Maintenance test equipment for double-layer mobile phone mainboard

Abstract

The utility model relates to the technical field of mainboard maintenance, in particular to maintenance test equipment for a double-layer mobile phone mainboard. Comprising a lower frame, a moving frame is slidably arranged on the upper surface of the lower frame, a displacement mechanism is arranged on the moving frame and used for driving the moving frame to move horizontally, and a pressing mechanism is arranged at the top of the moving frame and comprises a positioning frame fixedly connected to the upper surface of the moving frame. After a thin plate obtained after a double-layer main plate is disassembled is placed on the upper placing plate and a thick plate obtained after the double-layer main plate is disassembled is placed on the lower placing plate, the positions of the lower placing plate and the pressing mechanism are adjusted, so that the pressing plate, the upper placing plate and the lower placing plate are sequentially and vertically arranged again from top to bottom; the upper placing plate is pressed in the direction close to the lower placing plate through the pressing plate, the two plates are electrically connected through the probe, then the two disassembled single-layer mainboards are tested, and abnormal functional modules are rapidly detected.

Description

Technical Field

[0001] The utility model relates to the technical field of motherboard maintenance, and specifically, to a maintenance and test device for a double-layer mobile phone motherboard. Background Technique

[0002] During the processing and testing of a mobile phone motherboard, two single-layer motherboards are welded together through pads between them to form a double-layer motherboard.

[0003] For an abnormal double-layer motherboard during testing, it is necessary to use an instrument to separate the double-layer motherboard into two single-layer motherboards, then perform maintenance by measuring with a manual multimeter, and then assemble the two single-layer motherboards into a double-layer motherboard and place it in a test device for testing. If an abnormality occurs again during the testing of the double-layer motherboard, it is necessary to disassemble and repair it again. The maintenance and test process is complex and the maintenance cycle is long. It has become an urgent need to quickly detect the functions of the double-layer motherboard and the two single-layer motherboards. In view of this, we propose a maintenance and test device for a double-layer mobile phone motherboard. Content of the Utility Model

[0004] The purpose of the utility model is to provide a maintenance and test device for a double-layer mobile phone motherboard to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, one of the purposes of the utility model is to provide a maintenance and test device for a double-layer mobile phone motherboard, including a lower frame. A moving frame is slidably arranged on the upper surface of the lower frame. A displacement mechanism is arranged on the moving frame, and the displacement mechanism is used to drive the moving frame to move horizontally. A pressing mechanism is arranged on the top of the moving frame. The pressing mechanism includes a positioning frame fixedly connected to the upper surface of the moving frame. Inside the positioning frame, a pressing plate, an upper loading plate assembly, and a lower loading plate assembly are sequentially arranged from top to bottom. The upper loading plate assembly is used to place the thinner plate after the double-layer motherboard is disassembled, and the lower loading plate assembly is used to place the thicker plate after the double-layer motherboard is disassembled.

[0006] As a further improvement of this technical solution, the upper loading plate assembly includes an upper placement plate. Spring telescopic rods are fixedly connected to the positions near the four corners of the lower surface of the upper placement plate. The lower ends of the spring telescopic rods are fixedly connected to the upper surface of the lower frame. A plurality of probes are fixedly connected to the lower surface of the upper placement plate.

[0007] As a further improvement of this technical solution, the lower loading plate assembly includes a bottom tray slidably arranged on the upper surface of the lower frame. An electric telescopic rod is fixedly connected to the upper surface of the lower frame. One end of the electric telescopic rod is fixedly connected to the side wall of the bottom tray. The electric telescopic rod is used to drive the bottom tray to move horizontally. A lower placement plate is arranged above the bottom tray.

[0008] As a further improvement of the technical solution, a plurality of guide rods are fixedly connected to the upper surface of the bottom bracket. The upper ends of the guide rods penetrate through the side wall of the lower placement plate, and a compensation spring is sleeved on the outer side of the guide rods at the position between the bottom bracket and the lower placement plate.

[0009] As a further improvement of the technical solution, the pressing mechanism further includes a cylinder fixedly connected to the top of the positioning frame. The lower end of the piston rod of the cylinder is fixedly connected to the pressing plate. When the piston rod of the cylinder extends to drive the pressing plate to move vertically downward, the pressing plate presses the upper placement plate in the direction close to the lower placement plate, so that the upper placement plate is electrically connected to the lower placement plate through the probe.

[0010] As a further improvement of the technical solution, the displacement mechanism includes a lead screw rotatably connected inside the lower frame. One end of the lead screw is provided with a motor for driving the lead screw to rotate. A nut is threadedly connected to the lead screw, and a connecting member is fixedly connected to one side of the nut. The connecting member is fixedly connected to one side of the moving frame.

[0011] As a further improvement of the technical solution, an outer cover is fixedly connected to the upper surface of the lower frame, and a protective shell is fixedly connected to the upper surface of the moving frame. The protective shell is sleeved outside the positioning frame and the cylinder, and one end of the protective shell extends into the interior of the outer cover.

[0012] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0013] For the maintenance and testing equipment of the double-layer mobile phone motherboard, after the thin plate obtained by disassembling the double-layer motherboard is placed on the upper placement plate and the thick plate obtained by disassembling the double-layer motherboard is placed on the lower placement plate, the positions of the lower placement plate and the pressing mechanism are adjusted to make the pressing plate, the upper placement plate and the lower placement plate vertically arranged in sequence from top to bottom again. Then, the pressing plate presses the upper placement plate in the direction close to the lower placement plate, and the two plates are electrically connected through the probe, so as to test the two disassembled single-layer motherboards and quickly detect the abnormal functional modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is the overall structural schematic diagram of the present utility model;

[0015] Figure 2 is the overall structural schematic diagram of the present utility model after removing the outer cover;

[0016] Figure 3 is the structural schematic diagram of the displacement mechanism of the present utility model;

[0017] Figure 4 is the structural schematic diagram of the pressing mechanism of the present utility model;

[0018] Figure 5Schematic diagram of the installation of the pressing plate, the uploading plate assembly and the downloading plate assembly of the present utility model;

[0019] Figure 6 Schematic diagram of the structure of the uploading plate assembly and the downloading plate assembly of the present utility model;

[0020] Figure 7 For the present utility model Figure 6 Enlarged view of the structure at position A in

[0021] The meanings of each label in the figure are as follows:

[0022] 1. Lower frame; 2. Outer cover; 3. Protective shell; 4. Moving frame;

[0023] 5. Displacement mechanism; 51. Lead screw; 52. Nut;

[0024] 6. Pressing mechanism; 61. Positioning frame; 62. Cylinder; 63. Pressing plate;

[0025] 7. Uploading plate assembly; 71. Upper placing plate; 72. Spring telescopic rod; 73. Probe;

[0026] 8. Downloading plate assembly; 81. Bottom support; 82. Lower placing plate; 83. Electric telescopic rod; 84. Guide rod; 85. Compensation spring. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0028] Embodiment 1

[0029] Please refer to Figure 1 , Figure 2 and Figure 5As shown in the figure, this embodiment provides a maintenance and testing device for a double-layer mobile phone motherboard, including a lower frame 1. A moving frame 4 is slidably arranged on the upper surface of the lower frame 1. A displacement mechanism 5 is arranged on the moving frame 4. The displacement mechanism 5 is used to drive the moving frame 4 to move horizontally. A housing 2 is fixedly connected to the upper surface of the lower frame 1. A protective shell 3 is fixedly connected to the upper surface of the moving frame 4. One end of the protective shell 3 extends into the interior of the housing 2. The protective shell 3 is slidably arranged on the inner wall of the housing 2. When the moving frame 4 moves horizontally, it drives the protective shell 3 to slide along the inner wall of the housing 2. A pressing mechanism 6 is arranged on the top of the moving frame 4. The pressing mechanism 6 includes a positioning frame 61 fixedly connected to the upper surface of the moving frame 4. Inside the positioning frame 61, a pressing plate 63, an upper loading plate assembly 7, and a lower loading plate assembly 8 are arranged in sequence from top to bottom. The upper loading plate assembly 7 is used to place the thinner plates after the double-layer motherboard is disassembled. The lower loading plate assembly 8 is used to place the thicker plates after the double-layer motherboard is disassembled. By making the displacement mechanism 5 drive the moving frame 4 and the pressing mechanism 6 to move horizontally deep into the housing 2, the pressing plate 63 can be moved away from directly above the upper loading plate assembly 7, facilitating the placement of the thinner plates after the double-layer motherboard is disassembled on the upper loading plate assembly 7. By making the lower loading plate assembly 8 move horizontally away from the housing 2, the lower loading plate assembly 8 is moved out from directly below the upper loading plate assembly 7, facilitating the placement of the thicker plates after the double-layer motherboard is disassembled on the lower loading plate assembly 8. Then, the positions of the lower loading plate assembly 8 and the pressing mechanism 6 are adjusted so that the pressing mechanism 6, the upper loading plate assembly 7, and the lower loading plate assembly 8 are vertically arranged in sequence from top to bottom again. Then, by pressing the upper loading plate assembly 7 towards the lower loading plate assembly 8 with the pressing plate 63, the two plates obtained after the double-layer motherboard is disassembled can be brought closer together, facilitating the electrical connection of the two plates and testing the plates. During the testing process, the protective shell 3 provides comprehensive protection for the pressing mechanism 6, the upper loading plate assembly 7, and the lower loading plate assembly 8, preventing the pressing mechanism 6, the upper loading plate assembly 7, and the lower loading plate assembly 8 from being damaged by being hit by hard objects.

[0030] In order to drive the moving frame 4 and the pressing mechanism 6 to move horizontally deep into the housing 2, move the pressing plate 63 away from directly above the upper loading plate assembly 7, and facilitate the placement of the thinner plates after the double-layer motherboard is disassembled on the upper loading plate assembly 7, the structure of the displacement mechanism 5 is refined as follows. Refer to Figure 3 and Figure 4, the displacement mechanism 5 includes a lead screw 51 rotatably connected inside the lower frame 1. One end of the lead screw 51 is equipped with a motor for driving the rotation of the lead screw 51. A nut 52 is threadedly connected to the lead screw 51. One side of the nut 52 is fixedly connected with a connecting piece, and the connecting piece is fixedly connected with one side of the moving frame 4. After starting the motor, the output shaft of the motor drives the lead screw 51 to rotate. Through the threaded connection between the lead screw 51 and the nut 52, the nut 52 moves horizontally along the axis of the lead screw 51. The moving nut 52 drives the moving frame 4 to move synchronously through the connecting piece, so that the moving frame 4 drives the pressing mechanism 6 to move horizontally deep into the outer cover 2, and then moves the pressing plate 63 away from directly above the upper loading plate assembly 7, facilitating the placement of the thinner plate after disassembling the double-layer main board on the upper loading plate assembly 7.

[0031] In order to enable the lower loading plate assembly 8 to move horizontally away from the outer cover 2, so that the lower loading plate assembly 8 moves out from directly below the upper loading plate assembly 7, facilitating the placement of the thicker plate after disassembling the double-layer main board on the lower loading plate assembly 8, the structure of the lower loading plate assembly 8 is refined as follows. Refer to Figure 5 , the lower loading plate assembly 8 includes a bottom tray 81 slidably arranged on the upper surface of the lower frame 1. An electric telescopic rod 83 is fixedly connected to the upper surface of the lower frame 1. One end of the electric telescopic rod 83 is fixedly connected to the side wall of the bottom tray 81. The electric telescopic rod 83 is used to drive the bottom tray 81 to move horizontally. A lower placement plate 82 is arranged above the bottom tray 81. After starting the electric telescopic rod 83, the electric telescopic rod 83 extends to drive the bottom tray 81 to move horizontally away from the outer cover 2, and the bottom tray 81 drives the lower placement plate 82 to move synchronously, so that the lower loading plate assembly 8 can be moved out from directly below the upper loading plate assembly 7, facilitating the placement of the thicker plate after disassembling the double-layer main board on the lower loading plate assembly 8.

[0032] By rotating the output shaft of the motor in the reverse direction, the moving frame 4 and the pressing mechanism 6 can be moved horizontally outside the outer cover 2, and the pressing plate 63 can be moved directly above the thinner plate after disassembling the double-layer main board. By contracting the electric telescopic rod 83 to drive the bottom tray 81 and the lower placement plate 82 to move horizontally towards the outer cover 2, the thicker plate after disassembling the double-layer main board can be moved directly below the thinner plate after disassembling the double-layer main board.

[0033] In order to enable the pressing plate 63 to press the upper placement plate 71 towards the lower placement plate 82, so that the two plates after disassembling the double-layer main board approach each other, the structures of the pressing mechanism 6 and the upper loading plate assembly 7 are refined as follows. Refer to Figure 5 and Figure 6, the pressing mechanism 6 further includes a cylinder 62 fixedly connected to the top of the positioning frame 61. The lower end of the piston rod of the cylinder 62 is fixedly connected to the pressing plate 63. The upper carrier plate assembly 7 includes an upper placement plate 71. The thinner plate after the double-layer main board is disassembled is placed on the upper surface of the upper placement plate 71. Spring telescopic rods 72 are fixedly connected to the lower surface of the upper placement plate 71 near the four corners. The lower ends of the spring telescopic rods 72 are fixedly connected to the upper surface of the lower frame 1. A plurality of probes 73 are fixedly connected to the lower surface of the upper placement plate 71. When the piston rod of the cylinder 62 extends to drive the pressing plate 63 to move vertically downward, after the pressing plate 63 contacts the upper placement plate 71, it presses the upper placement plate 71 downward, and the spring telescopic rods 72 elastically contract, so that the upper placement plate 71 gradually approaches the lower placement plate 82. The two plates after the double-layer main board is disassembled approach each other until the probes 73 contact the lower placement plate 82, electrically connecting the upper placement plate 71 and the lower placement plate 82. The two plates after the double-layer main board is disassembled are electrically connected through the probes 73 and the circuits etched on the upper placement plate 71 and the lower placement plate 82. Both the upper placement plate 71 and the lower placement plate 82 are electrically connected to an external upper computer. The upper computer is used to send instructions to test the two plates after the double-layer main board is disassembled, and the test results are transmitted back to the upper computer to complete the test.

[0034] In order to prevent the pressing plate 63 from pressing the upper placement plate 71 with too large a stroke, resulting in the upper placement plate 71 applying too large a pressure to the lower placement plate 82 and causing potential damage to the upper placement plate 71 and the lower placement plate 82, referring to Figure 7 , a plurality of guide rods 84 are fixedly connected to the upper surface of the bottom bracket 81. The upper ends of the guide rods 84 penetrate through the side wall of the lower placement plate 82. A compensation spring 85 is sleeved on the outer side of the guide rods 84 at the position between the bottom bracket 81 and the lower placement plate 82. When the upper placement plate 71 applies pressure to the lower placement plate 82, the upper placement plate 71 pushes the lower placement plate 82 to move vertically upward along the outer wall of the guide rod 84, and the compensation spring 85 elastically contracts to offset part of the pressure, preventing the lower placement plate 82 from being damaged due to excessive pressure. At the same time, when the bottom bracket 81 moves horizontally, the bottom bracket 81 drives the lower placement plate 82 to move horizontally synchronously through the guide rods 84 and the compensation spring 85, facilitating the movement of the thicker plate after the double-layer main board is disassembled to directly below the thinner plate after the double-layer main board is disassembled.

[0035] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and do not limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A repair and test device for a double-layer mobile phone motherboard, including a lower frame (1), characterized in that: A moving frame (4) is slidably arranged on the upper surface of the lower frame (1). A displacement mechanism (5) is arranged on the moving frame (4), and the displacement mechanism (5) is used to drive the moving frame (4) to move horizontally. A pressing mechanism (6) is arranged on the top of the moving frame (4). The pressing mechanism (6) includes a positioning frame (61) fixedly connected to the upper surface of the moving frame (4). Inside the positioning frame (61), a pressing plate (63), an upper loading plate assembly (7) and a lower loading plate assembly (8) are sequentially arranged from top to bottom. The upper loading plate assembly (7) is used to place the thinner plates after the double-layer main board is disassembled, and the lower loading plate assembly (8) is used to place the thicker plates after the double-layer main board is disassembled.

2. The repair and test equipment for the double-layer mobile phone main board according to claim 1, characterized in that: The upper loading plate assembly (7) includes an upper placing plate (71). Spring telescopic rods (72) are fixedly connected to the positions near the four corners of the lower surface of the upper placing plate (71). The lower ends of the spring telescopic rods (72) are fixedly connected to the upper surface of the lower frame (1). A plurality of probes (73) are fixedly connected to the lower surface of the upper placing plate (71).

3. The repair and test equipment for the double-layer mobile phone motherboard according to claim 2, characterized in that: The lower loading plate assembly (8) includes a bottom tray (81) slidably arranged on the upper surface of the lower frame (1). An electric telescopic rod (83) is fixedly connected to the upper surface of the lower frame (1). One end of the electric telescopic rod (83) is fixedly connected to the side wall of the bottom tray (81). The electric telescopic rod (83) is used to drive the bottom tray (81) to move horizontally. A lower placing plate (82) is arranged above the bottom tray (81).

4. The repair and test equipment for the double-layer mobile phone main board according to claim 3, characterized in that: A plurality of guide rods (84) are fixedly connected to the upper surface of the bottom tray (81). The upper ends of the guide rods (84) penetrate through the side wall of the lower placing plate (82). A compensation spring (85) is sleeved on the outer side of the guide rods (84) at the position between the bottom tray (81) and the lower placing plate (82).

5. The repair and test device for the double-layer mobile phone main board according to claim 3, wherein: The pressing mechanism (6) further includes a cylinder (62) fixedly connected to the top of the positioning frame (61). The lower end of the piston rod of the cylinder (62) is fixedly connected to the pressing plate (63). When the piston rod of the cylinder (62) extends to drive the pressing plate (63) to move vertically downward, the pressing plate (63) presses the upper placing plate (71) in the direction close to the lower placing plate (82), so that the upper placing plate (71) is electrically connected to the lower placing plate (82) through the probes (73).

6. The repair and test equipment for the double-layer mobile phone main board according to claim 1, wherein: The displacement mechanism (5) includes a lead screw (51) rotatably connected inside the lower frame (1). One end of the lead screw (51) is equipped with a motor for driving the lead screw (51) to rotate. A nut (52) is threadedly connected to the lead screw (51). A connecting piece is fixedly connected to one side of the nut (52), and the connecting piece is fixedly connected to one side of the moving frame (4).

7. The repair and test equipment for the double-layer mobile phone main board according to claim 5, characterized in that: An outer cover (2) is fixedly connected to the upper surface of the lower frame (1). A protective shell (3) is fixedly connected to the upper surface of the moving frame (4). The protective shell (3) is sleeved outside the positioning frame (61) and the cylinder (62), and one end of the protective shell (3) extends into the inside of the outer cover (2).

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