Ingot protection plate assembly suitable for electroslag remelting and electroslag remelting equipment
A modular shield plate assembly for EAFs addresses high costs by stabilizing the inner plate's position and preventing deformation, facilitating reuse and reducing material and labor expenses.
Patent Information
- Application Number
- CN202422345420.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-09-25
AI Technical Summary
Traditional electric arc furnace (EAF) steelmaking processes face high costs due to the need for cutting and handling large, heavy shield plates after melting, leading to increased material and labor expenses.
A modular shield plate assembly for EAFs, comprising an inner shield plate and a frame with an insulating filler, which stabilizes the inner plate's position and prevents deformation, allowing reuse and reducing the need for post-melting cutting.
The solution reduces material and labor costs by enabling reuse of the shield plate assembly, minimizing deformation, and enhancing operational efficiency.
Smart Images
Figure CN223103045U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroslag remelting, in particular to a ingot protecting plate assembly applicable to electroslag remelting and an electroslag remelting device. Background Technique
[0002] The ingot protecting plate for electroslag remelting is a steel plate placed between the copper panel of the bottom water tank of electroslag steelmaking and the bottom flange of the mold. Then, the mold for electroslag remelting is installed on the steel plate. Its main functions are the copper panel of the bottom water tank and conduction of electricity. The traditional ingot protecting plate is a whole steel plate, which is connected to the electroslag ingot after remelting. When the electroslag ingot is stored or further processed, the ingot protecting plate at one end of the electroslag ingot is too large, and the redundant edge part needs to be cut by manual flame cutting, so that the diameter of the ingot protecting plate is close to that of the electroslag ingot, which is convenient for the electroslag ingot to be stored or further processed. However, due to the large size and heavy weight of the traditional ingot protecting plate, the peripheral part also needs to be cut by flame during the electroslag remelting process, which not only results in a high consumption cost of the ingot protecting plate per ton of steel, but also increases the labor cost.
[0003] Therefore, how to reduce the consumption cost of the ingot protecting plate and the labor cost during the electroslag remelting process is a problem to be solved at present. Content of the Utility Model
[0004] The purpose of the utility model is to provide an ingot protecting plate assembly applicable to electroslag remelting and an electroslag remelting device. The ingot protecting plate assembly is used in the electroslag remelting device. The inner ingot protecting plate and the ingot protecting plate frame are separately arranged. The ingot protecting plate assembly can be reused, is not easy to deform, and has a long service life. Compared with the prior art, the consumption cost of the ingot protecting plate per ton of steel and the processing cost are effectively reduced.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] An ingot protecting plate assembly applicable to electroslag remelting, comprising:
[0007] An inner ingot protecting plate, which is used to be arranged on the copper panel above the bottom water tank and is used to face the inner cavity of the mold. When the inner ingot protecting plate faces the inner cavity of the mold, the orthographic projection of the inner cavity of the mold on the inner ingot protecting plate is located inside the inner ingot protecting plate;
[0008] The ingot guard board frame is used to be arranged on the copper panel and surround the outer peripheral side of the inner ingot guard board. An annular gap is formed between the inner edge of the ingot guard board frame and the outer edge of the inner ingot guard board. The ingot guard board frame includes a first frame plate and a second frame plate. The first frame plate and the second frame plate are located on opposite sides of the inner ingot guard board. The first frame plate and the second frame plate are opposite and separated, and the separation area between the first frame plate and the second frame plate communicates with the annular gap.
[0009] Insulating filler filled in the annular gap and the separation area.
[0010] The above ingot guard board assembly is used for electroslag remelting. The inner ingot guard board protects the copper panel on the bottom water tank. On the outer peripheral side of the inner ingot guard board, the ingot guard board frame and the inner ingot guard board together play a protective role for the copper panel. And the ingot guard board frame is padded between the bottom flange of the mold and the copper panel on the outer peripheral side. And insulating filler is filled in the annular gap between the ingot guard board frame and the inner ingot guard board, which can make the position of the inner ingot guard board more stable, effectively prevent the inner ingot guard board from shifting during the installation process. The ingot guard board frame is set as the separated first frame plate and second frame plate, which can greatly improve the situation that the ingot guard board frame is deformed by pressure, extrusion, etc., ensure that the overall shape of the ingot guard board frame remains persistent, is not easy to deform, and extends the service life. After the electroslag remelting is completed, the electroslag ingot formed in the inner cavity of the mold is connected with the inner ingot guard board. The diameter of the inner ingot guard board is not much different from the inner diameter of the mold cavity. Therefore, the inner ingot guard board taken away after the formation of the electroslag ingot does not need to be cut again, reducing the manual labor intensity and processing cost, improving the work efficiency, and the surrounding ingot guard board frame will not be affected too much by the remelting and can be reused. It can be combined with a new inner ingot guard board for the next electroslag remelting, greatly reducing the consumption of the ingot guard board per ton of steel and reducing the cost of the ingot guard board per ton of steel.
[0011] Optionally, the ingot guard board frame is fixedly connected to the copper panel.
[0012] Optionally, the distance between the edge of the inner cavity of the mold and the edge of the inner ingot guard board is less than or equal to 5 mm.
[0013] Optionally, along the radial direction of the inner ingot guard board, the size of the annular gap is greater than or equal to 5 mm and less than or equal to 10 mm.
[0014] Optionally, the separation distance between the first frame plate and the second frame plate is greater than or equal to 5 mm and less than or equal to 10 mm.
[0015] Optionally, the inner ingot guard board and the ingot guard board frame are made of the same material, and the material of the inner ingot guard board is Q235 low-carbon steel plate.
[0016] Optionally, the thickness of the inner ingot guard plate is the same as that of the frame of the ingot guard plate, and the thickness of the inner ingot guard plate is greater than or equal to 10 mm and less than or equal to 20 mm.
[0017] Optionally, the insulating filler is solid steelmaking slag material.
[0018] Optionally, the shape of the inner edge of the frame of the ingot guard plate facing the inner ingot guard plate is adapted to the shape of the outer peripheral edge of the inner ingot guard plate;
[0019] The overall outer shape of the outer peripheral side of the frame of the ingot guard plate is circular or rectangular.
[0020] Based on the same design concept, this solution also provides an electroslag remelting device, including a bottom water tank, a copper panel, a mold, and any one of the ingot guard plate assemblies provided by the above technical solution. The copper panel is arranged on the top side of the bottom water tank. The ingot guard plate assembly is laid on the copper panel. The mold is located on the side of the ingot guard plate assembly away from the copper panel, and the inner cavity of the mold faces the inner ingot guard plate of the ingot guard plate assembly. The flange at the bottom of the mold is fixedly connected to the copper panel. Description of the Drawings
[0021] The schematic diagrams in the specification forming a part of this application are used to provide a further understanding of the present utility model. The schematic embodiments and descriptions thereof of the present utility model are used to explain the present utility model and do not constitute an improper limitation to the present utility model. Among them:
[0022] Figure 1 It is a schematic structural diagram of an electroslag remelting device provided by this embodiment;
[0023] Figure 2 It is a schematic diagram of the mechanism of an ingot guard plate assembly provided by this embodiment;
[0024] Figure 3 It is a schematic diagram of the mechanism of another ingot guard plate assembly provided by this embodiment.
[0025] Reference numerals: 1 - bottom water tank; 2 - copper panel; 3 - mold; 4 - ingot guard plate assembly; 41 - inner ingot guard plate; 42 - first frame plate; 43 - second frame plate; 44 - annular gap. Detailed Description of the Embodiment
[0026] The present utility model will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments. Each example is provided by way of explanation of the present utility model rather than a limitation thereof. In fact, those skilled in the art will appreciate that modifications and variations can be made to the present utility model without departing from the scope or spirit thereof. For example, features shown or described as part of one embodiment can be used in another embodiment to yield yet another embodiment. Accordingly, it is intended that the present utility model encompass such modifications and variations as fall within the scope of the appended claims and their equivalents.
[0027] In the description of the present utility model, the orientation or positional relationships indicated by the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model rather than requiring the present utility model to be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present utility model. The terms "connected", "joined", and "disposed" used in the present utility model should be understood in a broad sense. For example, they can be fixedly connected or detachably connected; they can be directly connected or indirectly connected through intermediate components. For those of ordinary skill in the art, the specific meanings of the above terms can be understood according to specific circumstances.
[0028] Refer to Figure 1 , Figure 2 and Figure 3As shown in the figure, the present utility model provides a ingot protecting plate assembly applicable to electroslag remelting. Among them, the electroslag remelting equipment includes a bottom water tank 1, a copper panel 2 and a mold 3. The copper panel 2 is arranged on the top side of the bottom water tank 1, and the mold 3 is arranged above the copper panel 2. The ingot protecting plate assembly 4 of this embodiment is used to be arranged between the copper panel 2 and the mold 3, and specifically includes: an inner ingot protecting plate 41, an ingot protecting plate frame and an insulating filler. The inner ingot protecting plate 41 is used to be arranged on the copper panel 2 above the bottom water tank 1, and the inner ingot protecting plate 41 is used to face the inner cavity of the mold 3. When the inner ingot protecting plate 41 faces the inner cavity of the mold 3, the orthographic projection of the inner cavity of the mold 3 on the inner ingot protecting plate 41 is located within the inner ingot protecting plate 41. The diameter D of the inner ingot protecting plate 41 is set to be greater than or equal to the inner cavity diameter of the mold 3; the ingot protecting plate frame is used to be arranged on the copper panel 2 and surround the outer peripheral side of the inner ingot protecting plate 41. An annular gap 44 is formed between the inner edge of the ingot protecting plate frame and the outer edge of the inner ingot protecting plate 41; the ingot protecting plate frame includes a first frame plate 42 and a second frame plate 43. The first frame plate 42 and the second frame plate 43 are located on opposite sides of the inner ingot protecting plate 41. The first frame plate 42 and the second frame plate 43 are opposite and separated, and the separation area between the first frame plate 42 and the second frame plate 43 is communicated with the annular gap 44; the insulating filler is filled in the annular gap 44 and the separation area. The insulating filler is only in contact with the inner ingot protecting plate 41 and has no connection relationship. Among them, the insulating filler can be solid steelmaking slag material. The solid steelmaking slag material is non-conductive and is filled around the inner ingot protecting plate 41, which can fix the position of the inner ingot protecting plate 41, making the inner ingot protecting plate 41 not easy to shift and preventing the inner ingot protecting plate 41 from moving.
[0029] The above ingot guard plate assembly 4 is used for electroslag remelting. The inner ingot guard plate 41 protects the copper panel 2 on the bottom water tank 1. On the outer peripheral side of the inner ingot guard plate 41, the ingot guard plate frame and the inner ingot guard plate 41 together play a role in protecting the copper panel 2. And the ingot guard plate frame is padded between the bottom flange of the mold 3 and the copper panel 2 on the outer peripheral side. And an insulating filler is filled in the annular gap 44 between the ingot guard plate frame and the inner ingot guard plate 41, which can make the position of the inner ingot guard plate 41 more stable and can effectively prevent the inner ingot guard plate 41 from shifting during the installation process. The ingot guard plate frame is set as the separated first frame plate 42 and second frame plate 43, which can greatly improve the situation that the ingot guard plate frame is deformed by pressure, extrusion force, etc., ensure that the overall shape of the ingot guard plate frame remains persistent, is not easily deformed, and extends the service life. After the electroslag remelting is completed, the electroslag ingot formed in the inner cavity of the mold 3 is connected to the internal ingot guard plate. The diameter of the internal ingot guard plate is not much different from the inner cavity diameter of the mold 3. Therefore, the inner ingot guard plate 41 taken away after the formation of the electroslag ingot does not need to be cut again, reducing the labor intensity and processing cost, and also improving the work efficiency. And the surrounding ingot guard plate frame will not be affected too much by the remelting and can be reused. It can be combined with a new inner ingot guard plate for the next electroslag remelting, greatly reducing the consumption of ingot guard plates per ton of steel and reducing the cost of ingot guard plates per ton of steel.
[0030] In the above ingot guard plate assembly for electroslag remelting, the ingot guard plate frame is used for fixedly connecting with the copper panel 2. As a preferred method, the ingot guard plate frame can be welded on the copper panel 2, or connected to the copper panel 2 by bolts, or adhered to the copper panel 2. Directly fixedly connecting the ingot guard plate frame with the copper panel 2 increases the stability of the ingot guard plate frame on the copper panel 2 and is beneficial to ensuring the position stability of the inner ingot guard plate 41.
[0031] Refer to Figure 1 and Figure 2 As shown, in the radial direction of the ingot guard plate, the distance between the edge of the inner cavity of the mold 3 and the edge of the inner ingot guard plate 41 is less than or equal to 5 mm. The diameter of the inner ingot guard plate 41 is slightly larger than the inner cavity of the mold 3, so that after the electroslag ingot is connected to the inner ingot guard plate 41, it will not affect the subsequent processing or storage of the electroslag ingot, and also when the mold 3 is connected to the copper panel 2, the inner ingot guard plate 41 can completely block the inner cavity of the mold 3, so that the slag material in the inner cavity will not leak out and the position of the inner ingot guard plate 41 is not easy to move. Preferably, the distance between the edge of the inner cavity of the mold 3 and the edge of the inner ingot guard plate 41 can be 2 mm, 3 mm or 4 mm, or other values, and this embodiment is not limited.
[0032] As Figure 3As shown, for the spacing setting of the annular gap 44, in the radial direction along the inner ingot guard plate 41, the dimension H1 of the annular gap 44 is greater than or equal to 5 mm and less than or equal to 10 mm. Preferably, the dimension H1 of the annular gap 44 can be set to 6 mm, 6.5 mm, 7 mm, 8 mm or 9 mm, and can be specifically set adaptively according to the size of the inner ingot guard plate 41, ensuring that there is enough gap between the inner ingot guard plate 41 and the ingot guard plate frame, and not too large, ensuring that the ingot guard plate frame can be well cushioned between the bottom flange of the mold 3 and the copper panel 2.
[0033] Continue to refer to Figure 3 As shown, the inner ingot guard plate 41 is located between the middle parts of the first frame plate 42 and the second frame plate 43. The first frame plate 42 and the second frame plate 43 are opposite and form an ingot guard plate frame surrounding the inner ingot guard plate 41. The first frame plate 42 and the second frame plate 43 are separately arranged and separated from each other. Among them, the separation spacing H2 between the first frame plate 42 and the second frame plate 43 is set to be greater than or equal to 5 mm and less than or equal to 10 mm, so that there is a gap between them. When being stressed between the copper panel 2 and the bottom flange of the mold 3, there is a certain deformation gap, so that the whole ingot guard plate frame will not deform, and the separation spacing H2 can specifically be 6 mm, 7 mm, 8 mm or 9 mm, and can be set adaptively according to the overall size of the ingot guard plate frame. This embodiment is not specifically limited.
[0034] As a possible option, the material of the inner ingot guard plate and the ingot guard plate frame is the same, and the materials of both the inner ingot guard plate and the ingot guard plate frame are Q235 low-carbon steel plates. And the thickness of the inner ingot guard plate is set to be the same as the thickness of the ingot guard plate frame. The thicknesses of both the inner ingot guard plate and the ingot guard plate frame are set to be greater than or equal to 10 mm and less than or equal to 20 mm. Preferably, the thicknesses of the inner ingot guard plate and the ingot guard plate frame can be set to 12 mm, 13 mm, 14 mm, 15 mm, 16 mm, 17 mm, 18 mm or 19 mm, and can be set adaptively according to the diameter size of the inner ingot guard plate. This embodiment is not limited.
[0035] As a specific setting method, as Figure 2 and Figure 3 shown, the shape of the inner edge of the ingot guard plate frame facing the inner ingot guard plate 41 is adapted to the outer peripheral shape of the inner ingot guard plate 41, so that the inner hole of the ingot guard plate frame for accommodating the ingot guard plate is similar to the outer shape of the inner ingot guard plate 41, and the spacing at each part of the annular gap 44 can be made uniform.
[0036] Furthermore, as Figure 2 and Figure 3 shown, the overall outer shape of the outer peripheral side of the ingot guard plate frame is circular or rectangular, which is convenient for manufacturing.
[0037] Based on the same design concept, as Figure 1As shown in the figure, this embodiment also provides an electroslag remelting device, which specifically includes a bottom water tank 1, a copper panel 2, a mold 3, and any one of the ingot protecting plate assemblies 4 provided in the above embodiment. The copper panel 2 is arranged on the top side of the bottom water tank 1. The ingot protecting plate assembly 4 is laid on the copper panel 2. The mold 3 is located on the side of the ingot protecting plate assembly 4 away from the copper panel 2, and the inner cavity of the mold 3 faces the inner ingot protecting plate 41 of the ingot protecting plate assembly 4. The flange at the bottom of the mold 3 is fixedly connected to the copper panel 2.
[0038] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.
Claims
1. A ingot protecting plate assembly applicable to electroslag remelting, characterized in that, Comprising: An inner ingot guard plate, which is used to be arranged on a copper panel above a bottom water tank, and the inner ingot guard plate is used to face the inner cavity of a mold. When the inner ingot guard plate faces the inner cavity of the mold, the orthographic projection of the inner cavity of the mold on the inner ingot guard plate is located inside the inner ingot guard plate; An ingot guard plate frame, which is used to be arranged on the copper panel and surround the outer peripheral side of the inner ingot guard plate. An annular gap is formed between the inner edge of the ingot guard plate frame and the outer edge of the inner ingot guard plate; the ingot guard plate frame includes a first frame plate and a second frame plate. The first frame plate and the second frame plate are located on two opposite sides of the inner ingot guard plate. The first frame plate and the second frame plate are opposite and separated, and the separated area between the first frame plate and the second frame plate communicates with the annular gap; An insulating filler filled in the annular gap and the separated area.
2. The ingot protecting plate assembly applicable to electroslag remelting according to claim 1, characterized in that, The ingot guard plate frame is fixedly connected to the copper panel.
3. The ingot protecting plate assembly applicable to electroslag remelting according to claim 1, wherein The distance between the edge of the inner cavity of the mold and the edge of the inner ingot guard plate is less than or equal to 5 mm.
4. The ingot protecting plate assembly applicable to electroslag remelting according to claim 1, characterized in that, In the radial direction of the inner ingot guard plate, the size of the annular gap is greater than or equal to 5 mm and less than or equal to 10 mm.
5. The ingot protecting plate assembly applicable to electroslag remelting according to claim 1, characterized in that, The separation distance between the first frame plate and the second frame plate is greater than or equal to 5 mm and less than or equal to 10 mm.
6. The ingot protecting plate assembly applicable to electroslag remelting according to claim 1, characterized in that, The inner ingot guard plate and the ingot guard plate frame are made of the same material, and the material of the inner ingot guard plate is Q235 low-carbon steel plate.
7. The ingot protecting plate assembly applicable to electroslag remelting according to claim 6, characterized in that, The thickness of the inner ingot guard plate is the same as the thickness of the ingot guard plate frame. The thickness of the inner ingot guard plate is greater than or equal to 10 mm and less than or equal to 20 mm.
8. The ingot protecting plate assembly applicable to electroslag remelting according to any one of claims 1-7, characterized in that, The insulating filler is solid steelmaking slag material.
9. The ingot protecting plate assembly applicable to electroslag remelting according to claim 1, characterized in that, The shape of the inner side edge of the ingot guard plate frame facing the inner ingot guard plate is adapted to the shape of the outer peripheral edge of the inner ingot guard plate; The overall outer shape of the outer peripheral side of the ingot guard plate frame is circular or rectangular.
10. An electroslag remelting device, characterized in that, Comprising a bottom water tank, a copper panel, a mold and an ingot guard plate assembly according to any one of claims 1-9. The copper panel is arranged on the top side of the bottom water tank. The ingot guard plate assembly is laid on the copper panel. The mold is located on the side of the ingot guard plate assembly away from the copper panel, and the inner cavity of the mold faces the inner ingot guard plate of the ingot guard plate assembly. The flange at the bottom of the mold is fixedly connected to the copper panel.