Wafer position calibration equipment

Abstract

The utility model provides wafer position calibration equipment, relates to the technical field of semiconductor processing equipment, and aims to solve the problems that the conventional equipment for searching and positioning the center of a wafer is poor in calibration effect and the position of the wafer cannot be well determined. Comprising a machine table, a movement module, a chuck, an auxiliary tool and a laser sensor, the movement module is installed on the machine table, and the output end of the movement module has the movement freedom degree in the X direction, the movement freedom degree in the Y direction and the rotation freedom degree in the Z direction; the chuck is detachably mounted at the output end of the motion module; the auxiliary tool is in a disc shape, the auxiliary tool can be detachably connected to the output end of the movement module, and the diameter of the auxiliary tool is larger than that of the chuck; the laser sensor is installed on the machine table and comprises a transmitting end and a receiving end which are spaced in the Z direction, and a detection space is formed between the transmitting end and the receiving end. According to the utility model, the circle center position of the wafer can be accurately determined.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing equipment, and particularly relates to a wafer position calibration device. Background Art

[0002] In the processing process of semiconductor devices, there are situations where it is necessary to find the center and position the wafer. In the prior art solutions, the purpose of finding the center and positioning the wafer is achieved by detecting the position of the center point and the position of the notch of the wafer.

[0003] However, the calibration effect of the existing equipment for finding the center and positioning the wafer is poor, and the position of the wafer cannot be determined well. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a wafer position calibration device to solve the technical problem that the calibration effect of the existing equipment for finding the center and positioning the wafer is poor and the position of the wafer cannot be determined well.

[0005] The wafer position calibration device provided by the utility model includes a machine table, a motion module, a chuck, an auxiliary tooling and a laser sensor. Among them, the motion module is installed on the machine table, and the output end of the motion module has a moving degree of freedom along the X direction, a moving degree of freedom along the Y direction and a rotating degree of freedom around the Z direction; the chuck is detachably installed at the output end of the motion module, and the chuck is used for fixing the wafer; the auxiliary tooling is in a disc shape, the auxiliary tooling can be detachably connected to the output end of the motion module, and the diameter of the auxiliary tooling is larger than the diameter of the chuck; the laser sensor is installed on the machine table and includes a transmitting end and a receiving end spaced along the Z direction, and a detection space for accommodating the contour of the auxiliary tooling is formed between the transmitting end and the receiving end.

[0006] Furthermore, the wafer position calibration device further includes an adjusting component. The adjusting component is installed on the machine table, and the laser sensor is installed on the adjusting component. The adjusting component is used for adjusting the horizontal deflection angle and the vertical pitch angle of the laser sensor.

[0007] Furthermore, the adjusting component includes a fixing frame, a sensor mounting seat, a fixing screw and a first set screw. Among them, one of the fixing frame and the sensor mounting seat is provided with a strip-shaped hole extending along the Z direction, and the other of the fixing frame and the sensor mounting seat is provided with a fixing screw hole. The fixing screw passes through the strip-shaped hole and is screwed into the fixing screw hole; the fixing frame is further provided with a first set screw hole with a hole axis along the Z direction, and the first set screw is arranged in the first set screw hole and abuts against the sensor mounting seat; the laser sensor is fixedly installed on the sensor mounting seat.

[0008] Furthermore, the adjustment component also includes a second top screw, and the fixing frame is also provided with a second top screw hole, wherein the sensor mounting seat is provided with a connecting screw hole for fixed connection with the laser sensor, and the hole axis of the connecting screw hole is along the Y direction; the hole axis of the second top screw hole is along the X direction, and the second top screw is arranged in the second top screw hole and is against the laser sensor.

[0009] Further, the motion module includes a linear motion component and a rotary motion component installed on the linear motion component, the linear motion component is used to move the rotary motion component along the X direction and the Y direction, and the rotary motion component includes a bracket, an auxiliary mounting seat, a driving motor, a driving wheel, a driven wheel and a flexible transmission body, wherein the bracket is fixedly connected to the linear motion component; the driving wheel and the driven wheel are arranged along a first direction, the flexible transmission body is sleeved and supported on the driving wheel and the driven wheel, and the auxiliary mounting seat is adjustably installed on the bracket along the first direction; the driving wheel is rotatably installed on the auxiliary mounting seat, the driving motor is installed on the bracket and is drivingly connected to the driving wheel; the chuck is coaxially fixed to the driven wheel.

[0010] Furthermore, the rotary motion assembly also includes a tensioning plate and a tensioning screw, wherein the tensioning plate is fixedly disposed on the bracket and is located on a side of the driving wheel away from the driven wheel, and the tensioning screw is disposed on the tensioning plate and fixedly connected to the auxiliary mounting seat.

[0011] Furthermore, the rotational motion component also includes a fastening screw, one of the bracket and the auxiliary mounting seat is provided with an adjustment long hole extending along the first direction, and the other of the bracket and the auxiliary mounting seat is provided with a fastening screw hole, and the fastening screw passes through the adjustment long hole and is screwed into the fastening screw hole.

[0012] Furthermore, the chuck is provided with an adsorption hole for adsorbing the wafer and an adsorption air channel connected with the adsorption hole, and the driven wheel is provided with an air channel opposite to and connected with the adsorption air channel.

[0013] Furthermore, the rotary motion component also includes a support plate and an intermediate support block, the support plate and the bracket are spaced apart along the Z direction and are located above the bracket, the intermediate support block is located between the support plate and the bracket, the intermediate support block is arranged around the driven wheel, and the intermediate support block has a notch on the side facing the driving wheel, and the notch is used to allow the flexible transmission body to pass through; the driven wheel is also rotatably connected to the support plate.

[0014] Further, the machine platform has an installation space, a first opening and a second opening both communicating with the installation space. The first opening and the second opening are both located at the top of the machine platform. At least part of the motion module and the laser sensor are received in the installation space and exposed from the first opening and the second opening respectively.

[0015] The beneficial effects brought by the wafer position calibration device of the present utility model are as follows:

[0016] By providing a wafer position calibration device mainly composed of a machine platform, a motion module, a chuck, an auxiliary tooling and a laser sensor, when it is necessary to calibrate the position of the wafer, that is, when it is necessary to perform centering and positioning on the wafer, the auxiliary tooling can be first installed at the output end of the motion module, so that the auxiliary tooling can move along the X direction, move along the Y direction and rotate around the Z direction.

[0017] Taking the interval between the output end of the motion module and the laser sensor along the Y direction as an example for illustration. By using the movement of the auxiliary tooling along the Y direction, the contour of the auxiliary tooling can be made to be in the detection space formed between the transmitting end and the receiving end. And since the diameter of the auxiliary tooling has been determined, the farthest point of the contour of the auxiliary tooling on the side facing the laser sensor can be found by using the reciprocating movement of the auxiliary tooling along the X direction and the numerical change of the laser sensor, that is, the diameter position of the auxiliary tooling can be found, so that the center of the auxiliary tooling can be in the same straight line as the light-emitting linear array of the laser sensor, that is, the rotation center of the output end of the motion module can be in the same straight line as the light-emitting linear array of the laser sensor. Furthermore, after the auxiliary tooling is removed and the chuck is installed, the rotation center of the chuck can be in the same straight line as the light-emitting linear array of the laser sensor, achieving the centering purpose. After the wafer is fixed on the chuck, by rotating the output end of the motion module around the Z direction, the wafer is driven to rotate, and thus the notch part of the wafer can be detected by the laser sensor.

[0018] Through the above settings, the wafer position calibration device can accurately determine the center position of the wafer, and the calibration effect is good, thus effectively solving the technical problems in the prior art. Description of the Drawings

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only the embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained according to the provided drawings without creative efforts.

[0020] Figure 1 It is a schematic structural diagram of the wafer position calibration device provided by the embodiment of the present utility model after calibration;

[0021] Figure 2 Schematic structural diagram of the wafer position calibration device provided by the embodiment of the present utility model during the calibration process;

[0022] Figure 3 Partial structural diagram of the wafer position calibration device provided by the embodiment of the present utility model;

[0023] Figure 4 Partial structural diagram of the movement module of the wafer position calibration device provided by the embodiment of the present utility model installed on the frame bottom plate;

[0024] Figure 5 Schematic structural diagram of the rotary motion component of the movement module of the wafer position calibration device provided by the embodiment of the present utility model;

[0025] Figure 6 Cross-sectional structural view of the rotary motion component of the movement module of the wafer position calibration device provided by the embodiment of the present utility model;

[0026] Figure 7 Schematic structural diagram of the intermediate support block of the rotary motion component of the movement module of the wafer position calibration device provided by the embodiment of the present utility model;

[0027] Figure 8 One of the installation diagrams of the laser sensor of the wafer position calibration device provided by the embodiment of the present utility model;

[0028] Figure 9 Another installation diagram of the laser sensor of the wafer position calibration device provided by the embodiment of the present utility model.

[0029] Explanation of reference numerals:

[0030] 100 - Machine platform; 200 - Movement module; 300 - Chuck; 400 - Auxiliary tooling; 500 - Laser sensor; 600 - Adjustment component;

[0031] 110 - Installation space; 120 - First opening; 130 - Second opening; 140 - Frame bottom plate; 150 - Interface component; 160 - Sensor housing;

[0032] 210 - X - direction movement component; 220 - Y - direction movement component; 230 - Rotary motion component;

[0033] 211 - X - axis bottom plate; 212 - X - axis motor; 213 - X - axis driving pulley; 214 - X - axis driven pulley; 215 - X - axis mounting plate; 216 - X - axis lead screw module;

[0034] 221 - Y - axis motor; 222 - Coupling; 223 - Y - axis lead screw module;

[0035] 231 - Bracket; 2311 - Bottom plate; 2312 - Column; 2313 - Mounting plate; 232 - Auxiliary mounting seat; 233 - Driving motor; 234 - Driving wheel; 235 - Driven wheel; 2351 - Central air duct; 2352 - Encoder; 2353 - Air pipe joint; 236 - Adapter block; 237 - Tension plate; 238 - Support plate; 239 - Intermediate support block; 2391 - Notch

[0036] 310 - Adsorption hole; 320 - Adsorption air duct

[0037] 410 - Weight - reducing hole

[0038] 510 - Transmitting end; 520 - Receiving end; 530 - Detection space

[0039] 610 - Fixing frame; 620 - Sensor mounting seat; 621 - Connecting screw hole; 630 - Strip - shaped hole

[0040] 611 - First vertical plate; 612 - Second vertical plate; 613 - Connecting horizontal plate; 614 - First jacking block; 6141 - First jacking hole; 6142 - First fixing hole; 615 - Connecting block; 616 - Second jacking block; 6161 - Second jacking hole; 6162 - Second fixing hole Detailed implementation manners

[0041] To make the above - mentioned objects, features, and advantages of the present utility model more obvious and understandable, the following detailed description of the specific embodiments of the present utility model will be given in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model

[0042] Figure 1 Structural schematic diagram of the wafer position calibration device provided in this embodiment after calibration Figure 2 Structural schematic diagram of the wafer position calibration device provided in this embodiment during the calibration process. As Figure 1 and Figure 2As shown in the figure, this embodiment provides a wafer position calibration device, which includes a machine table 100, a motion module 200, a chuck 300, an auxiliary tooling 400, and a laser sensor 500. Among them, the motion module 200 is installed on the machine table 100, and the output end of the motion module 200 has a moving degree of freedom in the X direction, a moving degree of freedom in the Y direction, and a rotating degree of freedom around the Z direction; the chuck 300 is detachably installed at the output end of the motion module 200, and the chuck 300 is used to fix the wafer; the auxiliary tooling 400 is in a disc shape, and the auxiliary tooling 400 can be detachably connected to the output end of the motion module 200, and the diameter of the auxiliary tooling 400 is larger than the diameter of the chuck 300; the laser sensor 500 is installed on the machine table 100 and is spaced from the output end of the motion module 200 in the Y direction. The laser sensor 500 includes a transmitting end 510 and a receiving end 520 spaced apart in the Z direction, and a detection space 530 for accommodating the contour of the auxiliary tooling 400 is formed between the transmitting end 510 and the receiving end 520.

[0043] By setting up a wafer position calibration device mainly composed of a machine table 100, a motion module 200, a chuck 300, an auxiliary tooling 400, and a laser sensor 500, when it is necessary to calibrate the position of the wafer, that is, when it is necessary to find the center and position the wafer, the auxiliary tooling 400 can be first installed at the output end of the motion module 200, so that the auxiliary tooling 400 can move in the X direction, move in the Y direction, and rotate around the Z direction.

[0044] Among them, by using the movement of the auxiliary tooling 400 in the Y direction, the contour of the auxiliary tooling 400 can be made to be in the detection space 530 formed between the transmitting end 510 and the receiving end 520. And since the diameter of the auxiliary tooling 400 has been determined, the farthest point of the contour of the auxiliary tooling 400 on the side facing the laser sensor 500 can be found by using the reciprocating movement of the auxiliary tooling 400 in the X direction and the numerical change of the laser sensor 500, that is: the diameter position of the auxiliary tooling 400 can be found, so that the center of the auxiliary tooling 400 can be in the same straight line as the light emitting linear array of the laser sensor 500, that is, the rotation center of the output end of the motion module 200 is in the same straight line as the light emitting linear array of the laser sensor 500. Furthermore, after removing the auxiliary tooling 400 and installing the chuck 300, the rotation center of the chuck 300 is in the same straight line as the light emitting linear array of the laser sensor 500, achieving the purpose of finding the center. After the wafer is fixed on the chuck 300, by rotating the output end of the motion module 200 around the Z direction, the wafer is driven to rotate, so that the notch part of the wafer can be detected by the laser sensor 500.

[0045] Through the above settings, this wafer position calibration device can accurately determine the center position of the wafer, and the calibration effect is good, thus effectively solving the technical problems in the prior art.

[0046] In this embodiment, the chuck 300 may be provided with a self-centering structure, that is: after determining the center position of the chuck 300 through the above solution, when the wafer is placed on the chuck 300, the determination of the center of the wafer is automatically achieved.

[0047] Please continue to refer to Figure 2 , in this embodiment, the auxiliary tooling 400 is provided with a plurality of weight reduction holes 410.

[0048] Figure 3 is a partial structural schematic diagram of the wafer position calibration device provided in this embodiment; Figure 4 is a partial structural schematic diagram of the motion module 200 of the wafer position calibration device provided in this embodiment installed on the frame bottom plate 140. As Figure 3 and Figure 4 shown, the motion module 200 of the wafer position calibration device includes a linear motion component and a rotary motion component 230 installed on the linear motion component. Among them, the linear motion component is used to move the rotary motion component 230 along the X direction and the Y direction. The linear motion component includes an X-direction motion component 210 and a Y-direction motion component 220.

[0049] Please continue to refer to Figure 4 , in this embodiment, the Y-direction motion component 220 is installed on the machine table 100, specifically installed on the frame bottom plate 140 of the machine table 100; the X-direction motion component 210 is installed at the output end of the Y-direction motion component 220 and is driven by the Y-direction motion component 220 to move along the Y direction; the rotary motion component 230 is installed at the output end of the X-direction motion component 210. Specifically, the Y-direction motion component 220 includes a Y-axis motor 221, a coupling 222, and a Y-axis lead screw module 223. Among them, the housing of the Y-axis motor 221 is fixedly installed on the frame bottom plate 140, and the motor shaft of the Y-axis motor 221 is connected to the Y-axis lead screw module 223 through the coupling 222, and is used to generate a power output along the Y direction of the Y-axis lead screw module 223, so as to realize the movement of the X-direction motion component 210 installed thereon along the X direction.

[0050] Please continue to refer to Figure 4, in this embodiment, the X-direction motion component 210 includes an X-axis bottom plate 211, an X-axis motor 212, an X-axis driving pulley 213, an X-axis driven pulley 214, an X-axis mounting plate 215, and an X-axis lead screw module 216. Specifically, the X-axis bottom plate 211 is fixedly connected to the output end of the Y-axis lead screw module 223; the X-axis mounting plate 215 is vertically and fixedly connected to the X-axis bottom plate 211; the housing of the X-axis motor 212 is fixedly connected to the X-axis mounting plate 215, the X-axis driving pulley 213 is fixedly sleeved on the motor shaft of the X-axis motor 212, the X-axis driven pulley 214 is rotatably arranged on the X-axis mounting plate 215, and the X-axis driving pulley 213 and the X-axis driven pulley 214 are connected by a synchronous belt; the X-axis lead screw module 216 is installed on the X-axis bottom plate 211, and its input end is fixedly connected to the X-axis driven pulley 214, so as to utilize the rotation of the X-axis driven pulley 214 to realize the power output of the X-axis lead screw module 216 in the X direction.

[0051] This setting form of the X-direction motion component 210 and the Y-direction motion component 220 can realize the movement of the rotary motion component 230 in the X direction and the Y direction, and has relatively high motion accuracy.

[0052] It should be noted that the specific structures of the X-axis lead screw module 216 and the Y-axis lead screw module 223 can be obtained by those skilled in the art according to the prior art, and they are not the key improvements of this application, so they will not be elaborated here.

[0053] In other embodiments, the X-direction motion component 210 can also be installed on the frame bottom plate 140 of the machine table 100, and the Y-direction motion component 220 can be installed on the output end of the X-direction motion component 210. At this time, the rotary motion component 230 is installed on the output end of the Y-direction motion component 220.

[0054] Figure 5 It is a schematic structural diagram of the rotary motion component 230 of the motion module 200 of the wafer position calibration device provided in this embodiment; Figure 6 It is a structural sectional view of the rotary motion component 230 of the motion module 200 of the wafer position calibration device provided in this embodiment. As Figure 5 and Figure 6As shown, in this embodiment, the rotary motion assembly 230 includes a bracket 231, an auxiliary mounting base 232, a driving motor 233, a driving wheel 234, a driven wheel 235, and a flexible transmission body. Among them, the bracket 231 is fixedly connected to the linear motion assembly, specifically to the output end of the X-axis lead screw module 216 of the X-direction motion assembly 210; the driving wheel 234 and the driven wheel 235 are arranged along the first direction, the flexible transmission body is sleeved and supported on the driving wheel 234 and the driven wheel 235, and the auxiliary mounting base 232 is mounted on the bracket in a position-adjustable manner along the first direction; the driving wheel 234 is rotatably mounted on the auxiliary mounting base 232, the driving motor 233 is mounted on the bracket 231 and is drivingly connected to the driving wheel 234; the chuck 300 is coaxially fixedly connected to the driven wheel 235.

[0055] When it is necessary to rotate the chuck 300, the driving motor 233 can be started, and the driving motor 233 outputs the rotational power to the driving wheel 234, so that the driving wheel 234 can drive the driven wheel 235 to rotate through the flexible transmission body, and then realize the rotation of the chuck 300 coaxially fixedly connected to the driven wheel 235. Among them, when it is necessary to install the flexible transmission body, the position of the auxiliary mounting base 232 along the first direction can be adjusted to tension the flexible transmission body. After the flexible transmission body is tensioned, the driving motor 233 is installed on the bracket 231 and is drivingly connected to the driving wheel 234. This setting will not cause excessive radial load pressure on the motor shaft of the driving motor 233, and plays a certain protective role for the driving motor 233.

[0056] In this embodiment, both the driving wheel 234 and the driven wheel 235 can be belt wheels. At this time, the flexible transmission body is a synchronous belt. In other embodiments, both the driving wheel 234 and the driven wheel 235 can also be sprockets. At this time, the flexible transmission body is a chain.

[0057] In this embodiment, the first direction is the X direction.

[0058] In this embodiment, the rotary motion assembly 230 may further include fastening screws. One of the bracket 231 and the auxiliary mounting base 232 is provided with an adjusting long hole extending along the first direction, and the other of the bracket 231 and the auxiliary mounting base 232 is provided with a fastening screw hole. The fastening screw passes through the adjusting long hole and is screwed into the fastening screw hole.

[0059] After the position of the auxiliary mounting base 232 is adjusted to tension the flexible transmission body, the fastening screw can be passed through the adjusting long hole and screwed into the fastening screw hole to fix the auxiliary mounting base 232 on the bracket 231. This setting can realize the adjustment and fixation of the auxiliary mounting base 232 at any position within a certain range, so that the driving wheel 234 and the driven wheel 235 meet the tensioning requirements.

[0060] Please continue to refer to Figure 5 andFigure 6 In this embodiment, the rotary motion assembly 230 may further include a tensioning plate 237 and a tensioning screw. Specifically, the tensioning plate 237 is fixedly arranged on the bracket 231, and the tensioning plate 237 is located on the side of the driving wheel 234 away from the driven wheel 235. The tensioning screw is arranged on the tensioning plate 237 and fixedly connected to the auxiliary mounting seat 232.

[0061] During the assembly process of the flexible transmission body, by screwing the tensioning screw, the auxiliary mounting seat 232 can be moved in the direction away from the driven wheel 235 to tension the auxiliary mounting seat 232, so as to achieve the purpose of tensioning the flexible transmission body. This form of tensioning the flexible transmission body by using the tensioning screw, with the tensioning screw bearing the axial tension, is reliable in tensioning.

[0062] Please continue to refer to Figure 6 In this embodiment, the chuck 300 is provided with an adsorption hole 310 for adsorbing the wafer and an adsorption air channel 320 communicated with the adsorption hole 310. Among them, the driven wheel 235 is provided with a hollow air channel 2351, and the hollow air channel 2351 is opposite to and communicated with the adsorption air channel 320.

[0063] The above setting enables the vacuum effect to be transmitted to the adsorption hole 310 of the chuck 300 through the hollow air channel 2351 and the adsorption air channel 320 in sequence, so as to realize the reliable adsorption and fixation of the chuck 300 to the wafer.

[0064] Please continue to refer to Figure 6 In this embodiment, one end of the hollow air channel 2351 away from the chuck 300 is connected with an air pipe joint 2353 for applying a vacuum adsorption force to the hollow air channel 2351.

[0065] Please continue to refer to Figure 5 and Figure 6 In this embodiment, the bracket 231 may include a bottom plate 2311, a column 2312 and a mounting plate 2313. Among them, the bottom plate 2311 and the mounting plate 2313 are arranged at intervals along the Z direction. The number of columns 2312 is multiple, and the multiple columns 2312 are fixedly connected to the bottom plate 2311 and the mounting plate 2313 to support the mounting plate 2313.

[0066] Figure 7 It is a schematic structural diagram of the intermediate support block 239 of the rotary motion assembly 230 of the motion module 200 of the wafer position calibration device provided in this embodiment. Please continue to refer to Figure 6 and Figure 7, in this embodiment, the rotational motion assembly 230 may further include a support plate 238 and an intermediate support block 239. The support plate 238 is spaced apart from the bracket 231 in the Z direction and is located above the bracket 231. The intermediate support block 239 is located between the support plate 238 and the bracket 231. The intermediate support block 239 surrounds the driven wheel 235, and a notch 2391 is formed on the side of the intermediate support block 239 facing the driving wheel 234. The notch 2391 is used for the flexible transmission body to pass through; the driven wheel 235 is also rotatably connected to the support plate 238.

[0067] In this embodiment, the top end of the driven wheel 235 is rotatably connected to the support plate 238, and the bottom end of the driven wheel 235 is rotatably connected to the mounting plate 2313 of the bracket 231, so that both ends of the driven wheel 235 are subjected to rotational support. By arranging the intermediate support block 239 on the outer periphery of the driven wheel 235, the intermediate support block 239 is used to support the support plate 238. Among them, the intermediate support block 239 plays a role in supporting the shafting, which can further ensure the concentric rotation of the shafting. And by providing an opening facing the driving wheel 234 on the intermediate support block 239, it also enables the flexible transmission body to smoothly connect the driving wheel 234 and the driven wheel 235 without affecting the normal operation of the flexible transmission body.

[0068] Please continue to refer to Figure 6 , in this embodiment, the driven wheel 235 is also coaxially and fixedly connected with an encoder 2352, which is used to record the number of rotation turns of the driven wheel 235, so as to realize the determination of the number of rotation turns of the chuck 300.

[0069] Please continue to refer to Figure 6 , in this embodiment, the driven wheel 235 and the chuck 300 are fixedly connected through an adapter block 236. Among them, the hollow air duct 2351 axially penetrates the adapter block.

[0070] Figure 8 is one of the installation schematic diagrams of the laser sensor 500 of the wafer position calibration device provided in this embodiment; Figure 9 is the second installation schematic diagram of the laser sensor 500 of the wafer position calibration device provided in this embodiment. Please continue to refer to Figure 3 , and in combination with Figure 8 and Figure 9 , in this embodiment, the wafer position calibration device may further include an adjustment assembly 600. Among them, the adjustment assembly 600 is installed on the machine table 100, and the laser sensor 500 is installed on the adjustment assembly 600. The adjustment assembly 600 is used to adjust the horizontal deflection angle and the up and down pitch angle of the laser sensor 500.

[0071] By setting the above-mentioned adjusting component 600 in the wafer position calibration device, it is possible to adjust the horizontal deflection angle and the up-and-down pitching angle of the laser sensor 500. Specifically, in this embodiment, that is: to adjust the deflection angle of the laser sensor 500 around the Z-axis and the deflection angle around the X-axis. This setting enables the laser sensor 500 to reach the appropriate angle and position through corresponding deflection angle adjustment after being assembled to the machine table 100, so as to ensure the reliability of wafer position calibration.

[0072] Please continue to refer to Figure 8 and Figure 9 , in this embodiment, the adjusting component 600 may include a fixing frame 610, a sensor mounting seat 620, fixing screws, and a first set screw. Among them, one of the fixing frame 610 and the sensor mounting seat 620 is provided with a strip-shaped hole 630 extending along the Z-axis, and the other of the fixing frame 610 and the sensor mounting seat 620 is provided with a fixing screw hole, and the fixing screw passes through the strip-shaped hole 630 and is screwed into the fixing screw hole; the fixing frame 610 is further provided with a first set screw hole 6141 with a hole axis along the Z-axis, and the first set screw is arranged in the first set screw hole 6141 and abuts against the sensor mounting seat 620; the laser sensor 500 is fixedly installed on the sensor mounting seat 620.

[0073] When it is necessary to adjust the up-and-down pitching angle of the laser sensor 500, the first set screw can be screwed, and by using the abutting action of the first set screw against the sensor mounting seat 620, the sensor mounting seat 620 is caused to generate polarization around the X-axis, so as to realize the adjustment of the up-and-down pitching angle of the sensor mounting seat 620, and further achieve the purpose of adjusting the up-and-down pitching angle of the laser sensor 500.

[0074] Among them, since the sensor mounting seat 620 is fixed in the fixing screw hole by passing the fixing screw through the strip-shaped hole 630, during the process of abutting the first set screw against the sensor mounting seat 620 to make it move, the above-mentioned assembly relationship will allow the sensor mounting seat 620 to generate a deflection amount around the X-axis, so as to achieve the purpose of adjusting the pitching angle of the sensor mounting seat 620. After completing the adjustment of the up-and-down pitching angle of the laser sensor 500, the sensor mounting seat 620 and the fixing frame 610 can be installed and fixed by using the fixing screw to ensure the stability of the laser sensor 500.

[0075] Please continue to refer to Figure 8 and Figure 9, in this embodiment, the fixing bracket 610 may include a first vertical plate 611, a second vertical plate 612, a connecting cross plate 613, and a first set screw block 614. Among them, the first vertical plate 611 and the second vertical plate 612 are arranged at intervals in the X direction, and the connecting cross plate 613 is fixedly connected to the first vertical plate 611 and the second vertical plate 612; the first set screw block 614 is connected to the connecting cross plate 613, and a first set screw hole 6141 is opened in the first set screw block 614; the sensor mounting seat 620 is located between the first vertical plate 611 and the second vertical plate 612.

[0076] After adjusting the up-and-down pitching angle of the laser sensor 500 by using the first set screw, the first set screw block 614 can be fixedly connected to the connecting cross plate 613 to prevent the first set screw block 614 from falling off. Among them, first fixing holes 6142 are arranged on both sides of the first set screw hole 6141, and the first set screw block 614 is fixedly connected to the sensor mounting seat 620 by using the first fixing holes 6142.

[0077] Please continue to refer to Figure 8 and Figure 9 , in this embodiment, the adjusting assembly 600 may further include a second set screw, and a second set screw hole 6161 is further opened in the fixing bracket 610. Among them, a connecting screw hole 621 for fixedly connecting to the laser sensor 500 is opened in the sensor mounting seat 620, and the axis of the connecting screw hole 621 is along the Y direction; the axis of the second set screw hole 6161 is along the X direction, and the second set screw is arranged in the second set screw hole 6161 and abuts against the laser sensor 500.

[0078] When it is necessary to adjust the horizontal deflection angle of the laser sensor 500, the second set screw can be screwed. By using the abutting action of the second set screw against the laser sensor 500, the laser sensor 500 is subjected to a deflection acting force. Since the laser sensor 500 is connected to the sensor mounting seat 620 through the connecting screw hole 621 with the axis along the Y direction, by using the assembly clearance of the connecting screw hole 621, the laser sensor 500 is allowed to generate polarization around the Z direction, thereby realizing the adjustment of the horizontal deflection angle of the laser sensor 500.

[0079] Please continue to refer to Figure 8 and Figure 9 , in this embodiment, the fixing bracket 610 may further include a connecting block 615 and a second set screw block 616. Specifically, the connecting block 615 is located at the top of the first vertical plate 611 and the second vertical plate 612, and the connecting block 615 is fixedly connected to the sensor mounting seat 620. The second set screw hole 6161 is opened in the connecting block 615. The second set screw block 616 is located between the connecting block 615 and the laser sensor 500, and the second set screw abuts against the laser sensor 500 through the second set screw block 616.

[0080] By setting the second set screw block 616, during the screwing process of the second set screw, the purpose of adjusting the horizontal deflection angle of the laser sensor 500 is achieved by moving the second set screw block 616, without the second set screw directly abutting against the laser sensor 500, thus avoiding the wear caused by the second set screw to the laser sensor 500. After completing the adjustment of the horizontal deflection angle of the laser sensor 500, the second set screw block 616 can be fixedly connected to the connecting block 615 to prevent the second set screw block 616 from falling off. Among them, second fixing holes 6162 are provided on both sides of the second set screw hole 6161, and the second set screw block 616 is fixedly connected to the connecting block 615 by using the second fixing holes 6162.

[0081] Please continue to refer to Figure 1 and Figure 3 , in this embodiment, the machine table 100 has an installation space 110, a first opening 120 and a second opening 130 that are both communicated with the installation space 110. Among them, the first opening 120 and the second opening 130 are both located at the top of the machine table 100. The motion module 200 and the laser sensor 500 are at least partially accommodated in the installation space 110 and are respectively exposed from the first opening 120 and the second opening 130.

[0082] The above settings achieve a hidden installation of the local structures of the motion module 200 and the laser sensor 500, play a certain protective role for the motion module 200 and the laser sensor 500, and at the same time, ensure the appearance neatness of the wafer position calibration device in this embodiment.

[0083] Please continue to refer to Figure 1 and Figure 2 , in this embodiment, the machine table 100 is further provided with an interface component 150 for realizing the electrical connection between the internal structure and the external structure. And, the machine table 100 further includes a sensor housing 160, and the sensor housing 160 covers the laser sensor 500 therein.

[0084] Although the present utility model is disclosed as above, the present utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present utility model. Therefore, the protection scope of the present utility model should be subject to the scope defined by the claims.

[0085] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprises" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprises a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0086] In the above embodiments, the descriptions of directions such as “upper”, “lower”, “side”, etc. are all based on the drawings.

[0087] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer position calibration device, characterized in that, It includes a machine tool (100), a motion module (200), a chuck (300), an auxiliary tooling (400) and a laser sensor (500). Among them, the motion module (200) is installed on the machine tool (100), and the output end of the motion module (200) has a moving degree of freedom along the X direction, a moving degree of freedom along the Y direction and a rotating degree of freedom around the Z direction; the chuck (300) is detachably installed at the output end of the motion module (200), and the chuck (300) is used for fixing a wafer; the auxiliary tooling (400) is disc-shaped, the auxiliary tooling (400) can be detachably connected to the output end of the motion module (200), and the diameter of the auxiliary tooling (400) is larger than the diameter of the chuck (300); the laser sensor (500) is installed on the machine tool (100), and includes a transmitting end (510) and a receiving end (520) spaced apart along the Z direction, and a detection space (530) for accommodating the contour of the auxiliary tooling (400) is formed between the transmitting end (510) and the receiving end (520).

2. The wafer position calibration device according to claim 1, wherein The wafer position calibration device further includes an adjustment component (600). The adjustment component (600) is installed on the machine tool (100), the laser sensor (500) is installed on the adjustment component (600), and the adjustment component (600) is used for adjusting the horizontal deflection angle and the vertical pitching angle of the laser sensor (500).

3. The wafer position calibration device according to claim 2, wherein, The adjustment component (600) includes a fixing frame (610), a sensor mounting seat (620), fixing screws and first set screws. Among them, a strip-shaped hole (630) extending along the Z direction is formed in one of the fixing frame (610) and the sensor mounting seat (620), and a fixing screw hole is formed in the other of the fixing frame (610) and the sensor mounting seat (620), and the fixing screw passes through the strip-shaped hole (630) and is screwed into the fixing screw hole; the fixing frame (610) further has a first set screw hole (6141) with a hole axis along the Z direction, and the first set screw is arranged in the first set screw hole (6141) and abuts against the sensor mounting seat (620); the laser sensor (500) is fixedly installed on the sensor mounting seat (620).

4. The wafer position calibration device according to claim 3, characterized in that, The adjustment component (600) further includes a second set screw, and the fixing frame (610) further has a second set screw hole (6161). Among them, the sensor mounting seat (620) is provided with a connecting screw hole (621) for fixedly connecting with the laser sensor (500), and the hole axis of the connecting screw hole (621) is along the Y direction; the hole axis of the second set screw hole (6161) is along the X direction, and the second set screw is arranged in the second set screw hole (6161) and abuts against the laser sensor (500).

5. The wafer position calibration device according to claim 1, characterized in that, The motion module (200) includes a linear motion component and a rotary motion component (230) mounted on the linear motion component. The linear motion component is configured to move the rotary motion component (230) in the X direction and the Y direction. The rotary motion component (230) includes a bracket (231), an auxiliary mounting seat (232), a drive motor (233), a driving wheel (234), a driven wheel (235), and a flexible transmission body. Among them, the bracket (231) is fixedly connected to the linear motion component; the driving wheel (234) and the driven wheel (235) are arranged in a first direction, the flexible transmission body is sleeved and supported on the driving wheel (234) and the driven wheel (235), and the auxiliary mounting seat (232) is mounted on the bracket (231) with adjustable position in the first direction; the driving wheel (234) is rotatably mounted on the auxiliary mounting seat (232), the drive motor (233) is mounted on the bracket (231) and is drivingly connected to the driving wheel (234); the chuck (300) is coaxially fixed to the driven wheel (235).

6. The wafer position calibration device according to claim 5, wherein, The rotary motion component (230) further includes a tensioning plate (237) and a tensioning screw. The tensioning plate (237) is fixedly arranged on the bracket (231), and the tensioning plate (237) is located on the side of the driving wheel (234) facing away from the driven wheel (235). The tensioning screw is arranged on the tensioning plate (237) and is fixedly connected to the auxiliary mounting seat (232).

7. The wafer position calibration device according to claim 5, wherein The rotary motion component (230) further includes a fastening screw. One of the bracket (231) and the auxiliary mounting seat (232) is provided with an adjusting long hole extending in the first direction, and the other of the bracket (231) and the auxiliary mounting seat (232) is provided with a fastening screw hole. The fastening screw passes through the adjusting long hole and is screwed into the fastening screw hole.

8. The wafer position calibration device according to claim 5, wherein, The chuck (300) is provided with an adsorption hole (310) for adsorbing a wafer and an adsorption air channel (320) communicating with the adsorption hole (310). The driven wheel (235) is provided with a hollow air channel (2351), and the hollow air channel (2351) is opposite to and communicates with the adsorption air channel (320).

9. The wafer position calibration device according to claim 5, wherein The rotary motion component (230) further includes a support plate (238) and an intermediate support block (239). The support plate (238) is spaced apart from the bracket (231) in the Z direction and is located above the bracket (231). The intermediate support block (239) is located between the support plate (238) and the bracket (231). The intermediate support block (239) surrounds the driven wheel (235). A notch (2391) is formed on the side of the intermediate support block (239) facing the driving wheel (234), and the notch (2391) is used for the flexible transmission body to pass through; the driven wheel (235) is also rotatably connected to the support plate (238).

10. The wafer position calibration device according to claim 1, wherein, The machine platform (100) has an installation space (110), a first opening (120) and a second opening (130) both communicating with the installation space (110). The first opening (120) and the second opening (130) are both located at the top of the machine platform (100). The motion module (200) and the laser sensor (500) are at least partially accommodated in the installation space (110) and respectively expose from the first opening (120) and the second opening (130).

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