Water channel structure and vehicle-mounted power supply
By adopting a detachable split waterway potting bin structure and welding design of high thermal conductivity materials in the on-board power supply, the problems of large space occupation and low thermal conductivity in traditional on-board power supply are solved, achieving more efficient heat dissipation and simplified production.
Patent Information
- Application Number
- CN202421529558.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-28
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-06-28
AI Technical Summary
The vertical waterway potting silo of traditional vehicle-mounted power supply is integrated with the shell, which takes up a large space and has low thermal conductivity. The die-casting process of high thermal conductivity materials is complicated, resulting in poor heat dissipation effect.
The detachable water channel potting chamber and shell are used to separate structures. The water channel sealing plate is made of high thermal conductivity materials, fixed by friction stir welding, and heat dissipation ribs are installed in the cooling water channel to form a cooling circulation pipeline.
It reduces the space occupied by the waterway potting silo, improves heat dissipation efficiency, simplifies production processes, saves resources, and enhances the heat dissipation effect of power devices.
Smart Images
Figure CN223094066U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of new energy power supply, and more specifically, to a waterway structure and a vehicle-mounted power supply. Background Art
[0002] The vertical water channel filling bin of a traditional on-board power supply is generally formed integrally with the shell. The weld of the bottom sealing plate of the vertical water channel filling bin will occupy a large space of the shell. In addition, due to the limitation of the die-casting material, the thermal conductivity of the part of the vertical water channel filling bin in contact with the power device is low. If a die-casting material with high thermal conductivity is used, the die-casting process will be more difficult and complicated, and will lead to die-casting defects.
[0003] Therefore, how to improve the heat dissipation effect while reducing the space occupied by the water channel filling bin has become a technical problem that needs to be urgently solved by technical personnel in this field. Utility Model Content
[0004] In view of this, the purpose of the present application is to provide a water channel structure to improve the heat dissipation effect while reducing the space occupied by the water channel filling bin.
[0005] Another object of the present application is to provide a vehicle-mounted power supply having the above-mentioned water channel structure.
[0006] To achieve the above objectives, this application provides the following technical solutions:
[0007] A waterway structure, comprising:
[0008] The water channel sealing bin is used to be detachably arranged in the shell of the vehicle-mounted power supply. The water channel sealing bin includes a bin body and water channel sealing plates located on both sides of the bin body. The water channel sealing plates and the bin body are split structures, and the water channel sealing plates and the bin body are surrounded by the cooling water channel.
[0009] Optionally, in the above-mentioned water channel structure, the water channel sealing plate is welded and fixed to the side of the warehouse body.
[0010] Optionally, in the above-mentioned water channel structure, the water channel sealing plate is made of a high thermal conductivity profile.
[0011] Optionally, in the above water channel structure, the water channel sealing plate is made of aluminum profile;
[0012] The water channel sealing plate and the warehouse body are welded and fixed by means of stir friction welding.
[0013] Optionally, in the above-mentioned water channel structure, the bin body includes a bottom plate and the cooling water channel arranged on the bottom plate in a U-shape, and ears for fixing the water channel filling bin are provided on the bottom plate.
[0014] Optionally, in the above water channel structure, a partition board is arranged in the enclosed space of the cooling water channel, and the partition board and the side wall of the cooling water channel enclose a potting groove for filling potting glue.
[0015] Optionally, in the above water channel structure, a step portion is arranged at the end of the bottom plate, and a liquid inlet and a liquid outlet for communicating with the cooling water channel are respectively arranged on the step portion.
[0016] Optionally, in the above water channel structure, diversion portions are respectively arranged at the positions of the liquid inlet and the liquid outlet of the cooling water channel.
[0017] Optionally, in the above water channel structure, a plurality of heat dissipation ribs are arranged on the inner wall of the cooling water channel, and the heat dissipation ribs are distributed in a strip shape or a ring shape.
[0018] A vehicle-mounted power supply includes a housing, power devices arranged in the housing, and the water channel structure as described in any one of the above for dissipating heat from the power devices.
[0019] Optionally, in the above vehicle-mounted power supply, the power device includes a power tube, and the power tube is fixed to the side wall of the water channel potting chamber by an adhesive method.
[0020] The water channel structure provided by the present application, by detachably connecting the water channel potting chamber with the housing of the vehicle-mounted power supply, avoids the problem that the traditional welding seam occupies the bottom space, reduces the occupied space of the water channel potting chamber, and at the same time, the chamber body and the water channel sealing plate adopt a split structure, and the water channel sealing plate can be independently designed and processed with a high thermal conductivity material, solving the problem that it is difficult to process the water channel potting chamber as a whole with a high thermal conductivity material, thereby improving the heat dissipation efficiency of the water channel potting chamber.
[0021] The technical features mentioned above, the technical features to be mentioned below, and the technical features shown separately in the drawings can be arbitrarily combined with each other as long as the combined technical features are not mutually contradictory. All feasible feature combinations are the technical contents clearly recorded in this article. Any one of the sub-features included in the same sentence can be independently applied without necessarily being applied together with other sub-features. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained according to the provided drawings.
[0023] Figure 1Schematic diagram of the structure of the water channel potting bin provided by the embodiment of the present application;
[0024] Figure 2 Schematic diagram of the structure of the water channel sealing plate provided by the embodiment of the present application Figure 1 ;
[0025] Figure 3 Schematic diagram of the structure of the water channel sealing plate provided by the embodiment of the present application Figure 2 ;
[0026] Figure 4 Schematic diagram of the structure of the bin body provided by the embodiment of the present application;
[0027] Figure 5 Axonometric view of the vehicle-mounted power supply provided by the embodiment of the present application;
[0028] Figure 6 Top view of the vehicle-mounted power supply provided by the embodiment of the present application.
[0029] Among them, 100 is the water channel potting bin, 101 is the cooling water channel, 1011 is the enclosed space, 102 is the bin body, 1021 is the bottom plate, 1022 is the ear part, 1023 is the step part, 103 is the water channel sealing plate, 1031 is the heat dissipation rib, 104 is the diversion part, 105 is the partition board, 106 is the potting groove;
[0030] 200 is the vehicle-mounted power supply, 201 is the housing, 202 is the power device, 2021 is the power tube. Detailed implementation manners
[0031] The core of the present application lies in providing a water channel structure to improve the heat dissipation effect while reducing the occupied space of the water channel potting bin.
[0032] Another core of the present application lies in providing a vehicle-mounted power supply having the above water channel structure.
[0033] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.
[0034] With the rapid development of electric vehicles, the importance of its auxiliary systems such as on-board chargers (OBCs) has become increasingly prominent. As the core component of energy conversion in electric vehicles, the OBC not only needs to meet higher power requirements but also faces significant challenges in thermal management. A large amount of heat is generated during the operation of the on-board power supply, and effective thermal management is the key to ensuring its stable operation and extending its service life. The water channel potting chamber can effectively fill the air gap between electronic devices and heat sinks by using thermally conductive potting glue materials, improving the thermal conduction efficiency and protecting electronic components from damage.
[0035] The traditional vertical water channel potting chamber of the on-board power supply is generally integrally formed with the housing, and the weld bead on the bottom sealing plate of the vertical water channel potting chamber will occupy a large space of the housing, resulting in a relatively large overall size of the radiator. Moreover, due to the limitations of the die-casting material of the vertical water channel potting chamber, the thermal conduction efficiency of the part in contact with the power device is relatively low. If a die-casting material with high thermal conductivity is used, the die-casting process will be difficult and complex, and die-casting defects will occur.
[0036] In addition, since the vertical water channel potting chamber is generally integrally formed with the housing, the space for installing the power device is relatively narrow, making it difficult to use the adhesive fixing method for the power device. Only additional fixing devices can be used for auxiliary fixing. At the same time, when the potting glue is baked at high temperature, the devices and structures outside the vertical water channel potting chamber are forced to be heated together, wasting the space resources and power resources of the equipment and reducing the transportation and turnover efficiency.
[0037] Therefore, as Figure 1 and Figure 4 shown, an embodiment of the present application discloses a water channel structure, including a water channel potting chamber 100. By detachably connecting the water channel potting chamber 100 to the housing 201 of the on-board power supply 200, the problem of the traditional weld bead occupying the bottom space is avoided, reducing the occupied space of the water channel potting chamber 100. At the same time, the chamber body 102 and the water channel sealing plate 103 adopt a split structure, and the water channel sealing plate 103 can be independently designed and processed with high thermal conductivity materials, solving the problem of difficult processing of the entire water channel potting chamber 100 with high thermal conductivity materials, thereby improving the heat dissipation efficiency of the water channel potting chamber 100.
[0038] Next, the water channel structure disclosed in the embodiments of the present application will be specifically explained and described in conjunction with Figure 1 and Figure 4 .
[0039] Among them, the water channel potting bin 100 and the housing 201 of the vehicle-mounted power supply 200 are designed with a split structure. At the same time, the water channel potting bin 100 and the housing 201 of the vehicle-mounted power supply 200 are connected by a detachable connection method. And the water channel potting bin 100 has a cooling water channel 101 for the cooling medium to flow, and the cooling water channel 101 is arranged along the side wall of the water channel potting bin 100, so as to achieve efficient heat dissipation when the power device 202 is fixed to the side wall of the water channel potting bin 100. Specifically, the water channel potting bin 100 includes a bin body 102 and water channel sealing plates 103 located on both sides of the bin body 102. The water channel sealing plates 103 and the bin body 102 enclose to form the cooling water channel 101. At the same time, the bin body 102 and the water channel sealing plates 103 adopt a split structure, and the water channel sealing plates 103 can be independently designed and processed with high thermal conductivity materials, solving the problem of difficult processing of the whole water channel potting bin 100 with high thermal conductivity materials, thereby improving the heat dissipation efficiency of the water channel potting bin 100. In addition, the bin body 102 and the water channel sealing plates 103 adopt a split structure, which can realize the separate processing and production of the bin body 102 and the water channel sealing plates 103, improve the production efficiency of the water channel potting bin 100, and can heat the bin body 102 separately to realize the heating and curing of the potting glue in the water channel potting bin 100, saving the space resources and power resources of the equipment and improving the transportation and turnover efficiency.
[0040] When the water channel potting bin 100 is assembled, as Figure 5 and Figure 6 shown, the water channel potting bin 100 realizes the installation and positioning of the water channel potting bin 100 in the housing 201 of the vehicle-mounted power supply 200 through pin fitting, and is locked and fixed by fasteners. The fasteners can be bolts, screws, etc. At the same time, a sealing ring is used for sealing to prevent the cooling medium in the cooling water channel 101 from leaking and damaging other components in the vehicle-mounted power supply 200. By connecting and fixing the water channel potting bin 100 and the housing 201 of the vehicle-mounted power supply 200 with fasteners, the problem that the welding bead occupies the bottom space when using the welding method can be avoided, the occupied space of the water channel potting bin 100 can be effectively reduced. At the same time, the water channel potting bin 100 can be independently designed and manufactured, improving the production efficiency and reducing the production cost. In addition, the water channel potting bin 100 can fix the power device 202 outside the housing 201 of the vehicle-mounted power supply 200, providing a larger space for the installation of the power device 202. At the same time, a thermosetting adhesive film can be used to directly bond the power device 202 to the side wall of the water channel potting bin 100, thereby increasing the contact area between the power device 202 and the cooling water channel 101 arranged along the side wall of the water channel potting bin 100, and further improving the heat dissipation efficiency of the power device 202.
[0041] As Figure 1 and Figure 4As shown, in a specific embodiment, the bin body 102 is designed in a cuboid structure. For the convenience of understanding, the two ends of the bin body 102 are respectively defined as the front end and the rear end. The front end of the bin body 102 is the end of the liquid inlet and outlet pipes of the cooling device close to the vehicle-mounted power supply 200, and the rear end of the bin body 102 is the end opposite to the front end of the bin body 102. At the same time, the rear end face of the bin body 102 contacts the inner wall of the shell 201 of the vehicle-mounted power supply 200. At the same time, a liquid inlet and a liquid outlet respectively communicating with the cooling water channel 101 are arranged at the front end of the bin body 102, so that the cooling water channel 101 is communicated with the cooling device of the vehicle-mounted power supply 200 through the liquid inlet and the liquid outlet to form a cooling circulation pipeline, thereby improving the heat exchange efficiency of the cooling medium and thus improving the heat dissipation efficiency of the power device 202. In this embodiment, the water channel sealing plate 103 is fixed to the side of the bin body 102 by welding. At the same time, the water channel sealing plate 103 can be prepared from a high thermal conductivity material, and it is not necessary to make the whole water channel potting bin 100 from a high thermal conductivity material. While ensuring effective heat dissipation for the power device 202, the manufacturing process difficulty can be reduced and the manufacturing cost can be lowered.
[0042] Specifically, the aluminum profile is prepared into the water channel sealing plate 103 through a stamping process, and at the same time, the water channel sealing plate 103 is welded and fixed to the side edge area of the bin body 102 by friction stir welding, so as to form the cooling water channel 101 between the water channel sealing plate 103 and the side of the bin body 102. Among them, the aluminum profile can be, but is not limited to, aluminum alloy. Of course, copper elements can also be added to the aluminum alloy to further improve the thermal conductivity of the water channel sealing plate 103 and thus improve the heat dissipation efficiency. At the same time, the use of friction stir welding ensures the connection strength between the water channel sealing plate 103 and the side edge of the bin body 102. In addition, friction stir welding does not require a shielding gas and a special environment, can be carried out in multiple directions and positions, increases the operation flexibility, and is not easy to generate common welding defects such as pores and cracks, ensuring the welding quality and efficiency. It should be noted that other welding methods such as brazing, resistance welding or manual arc welding can also be used between the water channel sealing plate 103 and the side of the bin body 102, which is not limited herein.
[0043] Furthermore, since the water channel sealing plate 103 and the bin body 102 adopt a split structure, it is convenient to add a heat dissipation structure in the cooling water channel 101 to improve the heat dissipation effect of the water channel potting bin 100. In a specific embodiment, a plurality of heat dissipation ribs 1031 are arranged on the inner wall of the cooling water channel 101 to increase the contact area between the cooling medium and the side wall of the cooling water channel 101, improve the heat exchange efficiency, and thus improve the heat dissipation effect of the water channel potting bin 100. Specifically, as Figure 2 shown, a plurality of strip-shaped distributed heat dissipation ribs 1031 can be evenly arranged on the contact side of the water channel sealing plate 103 with the cooling medium, or a plurality of annular distributed heat dissipation ribs 1031 can be arranged on the contact side of the water channel sealing plate 103 with the cooling medium, as Figure 3As shown, the contact area between the cooling medium and the water channel sealing plate 103 is increased, thereby improving the heat dissipation effect of the power device 202 fixed on the water channel sealing plate 103.
[0044] Furthermore, as Figure 1 and Figure 4 shown, in a specific embodiment, the bin body 102 includes a bottom plate 1021 and cooling water channels 101 arranged in a U-shaped distribution on the bottom plate 1021. At the same time, ears 1022 for fixing the water channel potting bin 100 are provided on the bottom plate 1021. Among them, there are four ears 1022, which are symmetrically distributed on both sides of the water channel potting bin 100. At least one positioning hole is provided on two ears 1022 on each side of the water channel potting bin 100, so as to cooperate with the positioning pins provided on the shell 201 of the vehicle-mounted power supply 200 through the positioning holes on both sides of the water channel potting bin 100 to realize the installation and positioning of the water channel potting bin 100. At the same time, a first mounting hole is provided on each ear 1022, and a second mounting hole matching the first mounting hole is provided at the corresponding position on the shell 201 of the vehicle-mounted power supply 200, so as to fix the ear 1022 of the water channel potting bin 100 on the shell 201 of the vehicle-mounted power supply 200 through bolts to realize the assembly of the water channel potting bin 100. By adopting the U-shaped distributed cooling water channels 101, while ensuring the heat dissipation efficiency of the power device 202, the occupied space of the cooling water channels 101 is reduced, and a partition 105 is provided in the enclosed space 1011 of the cooling water channels 101, so that the partition 105 and the cooling water channels 101 enclose a potting groove 106 for filling potting glue. Since the bin body 102 and the water channel sealing plate 103 adopt a split structure, the bin body 102 and the water channel sealing plate 103 can be processed and produced separately, improving the production efficiency of the water channel potting bin 100, and the bin body 102 can be heated separately to realize the heating and curing of the potting glue in the water channel potting bin 100, saving the space resources and power resources of the equipment and improving the transportation and turnover efficiency. By filling the potting groove 106 with thermally conductive potting glue, it can fill the tiny gaps between the electronic devices located in the potting groove 106 and the cooling water channels 101. Through the high thermal conductivity of the thermally conductive potting glue, the heat can be effectively conducted from the heating element to the cooling water channels 101, and then the heat is taken away by the cooling medium in the cooling water channels 101, so as to maintain the normal working temperature of the electronic devices. At the same time, the electronic devices are installed in the enclosed space 1011 of the U-shaped distributed cooling water channels 101, which can make the layout in the shell 201 of the vehicle-mounted power supply 200 more compact and improve the space utilization rate in the shell 201 of the vehicle-mounted power supply 200.
[0045] In addition, as Figure 4As shown in the figure, a step portion 1023 protruding into the cooling water channel 101 is provided on the bottom plate 1021 at the front end of the bin body 102, and the liquid inlet and outlet of the cooling water channel 101 are respectively located on the step portion 1023 at the corresponding positions at the ends of the bottom plate 1021, so as to leave a space for connecting the inlet and outlet pipes of the cooling device of the vehicle-mounted power supply 200 under the bottom plate 1021 at the front end of the bin body 102, facilitating the connection of the liquid inlet and outlet of the cooling water channel 101 with the inlet and outlet pipes of the cooling device of the vehicle-mounted power supply 200 respectively. At the same time, as Figure 4 shown, the front end of the bin body 102 is inclined towards the direction close to the bottom plate 1021 to form a diversion portion 104 at the positions of the liquid inlet and outlet of the cooling water channel 101, which can effectively reduce the flow resistance, avoid local dead water, and save external space.
[0046] As Figure 5 and Figure 6 shown, the embodiment of the present application also discloses a vehicle-mounted power supply, including a housing 201, a power device 202 arranged in the housing 201, and a water channel structure for dissipating heat from the power device 202. The water channel structure is the water channel structure disclosed in the above embodiment, so it has all the technical effects of the above water channel structure, which will not be elaborated herein.
[0047] Among them, as Figure 5 and Figure 6 shown, the power device 202 includes a power tube 2021, and the power tube 2021 is fixed to the side wall of the water channel encapsulation bin 100 by means of gluing. Specifically, a thermosetting adhesive film is used to directly bond the power tube 2021 to the water channel sealing plate 103 on the side of the water channel encapsulation bin 100, thereby increasing the contact area between the power tube 2021 and the cooling water channel 101 arranged along the side wall of the water channel encapsulation bin 100 and improving the heat dissipation effect of the power tube 2021.
[0048] The terms "first" and "second" etc. in the description, claims and above-mentioned drawings of the present application are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not limited to the listed steps or units, but may include unlisted steps or units.
[0049] The foregoing description of the disclosed embodiments enables those skilled in the art to practice or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A water channel structure, characterized in that, Comprising: A water channel potting bin (100) for detachably being arranged inside a housing (201) of a vehicle-mounted power supply (200). The water channel potting bin (100) includes a bin body (102) and water channel sealing plates (103) located on both sides of the bin body (102). The water channel sealing plates (103) and the bin body (102) are of a split structure, and the water channel sealing plates (103) and the bin body (102) enclose to form a cooling water channel (101).
2. The water channel structure according to claim 1, wherein, The water channel sealing plates (103) are fixedly welded to the side part of the bin body (102).
3. The water channel structure according to claim 2, characterized in that, The water channel sealing plates (103) are made of high thermal conductivity profiles.
4. The water channel structure according to claim 3, characterized in that, The water channel sealing plates (103) are made of aluminum profiles. The water channel sealing plates (103) and the bin body (102) are fixedly welded by friction stir welding.
5. The water channel structure according to claim 1, characterized in that The bin body (102) includes a bottom plate (1021) and the cooling water channel (101) arranged in a U-shaped distribution on the bottom plate (1021). An ear part (1022) for fixing the water channel potting bin (100) is arranged on the bottom plate (1021).
6. The water channel structure according to claim 5, characterized in that, A partition plate (105) is arranged inside an enclosing space (1011) of the cooling water channel (101). The partition plate (105) and the side wall of the cooling water channel (101) enclose to form a potting groove (106) for filling potting glue.
7. The water channel structure according to claim 5, wherein A step part (1023) is arranged at the end of the bottom plate (1021). An inlet and an outlet for communicating with the cooling water channel (101) are respectively arranged on the step part (1023).
8. The water channel structure according to claim 7, wherein Flow guiding parts (104) are respectively arranged at the positions of the inlet and the outlet of the cooling water channel (101).
9. The water channel structure according to any one of claims 1 to 8, characterized in that, A plurality of heat dissipation ribs (1031) are arranged on the inner wall of the cooling water channel (101), and the heat dissipation ribs (1031) are distributed in a strip shape or a ring shape.
10. A vehicle-mounted power supply, characterized in that, Comprising a housing (201), a power device (202) arranged inside the housing (201), and a water channel structure as described in any one of claims 1 to 9 for dissipating heat from the power device (202).
11. The vehicle-mounted power supply according to claim 10, wherein, The power device (202) includes a power tube (2021). The power tube (2021) is fixedly fixed to the side wall of the water channel potting bin (100) by gluing.