Semiconductor three-axis automatic glue sprayer

Abstract

The utility model relates to the technical field of semiconductor processing, in particular to a three-axis automatic glue sprayer for a semiconductor, which comprises an operating table, a platform is rotatably connected to the middle of the upper surface of the operating table, a mounting rack is welded on the upper surface of the operating table, and a first motor is fixedly mounted on the inner side wall of the mounting rack. A semiconductor component is placed on the upper surface of a platform, a first motor is started to drive a screw rod to rotate back and forth, a moving frame and a moving seat are driven to move left and right, so that an atomizing nozzle is driven to move left and right, a second motor is started to drive a screw rod to rotate back and forth, the moving seat and an electric cylinder move back and forth, and a lifting seat and the atomizing nozzle are driven to move back and forth. And the height of the atomizing nozzle is adjusted through the electric cylinder, so that the atomizing nozzle can be accurately controlled to move in X, Y and Z coordinate dimensions, the high-precision glue spraying requirement can be met, glue spraying work with a complex path can be carried out, the quality of a glue layer can be ensured, the performance of a semiconductor device is not influenced, and the practicability is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, and particularly relates to a semiconductor three-axis automatic glue spraying machine. Background Technique

[0002] A semiconductor is a material with electrical conductivity between that of a conductor and an insulator. Its conductivity can be controlled by doping and other means. Semiconductor materials play a fundamental role in modern electronic technology and are widely used in fields such as integrated circuits, consumer electronics, communication systems, and photovoltaic power generation. In the process of semiconductor manufacturing, glue spraying is a key process step. Glue spraying is to precisely coat a layer of photoresist on a wafer or chip. Photoresist is a photosensitive material. Through photolithography technology, circuit patterns are transferred onto the silicon wafer, which is the basis for forming microelectronic structures. Glue spraying can achieve high-precision and uniform coatings, which is crucial for subsequent development, etching and other steps and directly affects the performance of semiconductor devices.

[0003] In the process of semiconductor manufacturing, when coating glue on a wafer, the accuracy requirements for glue coating are relatively high, and the glue coating path is relatively complex. A slight mistake will affect the quality of the coating and thus the performance of semiconductor devices. For this reason, a semiconductor three-axis automatic glue spraying machine is proposed. Content of the Utility Model

[0004] The purpose of the utility model is to provide a semiconductor three-axis automatic glue spraying machine to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A semiconductor three-axis automatic glue spraying machine, including an operation table, a platform is rotatably connected to the middle of the upper surface of the operation table, a mounting frame is welded to the upper surface of the operation table, a first motor is fixedly installed on the inner side wall of the mounting frame, a screw rod is fixedly connected to the output shaft end of the first motor, the screw rod is rotatably connected to the inner side wall of the mounting frame through a bearing, a moving frame is threadedly connected to the outer side wall of the screw rod, a second motor is fixedly installed on the front surface of the moving frame, a lead screw is fixedly connected to the output shaft end of the second motor, the lead screw penetrates through the front surface of the moving frame, the lead screw is rotatably connected to the inner side wall of the moving frame through a bearing, a moving seat is threadedly connected to the outer side wall of the lead screw, an electric cylinder is fixedly installed on the lower surface of the moving seat, a lifting seat is fixedly connected to one end of the piston rod of the electric cylinder, and an atomizing nozzle is fixedly installed on the lower surface of the lifting seat.

[0006] As a further preference of this technical solution: A third motor is fixedly installed on the right side of the upper surface of the operation table, a main gear is fixedly connected to the output shaft end of the third motor, a driven gear is fixedly connected to the outer side wall of the platform, and the main gear and the driven gear are meshed and connected.

[0007] As a further preference of this technical solution: Two guide rods are fixedly connected to the inner side wall of the mounting frame, and the outer side wall of the guide rod is slidably connected to the moving frame.

[0008] As a further preference of this technical solution: A limiting block is fixedly connected to the upper surface of the moving seat, a limiting groove is fixedly connected to the upper surface of the inner side wall of the moving frame, and the outer side wall of the limiting block is slidably connected to the inner side wall of the limiting groove.

[0009] As a further preference of this technical solution: A glue guide tube is fixedly connected to the upper surface of the lifting seat, the glue guide tube penetrates through the lifting seat, and the lower surface of the glue guide tube is communicated with the upper surface of the atomizing nozzle.

[0010] As a further preference of this technical solution: Lighting lamps are provided on both sides of the inner side wall of the mounting frame.

[0011] As a further preference of this technical solution: A maintenance door is provided on the front surface of the operating table, and a handle is welded to the front surface of the maintenance door.

[0012] As a further preference of this technical solution: Support legs are welded to the lower surface of the operating table.

[0013] Compared with the prior art, the beneficial effects of the present utility model are:

[0014] In the present utility model, by placing the semiconductor component on the upper surface of the platform, starting the first motor to drive the screw rod to rotate back and forth, driving the moving frame and the moving seat to move left and right, thereby driving the electric cylinder and the lifting seat to move left and right, thereby driving the atomizing nozzle to move left and right, starting the second motor to drive the lead screw to rotate back and forth, making the moving seat and the electric cylinder move back and forth, thereby driving the lifting seat and the atomizing nozzle to move back and forth, and then adjusting the height of the atomizing nozzle through the electric cylinder, the movement of the atomizing nozzle in the three coordinate dimensions of X, Y, and Z can be precisely controlled, which can meet the high-precision glue spraying requirements, can perform glue spraying work with complex paths, can ensure the quality of the glue layer, does not affect the performance of the semiconductor device, and has stronger practicability. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is the front view structural schematic diagram of the present utility model;

[0016] Figure 2 is the internal structural schematic diagram of the mounting frame in the present utility model;

[0017] Figure 3 is the structural schematic diagram of the moving frame and the moving seat in the present utility model;

[0018] Figure 4 is the structural schematic diagram of the operating table in the present utility model.

[0019] In the figure: 1. Operating table; 2. Platform; 3. Mounting frame; 4. First motor; 5. Screw rod; 6. Moving frame; 7. Second motor; 8. Lead screw; 9. Moving seat; 10. Electric cylinder; 11. Lifting seat; 12. Atomizing nozzle; 13. Third motor; 14. Main gear; 15. Driven gear; 16. Guide rod; 17. Limit block; 18. Limit groove; 19. Glue guiding tube; 20. Lighting lamp; 21. Maintenance door; 22. Handle; 23. Leg. Detailed implementation manner

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as a limitation to the present application. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0021] In the description of the present application, it should be noted that unless otherwise clearly defined and limited, the terms "installation", "connection", "connection", and "setting" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0022] Please refer to all the specification drawings. The present utility model provides a technical solution: a semiconductor three-axis automatic glue spraying machine, which includes an operating table 1. In the middle of the upper surface of the operating table 1, there is a rotatably connected platform 2. On the upper surface of the operating table 1, there is a welded mounting frame 3. Inside the inner side wall of the mounting frame 3, there is a fixedly installed first motor 4. The output shaft end of the first motor 4 is fixedly connected to a screw rod 5. The screw rod 5 is rotatably connected to the inner side wall of the mounting frame 3 through a bearing. Threaded on the outer side wall of the screw rod 5 is a moving frame 6. On the front surface of the moving frame 6, there is a fixedly installed second motor 7. The output shaft end of the second motor 7 is fixedly connected to a lead screw 8. The lead screw 8 passes through the front surface of the moving frame 6. The lead screw 8 is rotatably connected to the inner side wall of the moving frame 6 through a bearing. Threaded on the outer side wall of the lead screw 8 is a moving seat 9. On the lower surface of the moving seat 9, there is a fixedly installed electric cylinder 10. One end of the piston rod of the electric cylinder 10 is fixedly connected to a lifting seat 11. On the lower surface of the lifting seat 11, there is a fixedly installed atomizing nozzle 12; Place the semiconductor component on the upper surface of the platform 2. Start the first motor 4 to drive the screw rod 5 to rotate back and forth, drive the moving frame 6 and the moving seat 9 to move left and right, thereby driving the electric cylinder 10 and the lifting seat 11 to move left and right, and thus driving the atomizing nozzle 12 to move left and right. Start the second motor 7 to drive the lead screw 8 to rotate back and forth, so that the moving seat 9 and the electric cylinder 10 move back and forth, thereby driving the lifting seat 11 and the atomizing nozzle 12 to move back and forth. Then, adjust the height of the atomizing nozzle 12 through the electric cylinder 10, and the movement of the atomizing nozzle 12 in the three coordinate dimensions of X, Y, and Z can be accurately controlled.

[0023] In this embodiment, specifically: on the right side of the upper surface of the operating table 1, there is a fixedly installed third motor 13. The output shaft end of the third motor 13 is fixedly connected to a main gear 14. On the outer side wall of the platform 2, there is a fixedly connected driven gear 15. The main gear 14 and the driven gear 15 are meshed; Drive the main gear 14 to rotate through the third motor 13, and the driven gear 15 meshed with the main gear 14 drives the platform 2 to rotate, so that the direction of the semiconductor component can be controlled, and the glue spraying work can be carried out in multiple directions.

[0024] In this embodiment, specifically: two guide rods 16 are fixedly connected to the inner side wall of the mounting frame 3. The outer side wall of the guide rod 16 is slidably connected to the moving frame 6; The moving frame 6 does not rotate with the rotation of the screw rod 5, but moves left and right in the direction of the moving frame 6.

[0025] In this embodiment, specifically: a limit block 17 is fixedly connected to the upper surface of the moving seat 9. On the upper surface of the inner side wall of the moving frame 6, there is a fixedly connected limit groove 18. The outer side wall of the limit block 17 is slidably connected to the inner side wall of the limit groove 18; The moving seat 9 does not rotate with the rotation of the lead screw 8, but moves back and forth in the direction of the limit groove 18.

[0026] In this embodiment, specifically: a glue guiding tube 19 is fixedly connected to the upper surface of the lifting seat 11. The glue guiding tube 19 penetrates through the lifting seat 11, and is communicated between the lower surface of the glue guiding tube 19 and the upper surface of the atomizing nozzle 12; it is used to introduce glue.

[0027] In this embodiment, specifically: lighting lamps 20 are provided on both sides of the inner side wall of the mounting frame 3.

[0028] In this embodiment, specifically: a maintenance door 21 is provided on the front surface of the operating table 1, and a handle 22 is welded on the front surface of the maintenance door 21.

[0029] In this embodiment, specifically: legs 23 are welded to the lower surface of the operating table 1.

[0030] The working principle of the present utility model is: Place the semiconductor component on the upper surface of the platform 2, start the first motor 4 to drive the screw rod 5 to rotate back and forth, drive the moving frame 6 and the moving seat 9 to move left and right, thereby driving the electric cylinder 10 and the lifting seat 11 to move left and right, thereby driving the atomizing nozzle 12 to move left and right. Start the second motor 7 to drive the lead screw 8 to rotate back and forth, so that the moving seat 9 and the electric cylinder 10 move back and forth, thereby driving the lifting seat 11 and the atomizing nozzle 12 to move back and forth. Then, adjust the height of the atomizing nozzle 12 through the electric cylinder 10, which can accurately control the movement of the atomizing nozzle 12 in the three coordinate dimensions of X, Y, and Z. Thus, a semiconductor three-axis automatic glue spraying machine is formed, which can meet the high-precision glue spraying requirements, can perform glue spraying work with complex paths, can ensure the quality of the glue layer, does not affect the performance of semiconductor devices, and has stronger practicability.

[0031] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor three-axis automatic glue spraying machine, comprising an operating table (1), characterized in that: In the middle of the upper surface of the operation table (1), a platform (2) is rotatably connected. On the upper surface of the operation table (1), a mounting frame (3) is welded. On the inner side wall of the mounting frame (3), a first motor (4) is fixedly installed. At the output shaft end of the first motor (4), a screw rod (5) is fixedly connected. The screw rod (5) is rotatably connected to the inner side wall of the mounting frame (3) through a bearing. On the outer side wall of the screw rod (5), a moving frame (6) is threadedly connected. On the front surface of the moving frame (6), a second motor (7) is fixedly installed. At the output shaft end of the second motor (7), a lead screw (8) is fixedly connected. The lead screw (8) penetrates through the front surface of the moving frame (6). The lead screw (8) is rotatably connected to the inner side wall of the moving frame (6) through a bearing. On the outer side wall of the lead screw (8), a moving seat (9) is threadedly connected. On the lower surface of the moving seat (9), an electric cylinder (10) is fixedly installed. At one end of the piston rod of the electric cylinder (10), a lifting seat (11) is fixedly connected. On the lower surface of the lifting seat (11), an atomizing nozzle (12) is fixedly installed.

2. The semiconductor three-axis automatic glue spraying machine according to claim 1, characterized in that: On the right side of the upper surface of the operation table (1), a third motor (13) is fixedly installed. At the output shaft end of the third motor (13), a main gear (14) is fixedly connected. On the outer side wall of the platform (2), a driven gear (15) is fixedly connected. The main gear (14) and the driven gear (15) are meshed and connected.

3. The semiconductor three-axis automatic glue spraying machine according to claim 2, wherein: On both sides of the inner side wall of the mounting frame (3), two guide rods (16) are fixedly connected. The outer side wall of the guide rod (16) is slidably connected to the moving frame (6).

4. The semiconductor three-axis automatic glue spraying machine according to claim 2, wherein: On the upper surface of the moving seat (9), a limiting block (17) is fixedly connected. On the upper surface of the inner side wall of the moving frame (6), a limiting groove (18) is fixedly connected. The outer side wall of the limiting block (17) is slidably connected to the inner side wall of the limiting groove (18).

5. The semiconductor three-axis automatic glue spraying machine according to claim 2, wherein: On the upper surface of the lifting seat (11), a glue guiding tube (19) is fixedly connected. The glue guiding tube (19) penetrates through the lifting seat (11). The lower surface of the glue guiding tube (19) is communicated with the upper surface of the atomizing nozzle (12).

6. The semiconductor three-axis automatic glue spraying machine according to claim 2, wherein: On both sides of the inner side wall of the mounting frame (3), lighting lamps (20) are provided.

7. The semiconductor three-axis automatic glue spraying machine according to claim 6, characterized in that: On the front surface of the operation table (1), a maintenance door (21) is provided. On the front surface of the maintenance door (21), a handle (22) is welded.

8. The semiconductor three-axis automatic glue spraying machine according to claim 6, wherein: On the lower surface of the operation table (1), legs (23) are welded.

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