Glass substrate backlight lamp panel structure

Abstract

The utility model discloses a glass substrate backlight lamp panel structure, which comprises a substrate main body, an FPC (Flexible Printed Circuit) and a plurality of luminous chips, the substrate main body is a glass substrate, a copper foil layer is arranged on the mounting surface of the substrate main body, a plurality of first bonding pads are arranged on the copper foil layer, the FPC is used for being connected with a control circuit and a power supply, and the luminous chips are arranged on the FPC. The FPC is connected with a plurality of metal wires. According to the glass substrate backlight lamp panel structure provided by the utility model, the glass substrate is adopted as the substrate main body, so that the glass substrate backlight lamp panel structure has excellent thermal stability and mechanical strength, can keep stability in high-temperature and high-humidity environments, and has lower thermal expansion coefficient and high flatness, and meanwhile, the copper foil layer is formed on the whole surface of the substrate main body through copper plating to serve as a positive electrode; the metal wire serves as the negative electrode, a complete loop can be formed to control the on-off function of the light-emitting chip, the high-current requirement of a large number of light-emitting chips is met, the technology and material finished products are low, and machining is easy.

Description

Technical Field

[0001] The utility model relates to the technical field of backlight modules, in particular to a glass substrate backlight board structure. Background Art

[0002] The backlight module is a key component of a liquid crystal display panel, which mainly provides a uniformly distributed light source for the liquid crystal display module to enable it to display images normally. The backlight module generally includes a light board, and the light board is connected to an external driving board. The light board is controlled by the driving board to emit light to achieve the display of the backlight module. With the rise of the market for backlight modules of micro light-emitting diodes, the market competition of LED backlight products is becoming increasingly fierce.

[0003] In order to ensure a certain brightness, the existing backlight board needs to increase the number of light-emitting chips corresponding to the backlight board. However, as the number of light-emitting chips increases, the area of the wires used will also increase accordingly. Since most of them adopt the PCB double-layer board or the glass substrate bridging wiring method, not only the process and material costs are relatively high, but also the processing is complex. Summary of the Utility Model

[0004] Based on this, in view of the above technical problems, it is necessary to provide a glass substrate backlight board structure. The substrate body adopts a glass substrate, so that it has excellent thermal stability and mechanical strength, can maintain stability in high-temperature and high-humidity environments, has a low coefficient of thermal expansion and high flatness. At the same time, on the substrate body, copper plating is formed on the entire surface to form a copper foil layer. The copper foil layer is used as the positive electrode of the power supply for multiple light-emitting chips. Then, through metal wiring and FPC, it is connected to the negative electrode of the power supply for multiple light-emitting chips. In this way, when in use, the other end of the FPC on the light board is connected to an external control circuit and power supply, and a complete circuit can be formed to control the on / off function of the light-emitting chips, play the role of controlling the on / off of a single light-emitting chip, and realize that the minimum partition is one lamp, meeting the requirements of a large number of light-emitting chips with high current. Not only the process and material costs are relatively low, but also the processing is simple, reducing the manufacturing cost of the backlight board.

[0005] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0006] A glass substrate backlight board structure includes: a substrate body, an FPC, and multiple light-emitting chips. The substrate body is a glass substrate. A copper foil layer is provided on the mounting surface of the substrate body. Multiple first pads are provided on the copper foil layer. The FPC is used to connect to a control circuit and a power supply. Multiple metal wirings are connected to the FPC. The other end of the metal wiring is fixedly connected with a second pad. The positive electrodes of multiple light-emitting chips are electrically connected to multiple first pads respectively, and the negative electrodes of multiple light-emitting chips are electrically connected to multiple second pads.

[0007] Further, the substrate body is made of tempered glass or plain glass.

[0008] Further, the substrate body is used to ensure good thermal stability and mechanical strength, and the thickness of the substrate body is 0.5 - 4 mm.

[0009] Further, an insulating layer is fixedly connected to the upper surface of the copper foil layer. The insulating layer is an insulating material coated on the upper surface of the copper foil layer, and the first pad is made by exposing the copper foil layer using the screen printing etching paste process.

[0010] Further, the copper foil layer is used to carry the current of multiple light-emitting chips, and the thickness of the copper foil layer is 0.01 - 0.03 mm.

[0011] Further, the insulating layer is used to isolate the copper foil layer from the metal traces, and the thickness of the insulating layer is 1 - 5 μm.

[0012] Further, a white oil layer is fixedly connected to the upper surface of the insulating layer. The white oil layer is used to protect the metal traces and reflect the light emitted by the light-emitting chips. The white oil layer is processed by the yellow light process or the screen printing process, and the thickness of the white oil layer is 5 - 20 μm.

[0013] Further, the metal traces and the second pads are processed by the yellow light process or the screen printing process.

[0014] Further, the light-emitting chip is a top-emitting LED lamp.

[0015] Further, the positive and negative electrodes of the light-emitting chip are respectively welded and fixed to the first pad and the second pad by soldering. The soldering is used to fix the light-emitting chip and ensure a firm connection of the light-emitting chip.

[0016] Compared with the prior art, the present utility model has the following beneficial effects:

[0017] For the glass substrate backlight board structure provided by the present utility model, the substrate body uses a glass substrate, enabling it to have excellent thermal stability and mechanical strength, being able to maintain stability in high-temperature and high-humidity environments, having a low coefficient of thermal expansion and high flatness. At the same time, on the substrate body, copper is plated on the entire surface to form a copper foil layer. The copper foil layer serves as the positive electrode of the power supply for multiple light-emitting chips, and then through the metal traces and the FPC to the negative electrode of the power supply for multiple light-emitting chips. In this way, when in use, the other end of the FPC on the light board is connected to an external control circuit and power supply, which can form a complete circuit to control the on / off function of the light-emitting chip, achieving the on / off control of a single light-emitting chip, realizing the smallest partition as one lamp, meeting the requirements of a large number of high-current light-emitting chips. It not only has a relatively low process and material cost, but also is simple to process, reducing the manufacturing cost of the backlight board. Description of the Drawings

[0018] Figure 1 The front view structural schematic diagram of the backlight board structure for the glass substrate provided by the present utility model;

[0019] Figure 2 The rear view structural schematic diagram of the backlight board structure for the glass substrate provided by the present utility model;

[0020] Figure 3 The Figure 1 enlarged schematic diagram at position A in the backlight board structure for the glass substrate provided by the present utility model;

[0021] Figure 4 The metal trace structure schematic diagram of the backlight board structure for the glass substrate provided by the present utility model;

[0022] Figure 5 The structural schematic diagram of the copper foil layer of the backlight board structure for the glass substrate provided by the present utility model;

[0023] Figure 6 The stacked structure schematic diagram of the backlight board structure for the glass substrate provided by the present utility model.

[0024] The markings in the figure are explained as follows:

[0025] 1. Substrate main body; 2. Copper foil layer; 3. First pad; 4. FPC; 5. Metal trace; 6. Second pad; 7. Insulating layer; 8. Light-emitting chip; 9. White oil layer; 10. Solder. Detailed implementation manners

[0026] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0027] As described in the background art, in order to ensure a certain brightness, the existing backlight board needs to increase the number of light-emitting chips corresponding to the backlight board. However, as the number of light-emitting chips increases, the area of the wires used will also increase accordingly. Since most use the PCB double-layer board or the glass substrate bridging trace method, not only the process and material costs are relatively high, but also the processing is complex.

[0028] To solve this technical problem, the present utility model provides a backlight panel structure for a glass substrate. The substrate body 1 is made of a glass substrate, enabling it to have excellent thermal stability and mechanical strength, maintain stability in high-temperature and high-humidity environments, have a low coefficient of thermal expansion and high flatness. At the same time, on the substrate body 1, copper is plated on the entire surface to form a copper foil layer 2 as the positive electrode, and the metal trace 5 serves as the negative electrode. In this way, when in use, the other end of the FPC 4 on the lamp board is connected to an external control circuit and power supply, forming a complete loop to control the on / off function of the light-emitting chip 8, achieving the on / off control of a single light-emitting chip 8, with the minimum partition being one lamp, meeting the requirements of a large number of light-emitting chips 8 for high current. This not only has relatively low process and material costs but also is simple to process.

[0029] Specifically, please refer to Figures 1-6 , the backlight panel structure for a glass substrate specifically includes:

[0030] The substrate body 1 mainly functions as a substrate. The substrate body 1 is a glass substrate. Using a glass substrate has excellent thermal stability and mechanical strength, can maintain stability in high-temperature and high-humidity environments, has a low coefficient of thermal expansion, and high flatness. On the mounting surface of the substrate body 1, there is a copper foil layer 2, and there are multiple first pads 3 on the copper foil layer 2. Specifically, copper is plated on the entire surface of the glass substrate as the positive electrode of the LED power supply, mainly for conducting electricity, serving as the common positive electrode for multiple light-emitting chips 8 to meet the requirements of a large number of LED lights for high current;

[0031] The FPC 4, one end of the FPC 4 is used to connect to a control circuit and a power supply, and there are multiple metal traces 5 connected to the other end of the FPC 4, and the other end of the metal trace 5 is fixedly connected to a second pad 6;

[0032] Multiple light-emitting chips 8, the positive electrodes of the multiple light-emitting chips 8 are electrically connected to the multiple first pads 3 respectively, and the negative electrodes of the multiple light-emitting chips 8 are electrically connected to the multiple second pads 6.

[0033] For the backlight panel structure for a glass substrate provided by the present utility model, the substrate body 1 is made of a glass substrate, enabling it to have excellent thermal stability and mechanical strength, maintain stability in high-temperature and high-humidity environments, have a low coefficient of thermal expansion and high flatness. At the same time, on the substrate body 1, copper is plated on the entire surface to form a copper foil layer 2. Through the copper foil layer 2 as the positive electrode of the power supply for multiple light-emitting chips 8, and then through the metal trace 5 and the FPC 4 as the negative electrode of the power supply for multiple light-emitting chips 8. In this way, when in use, the other end of the FPC 4 on the lamp board is connected to an external control circuit and power supply, forming a complete loop to control the on / off function of the light-emitting chip 8, achieving the on / off control of a single light-emitting chip 8, with the minimum partition being one lamp, meeting the requirements of a large number of light-emitting chips 8 for high current. This not only has relatively low process and material costs but also is simple to process, reducing the manufacturing cost of the backlight panel.

[0034] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0035] It should be noted that, without conflict, the embodiments in the present utility model and the features and technical solutions in the embodiments can be combined with each other.

[0036] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0037] Please refer to Figures 1-6 , a backlight board structure for a glass substrate, which includes a substrate main body 1, which mainly functions as a substrate. The substrate main body 1 is a glass substrate. Using a glass substrate has excellent thermal stability and mechanical strength, can maintain stability in high-temperature and high-humidity environments, has a low coefficient of thermal expansion, and high flatness. A copper foil layer 2 is provided on the mounting surface of the substrate main body 1. Multiple first pads 3 are provided on the copper foil layer 2. Specifically, copper is plated on the entire surface of the glass substrate as the positive electrode of the LED power supply, which mainly functions as a conductor and serves as the common positive electrode of multiple light-emitting chips 8 to meet the high-current requirements of a large number of LED lights;

[0038] An FPC 4, the FPC 4 is used to connect to a control circuit and a power supply. Multiple metal traces 5 are connected to the FPC 4, and the other ends of the metal traces 5 are fixedly connected to second pads 6;

[0039] Multiple light-emitting chips 8, the positive electrodes of the multiple light-emitting chips 8 are electrically connected to the multiple first pads 3 respectively, and the negative electrodes of the multiple light-emitting chips 8 are electrically connected to the multiple second pads 6.

[0040] Please refer to Figures 1-6 , the substrate main body 1 uses a glass substrate, so that it has excellent thermal stability and mechanical strength, can maintain stability in high-temperature and high-humidity environments, has a low coefficient of thermal expansion and high flatness. At the same time, on the substrate main body 1, copper is plated on the entire surface to form a copper foil layer 2. Through the copper foil layer 2 as the positive electrode of the power supply for multiple light-emitting chips 8, and then through the metal traces 5 and the FPC 4 as the negative electrode of the power supply for multiple light-emitting chips 8. In this way, when in use, the other end of the FPC 4 on the lamp board is connected to an external control circuit and a power supply, and a complete loop can be formed to control the on-off function of the light-emitting chips 8, play the role of controlling the on-off of a single light-emitting chip 8, realize that the minimum partition is one lamp, meet the high-current requirements of a large number of light-emitting chips 8, not only the process and material costs are relatively low, but also the processing is simple, reducing the manufacturing cost of the backlight board.

[0041] The glass substrate backlight board structure provided in Embodiment 1 is further optimized. Specifically, the substrate body 1 is made of tempered glass or plain glass. The substrate body 1 is used to ensure good thermal stability and mechanical strength, and the thickness of the substrate body 1 is 0.5 - 4 mm.

[0042] Through the above structural design, it can be ensured that the substrate body 1 has good thermal stability and mechanical strength and maintains flatness in high-temperature and high-humidity environments.

[0043] The glass substrate backlight board structure provided in Embodiment 1 or 2 is further optimized. As Figure 1 and Figure 6 shown, an insulating layer 7 is fixedly connected to the upper surface of the copper foil layer 2. The insulating layer 7 is an insulating material coated on the upper surface of the copper foil layer 2. The first pad 3 is made by exposing the copper foil layer 2 using a screen printing etching paste process. The insulating layer 7 is used to isolate the copper foil layer 2 from the metal trace 5. The thickness of the insulating layer 7 is 1 - 5 um, so that while ensuring insulation, the light-emitting chip 8 can also be conducted with the copper foil layer 2;

[0044] As Figure 5 and Figure 6 shown, the copper foil layer 2 is used to carry the current of multiple light-emitting chips 8. The thickness of the copper foil layer 2 is 0.01 - 0.03 mm. The specific thickness is related to the size of the substrate body 1 and the number of light-emitting chips 8. The larger the size of the substrate body 1, the thicker the copper plating; the more the number of light-emitting chips 8, the thicker the copper plating, so as to ensure that the copper foil layer 2 can carry the current well;

[0045] A white oil layer 9 is fixedly connected to the upper surface of the insulating layer 7. The white oil layer 9 is used to protect the metal trace 5 and reflect the light emitted by the light-emitting chip 8. The white oil layer 9 is processed by a yellow light process or a screen printing process, and the thickness of the white oil layer 9 is 5 - 20 um.

[0046] In the glass substrate backlight board structure provided in the above embodiments, it is further optimized. As Figure 1 and Figure 4 shown, the metal trace 5 and the second pad 6 are processed by a yellow light process or a screen printing process. The light-emitting chip 8 is a top-emitting LED lamp, so that a complete circuit can be formed to control the on / off function of the light-emitting chip 8 and achieve the minimum zoning of one lamp;

[0047] Figure 1 and Figure 3 shown, the positive and negative electrodes of the light-emitting chip 8 are respectively welded and fixed to the first pad 3 and the second pad 6 through solder 10. The solder 10 is used to fix the light-emitting chip 8 and ensure firm connection of the light-emitting chip 8. Thus, it is very convenient to fix the positive and negative electrodes of the light-emitting chip 8 through the solder 10.

[0048] The usage process of the glass substrate backlight board structure provided by the present utility model is as follows:

[0049] The substrate body 1 is made of a glass substrate, which has excellent thermal stability and mechanical strength, can maintain stability in high-temperature and high-humidity environments, has a low coefficient of thermal expansion and high flatness. At the same time, on the substrate body 1, a copper foil layer 2 is formed by electroplating copper over the entire surface. The copper foil layer 2 serves as the positive electrode of the power supply for multiple light-emitting chips 8. Then, through the metal traces 5 and the FPC 4, it is connected to the negative electrode of the power supply for multiple light-emitting chips 8. In this way, when in use, the other end of the FPC 4 on the lamp board is connected to an external control circuit and power supply, forming a complete circuit to control the on / off function of the light-emitting chip 8, achieving the on / off control of a single light-emitting chip 8, with the smallest partition being one lamp, meeting the requirements of a large number of light-emitting chips 8 for high current. This not only has a relatively low process and material cost, but also is simple to process, reducing the manufacturing cost of the backlight lamp board.

[0050] In the present utility model, unless otherwise clearly defined and limited, terms such as "installation", "connection", "linkage", "fixation" and the like shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection or communication with each other; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal connection or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0051] Obviously, the above-described embodiments are only a part of the embodiments of the present utility model, rather than all embodiments. The drawings show the preferred embodiments of the present utility model, but do not limit the patent scope of the present utility model. The present utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosed content of the present utility model more thorough and comprehensive. Although the present utility model has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing specific embodiments, or perform equivalent replacements on some of the technical features. Any equivalent structure directly or indirectly using the content of the specification and drawings of the present utility model in other related technical fields is equally within the scope of the patent protection of the present utility model.

Claims

1. A backlight panel structure for a glass substrate, characterized in that, It includes: A substrate body (1), the substrate body (1) is a glass substrate, a copper foil layer (2) is provided on the mounting surface of the substrate body (1), and a plurality of first pads (3) are provided on the copper foil layer (2); An FPC (4), the FPC (4) is used to connect to a control circuit and a power supply, a plurality of metal traces (5) are connected to the FPC (4), and the other ends of the metal traces (5) are fixedly connected to second pads (6); A plurality of light-emitting chips (8), the anodes of the plurality of light-emitting chips (8) are electrically connected to the plurality of first pads (3) respectively, and the cathodes of the plurality of light-emitting chips (8) are electrically connected to the plurality of second pads (6).

2. The glass substrate backlight panel structure according to claim 1, wherein, The substrate body (1) is made of tempered glass or plain glass.

3. The glass substrate backlight panel structure according to claim 2, characterized in that, The substrate body (1) is used to ensure good thermal stability and mechanical strength, and the thickness of the substrate body (1) is 0.5 - 4 mm.

4. The glass substrate backlight panel structure according to claim 1, characterized in that, An insulating layer (7) is fixedly connected to the upper surface of the copper foil layer (2), the insulating layer (7) is an insulating material coated on the upper surface of the copper foil layer (2), and the first pad (3) is made by exposing the copper foil layer (2) using a screen printing and etching paste process.

5. The glass substrate backlight panel structure according to claim 4, wherein The copper foil layer (2) is used to carry the current of the plurality of light-emitting chips (8), and the thickness of the copper foil layer (2) is 0.01 - 0.03 mm.

6. The glass substrate backlight panel structure according to claim 4, characterized in that, The insulating layer (7) is used to isolate the copper foil layer (2) from the metal traces (5), and the thickness of the insulating layer (7) is 1 - 5 um.

7. The glass substrate backlight panel structure according to claim 6, wherein, A white oil layer (9) is fixedly connected to the upper surface of the insulating layer (7), the white oil layer (9) is used to protect the metal traces (5) and reflect the light emitted by the light-emitting chips (8), the white oil layer (9) is processed by a yellow light process or a screen printing process, and the thickness of the white oil layer (9) is 5 - 20 um.

8. The glass substrate backlight panel structure according to claim 1, wherein, The metal traces (5) and the second pads (6) are processed by a yellow light process or a screen printing process.

9. The glass substrate backlight panel structure according to claim 1, wherein, The light-emitting chip (8) is a top-emitting LED lamp.

10. The glass substrate backlight panel structure according to claim 1, wherein, The anode and cathode of the light-emitting chip (8) are welded and fixed to the first pad (3) and the second pad (6) through solder (10) respectively, and the solder (10) is used to fix the light-emitting chip (8) and ensure a firm connection of the light-emitting chip (8).

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