Audio processing system and audio processing device
By introducing an I2S switching module into the audio processing device, unnoised or noise-reduced audio signals are selectively sent according to the use scenario, and the problem of low fidelity of audio signals in the prior art is solved, and the output of high-fidelity audio signals is realized.
Patent Information
- Application Number
- CN202421978800.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-15
AI Technical Summary
Existing audio processing devices cannot selectively perform noise reduction processing based on usage scenarios, resulting in low audio signal fidelity.
Set up the I2S switching module to receive audio signals that have not been AI-decreased and audio signals that have been AI-decreased through the I2S switching module, and select and send them to the processor according to the actual usage scenario to ensure high fidelity.
It realizes the selective use of unnoised or noise-reduced audio signals according to the usage scenario to ensure high fidelity of the audio signals.
Smart Images
Figure CN223093872U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of audio processing, and particularly to an audio processing system and an audio processing device. Background Art
[0002] With the continuous development of AI technology, some existing methods for noise reduction of audio can be, for example, installing an AI noise reduction chip inside an audio processing device to filter environmental noise and extract human voices more effectively.
[0003] Furthermore, the audio collected by existing audio processing devices can generally be divided into noisy audio signals and noise-free audio signals. Among them, a noisy audio signal can be, for example, the human voice collected by a microphone, and the human voice is mixed with other noises, so an AI noise reduction chip is required to perform noise reduction processing on the noisy human voice. However, since the noise-free audio signal is not mixed with noise (wherein, non-speech can be, for example, recorded music, etc.), distortion may occur when using the AI noise reduction chip to reduce noise on the noise-free audio signal.
[0004] However, since existing audio processing devices perform noise reduction processing regardless of whether the received audio signal is a noisy audio signal or a noise-free audio signal, and send the noise-reduced audio signal to the processor, the audio signal finally received by the processor may have low fidelity.
[0005] Regarding the technical problem in the above-mentioned existing technology of how to select an audio signal that has not been noise-reduced or an audio signal that has been noise-reduced based on the usage scenario to ensure high fidelity of the audio signal, no effective solution has been proposed yet. Summary of the Utility Model
[0006] The present utility model provides an audio processing system and an audio processing device to at least solve the technical problem in the existing technology of how to select an audio signal that has not been noise-reduced or an audio signal that has been noise-reduced based on the usage scenario to ensure high fidelity of the audio signal.
[0007] According to one aspect of the present application, there is provided an audio processing system, including: an audio processing device and an audio collection device connected to the audio processing device, the audio collection device is configured to send the collected original audio signal to the audio processing device, and the audio processing device includes: an AI noise reduction module, an I 2 S switching module, and a processor, wherein the I 2 S switching module is configured to receive a first audio signal corresponding to the original audio signal, where the first audio signal is used to indicate an audio signal that has not undergone AI noise reduction; I 2The S switching module is connected to the AI noise reduction module and is used to receive the second audio signal sent by the AI noise reduction module, where the second audio signal is used to indicate the audio signal after AI noise reduction; and I 2 The S switching module is connected to the processor and is used to send the first audio signal or the second audio signal to the processor.
[0008] Optionally, I 2 The S switching module includes: a first interface, a second interface, and a third interface, and the processor is connected to the I 2 S switching module through the I 2 C bus and is used to send a switching instruction to the I 2 S switching module, where the I 2 S switching module is used to connect the first interface and the third interface, or connect the second interface and the third interface according to the switching instruction.
[0009] Optionally, it further includes: an audio codec, where the audio codec is connected to the audio acquisition device and is used to convert the analog signal into a digital signal; and the audio codec is connected to the I 2 S switching module through the first interface, and the audio codec is connected to the AI noise reduction module.
[0010] Optionally, the audio acquisition device includes: a wireless microphone, and the audio processing device includes: a Bluetooth interface, where the wireless microphone is connected to the audio codec through the Bluetooth interface.
[0011] Optionally, the audio acquisition device includes: a built-in microphone, and the audio processing device includes: a microphone interface, and the built-in microphone is connected to the audio codec through the microphone interface.
[0012] Optionally, the audio processing device includes: a stereo interface, where the audio codec is connected to the stereo interface.
[0013] Optionally, the AI noise reduction module is an AI noise reduction chip.
[0014] According to another aspect of the present application, there is provided an audio processing device, including: an AI noise reduction module, an I 2 S switching module, and a processor, where the I 2 S switching module is used to receive the first audio signal sent by the audio acquisition device, where the first audio signal is used to indicate the audio signal without AI noise reduction; I 2 The S switching module is connected to the AI noise reduction module and is used to receive the second audio signal sent by the AI noise reduction module, where the second audio signal is used to indicate the audio signal after AI noise reduction; and I 2 The S switching module is connected to the processor and is used to send the first audio signal or the second audio signal to the processor.
[0015] This application provides an audio processing system. And the audio processing system includes an audio processing device and an audio acquisition device. Among them, the audio processing device includes an I 2 S switching module, an AI noise reduction module, and a processor. I 2 The I 2 S switching module is used to receive the first audio signal sent by the audio acquisition device. Among them, the first audio signal is used to indicate the audio signal without AI noise reduction. I 2 The I
[0016] S switching module is connected to the AI noise reduction module and is used to receive the second audio signal sent by the AI noise reduction module. And the second audio signal is used to indicate the audio signal after AI noise reduction. In addition, I 2 the I 2 S switching module is connected to the processor and is used to send the first audio signal or the second audio signal to the processor.
[0017] Referring to the above content, this application sets two different audio signal processing lines. That is, the line that directly sends the first audio signal corresponding to the original audio signal to the I 2 S switching module without performing AI noise reduction on the original audio signal, and the line that uses the AI noise reduction module to perform AI noise reduction on the original audio signal and then sends the generated second audio signal to the I
[0018] S switching module.
[0019] Therefore, when the audio processing device receives the original audio signal, it can generate the first audio signal (i.e., the audio signal without AI noise reduction) and the second audio signal (i.e., the audio signal after AI noise reduction) based on the above two different audio processing lines. And after the I Brief Description of the Drawings
[0020] Some specific embodiments of the present application will be described in detail below with reference to the accompanying drawings in an exemplary but not limiting manner. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings:
[0021] Figure 1 is a modular schematic diagram of an audio processing system according to an embodiment of the present application;
[0022] Figure 2 is a modular schematic diagram of an audio processing device according to an embodiment of the present application;
[0023] Figure 3 is an I according to an embodiment of the present application 2 circuit diagram of the S switching module;
[0024] Figure 4 is a circuit diagram of an AI noise reduction module according to an embodiment of the present application;
[0025] Figure 5 is a circuit diagram of the processor I according to an embodiment of the present application 2 S interface;
[0026] Figure 6 is a circuit diagram of a power supply according to an embodiment of the present application. Detailed implementation manners
[0027] It should be noted that, without conflict, the embodiments in the present utility model and the features in the embodiments may be combined with each other. The present utility model will be described in detail below with reference to the drawings and in conjunction with the embodiments.
[0028] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.
[0029] It should be noted that in the description, claims and above-mentioned drawings of the present utility model, terms such as "first" and "second" are used to distinguish similar objects, and do not necessarily describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances for the embodiments of the present utility model described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or units does not necessarily limit to those clearly listed steps or units, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.
[0030] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.
[0031] Figure 1 is a modular schematic diagram of an audio processing system according to an embodiment of the present application. Figure 3 is the I according to an embodiment of the present application 2 circuit diagram of the S switching module 120. Figure 4 is a circuit diagram of the AI noise reduction module 110 according to an embodiment of the present application. Figure 5 is the processor I according to an embodiment of the present application 2 circuit diagram of the S interface. Refer to Figure 1 、 Figure 3 、 Figure 4 and Figure 5 As shown, it includes: an audio processing device 10 and an audio collection device 20 connected to the audio processing device 10. The audio collection device 20 is used to send the collected original audio signal to the audio processing device 10. The audio processing device 10 includes: an AI noise reduction module 110, an I 2 S switching module 120, and a processor 130, wherein the I 2 S switching module 120 is used to receive a first audio signal corresponding to the original audio signal, where the first audio signal is used to indicate an audio signal without AI noise reduction; 2 The I 2The S switching module 120 is connected to the processor 130 and is configured to send the first audio signal or the second audio signal to the processor 130.
[0032] As described in the background art, since the existing audio processing device performs noise reduction processing on both the received noisy audio signal and the noise-free audio signal and sends the noise-reduced audio signal to the processor, the audio signal finally received by the processor may be of low fidelity.
[0033] In view of this, the present application provides an audio processing system. The audio processing system includes an audio processing device 10 and an audio acquisition device 20 connected to the audio processing device 10. The audio processing device 10 includes 2 an S switching module 120, an AI noise reduction module 110, and a processor 130.
[0034] Among them, the I in the audio processing device 10 2 The S switching module 120 is configured to receive the first audio signal sent by the audio acquisition device 20. The first audio signal is used to indicate an audio signal without AI noise reduction. And 2 The S switching module 120 is connected to the AI noise reduction module 110 and is configured to receive the second audio signal sent by the AI noise reduction module 110. Among them, the second audio signal is used to indicate an audio signal after AI noise reduction.
[0035] For example, in a noisy environment, if the original audio signal collected by the audio acquisition device 20 is a noisy human voice, then 2 The S switching module 120 not only receives the first audio signal (i.e., the audio signal without AI noise reduction) sent by the audio acquisition device 20, but also receives the second audio signal (i.e., the audio signal that has been subjected to AI noise reduction by the AI noise reduction module 110).
[0036] Thus, in order to ensure that the noise in the first audio signal can be removed, when 2 the S switching module 120 receives the first audio signal and the second audio signal, 2 the S switching module 120 can send the second audio signal to the processor 130 based on the switching instruction sent by the processor 130. That is, the audio signal that has been subjected to AI noise reduction processing is sent to the processor 130.
[0037] For another example, if the original audio signal collected by the audio acquisition device 20 is a recorded music, then 2The S switching module 120 not only receives the audio signal without AI noise reduction (i.e., the first audio signal) sent by the audio acquisition device 20, but also receives the audio signal after AI noise reduction via the AI noise reduction module 110 (i.e., the second audio signal).
[0038] Thus, in order to ensure the high fidelity of the audio signal, therefore in I 2 When the S switching module 120 receives the first audio signal and the second audio signal, I 2 The S switching module 120 can send the first audio signal to the processor 130 based on the switching instruction sent by the processor 130. That is, send the audio signal without AI noise reduction processing to the processor 130.
[0039] In view of this, the present application sets up two different audio signal processing lines. That is, the line that directly sends the first audio signal corresponding to the original audio signal to I 2 The S switching module 120 without performing AI noise reduction on the original audio signal, and the line that uses the AI noise reduction module 110 to perform AI noise reduction on the original audio signal, and then sends the generated second audio signal after processing to I 2 The S switching module 120.
[0040] Thus, when the audio processing device 10 receives the original audio signal, it can generate the first audio signal (i.e., the audio signal without AI noise reduction) and the second audio signal (i.e., the audio signal after AI noise reduction) based on the above two different audio processing lines. And in I 2 After the S switching module 120 receives the first audio signal and the second audio signal, it can select to send the first audio signal to the processor 130 or send the second audio signal to the processor 130 based on the actual usage scenario (i.e., whether the original audio signal is a noisy audio signal or a non-noisy audio signal).
[0041] Thus, it achieves the technical effect of being able to select to use the audio signal without AI noise reduction or the audio signal that has undergone AI noise reduction according to the actual usage scenario, and being able to ensure the high fidelity of the audio signal. Furthermore, it solves the technical problem in the prior art of how to select the audio signal without noise reduction or the audio signal that has been noise-reduced based on the usage scenario to ensure the high fidelity of the audio signal.
[0042] In addition, it is worth noting that the above I 2 The S switching module 120 and the AI noise reduction module 110 are connected through I 2 The S bus. I 2 The S switching module 120 and the processor 130 are also connected through I 2S-bus connection.
[0043] Optionally, the I 2 S switching module 120 includes: a first interface 121, a second interface 122, and a third interface 123, and the processor 130 is connected to the I 2 C-bus and the I 2 S switching module 120 for sending a switching instruction to the I 2 S switching module 120, where the I 2 S switching module 120 is configured to connect the first interface 121 and the third interface 123 according to the switching instruction, or connect the second interface 122 and the third interface 123.
[0044] Specifically, referring to Figure 1 as shown, the I 2 S switching module 120 includes a first interface 121, a second interface 122, and a third interface 123. And the processor 130 is also connected to the I 2 C-bus and the I 2 S switching module 120, so as to send a switching instruction to the I 2 S switching module 120. Thus, the I 2 S switching module 120 can connect the first interface 121 and the third interface 123 based on the switching instruction, or connect the second interface 122 and the third interface 123.
[0045] For example, when the I 2 S switching module 120 receives both the first audio signal and the second audio signal, the processor 130 can send a switching instruction to the I 2 S switching module 120. Wherein, the switching instruction is used to indicate to connect the second interface 122 and the third interface 123 when the original audio signal is a noisy audio signal. Or, when the original audio signal is a non-noisy audio signal, connect the first interface 121 and the third interface 123. Thus, when the I 2 S switching module 120 connects the first interface 121 and the third interface 123, the I 2 S switching module 120 sends the first audio signal to the processor 130; when the I 2 S switching module 120 connects the second interface 122 and the third interface 123, the I 2 S switching module 120 sends the second audio signal to the processor 130.
[0046] Thus, by setting the first interface 121, the second interface 122, and the third interface 123 in the I 2 S switching module 120, it is possible to make the I 2The S switching module 120 selects to send the first audio signal or the second audio signal to the processor 130 based on the switching instruction sent by the processor 130, thereby ensuring the technical effect of being able to select the most suitable audio signal.
[0047] Optionally, it further includes: an audio codec 140, where the audio codec 140 is connected to the audio acquisition device 20 and is used to convert the analog signal into a digital signal; and the audio codec 140 is connected to the I 2 S switching module 120 through the first interface 121, and the audio codec 140 is connected to the AI noise reduction module 110.
[0048] Specifically, referring to Figure 1 As shown, the audio processing system further includes an audio codec 140. The audio codec 140 is connected to the audio acquisition device 20 and is used to convert the analog signal into a digital signal. In addition, the audio codec 140 is also connected to the I 2 S switching module 120 through the first interface 121, and the audio codec 140 is also connected to the AI noise reduction module 110.
[0049] Thus, when the audio codec 140 receives the original audio signal, it converts the original audio signal from an analog signal into a digital signal and generates a first audio signal. Then, the audio codec 140 sends the first audio signal to the I 2 S switching module 120 through the first interface 121, and at the same time sends the first audio signal to the AI noise reduction module 110. After that, the AI noise reduction module 110 performs AI noise reduction processing on the first audio signal to generate a second audio signal. Further, the AI noise reduction module 110 sends the second audio signal to the I 2 S switching module 120 through the second interface 122. That is, the I 2 S switching module 120 receives not only the first audio signal through the first interface 121 but also the second audio signal through the second interface 122.
[0050] Thus, by setting the audio codec 140 in the audio processing system, the technical effect of converting the original audio signal from an analog signal into a digital signal can be achieved, and then the audio processing system can work properly.
[0051] Preferably, the audio codec 140 can be, for example, an I 2 S switch chip.
[0052] And referring to Figure 1 As shown, between the audio codec 140 and the first interface 121 of the I 2 S switching module 120 through the I 2The audio codec 140 and the AI noise reduction module 110 are connected through an I²S bus. 2 The connection is through an I²S bus.
[0053] Optionally, the audio acquisition device 20 includes a wireless microphone 210, and the audio processing device 10 includes a Bluetooth interface 151. The wireless microphone 210 is connected to the audio codec 140 through the Bluetooth interface 151.
[0054] Specifically, referring to Figure 1 As shown, the audio acquisition device 20 includes a wireless microphone 210. The audio processing device 10 includes a Bluetooth interface 151. Among them, the original audio signal collected by the wireless microphone 210 can be, for example, noisy human voices. And at this time, the original audio signal can be, for example, a mono audio signal.
[0055] Thus, when the wireless microphone 210 in the audio acquisition device 20 collects the original audio signal, the collected original audio signal can be sent to the audio codec 140 through the Bluetooth interface 151 in the audio processing device 10, and the audio codec 140 further processes the original audio signal.
[0056] Optionally, the audio acquisition device 20 includes a built-in microphone 220, and the audio processing device 10 includes a microphone interface 152. The built-in microphone 220 is connected to the audio codec 140 through the microphone interface 152.
[0057] Specifically, referring to Figure 1 As shown, the audio acquisition device 20 includes a built-in microphone 220, and the audio processing device 10 includes a microphone interface 152. Among them, the original audio signal collected by the built-in microphone 220 can be, for example, noisy animal calls. And at this time, the original audio signal can be, for example, a mono audio signal.
[0058] Thus, when the built-in microphone 220 in the audio acquisition device 20 collects the original audio signal, the collected original audio signal can be sent to the audio codec 140 through the microphone interface 152 in the audio processing device 10, and the audio codec 140 further processes the original audio signal.
[0059] Optionally, the audio processing device 10 includes a stereo interface 153, and the audio codec 140 is connected to the stereo interface 153.
[0060] Specifically, referring to Figure 1As shown, the audio processing device 10 includes a stereo interface 153, and at this time, the original audio signal sent to the audio codec 140 via the stereo interface 153 can be, for example, a stereo audio signal. Thus, when the stereo interface 153 in the audio processing device 10 receives the original audio signal, the original audio signal can be sent to the audio codec 140, and the audio codec 140 further processes the original audio signal.
[0061] Referring to the above content, it can be known that the audio acquisition device 20 can include various devices such as a wireless microphone 210 and a built-in microphone 220 that can acquire mono audio signals. It should be noted by those skilled in the art that the above content is only an example for illustration, and the actual situation is not limited thereto.
[0062] The audio processing device 10 can also include, for example, a Bluetooth interface 151, a microphone interface 152, and a stereo interface 153, which indicates that the audio processing device 10 can process not only mono audio signals but also stereo audio signals. It should be noted by those skilled in the art that the above content is only an example for illustration, and the actual situation is not limited thereto.
[0063] Optionally, the AI noise reduction module 110 is an AI noise reduction chip.
[0064] Figure 6 is the circuit diagram of the power supply according to the embodiment of the present application. Refer to Figure 6 As shown, the technical solution of the present application can, for example, use a power supply as Figure 6 shown to supply power to the audio acquisition system.
[0065] Figure 3 is the modular schematic diagram of the audio processing device according to the embodiment of the present disclosure. Refer to Figure 3 As shown, according to another aspect of the present application, there is also provided an audio processing device, including: an AI noise reduction module 110, an I 2 S switching module 120, and a processor 130, where the I 2 S switching module 120 is configured to receive a first audio signal sent by the audio acquisition device 20, where the first audio signal is used to indicate an audio signal without AI noise reduction; I 2 The S switching module 120 is connected to the AI noise reduction module 110 and is configured to receive a second audio signal sent by the AI noise reduction module 110, where the second audio signal is used to indicate an audio signal after AI noise reduction; and I 2 The S switching module 120 is connected to the processor 130 and is configured to send the first audio signal or the second audio signal to the processor 130.
[0066] In addition, the present application can achieve the following technical effects:
[0067] 1. In the audio processing device of the present application, by setting a stereo interface, and after the audio processing system receives a noise-free audio signal sent by the stereo interface, the I 2 S switching module can directly send the audio signal without AI noise reduction processing to the processor, thus ensuring the high fidelity of the audio signal;
[0068] 2. In order to achieve the high-fidelity effect, for many music recording scenarios, it is not suitable to perform AI noise reduction processing. Therefore, the present application sets the I 2 S switching module, and the I 2 S switching module can not only receive the audio signal without AI noise reduction processing, but also receive the audio signal that has undergone AI noise reduction processing. Thus, the operator can, based on the actual usage scenario, select which type of audio signal received by the I 2 S switching module to send to the processor and obtain a high-fidelity and noise-free audio signal;
[0069] 3. Although the AI noise reduction chip can be connected in series to the entire processing link and switching is done inside the chip, it has high requirements for the chip's functions, which will inevitably lead to an increase in cost and at the same time limit the selection of the AI noise reduction chip. Therefore, the present application sets a first interface 121, a second interface 122, and a third interface 123 in the I 2 S switching module. When the received is the first audio signal, the first interface 121 and the third interface 123 are connected; when the received is the second audio signal, the second interface 122 and the third interface 123 are connected, so as to ensure both low cost and high-fidelity audio signals.
[0070] Unless otherwise specifically stated, the relative arrangements of the components and steps, numerical expressions, and values set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that for the sake of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the said technologies, methods, and devices should be regarded as part of the authorization specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: similar reference numerals and letters denote similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
[0071] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper", etc. can be used here to describe the spatial positional relationship of a device or feature shown in the figure with other devices or features. It should be understood that the spatial relative terms are intended to cover different orientations in use or operation in addition to the orientation described in the figure for the device. For example, if the device in the drawing is inverted, the device described as "above or over other devices or structures" will then be positioned "below or under other devices or structures". Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the corresponding explanations are made for the spatial relative descriptions used here.
[0072] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom", etc. is usually based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description. Without contrary instructions, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the protection scope of the present utility model; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.
[0073] As described above, only the preferred specific embodiments of the present application are given, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. An audio processing system, comprising: An audio processing device (10) and an audio acquisition device (20) connected to the audio processing device (10), the audio acquisition device (20) being configured to send an acquired original audio signal to the audio processing device (10), characterized in that the audio processing device (10) comprises: an AI noise reduction module (110), an I 2 S switching module (120), and a processor (130), wherein The aforementioned I 2 The IS switching module (120) is configured to receive a first audio signal corresponding to the original audio signal, where the first audio signal is used to indicate an audio signal without AI noise reduction; The above-mentioned I 2 The IS switching module (120) is connected to the AI noise reduction module (110) and is configured to receive a second audio signal sent by the AI noise reduction module (110), where the second audio signal is used to indicate an audio signal after AI noise reduction; and The said I 2 The IS switching module (120) is connected to the processor (130) and is configured to send the first audio signal or the second audio signal to the processor (130).
2. The audio processing system according to claim 1, wherein The said I 2 The IS switching module (120) includes: a first interface (121), a second interface (122), and a third interface (123), and the processor (130) is connected to the IS 2 switching module (120) through an I 2 C bus, and is used to send a switching instruction to the IS 2 switching module (120), where The said I 2 The IS switching module (120) is configured to connect the first interface (121) and the third interface (123) according to the switching instruction, or to connect the second interface (122) and the third interface (123).
3. The audio processing system according to claim 2, wherein Further comprising: An audio codec (140), wherein The audio codec (140) is connected to the audio acquisition device (20) for converting an analog signal into a digital signal; and The audio codec (140) is connected to the I 2 S switching module (120) through the first interface (121), and the audio codec (140) is connected to the AI noise reduction module (110).
4. The audio processing system according to claim 3, characterized in that The audio acquisition device (20) includes: a wireless microphone (210), and the audio processing device (10) includes: a Bluetooth interface (151), wherein The wireless microphone (210) is connected to the audio codec (140) through the Bluetooth interface (151).
5. The audio processing system according to claim 3, wherein The audio acquisition device (20) includes: a built-in microphone (220), and the audio processing device (10) includes: a microphone interface (152), wherein The built-in microphone (220) is connected to the audio codec (140) through the microphone interface (152).
6. The audio processing system according to claim 3, wherein The audio processing device (10) includes: a stereo interface (153), wherein The audio codec (140) is connected to the stereo interface (153).
7. The audio processing system according to claim 1, wherein The AI noise reduction module (110) is an AI noise reduction chip.
8. An audio processing device, characterized in that, Comprising: AI noise reduction module (110), I 2 S switching module (120), and a processor (130), wherein The said I 2 The IS switching module (120) is configured to receive a first audio signal sent by the audio acquisition device (20), where the first audio signal is used to indicate an audio signal without AI noise reduction; The said I 2 S switching module (120) is connected to the said AI noise reduction module (110) and is used for receiving a second audio signal sent by the said AI noise reduction module (110), wherein the second audio signal is used for indicating an audio signal after AI noise reduction; and The said I 2 The S switching module (120) is connected to the processor (130) and is configured to send the first audio signal or the second audio signal to the processor (130).