] In other embodiments, the connection portion 21 may also protrude from the first surface 31 in a direction perpendicular to the first surface 31. At this time, it is not necessary to provide the installation groove 30 on the first surface 31 either. The present application does not impose special restrictions on whether the installation groove 30 is provided on the first surface 31 of the insulation package 3.

[0046] In some embodiments, as Figures 5 to 7 shown, the shape of the insulation package 3 may be set as a columnar shape, and the insulation package 3 may further have a second surface 32 connected to the first surface 31; the ends of the first lead 2a and the second lead 2b far from the core component 1 may both be bent to form an exposed portion 22 and a connection portion 21, and the exposed portion 22 may be exposed on the second surface 32.

[0047] When the insulation package 3 is of a columnar structure, the second surface 32 may be perpendicular to the first surface 31. When the overvoltage protection device is connected to the PCB, since the connection portion 21 is located within the first surface 31 and the first surface 31 faces the PCB, it is not easy to determine the placement position of the overvoltage protection device when placing it. In the present application, by bending the lead 2 to form the exposed portion 22 and the connection portion 21, and the exposed portion 22 is exposed on the second surface 32, when the overvoltage protection device is placed, the position of the connection portion 21 can be determined through the exposed portion 22, so that the overvoltage protection device can be accurately placed at the corresponding position on the PCB for the soldering of the connection portion 21. Among them, the exposed portion 22 may protrude from the second surface 32, may be attached to the second surface 32, or may be embedded in the second surface 32. The present application does not impose special restrictions on the relative positional relationship between the exposed portion 22 and the second surface 32.

[0048] In some embodiments, the insulation package 3 may be set as a square column. At this time, the first surface 31 may be the bottom surface of the square column, and the second surface 32 may be the side surface of the square column. Of course, the insulation package 3 may also be set as a cylinder. At this time, the first surface 31 may be the bottom surface of the cylinder, and the second surface 32 may be the arc side surface of the cylinder. The present application does not impose special restrictions on the specific shape of the insulation package 3.

[0049] In other embodiments, when the connecting portion 21 is disposed on the first surface 31, the overvoltage protection device can also be accurately placed at the corresponding position on the PCB by setting relevant wire frames, point positions and other identification symbols on the surface of the PCB. In this case, the exposed portion 22 does not need to be provided. This application does not impose special restrictions on whether the lead-out member 2 is bent to form the exposed portion 22.

[0050] In some embodiments, the shape of the first surface 31 is rectangular. As Figure 2 shown, the extending direction of the connecting portion 21 of the first lead-out member 2a and the second lead-out member 2b can be towards the short side of the first surface 31, or, as Figure 6 shown, the extending direction of the connecting portion 21 of the first lead-out member 2a and the second lead-out member 2b can be towards the long side of the first surface 31.

[0051] According to the different bending shapes of the lead-out member 2, the extending direction of the connecting portion 21 can be set on the side of the first surface 31 facing the short side or on the side of the first surface 31 facing the long side. In other embodiments, the insulating encapsulation member 3 can also be set as a cylindrical structure. At this time, the shape of the first surface 31 is circular, and the extending direction of the connecting portion 21 can be towards any direction of the first surface 31. This application does not impose special restrictions on the bending shape of the lead-out member 2 and the shape of the insulating encapsulation member 3.

[0052] In some embodiments, as Figures 8 to 10 shown, the insulating encapsulation member 3 can have a first surface 31. When the overvoltage protection device is connected to the PCB, the first surface 31 faces the PCB; the connecting portion 21 protrudes out of the first surface 31, and the connecting surfaces 210 of the first lead-out member 2a and the second lead-out member 2b are spaced apart outside the first surface 31.

[0053] When the connecting portion 21 protrudes out of the first surface 31, the position of the connecting surface 210 placed on the PCB can be directly observed through the connecting portion 21, so as to ensure the accuracy of the placement of the overvoltage protection device. Among them, the two connecting surfaces 210 can be either in the same plane as the first surface 31 or in different planes from the first surface 31. This application does not impose special restrictions on the specific positions of the two connecting surfaces 210.

[0054] In some embodiments, as Figures 8 to 10 shown, the first lead-out member 2a and the second lead-out member 2b can be disposed on both sides of the first surface 31, and the first lead-out member 2a and the second lead-out member 2b can be bent and formed in a direction away from the first surface 31.

[0055] Thus, the two connecting surfaces 210 can be in the same plane as the first surface 31, so that the overvoltage protection device can be placed more stably on the PCB. In other embodiments, the first lead 2a and the second lead 2b can also be bent and formed in the direction towards the first surface 31, and both connecting portions 21 are located outside the first surface 31.

[0056] In the above embodiments, the bending directions of the connecting portions 21 in the first lead 2a and the second lead 2b are both bent towards each other or away from each other. In other embodiments, the bending directions of the connecting portions 21 in the first lead 2a and the second lead 2b can also be the same. For example, the connecting portion 21 in the first lead 2a can be bent and disposed within the first surface 31, and the connecting portion 21 in the second lead 2b can be bent and disposed outside the first surface 31. The present application does not impose special restrictions on the bending directions of the connecting portions 21 in the first lead 2a and the second lead 2b.

[0057] In some embodiments, such as Figures 1 to 10 shown, the first lead 2a and the second lead 2b can be bent to form an L shape, a C shape or a Z shape respectively.

[0058] For example, as Figure 2 shown, the first lead 2a and the second lead 2b can be bent to form an L-shaped structure, so that the connecting portion 21 can be disposed within the first surface 31. Again, as Figure 7 shown, the first lead 2a and the second lead 2b can be bent to form a C-shaped structure, so that the lead 2 can be bent to form an exposed portion 22, facilitating the placement of the overvoltage protection device on the PCB. At the same time, the C-shaped structure can also clamp the insulating package 3 to increase the reliability of the connection between the lead 2 and the insulating package 3. Still further, as Figure 10 shown, the first lead 2a and the second lead 2b can be bent to form a Z-shaped structure, so that the connecting portion 21 can be disposed outside the first surface 31. The present application does not impose special restrictions on the specific shapes of the bends of the first lead 2a and the second lead 2b.

[0059] In some embodiments, the voltage-limiting device 11 can be a metal oxide varistor (MOV) or a transient voltage suppressor (TVS), and the switching device 12 can be a gas discharge tube (GDT), a spark gap protector (SPG) or a thyristor surge suppressor (TSS).

[0060] For example, in this application, the voltage-limiting device 11 is an MOV and the switching device 12 is a GDT as an example for illustration. As Figure 11 shown, the voltage-limiting device 11 (i.e., MOV) may include a first electrode 111 and a second electrode 112 which are oppositely arranged, and the switching device 12 (i.e., GDT) may include a third electrode 121 and a fourth electrode 122 which are oppositely arranged; the second electrode 112 is electrically connected to the third electrode 121, the first lead 2a is electrically connected to the first electrode 111, and the second lead 2b is electrically connected to the fourth electrode 122.

[0061] Among them, the second electrode 112 and the third electrode 121 can be welded by a conductive material and electrically conductively connected. The first lead 2a and the first electrode 111 can also be welded by a conductive material, and the second lead 2b and the fourth electrode 122 can also be welded by a conductive material. The switching device 12 may further include a connecting tube 123. The connecting tube 123 is a hollow structure. The third electrode 121 and the fourth electrode 122 are welded to both ends of the connecting tube 123 by solder at high temperature, and an inert gas can be filled in the inner cavity of the connecting tube 123.

[0062] In addition, the materials of the first electrode 111 and the second electrode 112 can be metal materials such as silver or copper, the materials of the third electrode 121 and the fourth electrode 122 can be metal materials such as iron, nickel or copper, and the conductive material can be metal materials such as tin, silver, aluminum, copper or alloy. The outer shapes of the voltage-limiting device 11 and the switching device 12 can be set to shapes such as square, circular or polygonal. This application does not make special restrictions on the specific materials and shapes of the voltage-limiting device 11 and the switching device 12.

[0063] In other embodiments, the voltage-limiting device 11 in the core component 1 can also be a TVS, and the switching device 12 in the core component 1 can also be an SPG or a TSS. According to different types of the voltage-limiting device 11 and the switching device 12, the voltage-limiting device 11 can be in shapes such as circular, square or cylindrical, and the switching device 12 can also be in shapes such as circular, square or cylindrical. For example, when the voltage-limiting device 11 is a TVS, the voltage-limiting device 11 can be in a square shape. When the voltage-limiting device 11 is a TVS, the voltage-limiting device 11 can be in a square or cylindrical shape. This application does not make special restrictions on the specific types and specific shapes of the voltage-limiting device 11 and the switching device 12. According to different anti-surge protection objectives achieved by the core component 1, any type of devices can be selected for combination of the voltage-limiting device 11 and the switching device 12.

[0064] In some embodiments, as Figure 12 shown, the insulating encapsulation 3 can be injection-molded into a prismatic shape.

[0065] For example, the insulating package 3 can be set in the shape of a quadrangular prism. When the insulating package 3 is in the shape of a quadrangular prism, it can be quickly picked up by a pick-and-place machine and transferred to the PCB for soldering. In the insulating package 3 in the above embodiment, a notch 33 can also be provided on the side away from the connection surface 210, so that the insulating package 3 forms a hexagonal prism shape, thereby reducing the volume of the insulating package 3, avoiding the problem of interference between the overvoltage protection device and other components on the PCB, and also saving the material used for the insulating package 3. In other embodiments, the insulating package 3 can also be injection-molded into a cylindrical shape, a pentagonal prism shape, or other polygonal prism shapes. The present application does not impose special restrictions on the specific shape of the insulating package 3.

[0066] In addition, the part of the lead-out member 2 inside the insulating package 3 can be bent multiple times. When the lead-out member 2 and the insulating package 3 are injection-molded, a biting force can also be formed between the lead-out member 2 and the insulating package 3, thereby enhancing the connection strength between the lead-out member 2 and the insulating package 3. The present application does not impose special restrictions on the bending shape of the lead-out member 2 inside the insulating package 3.

[0067] In some embodiments, the material of the insulating package 3 can be ceramic, glass, heat-resistant polymer, liquid polymer, or epoxy resin.

[0068] According to the different usage scenarios of the overvoltage protection device, the overvoltage protection device can be configured as components with high temperature resistance, low temperature resistance, high insulation, and high flame retardancy. The insulating package 3 can be injection-molded using materials such as ceramic, glass, heat-resistant polymer, liquid polymer, or epoxy resin. The present application does not impose special restrictions on the specific material of the insulating package 3.

[0069] The above uses specific examples to elaborate on the present invention, which is only used to help understand the present invention and is not intended to limit the present invention. For those skilled in the technical field to which the present invention belongs, based on the idea of the present invention, several simple deductions, deformations, or substitutions can also be made.

Claims

1. An overvoltage protection device, characterized in that, Comprising: A core component, including a voltage-limiting device and a switching device, the voltage-limiting device being electrically connected to the switching device; Leads, including a first lead and a second lead, the first lead being electrically connected to the voltage-limiting device, and the second lead being electrically connected to the switching device; and, An insulating encapsulation, the core component being embedded in the insulating encapsulation; Wherein, a connection portion is provided at one end of the first lead away from the voltage-limiting device and at one end of the second lead away from the switching device, the connection portion having a connection surface exposed from the insulating encapsulation, and the connection surfaces of the first lead and the second lead are spaced apart on the same plane, so that the overvoltage protection device forms an SMD.

2. The overvoltage protection device according to claim 1, characterized in that The insulating encapsulation has a first surface, and when the overvoltage protection device is connected to a PCB, the first surface faces the PCB; The connection portion is provided on the first surface, the connection surface is located on a side of the connection portion away from the insulating encapsulation, and the connection surfaces of the first lead and the second lead are spaced apart on the first surface.

3. The overvoltage protection device according to claim 2, characterized in that, The shape of the insulating encapsulation is cylindrical, and the insulating encapsulation further has a second surface connected to the first surface; One end of the first lead and the second lead away from the core component are bent to form an exposed portion and the connection portion, and the exposed portion exposes the second surface.

4. The overvoltage protection device according to claim 3, characterized in that, The shape of the first surface is rectangular, and the extending direction of the connection portions of the first lead and the second lead faces the short side of the first surface, or the extending direction of the connection portions of the first lead and the second lead faces the long side of the first surface.

5. The overvoltage protection device according to claim 1, characterized in that, The insulating encapsulation has a first surface, and when the overvoltage protection device is connected to a PCB, the first surface faces the PCB; The connection portion protrudes out of the first surface, and the connection surfaces of the first lead and the second lead are spaced apart outside the first surface.

6. The overvoltage protection device according to claim 5, characterized in that, The first lead and the second lead are provided on both sides of the first surface, and the first lead and the second lead are bent and formed in a direction away from the first surface.

7. The overvoltage protection device according to any one of claims 1 to 6, characterized in that, The first lead and the second lead are respectively bent to form an L shape, a C shape or a Z shape.

8. The overvoltage protection device according to any one of claims 1 to 6, characterized in that, The voltage-limiting device is a MOV or a TVS, and the switching device is a GDT, an SPG or a TSS.

9. The overvoltage protection device according to any one of claims 1 to 6, characterized in that, The insulating encapsulation is injection-molded into a prismatic shape.

10. The overvoltage protection device according to claim 9, characterized in that, The material of the insulating encapsulation is ceramic, glass, heat-resistant polymer, liquid polymer or epoxy resin.

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