Wear-resistant conductive adhesive tape

Abstract

The utility model discloses a wear-resistant conductive adhesive tape, which belongs to the technical field of conductive adhesive tapes and comprises a copper wire array structure, an elastic covering layer, a conductive colloid layer and a release layer, the copper wire array structure is embedded in the elastic covering layer; the conductive colloid layer is adjacent to the copper wire array structure and is arranged between the release layer and the elastic covering layer; the elastic covering layer, the conductive colloid layer and the release layer are sequentially stacked. The wear-resistant conductive adhesive tape provided by the utility model solves the technical problem of how to improve the wear resistance of the conductive adhesive tape.

Description

Technical Field

[0001] The utility model relates to the technical field of conductive tapes, and particularly relates to an abrasion-resistant conductive tape. Background Art

[0002] A conductive tape is a metal foil or conductive cloth with a highly conductive adhesive backing, and its conductive adhesive backing and conductive substrate form a complete conductor. At present, commonly used conductive tapes usually take a matrix resin and conductive fillers, i.e., conductive particles, as the main components. Through the bonding action of the matrix resin, the conductive particles are combined together to form a conductive path, realizing the conductive connection of the adhered materials.

[0003] Therefore, the conductive tape has excellent electrical conductivity and can effectively conduct current. Moreover, the conductive tape has good flexibility and strong adhesion, and can be conveniently pasted on various surfaces. In addition, the conductive tape has a good effect of shielding magnetic fields and electromagnetic waves and can reduce electromagnetic interference. Therefore, based on the unique properties of the conductive tape, it is widely used in multiple fields.

[0004] For example, in the field of electronic product manufacturing, it can be used to seal the seams of EMI shielding rooms, housings and electronic devices, wind cables for shielding, provide a reliable grounding surface, and provide electrical contact for surfaces that cannot be welded. In electrical engineering, conductive tapes can be used for the connection and insulation of electrical equipment. In occasions where electromagnetic shielding is required, such as communication equipment, radar systems, etc., conductive tapes can play an important role.

[0005] Based on this, Chinese Patent CN1105762C discloses a conductive tape, which is a tape with an extremely thin thickness made by forming a conductive adhesive on a metal vapor deposition layer of a resin film. The metal vapor deposition layer is formed by vacuum-evaporating a conductive metal substance on one side of the resin film or evaporating a mesh-shaped metal vapor deposition layer on one side of the resin film. This kind of conductive tape has the functions of simple manufacturing process, being convenient to cut and use on-site, having electrical conductivity and being able to block electronic waves.

[0006] However, the above-mentioned disclosed conductive tape still has the technical problem of insufficient abrasion resistance. Specifically, the conductive tapes disclosed in the existing patents do not optimize the abrasion resistance of the conductive tapes. If such conductive tapes are applied to occasions where some components are in contact with each other, it is easy to have situations of fracture or poor contact due to colloid aging or material fatigue; thus affecting the service life of the conductive tape. Summary of the Utility Model

[0007] Based on this, it is necessary to provide an abrasion-resistant conductive tape for the technical problem of how to improve the abrasion resistance of the conductive tape.

[0008] A wear-resistant conductive tape, comprising: a copper wire array structure, an elastic covering layer, a conductive colloid layer, and a release layer; the copper wire array structure is embedded in the elastic covering layer; the conductive colloid layer is disposed between the release layer and the elastic covering layer adjacent to the copper wire array structure; the elastic covering layer, the conductive colloid layer, and the release layer are sequentially stacked.

[0009] Further, the copper wire array structure is a single-layer copper wire structure or a multi-layer copper wire structure, and each structural layer of the copper wire array structure is formed by uniformly arranging a plurality of copper wires.

[0010] Further, in the copper wire array structure, the diameter of each copper wire is 25μm to 50μm.

[0011] Further, in the copper wire array structure, the interval between every two copper wires is a single times the diameter of the copper wire.

[0012] Further, in the copper wire array structure, the interval between every two copper wires is 25μm to 35μm.

[0013] Further, the thickness of the elastic covering layer is two to four times the thickness of the copper wire array structure 1.

[0014] Further, the thickness of the conductive colloid layer is 20μm to 35μm.

[0015] Further, the thickness of the release layer is 20μm to 35μm.

[0016] In summary, a wear-resistant conductive tape of the present invention is respectively provided with a copper wire array structure, an elastic covering layer, a conductive colloid layer, and a release layer; the copper wire array structure is embedded in the elastic covering layer; the conductive colloid layer is disposed between the release layer and the elastic covering layer adjacent to the copper wire array structure; the elastic covering layer, the conductive colloid layer, and the release layer are sequentially stacked. The provided elastic covering layer is used to accommodate the copper wire array structure and can enhance the overall toughness and wear resistance of the conductive tape; the copper wire array structure can be used to enhance the conductive performance and tensile performance of the conductive tape; the conductive colloid layer can be used for adhesion, conduction, signal shielding, etc.; the release layer can be used to isolate the colloid material. It can be seen that a wear-resistant conductive tape of the present invention solves the technical problem of how to improve the wear resistance of the conductive tape. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic structural diagram of a wear-resistant conductive tape of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] To make the above objects, features, and advantages of the present utility model more apparent and understandable, the following detailed description of the specific embodiments of the present utility model will be provided in conjunction with the accompanying drawings. A lot of specific details are set forth in the following description to facilitate a full understanding of the present utility model. However, the present utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present utility model. Therefore, the present utility model is not limited by the specific embodiments disclosed below.

[0019] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0020] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0021] In the present utility model, unless otherwise clearly defined and limited, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0022] In the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0023] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0024] Please refer to Figure 1 , a wear-resistant conductive tape of the present utility model includes: a copper wire array structure 1, an elastic covering layer 2, a conductive colloid layer 3 and a release layer 4; the copper wire array structure 1 is embedded in the elastic covering layer 2; the conductive colloid layer 3 is disposed adjacent to the copper wire array structure 1 between the release layer 4 and the elastic covering layer 2; the elastic covering layer 2, the conductive colloid layer 3 and the release layer 4 are stacked in sequence.

[0025] Specifically, the copper wire array structure 1 can be composed of a single copper wire or can be formed by a plurality of copper wires arranged evenly with intervals. Moreover, the copper wire array structure 1 can also be composed of multiple layers of evenly arranged copper wire arrays. For example, a copper wire structure of 4*2 or 4*8 arrays. That is, the copper wire array structure 1 has a total of 2 layers, and each layer has 4 copper wires; or a total of 4 layers, and each layer has 8 copper wires in total. The copper wire array structure 1 can not only achieve the function of conductive connection but also enhance the tensile performance of the conductive tape, so that the overall toughness of the conductive tape is stronger.

[0026] More specifically, in a specific embodiment, the copper wire array structure 1 is composed of eight copper wires arranged evenly. Among them, the wire diameter of each copper wire is preferably between 25μm and 50μm; generally, it can be set to 35μm; the interval between every two copper wires can be between 25μm and 35μm; generally, the interval between every two copper wires can be set to be a single copper wire diameter.

[0027] Further, the elastic covering layer 2 is made of a preset elastomeric material, usually hydrogenated nitrile rubber. The elastic covering layer may also contain short fiber materials, such as short fibers, pulp fibers or chopped fiber reinforcing materials. Moreover, suitable materials for filling the fibers include meta- and para-aramid, nylon, polyester and natural cotton. The fiber filling amount should be suitable for the application. Most of the fiber orientations should be perpendicular to the stretching and taking direction of the conductive tape. Thus, the elastic covering layer 2 can have strong toughness, tensile strength and wear resistance.

[0028] Specifically, the thickness of the elastic covering layer 2 can generally be two to four times the thickness of the copper wire array structure 1. That is, when the copper wire array in the copper wire array structure 1 is arranged in a single layer, the thickness of the elastic covering layer 2 is usually two to four times the diameter of each copper wire in the copper wire array structure 1. That is, when the diameter of the copper wire is 35 μm, it is better that the thickness of the elastic covering layer 2 is greater than 70 μm.

[0029] More specifically, in a specific embodiment of the elastic covering layer 2, by mass, it includes 60 phr of carbon black, 15 phr of plasticizer, 3.5 phr of zinc oxide, 2 phr of sulfur and a dithiocarbamate accelerator.

[0030] Further, the conductive colloid layer 3 is usually a viscous conductive and strip-shaped colloid structure formed by adding conductive fillers such as carbon powder and metal powder to a resin substrate to increase the conductive performance of the resin substrate. The resin substrate can usually be epoxy resin, silicone, polyurethane, polyimide or acrylic acid, etc.; in the process of manufacturing the conductive tape, by adding conductive fillers such as metal powder, carbon powder and additives such as curing agent and accelerator to the epoxy resin, through processes such as mixing, coating and curing, a tape with conductive performance is formed. The conductive filler plays a role in conducting current in the tape, while the epoxy resin plays a role in bonding and supporting the conductive filler. The thickness of the conductive colloid layer 3 is usually between 20 μm and 35 μm to facilitate the realization of conductive performance and adhesive performance.

[0031] Further, the release layer 4 is usually a film-like structure made of materials such as PVC or PET. The release layer 4 is arranged under the conductive tape layer 3 to achieve the functions of isolation and easy peeling. First, in the state of the tape roll, the conductive tape layer 3 can be isolated from another elastic covering layer; second, it is convenient for the conductive tape layer 3 to be peeled off from the release layer 4 to realize the function of the release film. Usually, the thickness of the release layer is between 15 μm and 25 μm.

[0032] In summary, the wear-resistant conductive tape of the present utility model is respectively provided with a copper wire array structure 1, an elastic covering layer 2, a conductive colloid layer 3 and a release layer 4; the copper wire array structure 1 is embedded in the elastic covering layer 2; the conductive colloid layer 3 is arranged adjacent to the copper wire array structure 1 between the release layer 4 and the elastic covering layer 2; the elastic covering layer 2, the conductive colloid layer 3 and the release layer 4 are stacked in sequence. The provided elastic covering layer 2 is used to accommodate the copper wire array structure 1 and can enhance the overall toughness and wear resistance of the conductive tape; the copper wire array structure 1 can be used to enhance the conductive performance and tensile performance of the conductive tape; the conductive colloid layer 3 can be used for adhesion, conduction, signal shielding, etc.; the release layer 4 can be used to isolate the colloid material. Thus, the wear-resistant conductive tape of the present utility model solves the technical problem of how to improve the wear resistance of the conductive tape.

[0033] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of concise description, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification.

[0034] The above-described embodiments only represent several implementation manners of the present utility model. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the utility model patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the utility model patent shall be subject to the appended claims.

Claims

1. A wear-resistant conductive tape, characterized in that, It includes: a copper wire array structure, an elastic covering layer, a conductive colloid layer, and a release layer; the copper wire array structure is embedded in the elastic covering layer; the conductive colloid layer is disposed between the release layer and the elastic covering layer adjacent to the copper wire array structure; the elastic covering layer, the conductive colloid layer, and the release layer are sequentially stacked.

2. The wear-resistant conductive tape according to claim 1, wherein: The copper wire array structure is a single-layer copper wire structure or a multi-layer copper wire structure, and each structural layer of the copper wire array structure is formed by uniformly arranging a plurality of copper wires.

3. The wear-resistant conductive tape according to claim 2, wherein: In the copper wire array structure, the diameter of each copper wire is 25 μm to 50 μm.

4. The wear-resistant conductive tape according to claim 3, characterized in that: In the copper wire array structure, the interval between every two copper wires is a single times the diameter of the copper wire.

5. A wear-resistant conductive tape according to claim 3, characterized in that: In the copper wire array structure, the interval between every two copper wires is 25 μm to 35 μm.

6. A wear-resistant conductive tape according to claim 1, characterized in that: The thickness of the elastic covering layer is two to four times the thickness of the copper wire array structure.

7. The wear-resistant conductive tape according to claim 1, wherein: The thickness of the conductive colloid layer is 20 μm to 35 μm.

8. A wear-resistant conductive tape according to claim 1, wherein: The thickness of the release layer is 20 μm to 35 μm.

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