Wafer paper collecting and stacking device
The wafer collection and stacking system addresses the challenge of automated handling by using a transfer mechanism with a floating arm to ensure precise and efficient stacking, enhancing production efficiency and product quality.
Patent Information
- Application Number
- CN202422458086.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-11
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-10-11
AI Technical Summary
It is difficult to achieve automatic material pick-up and stacking in automated production, resulting in low production efficiency and unstable product quality.
A wafer paper material collection and stacking device is designed, using a rotating mechanism and a plurality of wafer paper molds that are uniformly distributed in annular direction. Combining an elastic floating material collection head and an accurate stacking mechanism, the automatic collection and neat stacking of wafer paper are realized.
It significantly improves the automation level and production efficiency of wafer paper production, improves product quality and hygiene standards, reduces labor intensity, saves storage space, and has flexibility and scalability.
Smart Images
Figure CN223102294U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of automation equipment, in particular to a wafer paper receiving and stacking device. Background Technique
[0002] Wafer paper, also known as rice paper professionally, is an edible starch product. It is mainly made of starch, gelatin and a small amount of lecithin, and is formed into a film by casting and dried. Wafer paper has a wide range of applications in the food industry, mainly as an inner packaging material for products such as candies, pastries or medicines, to prevent these products from sticking to the outer packaging paper and play a role in moisture protection.
[0003] The automation of wafer paper production is an important technological innovation in the food processing field, which marks the transformation from traditional manual workshop production to a modern production mode of high efficiency, precision and hygiene. On the automated production line, precision mechanical equipment replaces manual operation. However, due to the characteristics of wafer paper, it is difficult to achieve automatic material taking and stacking in automated production. Therefore, new designs need to be made for the existing wafer paper automated production material taking and stacking. Summary of the Utility Model
[0004] To solve the above problems, when the material taking head is above the mechanism and ready to release the material, the resilience of the elastic floating part automatically generates a slight shaking force, which promotes the smooth falling off of the wafer paper, and significantly improves the receiving efficiency and accuracy of the wafer paper receiving and stacking device.
[0005] The technical solution adopted by the utility model is: a wafer paper receiving and stacking device, including a turntable mechanism, a wafer paper forming die, a material taking mechanism, a receiving mechanism and a stacking mechanism. A plurality of wafer paper forming dies are provided, and the plurality of wafer paper forming dies are circumferentially and evenly distributed on the turntable mechanism. The turntable mechanism is used to drive the plurality of wafer paper forming dies to pass through the material taking mechanism in sequence. The material taking mechanism is used to grab the wafer paper on the wafer paper forming die to the receiving mechanism for receiving, and stack it towards the stacking mechanism.
[0006] A further improvement to the above solution is that the material taking mechanism includes a material taking support, a material taking transmission module, a material taking lifting module, and a material taking extension arm. The material taking transmission module is arranged on the material taking support, and the material taking lifting module is arranged on the material taking lifting module; the material taking extension arm includes a fixed connection plate, a floating connecting rod, and a material taking head. The fixed connection plate is arranged on the material taking lifting module. The floating connecting rod includes a driving connection part, an elastic floating part, and a material taking connection part. The driving connection part and the elastic floating part are integrally processed with the material taking connection part through an elastic metal material. The driving connection part is arranged on the fixed connection plate, and the material taking head is arranged on the material taking connection part. The elastic floating part is inclined from the driving connection part towards the material taking connection part. When the material taking head takes materials, an elastic floating force is generated to drive the wafer paper grabbed by the material taking head to move towards the material receiving mechanism. When it is above the material taking mechanism, a shaking force is generated under the action of the resilience of the elastic floating part, so that the wafer paper falls into the material receiving mechanism. The stacking mechanism is located below the material receiving mechanism and is used for stacking the falling wafer paper.
[0007] A further improvement to the above solution is that the turntable mechanism includes a frame, a turntable furnace, and a disc. The turntable furnace is arranged at the center of the disc, the disc is arranged on the upper surface of the frame, and a plurality of fixed seats are arranged on the disc. The wafer paper forming die is arranged on the fixed seat.
[0008] A further improvement to the above solution is that the material taking support includes a lower support and an upper support arranged on the lower support. The lower support is provided with a stacking platform on one side of the upper support. The material taking transmission module is arranged on the upper support, and the stacking mechanism is arranged on the stacking platform.
[0009] A further improvement to the above solution is that the material taking transmission module includes a transmission bottom plate, a transmission guide rail, a transmission cam assembly, a transmission slide table, and a transmission motor. The transmission cam assembly includes a transmission cam disc and a transmission cam connecting rod. The transmission guide rail is arranged on the transmission bottom plate, the transmission slide table is slidably arranged on the transmission guide rail, the transmission motor is arranged on the transmission bottom plate and is connected to the transmission cam disc, and the transmission cam disc is connected to the transmission slide table through the transmission cam connecting rod.
[0010] A further improvement to the above solution is that the transmission cam disc is provided with a stroke adjustment groove. A stroke adjustment block is arranged on the stroke adjustment groove, and a plurality of mounting holes are arranged on the stroke adjustment groove for mounting the stroke adjustment block; the transmission cam disc rotates under the driving action of the transmission motor to drive the transmission slide table to slide on the transmission guide rail through the transmission cam connecting rod. The material taking lifting module is arranged on the transmission slide table and moves along with the transmission slide table.
[0011] A further improvement to the above solution is that the material taking and lifting module includes a lifting bottom plate, lifting guide rails, a lifting cam assembly, a lifting slide table, and a lifting motor. The lifting cam assembly includes a lifting cam disc and a lifting cam connecting rod. The lifting guide rails are arranged on the lifting bottom plate. The lifting slide table is slidably arranged on the lifting guide rails. The lifting motor is arranged on the lifting bottom plate and connected to the lifting cam disc. The lifting cam disc is connected to the lifting slide table through the lifting cam connecting rod.
[0012] A further improvement to the above solution is that the lifting cam disc rotates under the driving action of the lifting motor to drive the lifting slide table to slide on the lifting guide rails through the lifting cam connecting rod. The fixed connecting plate is arranged on the lifting slide table and moves along with the lifting slide table.
[0013] A further improvement to the above solution is that the driving connection part is provided with a fixed gasket, and the driving connection part is installed on the fixed connecting plate through the fixed gasket.
[0014] A further improvement to the above solution is that the material taking head includes a mounting gasket and a material taking suction head. The material taking suction head is provided with an adsorption groove and adsorption holes for adsorbing wafer paper.
[0015] A further improvement to the above solution is that the material receiving mechanism includes a material receiving mounting frame and a material receiving guide sleeve. One side of the material receiving guide sleeve is provided with a material receiving guide groove. One end of the material receiving guide groove extends towards the turntable mechanism and the other end is inclined towards the stacking mechanism. The material receiving guide sleeve is provided with a material receiving groove for communicating the material taking mechanism and the stacking mechanism.
[0016] A further improvement to the above solution is that the stacking mechanism includes a stacking tray located below the material receiving mechanism and a stacking pressing assembly located on one side of the stacking tray. The material receiving groove is used to guide the wafer paper towards the stacking tray. The stacking pressing assembly is used to press the wafer paper onto the stacking tray in sequence for stacking.
[0017] A further improvement to the above solution is that the outer periphery of the stacking tray is provided with positioning guide pieces extending towards the material receiving groove. The stacking pressing assembly includes a pressing support, a pressing driving motor, pressing connecting rods, and a pressing plate. The pressing driving motor is arranged on the pressing support. There are two pressing connecting rods connected to the pressing driving motor. Both sides of the pressing plate are respectively connected to the two pressing connecting rods. The pressing plate is provided with a plurality of through holes.
[0018] The beneficial effects of the present utility model are:
[0019] Compared with the existing wafer paper collection, the utility model is used for automatic collection and stacking of wafer paper. By adopting a turntable mechanism and a plurality of wafer paper forming molds uniformly distributed in the annular direction, a continuous operation process of wafer paper forming is realized, which significantly improves the automation degree and production efficiency of the production line. The precise drive of the turntable mechanism ensures that each forming mold can pass through the material taking mechanism in sequence and order, reducing the waiting time and optimizing the production rhythm. The material taking mechanism can accurately grab the wafer paper on the wafer paper forming mold and transfer it to the material collection mechanism. In this process, not only the integrity of the wafer paper is guaranteed, but also the pollution and damage that may be caused by manual operation are avoided, thereby improving the hygiene standards and appearance quality of the product. The coordinated work of the material collection mechanism and the stacking mechanism realizes the automatic collection and neat stacking of wafer paper. This process not only reduces the labor intensity, but also greatly improves the accuracy and stability of stacking, which provides convenience for subsequent packaging, transportation and other links. At the same time, automatic stacking also helps to save storage space and improve warehouse utilization.
[0020] The utility model significantly improves the overall efficiency and product quality of wafer paper production and reduces labor costs through the characteristics of high efficiency, precision and automation. It is an important technological innovation in the field of food processing. In addition, the wafer paper collecting and stacking device also has high flexibility and scalability. Its modular design makes it easy to maintain and replace the components. When production needs change, the device can be easily adjusted or upgraded to meet the production needs of wafer papers of different specifications and types.
[0021] The retrieving mechanism integrates the retrieving bracket, retrieving transmission module, retrieving lifting module and innovative retrieving extension arm to build a highly flexible and stable material grabbing system. The retrieving transmission module accurately controls the motion trajectory to ensure the accuracy of the retrieving position; the retrieving lifting module adjusts the height according to actual needs to adapt to the operation requirements in different production scenarios. The design of the retrieving extension arm combines the stability of the fixed connecting plate and the dynamic adaptability of the floating connecting rod. The floating connecting rod is made of elastic metal material in one piece, which not only ensures the compactness and strength of the structure, but also gives the retrieving head an elastic floating force during the retrieving process, effectively reducing the impact caused by direct contact with the material and protecting the integrity of the wafer paper. At the same time, when the retrieving head is located above the mechanism and is ready to release the material, the rebound force of the elastic floating part automatically generates a slight shaking force, which promotes the smooth shedding of the wafer paper and significantly improves the efficiency and accuracy of material collection.
[0022] The stacking mechanism is located below the receiving mechanism, which accurately receives and stacks the wafer paper from the retrieving mechanism, realizing a continuous automated operation process from retrieving to stacking. This design not only reduces manual intervention and labor intensity, but also improves the overall production line throughput and product quality consistency by optimizing the material flow path. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 This is a three-dimensional schematic diagram of the wafer paper receiving and stacking device of the present utility model;
[0024] Figure 2 It is Figure 1 a three-dimensional schematic diagram of another perspective of the wafer paper receiving and stacking device in
[0025] Figure 3 It is Figure 1 a front view schematic diagram of the wafer paper receiving and stacking device in
[0026] Figure 4 It is Figure 1 a schematic diagram of a partial structure of the wafer paper receiving and stacking device in
[0027] Figure 5 It is Figure 1 a schematic diagram of a partial structure of the wafer paper receiving and stacking device in
[0028] Figure 6 It is Figure 1 a schematic diagram of the material taking mechanism of the wafer paper receiving and stacking device in
[0029] Figure 7 It is Figure 1 a schematic diagram of the material taking mechanism of the wafer paper receiving and stacking device in
[0030] Figure 8 It is Figure 1 a schematic diagram of the material receiving mechanism of the wafer paper receiving and stacking device in
[0031] Figure 9 It is Figure 1 a schematic diagram of the stacking mechanism of the wafer paper receiving and stacking device in
[0032] Explanation of reference numerals: Turntable mechanism 1, frame 11, turntable furnace 12, disc 13, fixed seat 131;
[0033] Wafer paper forming die 2;
[0034] Material taking mechanism 3, material taking support 31, lower support 311, upper support 312, stacking platform 313, material taking drive module 32, drive base plate 321, drive guide rail 322, drive cam assembly 323, drive cam disc 3231, drive cam connecting rod 3232, stroke adjustment groove 3233, stroke adjustment block 3234, drive slide 324, drive motor 325, material taking lifting module 33, lifting base plate 331, lifting guide rail 332, lifting cam assembly 333, lifting cam disc 3331, lifting cam connecting rod 3332, lifting slide 334, lifting motor 335, material taking extension arm 34, fixed connection plate 341, floating connecting rod 342, drive connection part 3421, elastic floating part 3422, material taking connection part 3423, fixed gasket 3424, material taking head 343, mounting gasket 3431, material taking suction head 3432, adsorption groove 3433, adsorption hole 3434;
[0035] Material receiving mechanism 4, material receiving mounting frame 41, material receiving guide sleeve 42, material receiving groove 421, material receiving guide groove 43;
[0036] Stacking mechanism 5, stacking tray 51, positioning guide piece 511, stacking pressing assembly 52, pressing support 521, pressing drive motor 522, pressing connecting rod 523, pressing plate 524, through hole 5241. Detailed implementation mode
[0037] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. The preferred embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0038] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time.
[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.
[0040] Such as Figures 1 to 9As shown in the figure, in an embodiment of the present utility model, a wafer paper receiving and stacking device is involved, which includes a turntable mechanism 1, a wafer paper forming die 2, a material taking mechanism 3, a material receiving mechanism 4 and a stacking mechanism 5. A plurality of wafer paper forming dies 2 are provided, and the plurality of wafer paper forming dies 2 are circumferentially and evenly distributed on the turntable mechanism 1. The turntable mechanism 1 is used to drive the plurality of wafer paper forming dies 2 to sequentially pass through the material taking mechanism 3. The material taking mechanism 3 is used to grab the wafer paper on the wafer paper forming die 2 to the material receiving mechanism 4 for material receiving, and stack it towards the stacking mechanism 5. This embodiment is used for automatic receiving and stacking of wafer paper. By adopting the design of the turntable mechanism 1 and a plurality of wafer paper forming dies 2 evenly distributed circumferentially, a continuous operation process for wafer paper forming is realized, significantly improving the automation degree and production efficiency of the production line. The precise drive of the turntable mechanism 1 ensures that each forming die can pass through the material taking mechanism 3 sequentially and orderly, reducing the waiting time and optimizing the production rhythm. The material taking mechanism 3 can accurately grab the wafer paper on the wafer paper forming die 2 and transfer it to the material receiving mechanism 4. In this process, not only the integrity of the wafer paper is ensured, but also the pollution and damage that may be caused by manual operation are avoided, thus improving the hygiene standard and appearance quality of the product. The coordinated work of the material receiving mechanism 4 and the stacking mechanism 5 realizes the automatic collection and neat stacking of wafer paper. This process not only reduces the labor intensity, but also greatly improves the accuracy and stability of stacking, providing convenience for subsequent packaging, transportation and other links. At the same time, automatic stacking also helps to save storage space and improve the utilization rate of the warehouse.
[0041] Through the characteristics of high efficiency, precision and automation, this embodiment significantly improves the overall efficiency and product quality of wafer paper production, reduces the labor cost, and is an important technological innovation in the food processing field. In addition, the wafer paper receiving and stacking device also has high flexibility and scalability. Its modular design makes it easy to maintain and replace each component. When the production demand changes, the device can be conveniently adjusted or upgraded to adapt to the production requirements of different specifications and types of wafer paper.
[0042] The turntable mechanism 1 includes a frame 11, a rotary furnace 12, and a disc 13. The rotary furnace 12 is arranged at the center of the disc 13. The disc 13 is arranged on the upper surface of the frame 11. A plurality of fixing seats 131 are arranged on the disc 13, and the wafer paper forming die 2 is arranged on the fixing seats 131. In this embodiment, the use of the turntable mechanism 1 significantly improves the production efficiency and the product sorting quality. This mechanism is stably supported by the frame 11, and the rotary furnace 12 is accurately positioned at the core of the disc 13, which not only ensures the heating uniformity but also optimizes the process flow. The design of the plurality of fixing seats 131 on the disc 13 provides a stable working platform for the wafer paper forming die 2, ensures the consistent die spacing, and avoids the mutual interference between products. This layout accelerates the forming and separation of the wafer paper, and then facilitates the efficient and orderly collection and stacking of the finished products by the automated material collection and stacking system, significantly reducing the manual intervention and enhancing the automation level and production efficiency of the overall production line. The design of the turntable mechanism 1 allows for the flexible adjustment of the number and position of the dies according to the production requirements, so as to adapt to the production of wafer papers of different sizes and shapes, and improves the flexibility and adaptability of the production line. The disc 13 layout makes the entire turntable mechanism 1 structure compact, saves more space compared with the traditional layout, and is conducive to maximizing the production capacity in a limited production area.
[0043] Refer to Figures 4 to 7As shown in the figure, the material taking mechanism 3 includes a material taking support 31, a material taking drive module 32, a material taking lifting module 33 and a material taking extension arm 34. The material taking drive module 32 is arranged on the material taking support 31, and the material taking lifting module 33 is arranged on the material taking lifting module 33; the material taking extension arm 34 includes a fixed connecting plate 341, a floating connecting rod 342 and a material taking head 343. The fixed connecting plate 341 is arranged on the material taking lifting module 33. The floating connecting rod 342 includes a driving connection part 3421, an elastic floating part 3422 and a material taking connection part 3423. The driving connection part 3421 and the elastic floating part 3422 are integrally processed with the material taking connection part 3423 through an elastic metal material. The driving connection part 3421 is arranged on the fixed connecting plate 341, and the material taking head 343 is arranged on the material taking connection part 3423. The elastic floating part 3422 is inclined from the driving connection part 3421 towards the material taking connection part 3423. When the material taking head 343 takes materials, an elastic floating force is generated to drive the wafer paper grabbed by the material taking head 343 to move towards the material receiving mechanism 4. When it is above the material taking mechanism 3, a shaking force is generated under the action of the resilience of the elastic floating part 3422, so that the wafer paper falls into the material receiving mechanism 4. The stacking mechanism 5 is located below the material receiving mechanism 4 and is used for stacking the falling wafer paper. In this embodiment, the material taking mechanism 3 constructs a highly flexible and stable material grabbing system by integrating the material taking support 31, the material taking drive module 32, the material taking lifting module 33 and the innovative material taking extension arm 34. The material taking drive module 32 precisely controls the movement trajectory to ensure the accuracy of the material taking position; the material taking lifting module 33 adjusts the height according to actual needs to adapt to the operation requirements in different production scenarios. The design of the material taking extension arm 34 combines the stability of the fixed connecting plate 341 and the dynamic adaptability of the floating connecting rod 342. The floating connecting rod 342 is integrally processed with an elastic metal material, which not only ensures the compactness and strength of the structure, but also endows the material taking head 343 with an elastic floating force during the material taking process, effectively reducing the impact caused by direct contact with the material and protecting the integrity of the wafer paper. At the same time, when the material taking head 343 is above the mechanism and ready to release the material, the resilience of the elastic floating part 3422 automatically generates a slight shaking force, promoting the smooth falling off of the wafer paper and significantly improving the material receiving efficiency and accuracy.
[0044] The material taking bracket 31 includes a lower bracket 311 and an upper bracket 312 arranged on the lower bracket 311. A stacking platform 313 is arranged on one side of the lower bracket 311 where the lower bracket 311 is located. The material taking transmission module 32 is arranged on the upper bracket 312, and the stacking mechanism 5 is arranged on the stacking platform 313. In this embodiment, the adoption of the above material taking bracket 31 design significantly improves the automation efficiency and stacking accuracy. The lower bracket 311 provides a stable support, and the upper bracket 312 flexibly arranges the material taking transmission module 32, ensuring the stability and efficiency of the material taking process. The stacking platform 313 arranged on one side ingeniously integrates the stacking mechanism 5, realizing the seamless connection of the wafer paper from material taking to stacking, reducing manual intervention, and improving production efficiency. This structural design optimizes the space utilization, makes the stacking process more compact and orderly, avoids the chaos and damage of the paper, and ensures the consistency of product quality.
[0045] The stacking mechanism 5 is located below the material receiving mechanism 4, accurately receiving and stacking the wafer paper from the material taking mechanism 3, and realizing the continuous automated operation process from material taking to stacking. This design not only reduces manual intervention and labor intensity, but also improves the throughput capacity and product quality consistency of the overall production line by optimizing the material flow path.
[0046] The material taking transmission module 32 includes a transmission bottom plate 321, a transmission guide rail 322, a transmission cam assembly 323, a transmission slide table 324 and a transmission motor 325. The transmission cam assembly 323 includes a transmission cam disc 3231 and a transmission cam connecting rod 3232. The transmission guide rail 322 is arranged on the transmission bottom plate 321. The transmission slide table 324 is slidably arranged on the transmission guide rail 322. The transmission motor 325 is arranged on the transmission bottom plate 321 and connected to the transmission cam disc 3231. The transmission cam disc 3231 is connected to the transmission slide table 324 through the transmission cam connecting rod 3232. Specifically, the transmission cam disc 3231 is provided with a stroke adjustment groove 3233. A stroke adjustment block 3234 is arranged on the stroke adjustment groove 3233. Multiple mounting holes are arranged on the stroke adjustment groove 3233 for mounting the stroke adjustment block 3234. The transmission cam disc 3231 rotates under the driving action of the transmission motor 325 to drive the transmission slide table 324 to slide on the transmission guide rail 322 through the transmission cam connecting rod 3232. The material taking lifting module 33 is arranged on the transmission slide table 324 and moves along with the transmission slide table 324. In this embodiment, through the precisely designed transmission bottom plate 321 and the guide rail system, the smooth sliding of the transmission slide table 324 in the horizontal direction is ensured, laying a solid foundation for accurate material taking. The innovative application of the transmission cam assembly 323, especially its built-in stroke adjustment groove 3233 and adjustable stroke adjustment block 3234 design, not only facilitates the flexible adjustment of the material taking stroke according to the size of the wafer paper, but also enhances the flexibility and stability of the adjustment through the multi-mounting hole configuration. The close connection between the transmission motor 325 and the transmission cam disc 3231 realizes the efficient transmission of power, drives the transmission slide table 324 to move precisely along the preset path, and effectively reduces the mechanical error. During this process, the material taking lifting module 33 moves synchronously with the transmission slide table 324, ensuring the smooth completion of actions such as material taking, lifting, and stacking, significantly improving the automation level of wafer paper receiving and stacking, reducing the need for manual intervention, and at the same time enhancing the overall operation efficiency and product quality stability of the production line. The automated material taking and stacking process greatly shortens the production cycle and reduces the waiting time caused by manual operation, enabling the entire production line to operate continuously and efficiently, thereby improving the overall production efficiency.
[0047] The material picking and lifting module 33 includes a lifting bottom plate 331, lifting guide rails 332, a lifting cam assembly 333, a lifting slide table 334, and a lifting motor 335. The lifting cam assembly 333 includes a lifting cam disc 3331 and a lifting cam connecting rod 3332. The lifting guide rails 332 are arranged on the lifting bottom plate 331. The lifting slide table 334 is slidably arranged on the lifting guide rails 332. The lifting motor 335 is arranged on the lifting bottom plate 331 and connected to the lifting cam disc 3331. The lifting cam disc 3331 is connected to the lifting slide table 334 through the lifting cam connecting rod 3332. Specifically, the lifting cam disc 3331 rotates under the driving action of the lifting motor 335 to drive the lifting slide table 334 to slide on the lifting guide rails 332 through the lifting cam connecting rod 3332. The fixed connecting plate 341 is arranged on the lifting slide table 334 and moves along with the lifting slide table 334. In this embodiment, through the precisely designed lifting cam assembly 333, under the precise control of the lifting motor 335, the stable and accurate lifting movement of the lifting slide table 334 is realized. During this process, the efficient cooperation between the lifting cam disc 3331 and the connecting rod ensures the continuity and stability of power transmission, enabling the lifting slide table 334 to move smoothly along the lifting guide rails 332, reducing mechanical vibration and noise. The fixed connecting plate 341 moves synchronously with the lifting slide table 334, precisely controlling the picking and stacking height of the wafer paper material, effectively avoiding the uncertainty and error of manual operation. Overall, the application of this module greatly optimizes the material receiving and stacking process, improves production efficiency and product quality, and reduces labor costs.
[0048] The driving connection part 3421 is provided with a fixing gasket 3424, and the driving connection part 3421 is installed on the fixed connection plate 341 through the fixing gasket 3424. Specifically, the material taking head 343 includes a mounting gasket 3431 and a material taking suction head 3432. The material taking suction head 3432 is provided with an adsorption groove 3433 and adsorption holes 3434 for adsorbing wafer paper. In this embodiment, the fixing gasket 3424 is skillfully arranged between the driving connection part 3421 and the fixed connection plate 341, which not only ensures the stability of the connection, but also effectively reduces the vibration and noise during the operation of the equipment through the buffering effect of the gasket, improving the stability and comfort of the overall working environment. At the same time, the designed mounting gasket 3431 of the material taking head 343 is combined with the material taking suction head 3432 to form an integrated and efficient material taking unit. The adsorption groove 3433 and the precisely arranged adsorption holes 3434 on the material taking suction head 3432 adsorb the wafer paper accurately and strongly, ensuring that the wafer paper can be stably and completely grabbed and transferred during the high-speed and continuous material receiving and stacking process, significantly improving the production efficiency and product quality. This structural design demonstrates a high level of integration and intelligence and is an important technological breakthrough in promoting the automation process of wafer paper processing. In addition, this structural design also takes into account maintainability and flexibility. The introduction of the fixing gasket 3424 and the mounting gasket 3431 makes it more convenient to disassemble and install when maintenance or component replacement is required, reducing the maintenance cost and time.
[0049] Refer to Figure 8 As shown, the material receiving mechanism 4 includes a material receiving mounting frame 41 and a material receiving guide sleeve 42. One side of the material receiving guide sleeve 42 is provided with a material receiving guide groove 43. One end of the material receiving guide groove 43 extends towards the turntable mechanism 1 and the other end inclines towards the stacking mechanism 5; the material receiving guide sleeve 42 is provided with a material receiving groove 421, and the material receiving groove 421 is used to connect the material taking mechanism 3 and the stacking mechanism 5. In this embodiment, through the coordinated action of the material receiving mounting frame 41 and the material receiving guide sleeve 42, combined with the precise design of the material receiving guide groove 43, it ensures the smooth transition and precise guidance of the wafer paper between the turntable mechanism 1 and the stacking mechanism 5. The inclined design of the guide groove not only promotes the smooth flow of materials, but also effectively prevents the jamming phenomenon during the stacking process, ensuring the neatness of stacking. At the same time, the ingenious setting of the material receiving groove 421, as a bridge between the material taking mechanism 3 and the stacking mechanism 5, realizes the continuity and efficiency of material transmission, reduces manual intervention, and improves the overall automation level of the production line.
[0050] Refer to Figure 9As shown in the figure, the stacking mechanism 5 includes a stacking tray 51 located below the material receiving mechanism 4 and a stacking pressing assembly 52 located on one side of the stacking tray 51. The material receiving groove 421 is used to guide the wafer paper towards the stacking tray 51, and the stacking pressing assembly 52 is used to sequentially press the wafer paper onto the stacking tray 51 for stacking. Specifically, a positioning guide piece 511 is provided on the outer periphery of the stacking tray 51, and the positioning guide piece 511 extends towards the material receiving groove 421. The stacking pressing assembly 52 includes a pressing support 521, a pressing drive motor 522, pressing connecting rods 523, and a pressing plate 524. The pressing drive motor 522 is provided on the pressing support 521. Two pressing connecting rods 523 are provided and are connected to the pressing drive motor 522. Both sides of the pressing plate 524 are respectively connected to the two pressing connecting rods 523, and a plurality of through holes 5241 are provided on the pressing plate 524. In this embodiment, through the exquisitely designed positioning guide piece 511, the wafer paper is accurately guided to the stacking tray 51, reducing the offset phenomenon and improving the stacking accuracy. The integration of the stacking pressing assembly 52, especially the linkage mechanism of the pressing connecting rods 523 and the pressing plate 524 driven by the pressing drive motor 522, realizes the automatic pressing process, ensures that each layer of wafer paper is closely attached, and avoids the problem of loose stacking. The design of the plurality of through holes 5241 on the pressing plate 524 not only reduces the overall weight but also helps air circulation, reduces the resistance during the pressing process, and improves the pressing efficiency and stability. The output force of the pressing drive motor 522 can be finely adjusted according to the thickness and material of the wafer paper to ensure that appropriate pressing force can be obtained for different specifications and types of wafer paper, avoiding damage caused by over-tightening or unstable stacking caused by over-loosening. At the same time, the structural design of the pressing connecting rods 523 and the pressing plate 524 allows for quick replacement or adjustment according to actual needs to adapt to different production scenarios and process requirements.
[0051] The above embodiments only illustrate several implementation manners of the present invention, and the description is relatively specific and detailed, but it should not be construed as a limitation to the patent scope of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.
Claims
1. A wafer paper collecting and stacking device, characterized in that: It includes a turntable mechanism, a wafer paper forming die, a material taking mechanism, a material receiving mechanism and a stacking mechanism. There are multiple wafer paper forming dies, and the multiple wafer paper forming dies are circumferentially and evenly distributed on the turntable mechanism. The turntable mechanism is used to drive the multiple wafer paper forming dies to sequentially pass through the material taking mechanism. The material taking mechanism is used to grab the wafer paper on the wafer paper forming die to the material receiving mechanism for material receiving and stack it towards the stacking mechanism. The material taking mechanism includes a material taking support, a material taking transmission module, a material taking lifting module and a material taking extension arm. The material taking transmission module is arranged on the material taking support, and the material taking lifting module is arranged on the material taking lifting module; The material taking extension arm includes a fixed connecting plate, a floating connecting rod and a material taking head. The fixed connecting plate is arranged on the material taking lifting module. The floating connecting rod includes a driving connecting part, an elastic floating part and a material taking connecting part. The driving connecting part and the elastic floating part are integrally processed with the material taking connecting part by an elastic metal material. The driving connecting part is arranged on the fixed connecting plate, and the material taking head is arranged on the material taking connecting part. The elastic floating part inclines from the driving connecting part towards the material taking connecting part. When the material taking head takes materials, an elastic floating force is generated to drive the wafer paper grabbed by the material taking head to move towards the material receiving mechanism. When it is above the material taking mechanism, a shaking force is generated under the action of the resilience of the elastic floating part, so that the wafer paper falls into the material receiving mechanism. The stacking mechanism is located below the material receiving mechanism for stacking the falling wafer paper; The material taking head includes a mounting gasket and a material taking suction head. The material taking suction head is provided with an adsorption groove and an adsorption hole for adsorbing the wafer paper.
2. The wafer paper receiving and stacking device according to claim 1, wherein: The turntable mechanism includes a frame, a turntable furnace and a disc. The turntable furnace is arranged at the center of the disc. The disc is arranged on the upper surface of the frame. There are multiple fixed seats on the disc, and the wafer paper forming die is arranged on the fixed seat.
3. The wafer paper collecting and stacking device according to claim 1, characterized in that: The material taking support includes a lower support and an upper support arranged on the lower support. The lower support is provided with a stacking platform on one side of the upper support. The material taking transmission module is arranged on the upper support, and the stacking mechanism is arranged on the stacking platform.
4. The wafer paper receiving and stacking device according to claim 1, wherein: The material taking transmission module includes a transmission bottom plate, a transmission guide rail, a transmission cam assembly, a transmission slide and a transmission motor. The transmission cam assembly includes a transmission cam disc and a transmission cam connecting rod. The transmission guide rail is arranged on the transmission bottom plate. The transmission slide is slidably arranged on the transmission guide rail. The transmission motor is arranged on the transmission bottom plate and connected to the transmission cam disc. The transmission cam disc is connected to the transmission slide through the transmission cam connecting rod.
5. The wafer paper receiving and stacking device according to claim 4, characterized in that: The transmission cam disc is provided with a stroke adjustment groove. The stroke adjustment block is arranged on the stroke adjustment groove. There are multiple mounting holes on the stroke adjustment groove for mounting the stroke adjustment block; The transmission cam disc rotates under the drive of the transmission motor to drive the transmission slide to slide on the transmission guide rail through the transmission cam connecting rod. The material taking lifting module is arranged on the transmission slide and moves along with the transmission slide.
6. The wafer paper collecting and stacking device according to claim 5, characterized in that: The material taking and lifting module includes a lifting bottom plate, lifting guide rails, a lifting cam assembly, a lifting slide table, and a lifting motor. The lifting cam assembly includes a lifting cam disc and a lifting cam connecting rod. The lifting guide rails are arranged on the lifting bottom plate. The lifting slide table is slidably arranged on the lifting guide rails. The lifting motor is arranged on the lifting bottom plate and connected to the lifting cam disc. The lifting cam disc is connected to the lifting slide table through the lifting cam connecting rod; The lifting cam disc rotates under the driving action of the lifting motor to drive the lifting slide table to slide on the lifting guide rails through the lifting cam connecting rod. The fixed connecting plate is arranged on the lifting slide table and moves along with the lifting slide table.
7. The wafer paper receiving and stacking device according to claim 1, wherein: A fixed gasket is arranged on the driving connection part. The driving connection part is installed on the fixed connecting plate through the fixed gasket.
8. The wafer paper receiving and stacking device according to claim 1, characterized in that: The material receiving mechanism includes a material receiving mounting frame and a material receiving guide sleeve. A material receiving guide groove is arranged on one side of the material receiving guide sleeve. One end of the material receiving guide groove extends towards the turntable mechanism, and the other end is inclined towards the stacking mechanism. The material receiving guide sleeve is provided with a material receiving groove, and the material receiving groove is used for communicating the material taking mechanism and the stacking mechanism.
9. The wafer paper receiving and stacking device according to claim 8, wherein: The stacking mechanism includes a stacking disc located below the material receiving mechanism and a stacking pressing assembly located on one side of the stacking disc. The material receiving groove is used for guiding the wafer paper towards the stacking disc. The stacking pressing assembly is used for sequentially pressing the wafer paper on the stacking disc for stacking.
10. The wafer paper receiving and stacking device according to claim 9, characterized in that: Positioning guide pieces are arranged on the outer periphery of the stacking disc and extend towards the material receiving groove. The stacking pressing assembly includes a pressing support, a pressing driving motor, pressing connecting rods, and a pressing plate. The pressing driving motor is arranged on the pressing support. There are two pressing connecting rods, which are connected to the pressing driving motor. Both sides of the pressing plate are respectively connected to the two pressing connecting rods. A plurality of through holes are arranged on the pressing plate.