Multidirectional positioning carrier for semiconductor device
The multi-directional positioning fixture addresses the challenge of precise yet easy handling of semiconductor devices by using a combination of sliding blocks and gas-driven clamps for accurate alignment and secure holding, enhancing the handling process.
Patent Information
- Application Number
- CN202421696357.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-07-17
AI Technical Summary
The positioning slot design of existing semiconductor device vehicles is difficult to take into account both precise positioning and convenient operation, especially the robotic hand is difficult to efficiently insert and remove the device.
The multi-directional positioning vehicle design is adopted, including base, carrier plate, clamp and pneumatic fingers. The pneumatic fingers are used to drive the clamp to move inward and the pin rod is centrally positioned. Combined with the coordination of the wedge and slide rail, multi-directional positioning and limiting are achieved, and positioning accuracy is improved.
The multi-directional positioning of semiconductor devices is realized, positioning accuracy and operation convenience are improved, and width changes of different batches of devices are adapted to avoid damage.
Smart Images
Figure CN223099248U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor device processing, in particular to a multi-directional positioning carrier for semiconductor devices. Background Art
[0002] During the detection or processing of semiconductor devices, carriers are required. The semiconductor devices are small in volume, and they need to be placed in the carrier to position the semiconductor devices through the carrier, so as to improve the accuracy of detection or processing.
[0003] Due to the small volume of semiconductor devices, the positioning slots on the carrier are often small to achieve precise positioning of semiconductor devices. However, the small positioning slots are not conducive to the insertion and extraction of semiconductor devices, especially it is difficult to use a manipulator to insert and extract semiconductor devices. In order to facilitate the insertion and extraction of semiconductor devices, the positioning slots usually need to be enlarged, which affects the positioning accuracy of semiconductor devices and needs to be improved. Summary of the Utility Model
[0004] The purpose of the utility model is to provide a multi-directional positioning carrier for semiconductor devices, which can realize multi-directional positioning of semiconductor devices and facilitate the insertion and extraction of semiconductor devices.
[0005] To achieve the above object, the utility model adopts the following technical solutions:
[0006] A multi-directional positioning carrier for semiconductor devices includes: a base, a carrier plate, clamping plates and pneumatic fingers. The carrier plate is horizontally arranged on the base. The pneumatic fingers are arranged on the base and behind the carrier plate. The top surface of the carrier plate is concavely provided with a positioning slot. Two clamping jaws pointing to the carrier plate are arranged in parallel on the pneumatic fingers. The clamping plates are symmetrically distributed on both sides of the carrier plate and are respectively connected to the clamping jaws one by one. The inner sides of the clamping plates are respectively provided with ejector rods extending into the positioning slot. A slide rail passing through the positioning slot and pointing to the pneumatic fingers is arranged in the carrier plate. The tail end of the slide rail is provided with a slider located between the two clamping jaws. Wedge blocks are arranged on the inner sides of the clamping jaws. Inclined surfaces fitting with the wedge blocks are arranged on both sides of the slider. A retaining pin located in the positioning slot is arranged on the slide rail.
[0007] Wherein, screws connected to the clamping jaws are arranged on the clamping plates.
[0008] Wherein, the tail ends of the clamping plates are located outside the corresponding clamping jaws. A gasket is arranged between the clamping jaws and the clamping plates. Through holes corresponding to the screws are arranged on the gasket.
[0009] Wherein, the surface of the retaining pin is coated with a rubber sleeve.
[0010] Wherein, the positioning slots are spaced along the length direction of the clamping plates on the carrier plate.
[0011] Wherein, a rubber pad is provided at the front end of the ejector rod.
[0012] Wherein, a stop block is provided on the base in front of the carrier plate, and a spring is provided between the stop block and the slide rail.
[0013] The beneficial effects of the present utility model: A multi-directional positioning carrier for semiconductor devices. The positioning slot is designed to be slightly larger than the size of the semiconductor device, facilitating the insertion and removal of the semiconductor device. After the semiconductor device is inserted into the positioning slot, the pneumatic fingers drive the clamping plates on both sides to move inwards, and the ejector rod is used to achieve the centering positioning on both sides of the semiconductor device. At the same time, by the cooperation of the wedge block and the slider, the slide rail is driven to move forward, and the rear side limit of the semiconductor device is achieved by the forward movement of the stop pin, realizing the multi-directional positioning of the semiconductor device and greatly improving the positioning accuracy of the semiconductor device in the positioning slot. Description of the Drawings
[0014] Figure 1 is a schematic structural diagram of the present utility model;
[0015] Figure 2 is Figure 1 the schematic structural diagram after the slide rail moves forward in Detailed Embodiments
[0016] The following Figures 1 to 2 is combined with
[0017] and the technical solutions of the present utility model are further described through specific embodiments. Figure 1 As shown in the multi-directional positioning carrier for semiconductor devices, including: a base 1, a carrier plate 2, clamping plates 10 and pneumatic fingers 7. The carrier plate 2 is horizontally arranged on the base 1 and can be fixed by bolts, with a firm structure.
[0018] A positioning slot 3 is concavely arranged on the top surface of the carrier plate 2. The positioning slot 3 is designed to be slightly larger than the size of the semiconductor device, facilitating the insertion and removal of the semiconductor device 18. The pneumatic fingers 7 are arranged on the base 1 and behind the carrier plate 2. As Figure 2 shown, two clamping jaws 17 pointing to the carrier plate 2 are arranged in parallel on the pneumatic fingers 7 and can move in opposite directions synchronously.
[0019] The clamping plates 10 are symmetrically distributed on both sides of the carrier plate 2 and are connected to the clamping jaws 17 one by one. In this embodiment, screws 8 connected to the clamping jaws 17 are provided on the clamping plates 10, enabling the clamping plates 10 to move left and right along with the clamping jaws 17. The positioning slots 3 are spaced along the length direction of the clamping plates 10 on the carrier plate 2, and the insertion and positioning of multiple semiconductor devices 18 can be realized, which is beneficial to improving the detection or processing efficiency.
[0020] On the inner sides of the clamping plates 10, ejector rods 11 extending into the positioning grooves 3 are respectively arranged. After the semiconductor device 18 is placed into the positioning groove 3, the pneumatic fingers 7 drive the clamping plates 10 on both sides to move inwards, and the ejector rods 11 are used to achieve centering positioning on both sides of the semiconductor device 18. In this embodiment, a rubber pad 14 is arranged at the front end of the ejector rod 11, and the side surface of the semiconductor device 18 is contacted through the rubber pad 14 to avoid damage to the semiconductor device 18.
[0021] As Figure 2 shown, the tail ends of the clamping plates 10 are located outside the corresponding clamping jaws 17, and a gasket 16 is arranged between the clamping jaws 17 and the clamping plates 10. By changing the number of the gaskets 16, the distance between the clamping jaws 17 and the clamping plates 10 is adjusted, and the distance between the two clamping plates 10 after moving inwards is adjusted, so as to improve the width adaptability to semiconductor devices 18 of different batches. Through holes corresponding to the screws 8 are arranged on the gasket 16, which is convenient for disassembly and assembly of the gasket 16.
[0022] As Figure 1 shown, a slide rail 4 penetrating through the positioning groove 3 and pointing to the pneumatic fingers 7 is arranged in the carrier plate 2. A slider 6 located between the two clamping jaws 17 is arranged at the tail end of the slide rail 4. A wedge block 5 is arranged inside the clamping jaw 17, and inclined surfaces 15 attached to the wedge block 5 are arranged on both sides of the slider 6. When the clamping jaws 17 of the pneumatic fingers 7 are closed, the cooperation between the wedge block 5 and the slider 6 is used to drive the slide rail 4 to move forward.
[0023] As Figure 1 shown, the slide rail 4 is located below the semiconductor device 18, which does not affect the placement and removal of the semiconductor device 18. A stop pin 9 located in the positioning groove 3 is arranged on the slide rail 4. When the slide rail 4 moves forward, the stop pin 9 is driven to move forward, and the rear side limit of the semiconductor device 18 is achieved by the forward movement of the stop pin 9, thereby improving the positioning accuracy of the semiconductor device in the positioning groove 3.
[0024] In this embodiment, a rubber sleeve is coated on the surface of the stop pin 9, and the rear side of the semiconductor device 18 is elastically contacted through the rubber sleeve to avoid damage to the semiconductor device 18. A stop block 12 located in front of the carrier plate 2 is arranged on the base 1. A spring 13 is arranged between the stop block 12 and the slide rail 4. After the clamping jaws 17 of the pneumatic fingers 7 are opened, the slide rail 4 is driven to move backward through the spring 13, and the stop pin 9 is driven to move backward, automatically releasing the semiconductor device 18.
[0025] The above content is only a preferred embodiment of the present invention. For those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manners and application scopes. The content of this specification should not be construed as a limitation to the present invention.
Claims
1. A multi-directional positioning carrier for semiconductor devices, characterized in that, Including: A base, a carrier plate, a clamping plate and pneumatic fingers. The carrier plate is horizontally arranged on the base. The pneumatic fingers are arranged on the base and behind the carrier plate. A positioning groove is concavely arranged on the top surface of the carrier plate. Two clamping jaws pointing to the carrier plate are arranged in parallel on the pneumatic fingers. The clamping plates are symmetrically distributed on both sides of the carrier plate and are correspondingly connected to the clamping jaws one by one. Thrust rods extending into the positioning groove are respectively arranged on the inner sides of the clamping plates. A slide rail penetrating the positioning groove and pointing to the pneumatic fingers is arranged in the carrier plate. A slider located between the two clamping jaws is arranged at the tail end of the slide rail. Wedge blocks are arranged on the inner sides of the clamping jaws. Inclined surfaces fitting with the wedge blocks are arranged on both sides of the slider. A retaining pin located in the positioning groove is arranged on the slide rail.
2. The multi-directional positioning carrier for semiconductor devices according to claim 1, wherein Screws connecting the clamping plates to the clamping jaws are arranged on the clamping plates.
3. The multi-directional positioning carrier for semiconductor devices according to claim 2, wherein, The tail end of the clamping plate is located outside the corresponding clamping jaw. A gasket is arranged between the clamping jaw and the clamping plate. Through holes corresponding to the screws are arranged on the gasket.
4. The multi-directional positioning carrier for semiconductor devices according to claim 1, characterized in that, The surface of the retaining pin is coated with a rubber sleeve.
5. The multi-directional positioning carrier for semiconductor devices according to claim 1, wherein The positioning grooves are spaced along the length direction of the clamping plate on the carrier plate.
6. The multi-directional positioning carrier for semiconductor devices according to claim 1, wherein A rubber pad is arranged at the front end of the thrust rod.
7. The multi-directional positioning carrier for semiconductor devices according to claim 1, wherein A stop block located in front of the carrier plate is arranged on the base. A spring is arranged between the stop block and the slide rail.