Power management circuit board
By introducing the main heat dissipation board, the secondary heat dissipation board and the insulation pipe design into the power management circuit board, combined with the impeller and check valve control of the heat dissipation fan, the problems of low heat dissipation efficiency and large space occupation are solved, and a thin, compact and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421543202.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-02
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-07-02
AI Technical Summary
The current power management circuit board has a backwind phenomenon in the heat dissipation method, which leads to low heat dissipation efficiency and takes up a large space, making it difficult to meet the needs of thin and compact electronic equipment.
The main heat dissipation plate and the secondary heat dissipation plate are connected through an insulating pipe, combined with the impeller design of the heat dissipation fan and the one-way valve to control the coolant flow, optimize the heat transfer path, avoid backwind, and optimize thermal management through multiple secondary heat dissipation plates.
It realizes a thin and compact power management circuit board, avoids wind back, improves heat dissipation efficiency, and optimizes the thermal management effect.
Smart Images
Figure CN223094067U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of power electronics, in particular to a power management circuit board. Background Art
[0002] As the core component of energy conversion of power electronic devices, heat generation is a common phenomenon during the operation of the power management circuit board. This is mainly because there will inevitably be some energy losses during the process of electric energy conversion, and these losses are mainly released in the form of heat energy.
[0003] Currently, the main heat dissipation method for the power management circuit board is generally to add a main heat dissipation plate and a heat dissipation fan on the power management circuit board. The main heat dissipation plate tries to gather the heat generated by the entire power management circuit board as much as possible, and uses the high-speed air flow generated by the heat dissipation fan to take away the heat gathered by the main heat dissipation plate.
[0004] Although the above technical means have the advantages of mature technology, simplicity and reliability, etc., they have technical defects. As shown in the attached drawing description Figure 1 When the heat dissipation fan is installed on the main heat dissipation plate and the fan blades rotate at high speed to generate a high-speed air flow A1, since the bottom of the heat dissipation fan is too close to the main heat dissipation plate, the air pressure on the upper surface of the main heat dissipation plate is relatively high, resulting in a sudden increase in pressure in the middle area, pushing the air A2 to escape to the inner and outer circles of the fan blades, thereby generating a reverse air flow A3 at the inner and outer circles of the fan blades; the reverse air flow A3 at the outer circle of the fan blades will escape along the outer circle of the heat dissipation fan and take away the heat of the main heat dissipation plate at the same time, but the reverse air flow A3 at the inner circle of the fan blades will collide with the air A2 area and the high-speed air flow A1, resulting in extremely low heat dissipation efficiency of the entire heat dissipation fan.
[0005] To solve the above technical defects, there are mainly two technical means. The first is to raise the heat dissipation fan and increase the distance between it and the main heat dissipation plate. The second is to change the blowing direction of the heat dissipation fan, leaving a gap between the heat dissipation fan and the main heat dissipation plate, and changing the heat dissipation fan from blowing air to the main heat dissipation plate to sucking the air on the main heat dissipation plate; both of these two technical means can solve the above technical defects, but they have additional technical defects, that is, the installation of the heat dissipation fan and the main heat dissipation plate requires a relatively large space. In other words, the heat dissipation fan and the main heat dissipation plate are relatively bulky and occupy a large space, which runs counter to the concept of today's electronic devices being more lightweight, thin and small. Content of the Utility Model
[0006] The utility model aims to solve at least one of the technical problems in the above technologies to a certain extent.
[0007] For this reason, an object of the utility model is to propose a power management circuit board, which has the advantages of being lightweight, thin and small, not prone to reverse air flow and having high heat dissipation effect.
[0008] To achieve the above object, an embodiment of the first aspect of the present utility model provides a power management circuit board, comprising: a main heat dissipation plate, a plurality of auxiliary heat dissipation plates, a heat dissipation fan, and a substrate. Among them,
[0009] The main heat dissipation plate and the auxiliary heat dissipation plates are respectively embedded in the substrate, and the main heat dissipation plate and the auxiliary heat dissipation plates are connected through an adiabatic tube;
[0010] The heat dissipation fan is arranged on one side of the main heat dissipation plate. The heat dissipation fan comprises: an impeller, an outer frame, and a motor. Among them,
[0011] The outer frame is connected to the main heat dissipation plate, the impeller is arranged inside the outer frame, the motor drives the impeller to rotate, and the wind direction of the impeller points to the main heat dissipation plate.
[0012] The power management circuit board according to the embodiment of the present utility model has the advantages of being thin, light, small, not prone to reverse wind, and having high heat dissipation effect.
[0013] In addition, the power management circuit board proposed according to the above embodiment of the present utility model may also have the following additional technical features:
[0014] In an embodiment of the present utility model, heat dissipation fins are arranged on the surface of the main heat dissipation plate close to the impeller.
[0015] In an embodiment of the present utility model, cavities are respectively arranged inside the main heat dissipation plate and inside the auxiliary heat dissipation plates, and the cavity of the main heat dissipation plate and the cavity of the auxiliary heat dissipation plates are connected through the adiabatic tube.
[0016] In an embodiment of the present utility model, the cavities of the main heat dissipation plate and the auxiliary heat dissipation plates are respectively filled with a coolant.
[0017] In an embodiment of the present utility model, a one-way valve is arranged inside the adiabatic tube, and the one-way valve restricts the coolant in the cavity of the main heat dissipation plate from flowing into the cavity of the auxiliary heat dissipation plate.
[0018] In an embodiment of the present utility model, a limiting ring is arranged inside the adiabatic tube, and the one-way valve is provided with a plug;
[0019] The head of the plug points to the main heat dissipation plate, the tail of the plug points to the auxiliary heat dissipation plate, a spring is arranged on the tail of the plug, and the spring drives the plug to be stuck on the limiting ring.
[0020] In an embodiment of the present utility model, when the spring is heated and elongated, the spring pushes the plug to separate from the limiting ring.
[0021] In an embodiment of the present utility model, a dust-proof net is provided on the impeller.
[0022] Additional aspects and advantages of the present utility model will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present utility model. Brief Description of the Drawings
[0023] The above-mentioned and / or additional aspects and advantages of the present utility model will become apparent and be readily understood from the following description of the embodiments in conjunction with the drawings, wherein:
[0024] Figure 1 is a working schematic diagram of a current heat dissipation fan;
[0025] Figure 2 is a structural schematic diagram of the power management circuit board of the present utility model Figure 1 ;
[0026] Figure 3 is a structural schematic diagram of the power management circuit board of the present utility model Figure 2 ;
[0027] Figure 4 is a structural schematic diagram of the power management circuit board of the present utility model Figure 3 ;
[0028] Figure 5 is a structural schematic diagram of the heat dissipation fan of the power management circuit board of the present utility model;
[0029] Figure 6 is a working schematic diagram of the heat dissipation fan of the power management circuit board of the present utility model;
[0030] Figure 7 is a structural schematic diagram of the heat insulation tube of the power management circuit board of the present utility model;
[0031] As shown in the figure:
[0032] 1 - Main heat dissipation plate;
[0033] 2 - Sub - heat dissipation plate;
[0034] 3 - Heat dissipation fan, 31 - Impeller, 32 - Outer frame, 33 - Motor, 34 - Dust - proof net;
[0035] 4 - Substrate;
[0036] 5 - Heat insulation tube;
[0037] 6 - Check valve, 61 - Limit ring, 62 - Plug, 63 - Spring. Detailed Embodiments
[0038] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present utility model, and should not be construed as a limitation to the present utility model.
[0039] The power management circuit board according to an embodiment of the present utility model will be described below with reference to the accompanying drawings.
[0040] As Figure 2 、 Figure 3 and Figure 4 shown, a power management circuit board includes: a main heat dissipation plate 1, a plurality of secondary heat dissipation plates 2, a heat dissipation fan 3, and a substrate 4. Among them,
[0041] The main heat dissipation plate 1 and the secondary heat dissipation plates 2 are respectively embedded on the substrate 4, and the main heat dissipation plate 1 and the secondary heat dissipation plates 2 are connected through an adiabatic tube 5;
[0042] As Figure 5 shown, the heat dissipation fan 3 is arranged on one surface of the main heat dissipation plate 1. The heat dissipation fan 3 includes: an impeller 31, an outer frame 32, and a motor 33. Among them,
[0043] The outer frame 32 is connected to the main heat dissipation plate 1, the impeller 31 is arranged inside the outer frame 32, the motor 33 drives the impeller 31 to rotate, and the wind direction of the impeller 31 points to the main heat dissipation plate 1.
[0044] Specifically, as Figure 6 shown, when the heat dissipation fan 3 is installed on the main heat dissipation plate 1 and the impeller 31 rotates at a high speed to generate a high-speed air flow B1, since the bottom of the heat dissipation fan 3 is too close to the main heat dissipation plate, the wind pressure on the upper surface of the main heat dissipation plate 1 is relatively high, resulting in a sudden increase in pressure in the middle area, pushing the air B2 to escape towards the inner and outer circles of the impeller 31, thereby generating a reverse wind B3 in the inner and outer circles of the heat dissipation fan;
[0045] The reverse wind B3 on the outer circle of the impeller 31 will escape along the outer circle of the outer frame 32 while taking away the heat of the main heat dissipation plate 1, and the reverse wind B3 on the inner circle of the impeller 31 will escape along the inner circle of the outer frame 32 while taking away the heat of the main heat dissipation plate 1;
[0046] Compared with the heat dissipation fan 3 using fan blades, the distance between the heat dissipation fan 3 using the impeller 31 and the main heat dissipation plate 1 in the embodiment of the present utility model is much smaller than the distance between the heat dissipation fan 3 using fan blades and the main heat dissipation plate 1.
[0047] The power management circuit board according to an embodiment of the present utility model has the advantages of being thin, light, small, not prone to reverse wind, and having a high heat dissipation effect.
[0048] In order to better explain the present utility model, in an embodiment of the present utility model, heat dissipation fins are provided on one side of the main heat dissipation plate 1 close to the impeller 31.
[0049] Cavities are respectively provided inside the main heat dissipation plate 1 and the auxiliary heat dissipation plate 2, and the cavity of the main heat dissipation plate 1 and the cavity of the auxiliary heat dissipation plate 2 are communicated through an adiabatic tube 5.
[0050] The cavities of the main heat dissipation plate 1 and the auxiliary heat dissipation plate 2 are respectively filled with a coolant.
[0051] As Figure 7 shown, a one-way valve 6 is provided inside the adiabatic tube 5, and the one-way valve 6 restricts the coolant in the cavity of the main heat dissipation plate 1 from flowing into the cavity of the auxiliary heat dissipation plate 2.
[0052] A limiting ring 61 is provided inside the adiabatic tube 5, and the one-way valve 6 is provided with a plug 62;
[0053] The head of the plug 62 points to the main heat dissipation plate 1, the tail of the plug 62 points to the auxiliary heat dissipation plate 2, and a spring 63 is provided on the tail of the plug 62, and the spring 63 drives the plug 62 to be stuck on the limiting ring 61.
[0054] When the spring 63 is heated and elongated, the spring 63 pushes the plug 62 and the limiting ring 61 apart.
[0055] A dust-proof net 34 is provided on the impeller 31.
[0056] A plurality of auxiliary heat dissipation plates 2 are respectively used for dissipating heat of each power electronic component in the circuit board. During the actual working process of the power management circuit board, the heat generation situations of the power electronic components provided thereon are different, that is, the temperatures of each power electronic component are different. If these power electronic components are simultaneously connected to the main heat dissipation plate 1 through the auxiliary heat dissipation plate 2 and the adiabatic tube 5, it is very likely that the heat of the power electronic component with a higher temperature is introduced into the main heat dissipation plate 1 along the adiabatic tube 5 and then along the adiabatic tube 5 into the auxiliary heat dissipation plate 2 of the power electronic component with a higher temperature;
[0057] In the embodiment of the present utility model, providing an additional auxiliary heat dissipation plate 2 on the substrate 4 can further optimize the thermal management effect of the entire circuit board;
[0058] The heat of the secondary heat dissipation plate 2 can be unidirectionally introduced into the main heat dissipation plate 1 along the coolant in the heat insulation tube 5 by using the plug 62 in the one-way valve 6. Specifically, when the temperature of the secondary heat dissipation plate 2 is lower than that of the main heat dissipation plate 1, the spring 63 drives the plug 62 to be stuck on the limit ring 61. At this time, the coolant in the heat insulation tube 5 between the secondary heat dissipation plate 2 and the main heat dissipation plate 1 cannot communicate, making it difficult for heat to be transferred. When the temperature of the secondary heat dissipation plate 2 is higher than that of the main heat dissipation plate 1, the spring 63 drives the plug 62 to disengage from the limit ring 61. At this time, the coolant in the heat insulation tube 5 between the secondary heat dissipation plate 2 and the main heat dissipation plate 1 communicates, and the heat of the secondary heat dissipation plate 2 is transferred to the main heat dissipation plate 1.
[0059] In summary, the power management circuit board according to the embodiment of the present invention has the advantages of being thin, light, small, not prone to reverse air flow, and having a high heat dissipation effect.
[0060] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.
[0061] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more unless otherwise specifically defined.
[0062] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0063] In the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.
[0064] In the description of this specification, the description with reference to terms such as "an embodiment", "some embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.
[0065] Although the embodiments of the present utility model have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present utility model. Those of ordinary skill in the art can make changes, modifications, substitutions, and variations to the above embodiments within the scope of the present utility model.
Claims
1. A power management circuit board, characterized in that, Comprising: A main heat dissipation plate (1), a plurality of auxiliary heat dissipation plates (2), a heat dissipation fan (3) and a substrate (4), wherein, The main heat dissipation plate (1) and the auxiliary heat dissipation plates (2) are respectively embedded in the substrate (4), and the main heat dissipation plate (1) and the auxiliary heat dissipation plates (2) are communicated through an adiabatic pipe (5); The heat dissipation fan (3) is arranged on one side of the main heat dissipation plate (1), and the heat dissipation fan (3) includes: an impeller (31), an outer frame (32) and a motor (33), wherein, The outer frame (32) is connected to the main heat dissipation plate (1), the impeller (31) is arranged inside the outer frame (32), the motor (33) drives the impeller (31) to rotate, and the wind direction of the impeller (31) points to the main heat dissipation plate (1).
2. The power management circuit board according to claim 1, wherein The side of the main heat dissipation plate (1) close to the impeller (31) is provided with heat dissipation fins.
3. The power management circuit board according to claim 1, wherein, Cavities are respectively arranged inside the main heat dissipation plate (1) and inside the auxiliary heat dissipation plates (2), and the cavity of the main heat dissipation plate (1) and the cavities of the auxiliary heat dissipation plates (2) are communicated through the adiabatic pipe (5).
4. The power management circuit board according to claim 3, wherein The cavities of the main heat dissipation plate (1) and the auxiliary heat dissipation plates (2) are respectively filled with a coolant.
5. The power management circuit board according to claim 4, wherein A one-way valve (6) is arranged inside the adiabatic pipe (5), and the one-way valve (6) restricts the coolant in the cavity of the main heat dissipation plate (1) from flowing into the cavity of the auxiliary heat dissipation plate (2).
6. The power management circuit board according to claim 5, wherein A limiting ring (61) is arranged inside the adiabatic pipe (5), and the one-way valve (6) is provided with a plug (62); The head of the plug (62) points to the main heat dissipation plate (1), the tail of the plug (62) points to the auxiliary heat dissipation plate (2), and a spring (63) is arranged on the tail of the plug (62), and the spring (63) drives the plug (62) to be stuck on the limiting ring (61).
7. The power management circuit board according to claim 6, wherein When the spring (63) expands due to heat, the spring (63) pushes the plug (62) to separate from the limiting ring (61).
8. The power management circuit board according to claim 1, wherein A dust-proof net (34) is arranged on the impeller (31).