Probe cleaning piece with elastic buffering function

Abstract

The utility model relates to a probe cleaning piece with an elastic buffer, which is mainly used for cleaning foreign matters on the surface of a probe and comprises a subbase layer, the middle layer is stacked on the top surface of the subbase layer, and the outer surface of the middle layer is subjected to surface processing treatment; the grinding layer is stacked on the top face of the middle layer, the grinding layer is formed by mixing a second material piece and a plurality of first grinding particles, the surface of the middle layer is tightly connected with the grinding layer after surface machining treatment, and the ductility of the second material piece in the grinding layer is larger than that of the first material piece in the middle layer; the release layer is movably attached to and torn from the top surface of the grinding layer; under the condition that the grinding layer has high elastic deformation and the middle layer has the compression characteristic, when the probe is inserted to apply force, the grinding layer can be elastically stretched downwards according to the characteristic of the second material piece, and a plurality of first grinding particles are in contact with foreign matters on the surface of the probe, so that the foreign matters can be separated from the surface of the probe; therefore, the grinding layer is driven to really coat the probe, so that the foreign matters on the probe can be completely removed.

Description

Technical Field

[0001] The utility model relates to a probe cleaning sheet with elastic buffering, specifically a technology applied to the field of electronic machinery, mainly for cleaning probes. Background Technique

[0002] Probes are mainly used in the field of precision high-tech technologies. Their function is to contact the electrodes of various electronic components for conduction inspection. Probes are widely used in the inspection of various electronic components. The electronic component objects that probes can inspect are numerous, including semiconductors, liquid crystal panels, bare boards, packaged printed circuit boards, connectors, capacitors, sensors, batteries, etc. In addition to conduction confirmation, it is also used to collect data for the inspection of the operation of components in the circuit (circuit testing), and to confirm the operation during functional inspection (functional testing). Specific examples include functions such as open circuit (broken wire) and short circuit, high-frequency measurement and impedance (resistance value) inspection, and parameter inspection of components in the circuit. Therefore, probes are indispensable precision tools in the high-tech field.

[0003] However, the most common problem in the use of probes is that foreign matters (such as dust, dust, pollutants, etc.) often adhere and accumulate on the surface. Therefore, the common practice is to use a natural fiber brush (TBR-1) of QA to gently brush the tip of the probe and use a vacuum cleaner to remove the fallen dust particles. However, this method is too time-consuming and easily causes wear on the appearance of the probe. Therefore, some manufacturers have introduced cleaning sheets dedicated to cleaning probes. Only need to insert the detecting end of the probe into the cleaning sheet, and use the special structure of the cleaning sheet to adsorb the foreign matters on the surface of the probe, so that they no longer adhere to the surface of the probe, enabling the probe to maintain the best measurement use.

[0004] However, most of the commercially available cleaning sheets dedicated to probes on the market are made of homogeneous materials to provide a multi-layer structure for cleaning probes. However, due to the same physical properties of the same materials such as puncture, compression, and recovery, the wrapping and grinding effects on the probes are also the same. Therefore, the cleaning efficiency for the simultaneous adhesion of different foreign matters is limited. Therefore, relevant manufacturers must further consider how to make progress to solve the above problems in this era of rapid technological development. Content of the Utility Model

[0005] To address the issue that when using existing probe cleaning sheets to clean different foreign substances attached to probes, due to the relatively single physical characteristics of the cleaning areas on the cleaning sheets, the cleaning effect can only target a single type of foreign substance. When cleaning other foreign substances, it is necessary to use cleaning sheets with different physical characteristics for secondary cleaning. This method is time-consuming and may cause wear on the probe surface if not careful, thereby affecting the conduction and contact between the probe and various electronic components. The present utility model provides a probe cleaning sheet with elastic buffering. When different foreign substances are attached to the probe, the cleaning sheet can effectively remove them, thereby maintaining the cleanliness of the probe surface and ensuring the contact and conduction between various electronic components.

[0006] The technical solution adopted by the present utility model to solve its technical problems is as follows:

[0007] A probe cleaning sheet with elastic buffering, mainly used to clean foreign substances on the probe surface, comprising: a base layer; an intermediate layer stacked on the top surface of the base layer, and the intermediate layer is a sheet formed by processing a first material. In addition, the outer surface of the intermediate layer is subjected to surface processing; a grinding layer stacked on the top surface of the intermediate layer, and the grinding layer is a sheet formed by mixing a second material and several first grinding particles and then processing. After the surface of the intermediate layer is subjected to surface processing, it is tightly joined to the grinding layer. The elongation rate of the second material in the grinding layer is greater than that of the first material in the intermediate layer; and a release layer that is movably attached to and peeled off from the top surface of the grinding layer; wherein, through the high elastic deformation of the second material in the grinding layer and the compression characteristics of the first material in the intermediate layer, when the probe is inserted into the grinding layer and a force is applied towards the base layer direction, the grinding layer will elastically stretch downward with the characteristics of the second material, and the several first grinding particles will contact the foreign substances on the probe surface, enabling the foreign substances to detach from the probe surface. When the probe is inserted with force, the intermediate layer utilizes the compression deformation characteristics of the first material to drive the grinding layer to effectively wrap the probe, and the several first grinding particles can indeed contact the foreign substances, thereby completely removing the foreign substances on the probe.

[0008] The beneficial effect of the present utility model is that when different foreign substances are attached to the probe, the cleaning sheet can effectively remove them, thereby maintaining the cleanliness of the probe surface and ensuring the contact and conduction between various electronic components. Description of the Drawings

[0009] The following further illustrates the present utility model in conjunction with the drawings and embodiments.

[0010] Figure 1 It is a three-dimensional schematic diagram of the present utility model.

[0011] Figure 2 for Figure 1 Schematic diagram of section II-II.

[0012] Figure 3 for Figure 2 Schematic diagram of actively tearing off the release layer.

[0013] Figure 4 for Figure 3 Schematic diagram of the probe tip contacting the polishing layer after the release layer.

[0014] Figure 5 for Figure 4 The probe at position A is inserted with force toward the base layer, which is a locally enlarged schematic diagram of the sinking change of the grinding layer.

[0015] Figure 6 for Figure 5 A schematic diagram of a partial enlarged action of the middle layer compressing and deforming under the continuous force applied by the probe, and driving the grinding layer to shrink and cover the outer surface of the probe.

[0016] Figure 7 This is a schematic diagram of an experiment after the grinding layer of the utility model is inserted with a probe.

[0017] Description of the numbers in the figure:

[0018] Probe 100

[0019] Base layer 10

[0020] Middle layer 20

[0021] First material 201

[0022] Second abrasive particles 202

[0023] Grinding layer 30

[0024] Second material 301

[0025] First abrasive particles 302

[0026] Release layer 40 DETAILED DESCRIPTION

[0027] Please see Figures 1 to 7As shown in the figure, a probe cleaning sheet with elastic buffering of the present utility model is mainly used to clean foreign matters (such as dust, powder, pollutants, etc.) on the surface of the probe 100, and it includes: a base layer 10; an intermediate layer 20, which is stacked on the top surface of the base layer 10, and the intermediate layer 20 is a sheet formed by processing a first material 201 (the first material 201 can be silica gel), and its processing method can be hot pressing (the above processing method is not limited). In addition, the outer surface of the intermediate layer 20 is subjected to surface processing, and its processing method can be heating to form a rough surface, a serrated surface with patterns, etc. (the above surface processing methods are not limited to the listed methods and can also include other feasible methods); a grinding layer 30, which is stacked on the top surface of the intermediate layer 20 and is firmly combined with the outer surface of the intermediate layer 20 after surface processing. The grinding layer 30 is a sheet formed by kneading a second material 301 and several first grinding particles 302 and then processing (the second material 301 can be an elastic resin). Moreover, after the surface of the intermediate layer 20 is subjected to surface processing, it is closely joined with the grinding layer 30. Also, the elongation rate of the second material 301 in the grinding layer 30 is greater than the elongation rate of the first material 201 of the intermediate layer 20; and a release layer 40, which is movably attached to and peeled off from the top surface of the grinding layer 30, and is mainly used to protect the grinding layer 30 and temporarily isolate the contact with air. Among them, through the high elastic deformation of the second material 301 in the grinding layer 30 and the compression characteristics of the first material 201 in the intermediate layer 20, when the probe 100 is inserted into the grinding layer 30 and a force is applied in the direction of the base layer 10, the grinding layer 30 will elastically stretch downward with the characteristics of the second material 301, and the several first grinding particles 302 will contact the foreign matters on the surface of the probe 100, so that the foreign matters can be separated from the surface of the probe 100. When the probe 100 is inserted with force, the intermediate layer 20 uses the compression deformation characteristics of the first material 201 to drive the grinding layer 30 to firmly wrap the probe 100, and the several first grinding particles 302 can indeed contact the foreign matters, thereby completely removing the foreign matters on the probe 100.

[0028] According to the above main technical description of the present utility model, when the probe 100 needs to be cleaned with the present utility model, the release layer 40 needs to be peeled off first, and then the present utility model is placed on the working machine table or area. Then, move the probe 100 and face the tip (the end in contact with the electronic circuit) towards the grinding layer 30, and then apply a downward force to insert the probe 100 into the present utility model (as Figure 4As shown in part A), at this time, the tip of the probe 100 will first contact the polishing layer 30. Continuing to apply force will press the polishing layer 30 with the probe 100, and it will gradually deform due to the characteristics of the second component 301 in the polishing layer 30. Also, when the polishing layer 30 is pressed by the probe 100, it will deform towards the intermediate layer 20. At this time, if there is no intermediate layer 20, the position where the polishing layer 30 sinks will not completely approach the outer surface of the probe 100. Therefore, the function of the intermediate layer 20 is to assist the polishing layer 30 to indeed cover the outer surface of the probe 100 for cleaning. Therefore, by using the characteristics of the first component 201 in the intermediate layer 20, it can assist the polishing layer 30 to gradually approach and cover the outer surface of the probe 100. In this way, when the probe 100 punctures through the polishing layer 30 under force, in addition to the intermediate layer 20 driving the polishing layer 30 to adhere to the surface of the probe 100, the intermediate layer 20 will also indeed cover the outer surface of the probe 100. From Figure 7 it can be seen that the holes formed after the probe 100 punctures through the polishing layer 30 are relatively convergent. Each first abrasive particle 302 in the polishing layer 30 can remove foreign matter on the surface of the probe 100 (the so-called removal is just to let the foreign matter break away from the attachment on the probe 100). Also, after the foreign matter breaks away, the outer surface of the probe 100 no longer has foreign matter blocking, thereby making the contact between the probe 100 and the electronic circuit more complete and reliable.

[0029] Based on the main technical features described above for the present utility model, other technical features and detailed structures will be further described below. First, please see Figure 3 As shown, in addition to cleaning the surface of the probe 100 with several first abrasive particles 302 in the polishing layer 30, several second abrasive particles 202 can be further added to the intermediate layer 20. The setting of the several second abrasive particles 202 is mainly to further clean the foreign matter that has not been removed on the probe 100. Therefore, the particle material, particle size, etc. of the several second abrasive particles 202 can be the same as or different from those of the several first abrasive particles 302. When each first abrasive particle 302 and each second abrasive particle 202 are different, they can handle different foreign matters on the probe 100. When each first abrasive particle 302 and each second abrasive particle 202 are the same, it can further distinguish between basic cleaning and deep cleaning. The so-called basic cleaning can be used for the probe 100 with slightly attached foreign matter on the surface, while deep cleaning can be used for the probe 100 with more attached foreign matter on the surface.

[0030] Continuing from the above, the several first abrasive particles 302 and the several second abrasive particles 202 can mainly be any one of alumina particles, silicon nitride particles, boron nitride particles, silicon carbide particles, boron carbide particles or diamond particles. The particles of various materials can clean foreign matters on the probe 100 without damaging the outer surface of the probe 100. The above-mentioned particles can select different cleaning sheets according to different foreign matters. In addition, for the part of the grinding layer 30, the second component 301 used inside is mainly a polymer, and the polymer can be any one of epoxy resin, polyurethane resin, acrylic resin or alkyd resin.

[0031] Furthermore, for the part of the base layer 10, the present invention is designed with two embodiments, mainly distinguished by the temperature of the construction environment. First, the first one is that the base layer 10 is in the form of a plate, and the material of the plate can be any one of glass fiber, plastic, stone-free lead, metal, etc. And when the base layer 10 is a plate, it can be integrally formed with the intermediate layer 20. This embodiment is mainly used in high-temperature environments. The second one is that the base layer 10 is in the form of a glue material. Compared with the first form, because the environmental temperature that the glue material can withstand cannot be too high, mainly to avoid softening due to heat and causing glue overflow, so the first form of the plate can avoid the problem of softening of the second glue material form, and can prevent the probe 100 from sticking to the glue material. Also, the second glue material form is only applicable to the working environment temperature below 110°C, and will not be affected by high temperature to avoid the probe 100 from sticking to the glue material.

[0032] Finally, for the setting of the release layer 40, the present invention attaches any one of high-quality paper, glass paper, paper-based material coated with a release agent, polyethylene-laminated paper-based material, polyethylene film or polypropylene film to the grinding layer 30, thereby protecting the present invention before it is used, and avoiding foreign matters from adhering to the grinding layer 30 and affecting the cleaning effect on the probe 100.

[0033] The above are only the preferred embodiments of the present invention, and do not impose any form of limitation on the present invention. Any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. An elastic buffer probe cleaning sheet, mainly used to clean foreign matters on the surface of the probe, characterized in that, Comprising: Base layer; Intermediate layer, which is stacked on the top surface of the base layer, and the intermediate layer is formed into a sheet after processing with a first material, and the outer surface of the intermediate layer is subjected to surface treatment; Abrasive layer, which is stacked on the top surface of the intermediate layer, the abrasive layer is kneaded with a second material and several first abrasive particles and formed into a sheet after processing, and the surface of the intermediate layer is tightly joined to the abrasive layer after surface treatment, and the elongation rate of the second material in the abrasive layer is greater than the elongation rate of the first material in the intermediate layer; And a release layer, which is movably attached to and peeled off from the top surface of the abrasive layer; Wherein, through the high elastic deformation of the second material possessed by the abrasive layer and the compression characteristics of the first material of the intermediate layer, when the probe is inserted from the abrasive layer and a force is applied in the direction of the base layer, the abrasive layer will elastically stretch downward with the characteristics of the second material, and the several first abrasive particles will contact the foreign matter on the surface of the probe, so that the foreign matter can be separated from the surface of the probe. When the probe is inserted with force, the intermediate layer utilizes the compression deformation characteristics of the first material, thereby driving the abrasive layer to be able to firmly wrap the probe, and achieving that the several first abrasive particles do contact the foreign matter indeed, whereby the foreign matter on the probe can be completely removed.

2. The elastic buffer probe cleaning sheet according to claim 1, wherein Several second abrasive particles can be further added to the intermediate layer.

3. The elastic buffer probe cleaning sheet according to claim 1, wherein, The several first abrasive particles are any one of alumina particles, silicon nitride particles, boron nitride particles, silicon carbide particles, boron carbide particles or diamond particles.

4. The elastic buffer probe cleaning sheet according to claim 2, wherein The several second abrasive particles are any one of alumina particles, silicon nitride particles, boron nitride particles, silicon carbide particles, boron carbide particles or diamond particles.

5. The elastic buffer probe cleaning sheet according to claim 1, wherein, The second material in the abrasive layer is a polymer and is any one of epoxy resin, polyurethane resin, acrylic resin or alkyd resin.

6. The elastic buffer probe cleaning sheet according to claim 1, wherein The release layer is any one of high-quality paper, cellophane, paper-based material coated with a release agent, polyethylene-laminated paper-based material, polyethylene film or polypropylene film.

7. The elastic buffer probe cleaning sheet according to claim 1, wherein The base layer is further any one of a glass fiber board, a plastic board, a stone-free lead board, a metal board, and is integrally formed with the intermediate layer.

8. The elastic buffer probe cleaning sheet according to claim 1, wherein, The base layer is further a cementitious material, and the temperature borne by the base layer is lower than 110°C.

9. The elastic buffer probe cleaning sheet according to claim 1, characterized in that The first material is silica gel.

10. The elastic buffer probe cleaning sheet according to claim 1, wherein The second material is an elastic resin.

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