Driving module of brushless motor applied to food processor and food processor

Abstract

The utility model discloses a driving module applied to a brushless motor of a food processor and the food processor. The driving module comprises a plate body, an IPM module, a power supply connection module, a power supply control module and an MCU module. The IPM module is arranged on the first side of the board body and used for being connected with the brushless motor. The power connection module is arranged on a second side, opposite to the first side, of the board body and connected with the IPM module, and the power connection module is used for being connected with a power supply. The power control module is arranged on the second side of the board body and connected with the power connection module. The MCU module is arranged on the second side of the board body, the MCU module and the power supply control module are located on different surfaces of the board body, and the MCU module is electrically connected with the power supply control module and the IPM module. The brushless motor is used, so that the service life of the food processor can be prolonged, the speed can be adjusted more easily, and the rotating speed is higher. Through reasonable layout of the modules, the power consumption of the driving module is smaller, the temperature rise is low, and the occupied space is small.

Description

Technical Field

[0001] The utility model relates to the technical field of household appliances, and more specifically, to a driving module for a brushless motor applied to a food processor and a food processor. Background Art

[0002] With the progress of technology, there are more and more categories of food processors emerging, such as juicers, blenders, etc. The food processors in the related art usually include a housing and a brushed motor. For example, the Chinese utility model patent CN201721001278.6. However, due to the working principle of the DC brushed motor itself, the use of a DC brushed motor must have carbon brushes and a commutator. However, the spark interference between the carbon brushes and the commutator is large, and the carbon brushes are prone to carbon powder accumulation due to friction, which poses a risk of damaging the circuit board and shortening the lifespan of the food processor. At the same time, the use of a DC brushed motor also brings relatively large noise. To improve this problem, the Chinese utility model patent CN202322642955.4 discloses a low-noise food processor driven by a brushless motor. This patent solves the safety and hygiene problems of the food processor caused by carbon brush carbon powder by applying a brushless motor in the field of food processors and optimizes the sound quality. However, when using a brushless motor, a driving module is required to drive the brushless motor. Generally, the driving module is relatively large, resulting in a large occupied space for the driving module. The driving modules for brushless motors are disclosed in the Chinese utility model patents CN202322590933.8 and CN202322590889.0. Since the IPM module is used to handle the actual strong and weak electricity and high-voltage environment, based on meeting the functional requirements of the IPM module, even if the space limit of the driving module is compressed, the occupied space of the driving module is still relatively large. Therefore, the existing driving modules for brushless motors are not suitable for portable or miniaturized food processors. Among them, portable or miniaturized food processors, such as portable juice machines, portable juicers, etc. The Chinese utility model patent CN201820317388.1 mentions that a rectifier bridge can be controlled by MOS tubes or IGBTs. However, it only provides a driving method for a brushless motor and cannot solve the problem of small occupied space of the driving module.

[0003] Based on the above, how to further realize a miniaturized food processor and design a driving module that can drive a brushless motor to drive a processing tool to operate in a small space, so as to save the space of the food processor, realize the miniaturization and portability of the food processor, is an urgent problem to be solved. Summary of the Utility Model

[0004] The purpose of this application is to provide a drive module for a brushless motor applied to a food processor and a food processor, so as to solve the problems that the drive module of the brushless motor of a miniaturized and portable food processor has unreasonable power device layout, resulting in a large space occupied by the drive module and the inconvenience of carrying the food processor.

[0005] To achieve the above purpose, the present utility model provides a drive module for a brushless motor applied to a food processor. The drive module includes: a board body, an IPM module, a power connection module, a power control module, and an MCU module. The IPM module is arranged on the first side of the board body, and the IPM module is used to connect to the brushless motor. The power connection module is arranged on the second side of the board body opposite to the first side, the power connection module is connected to the IPM module, and the power connection module is used to connect to a power supply. The power control module is arranged on the second side of the board body, the power control module is connected to the power connection module, and the power control module is used to receive a power control signal and control the on-off of the power signal of the drive module of the brushless motor according to the power control signal. The MCU module is arranged on the second side of the board body, and the MCU module and the power control module are located on different surfaces of the board body; the MCU module is electrically connected to the power control module and the IPM module, and the MCU module is used to control the operation of the drive module of the brushless motor.

[0006] This application sets an IPM module for driving a brushless motor and uses a power connection module to connect the IPM module, so as to supply power to the brushless motor connected to the IPM module. At the same time, the MCU module is used to connect the IPM module and the power control module to control the operation of the IPM module. The food processor can use a brushless motor to replace a brushed motor. Since the brushless motor does not need to use carbon brushes and commutators, the food processor using a brushless motor has a longer lifespan, is easier to speed up, and has a higher rotational speed compared to the food processor using a brushed motor. At the same time, by setting the power connection module and the power control module on the same side, the distance between the power connection module and the power control module can be made closer, the power loop wiring can be shorter, which is beneficial to improving the power transmission efficiency, making the power consumption smaller, not easily generating high temperature, and the internal wiring of the whole machine is smoother. By setting the power control module on the opposite side of the IPM module, the power control module can be made farther away from the IPM module, that is, the power control module can be made away from the high-frequency power circuit, making the power circuit more stable. By making the MCU module and the power control module located on different surfaces of the board body, that is, arranging the components required for the drive module on both sides, the volume of the drive module can be reduced, and thus the space occupied by the drive module can be reduced.

[0007] In a preferred implementation manner of a drive module for a brushless motor applied to a food processor, the IPM module includes a three-phase inverter bridge; the upper bridge of the three-phase inverter bridge and the power control module are located on the same surface of the board body; the lower bridge of the three-phase inverter bridge and the MCU module are located on the same surface of the board body.

[0008] In this application, through the three-phase inverter bridge, the motor can be driven well. At the same time, placing the upper bridge of the three-phase inverter bridge and the lower bridge of the three-phase inverter bridge on both sides of the board can reduce the area of the board, thus facilitating the miniaturization of the drive module.

[0009] In a preferred implementation of a drive module for a brushless motor applied to a food processor, the MOS transistors forming the upper bridge of the three-phase inverter bridge and the MOS transistors forming the lower bridge of the three-phase inverter bridge are placed alternately.

[0010] In this application, by placing the MOS transistors forming the upper bridge of the three-phase inverter bridge and the MOS transistors forming the lower bridge of the three-phase inverter bridge alternately, it is beneficial to the heat dissipation of the MOS transistors, preventing the MOS transistors from being damaged due to high temperature. Furthermore, the drive module will not fail to operate due to the damage of the MOS transistors, thereby improving the stability of the drive module.

[0011] In a preferred implementation of a drive module for a brushless motor applied to a food processor, the drive module further includes: a charging module, the charging module is arranged on the third side of the board, and the charging module is electrically connected to the power connection module.

[0012] In this application, by arranging the charging module on the third side of the board, the charging module can be separated from the main power circuit, away from the high-frequency signal circuit. At the same time, the wiring of the charging circuit can be shorter, less likely to generate a high temperature rise, and the charging efficiency is higher.

[0013] In a preferred implementation of a drive module for a brushless motor applied to a food processor, the components constituting the charging module are scattered on both sides of the board.

[0014] In this application, by scattering the components constituting the charging module on both sides of the board, the area of the board occupied by the components can be reduced, thus facilitating the miniaturization of the drive module.

[0015] In a preferred implementation of a drive module for a brushless motor applied to a food processor, the drive module further includes: a charging detection module, the charging detection module is arranged on the third side of the board, and the charging detection module and the MCU module are on the same side of the board; the charging detection module is connected to the MCU module.

[0016] In this application, by arranging both the charging detection module and the charging module on the third side of the board, the charging detection module is close to the charging module, so that the charging access signal received by the charging detection module is not interfered, facilitating the transmission of an accurate charging access signal to the MCU module.

[0017] In a preferred implementation of the drive module of a brushless motor applied to a food processor, the drive module further includes: a lid opening detection module, which is arranged on the third side of the board body, and the lid opening detection module and the power control module are located on the same surface of the board body; the lid opening detection module is connected to the MCU module.

[0018] In this application, both the lid opening detection module and the charging module are arranged on the third side of the board body, so that the lid opening detection module is close to the charging module, which can make the lid opening detection module away from the high-frequency power circuit. At the same time, by making the lid opening detection module close to the charging module, the lid opening Hall signal for transmitting the screwing state of the transfer cup lid can be undisturbed, so as to facilitate the transmission of an accurate lid opening Hall signal to the MCU module.

[0019] In a preferred implementation of the drive module of a brushless motor applied to a food processor, the drive module further includes: a display board, which is connected to the MCU module and the power control module; the display board is used to display the working state of the food processor and receive the power control signal.

[0020] In this application, by connecting the display board to the drive module and displaying the working state of the food processor, it is convenient for users to intuitively view the working state of the food processor. At the same time, the power state of the food processor can be conveniently controlled through the display board.

[0021] In a preferred implementation of the drive module of a brushless motor applied to a food processor, the drive module further includes: a Hall board, which is connected to the charging module; the Hall board is used to connect to the charging module and an external charging wire to provide a charging circuit.

[0022] In this application, by connecting the Hall board to the charging module and the external charging wire, since the Hall board can intelligently sense the placement state of the device, when the food processor is placed on the charger, the potential difference generated by the Hall effect can drive current to pass through the Hall board, thus realizing automatic start of charging, which can make the charging process for users more convenient.

[0023] The present utility model also provides a food processor, which includes a housing, a power supply, a brushless motor, and a drive module of a brushless motor applied to a food processor as described in the above embodiments. The housing has a receiving cavity. The power supply is arranged in the receiving cavity. The brushless motor is arranged in the receiving cavity, and the drive module as described above is arranged in the receiving cavity.

[0024] In this application, by arranging a power supply, a brushless motor, and a drive module for controlling the brushless motor in the housing of the food processor, the food processor can have effects such as a large speed regulation range, low noise, long service life, large starting torque, good heat dissipation effect, low device temperature rise, convenient wiring of each module, each module is not easily interfered, and the board layout area is more refined.

[0025] Additional aspects and advantages of the present application will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings described herein are used to provide a further understanding of the present utility model and constitute a part of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation to the present utility model. In the drawings:

[0027] Figure 1 It is a schematic diagram of module connection in an embodiment of the present utility model;

[0028] Figure 2 It is a schematic structural diagram of a board body in an embodiment of the present utility model;

[0029] Figure 3 It is a schematic diagram of the front layout of a board body in an embodiment of the present utility model;

[0030] Figure 4 It is a schematic diagram of the reverse layout of a board body in an embodiment of the present utility model;

[0031] Figure 5 It is a schematic diagram of module connection in another embodiment of the present utility model.

[0032] DESCRIPTION OF THE REFERENCE NUMERALS:

[0033] 1 - driving module; 10 - board body; 20 - IPM module; 21 - motor connection end; 22 - first NMOS transistor; 23 - second NMOS transistor; 24 - third NMOS transistor; 25 - fourth NMOS transistor; 26 - fifth NMOS transistor; 27 - sixth NMOS transistor; 30 - power connection module; 31 - power connection end; 40 - power control module; 41 - PMOS transistor; 50 - MCU module; 51 - MCU chip; 60 - charging module; 61 - charging connection end; 62 - charging chip; 63 - surge protection TVS tube; 64 - current limiting resistor; 65 - boost inductor; 66 - switching MOS transistor; 70 - charging detection module; 71 - NPN type triode; 80 - opening detection module; 81 - unipolar Hall element; 90 - display board; 100 - Hall board; 110 - brushless motor; 120 - battery assembly; 130 - motor assembly. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0034] In order to more clearly illustrate the overall concept of the present utility model, the following will be further described in detail by way of examples in combination with the drawings of the specification.

[0035] It should be noted that many specific details are set forth in the following description to facilitate a full understanding of the present utility model. However, the present utility model may also be implemented in other ways different from those described herein. Therefore, the protection scope of the present utility model is not limited by the specific embodiments disclosed below.

[0036] As Figures 1 to 5 shown, the present utility model provides a drive module 1 for a brushless motor 110 applied to a food processor. The drive module 1 includes a board body 10, an IPM module 20, a power connection module 30, a power control module 40, and an MCU module 50. The IPM module 20 is disposed on the first side of the board body 10, and the IPM module 20 is used to connect to the brushless motor 110. The power connection module 30 is disposed on the second side of the board body 10 opposite to the first side. The power connection module 30 is connected to the IPM module 20, and the power connection module 30 is used to connect to a power supply. The power control module 40 is disposed on the second side, and the power control module 40 is connected to the power connection module 30. The power control module 40 is used to receive a power control signal and control the on / off of the power signal of the drive module 1 of the brushless motor 110 according to the power control signal. The MCU module 50 is disposed on the second side of the board body 10, and the MCU module 50 and the power control module 40 are located on different surfaces of the board body 10. The MCU module 50 is electrically connected to the power control module 40 and the IPM module 20, and the MCU module 50 is used to control the operation of the drive module 1 of the brushless motor 110.

[0037] It should be noted that the board body 10 may be a circuit board, and the material may be ceramic, alumina ceramic, aluminum nitride ceramic, thick copper, etc.

[0038] It should be noted that the IPM module 20 (Intelligent Power Module, the Chinese name is intelligent power module) may have a motor connection end 21 for connecting to the brushless motor 110 to drive the brushless motor 110 to rotate.

[0039] It should be noted that the power connection module 30 may have a power connection end 31 for connecting to a power supply to supply power to some or all of the modules on the drive module 1. For example, the power supply supplies power to the IPM module 20, the power control module 40, and the MCU module 50. Among them, the power supply may be a battery or an external power supply.

[0040] It should be noted that the power control module 40 can receive a power control signal and control the on / off of the power signal of the drive module 1 of the brushless motor 110 according to the power control signal. Among them, the power control signal may indicate that the drive module 1 is connected to the power supply or indicate that the drive module 1 is disconnected from the connected power supply.

[0041] It should be noted that the MCU module 50 (Microcontroller Unit, whose Chinese name is microcontroller unit) is used to control some modules on the drive module 1 of the brushless motor 110 so that the drive module 1 can work better.

[0042] It should be noted that wires can be arranged on the board body 10, and the drive module 1 realizes the electrical connection of each module through the wires.

[0043] It should be noted that the first side of the board body 10 can be represented by the direction shown by the letter A in the figure, the second side of the board body 10 can be represented by the direction shown by the letter B in the figure, the third side of the board body 10 can be represented by the direction shown by the letter C in the figure, and the fourth side of the board body 10 can be represented by the direction shown by the letter D in the figure. It can be understood that setting a module on the first side of the board body means that the components in the module are closer to the board body edge of the first side of the board body than to the other board body edges of the board body, that is, among the distances from the components in the module to the board body edges of the board body, the distance to the board body edge of the first side of the board body is the closest. Similarly, setting a module on the second side of the board body means that the components in the module are closer to the board body edge of the second side of the board body than to the other board body edges of the board body. Setting a module on the third side of the board body means that the components in the module are closer to the board body edge of the third side of the board body than to the other board body edges of the board body. If the distances from the position of the components in the module to the board body edges of the board body are not much different, the module is set in the middle of the board body. At the same time, since there are multiple components in some modules, the board body edge to which more components in the module are close can be used as the side where the module is located. Among them, more components can be understood as more than half of the total number of components in the module.

[0044] This application is connected to the power supply connection module 30 through the IPM module 20, enabling the power supply to supply power to the IPM module 20 through the power supply connection module 30. By connecting the power control module 40 to the power supply connection module 30 and the MCU module 50, it is possible to control whether the MCU module 50 is connected to the power supply by the power control module 40. Connecting the MCU module 50 to the IPM module 20 enables the start and stop of the brushless motor 110 connected to the IPM module 20 to be controlled by the MCU module 50. In this way, through the connection of the above-mentioned modules, it is possible to drive the food processor with a brushless motor. At the same time, the IPM module 20 is arranged on the first side of the board 10, and the power supply connection module 30, the power control module 40, and the MCU module 50 are arranged on the second side of the board 10. Since the IPM module 20 is far from the power supply connection module 30 and the power control module 40, the power supply connection module 30 and the power control module 40 are far from the high-frequency power circuit, which can make the power circuit more stable. At the same time, the power supply connection module 30 and the power control module 40 are arranged on the same side, which can improve the power transmission efficiency.

[0045] Exemplarily, the MCU module 50 includes an MCU chip 51. The charging and discharging of the battery, the on-off of the power circuit, the start and stop of the brushless motor, the open cover detection, and the fault handling can be controlled by the MCU chip 51.

[0046] Exemplarily, the power control module 40 may include a PMOS transistor 41, and the power control module 40 may also include several resistors. The power on and off of the drive module 1 of the brushless motor can be controlled by the PMOS transistor 41.

[0047] Exemplarily, the power supply connection module 30 may include a power supply connection terminal 31, and the power supply connection module 30 may also include several resistors. It can be connected to an external power supply through the power supply connection terminal 31. Among them, in order to better control the power on and off of the drive module 1 of the brushless motor, the distance between the power supply connection terminal 31 and the PMOS transistor 41 can be set to be less than a first preset distance. The first preset distance can be set by the engineer according to experience.

[0048] As an alternative implementation of this application, the IPM module includes a three-phase inverter bridge. The three-phase inverter bridge and the power control module are on the same surface of the board. Or, the three-phase inverter bridge and the MCU module are on the same surface of the board.

[0049] Exemplarily, the three-phase inverter bridge is composed of 6 DFN5*6 packaged NMOS transistors. The placement positions of the six NMOS transistors are parallel to the board edge of the first side of the board, and the NMOS transistors are close enough to the motor connection end, that is, the distance between the NMOS transistors and the motor connection end is less than a second preset distance. The second preset distance can be set by the engineer according to experience.

[0050] As another alternative embodiment of the present application, the IPM module 20 includes a three-phase inverter bridge; the upper bridge of the three-phase inverter bridge and the power control module 40 are located on the same surface of the board body 10; the lower bridge of the three-phase inverter bridge and the MCU module 50 are located on the same surface of the board body 10.

[0051] By placing the upper bridge and the lower bridge of the three-phase inverter bridge on two sides of the board body 10, the present application can reduce the area of the board body 10, thereby facilitating the miniaturization of the drive module 1.

[0052] As an embodiment of the above alternative embodiment, the MOS (Metal-Oxide-Semiconductor Field-Effect Transistor) tubes constituting the upper bridge of the three-phase inverter bridge and the MOS tubes constituting the lower bridge of the three-phase inverter bridge are staggered.

[0053] Exemplarily, the three-phase inverter bridge is composed of 6 DFN5*6 packaged NMOS tubes, for example: the first NMOS tube 22, the second NMOS tube 23, the third NMOS tube 24, the fourth NMOS tube 25, the fifth NMOS tube 26, and the sixth NMOS tube 27. Among them, the first NMOS tube 22, the second NMOS tube 23, and the third NMOS tube 24 constitute the upper bridge of the three-phase inverter bridge. The fourth NMOS tube 25, the fifth NMOS tube 26, and the sixth NMOS tube 27 constitute the lower bridge of the three-phase inverter bridge. The first NMOS tube 22, the second NMOS tube 23, and the third NMOS tube 24 and the power control module 40 are located on the same surface of the board body 10, and the fourth NMOS tube 25, the fifth NMOS tube 26, and the sixth NMOS tube 27 and the MCU module 50 are located on the same surface of the board body 10. At the same time, the placement positions of the first NMOS tube 22, the second NMOS tube 23, and the third NMOS tube 24 are parallel to the board edge of the first side of the board body 10, and there are gaps among the first NMOS tube 22, the second NMOS tube 23, and the third NMOS tube 24 in the direction along the first side. The fourth NMOS tube 25, the fifth NMOS tube 26, and the sixth NMOS tube 27 are parallel to the board edge of the first side of the board body 10, there are gaps among the fourth NMOS tube 25, the fifth NMOS tube 26, and the sixth NMOS tube 27 in the direction along the first side, and the positions of two of the fourth NMOS tube 25, the fifth NMOS tube 26, and the sixth NMOS tube 27 are the same as the positions of the gaps generated by the first NMOS tube 22, the second NMOS tube 23, and the third NMOS tube 24.

[0054] In this application, by interleaving the first NMOS transistor 22, the second NMOS transistor 23, and the third NMOS transistor 24 that form the upper bridge of the three-phase inverter with the fourth NMOS transistor 25, the fifth NMOS transistor 26, and the sixth NMOS transistor 27 that form the lower bridge of the three-phase inverter, it is beneficial to the heat dissipation of each NMOS transistor, preventing the NMOS transistor from being damaged due to high temperature. Furthermore, the driving module 1 will not fail to work due to the damage of the NMOS transistor, thereby improving the stability of the driving module 1.

[0055] As an alternative embodiment of this application, the driving module 1 further includes: a charging module 60. The charging module 60 is arranged on the third side of the board body 10, and the charging module 60 is electrically connected to the power connection module 30.

[0056] Among them, the components constituting the charging module 60 are dispersedly placed on both sides of the board body 10.

[0057] It should be noted that the charging module 60 may have a charging connection terminal 61 for connecting to the power connection module 30. When the power supply is a battery, the charging module 60 is used to charge the battery.

[0058] Exemplarily, the components of the charging module 60 include: a charging chip 62, a surge protection TVS tube 63, a current-limiting resistor 64, a boost inductor 65, a switching MOS transistor 66, and a charging connection terminal 61. Among them, the switching MOS transistor 66 and the charging chip 62 are on the same side of the board body 10 as the MCU module 50. The surge protection TVS (Transient Voltage Suppressor) tube 63, the current-limiting resistor 64, and the boost inductor 65 are on the same side of the board body 10 as the power control module 40. In order to make the connection harness smoother, the charging connection terminal 61 can be set on the board edge of the third side of the board body 10.

[0059] It is worth noting that, in order to better control the battery charging, the distance between the switching MOS transistor 66 and the charging chip 62 is less than a third preset distance. The third preset distance can be set by engineers according to experience.

[0060] In this application, by arranging the charging module 60 on the third side of the board body 10, the charging module 60 can be separated from the main power circuit, away from the high-frequency signal circuit. At the same time, the wiring of the charging module 60 loop can be shorter, less likely to generate a high temperature rise, and the charging efficiency is higher. By dispersedly placing the components constituting the charging module 60 on both sides of the board body 10, the area of the board body 10 occupied by the components can be reduced, thus facilitating the miniaturization of the driving module 1.

[0061] As an alternative embodiment of the present application, the driving module 1 further includes a charging detection module 70. The charging detection module 70 is disposed on the third side of the board body 10, and the charging detection module 70 and the MCU module 50 are located on the same surface of the board body 10. The charging detection module 70 is connected to the MCU module 50.

[0062] Exemplarily, the charging detection module 70 may include an NPN-type triode 71. The charging detection module 70 may further include a plurality of resistors.

[0063] It should be noted that the charging detection module 70 can detect a charging access signal. By connecting the charging detection module 70 to the MCU module 50, the charging detection module 70 can convey the charging access signal to the MCU module 50.

[0064] In the present application, both the charging detection module 70 and the charging module 60 are disposed on the third side of the board body 10, so that the charging detection module 70 is close to the charging module 60, which can ensure that the received charging access signal is not interfered, facilitating the transmission of an accurate charging access signal to the MCU module 50.

[0065] As an alternative embodiment of the present application, the driving module 1 further includes a lid opening detection module 80. The lid opening detection module 80 is disposed on the third side of the board body 10, and the lid opening detection module 80 and the power control module 40 are located on the same surface of the board body 10. The lid opening detection module 80 is connected to the MCU module 50.

[0066] Exemplarily, the lid opening detection module 80 may include a unipolar Hall device 81. The lid opening detection module 80 may further include a plurality of resistors and a plurality of capacitors.

[0067] It should be noted that the lid opening detection module 80 is used to detect the screwing state of the cup lid. By connecting the lid opening detection module 80 to the MCU module 50, the lid opening detection module 80 can convey the screwing state of the cup lid to the MCU module 50. It can be understood that the screwing state of the cup lid can be that the cup lid is in the closed state or the cup lid is in the open state.

[0068] In the present application, both the lid opening detection module 80 and the charging module 60 are disposed on the third side of the board body 10, so that the lid opening detection module 80 is close to the charging module 60, which can keep the lid opening detection module 80 away from the high-frequency power circuit. At the same time, by making the lid opening detection module 80 close to the charging module 60, the lid opening Hall signal for transmitting the screwing state of the cup lid can be kept from being interfered, facilitating the transmission of an accurate lid opening Hall signal to the MCU module 50.

[0069] As an alternative embodiment of the present application, the length of any side of the board body 10 does not exceed 80 mm. In this way, by arranging each module in the above-mentioned arrangement method, it is possible to arrange the components required for the drive module 1 when the length of any side of the board body does not exceed 80 mm, so that the function of the drive module 1 can be realized when the drive module 1 is relatively small. Furthermore, the space occupied by the drive module 1 is reduced.

[0070] As an alternative embodiment of the present application, the drive module 1 further includes: a bootstrap diode. The distance between the bootstrap diode and the MCU module 50 is made less than a fourth preset distance. Wherein, the fourth preset distance can be set by the engineer according to experience.

[0071] In the present application, making the distance between the bootstrap diode and the MCU module less than the fourth preset distance can make the bootstrap diode close enough to the MCU module, thereby avoiding the instability of the bootstrap voltage caused by the relatively large distance between the bootstrap diode and the MCU module.

[0072] As an alternative embodiment of the present application, the drive module 1 further includes: a display board 90, and the display board 90 is connected to the MCU module 50 and the power control module 40; the display board 90 is used to display the working state of the food processor and receive a power control signal.

[0073] Exemplarily, the display board 90 may include a power line, a ground line, a DAT data signal line, an SCK clock signal line, and a KEY button signal line.

[0074] It should be noted that the display board 90 may be a touch display screen, and the user can touch the touch display screen to select the conduction or disconnection of the power signal of the drive module 1. The display board 90 may also be a display panel with buttons and a display screen, and the user can select the conduction or disconnection of the power signal of the drive module 1 through the buttons. Wherein, the signal generated when the user touches the display screen or presses the button for the power control state of the drive module 1 is called a power control signal.

[0075] In the present application, by connecting the display board 90 to the MCU module 50 and the power control module 40 and displaying the working state of the food processor, it is convenient for the user to intuitively view the working state of the food processor. At the same time, by the user touching the display board 90 to generate a power control signal, the user can conveniently control the food processor.

[0076] As an alternative embodiment of the present application, the drive module 1 further includes: a Hall board 100, and the Hall board 100 is connected to the charging module 60; the Hall board 100 is used to connect to the charging module 60 and an external charging cable to provide a charging circuit.

[0077] Exemplarily, the Hall plate 100 may include a power line, a ground line, a Hall output signal line, a Hall input signal line, and the like.

[0078] It should be noted that the Hall plate 100 can be connected to the charging module 60 and an external charging cable to provide a charging circuit. The Hall plate 100 can also be connected to the lid opening detection module 80 and the charging detection module 70.

[0079] In this application, the charging module 60 and the external charging cable are connected through the Hall plate 100. Since the Hall plate 100 can intelligently sense the placement state of the device, when the food processor is placed on the charger, the potential difference generated by the Hall effect can drive current through the Hall plate 100, thereby realizing automatic startup of charging and making the charging process more convenient for users.

[0080] The present utility model also provides a food processor, which includes a housing, a power supply, a brushless motor, and a driving module for the brushless motor applied to the food processor in the above embodiment. The housing has a receiving cavity, the power supply is arranged in the receiving cavity, the brushless motor is arranged in the receiving cavity, and the driving module for the brushless motor applied to the food processor is arranged in the receiving cavity.

[0081] It can be understood that the power supply arranged in the food processor can be a battery.

[0082] As Figures 1 to 5 shown. As an alternative embodiment of the present application, the driving module 1 includes: an IPM module 20 arranged on the first side of the board body 10, a power connection module 30, a power control module 40, and an MCU module 50 arranged on the second side of the board body 10 opposite to the first side.

[0083] As an alternative embodiment of the present application, the driving module 1 further includes: a charging module 60 arranged on the third side of the board body 10. The charging module 60 may have a charging connection end 61 for connecting to the power connection module 30. When the power supply is a battery, the charging module 60 is used to charge the battery.

[0084] As an alternative embodiment of the present application, the driving module 1 further includes: a charging detection module 70 arranged on the third side of the board body 10. The charging detection module 70 can detect a charging access signal. By connecting the charging detection module 70 to the MCU module 50, the charging detection module 70 can convey the charging access signal to the MCU module 50.

[0085] As an alternative embodiment of the present application, the drive module 1 further includes: a lid opening detection module 80 disposed on the third side of the board body 10. The lid opening detection module 80 is configured to detect the screwing-in state of the cup lid. The lid opening detection module 80 is connected to the MCU module 50, and the lid opening detection module 80 can convey the screwing-in state of the cup lid to the MCU module 50.

[0086] As an alternative embodiment of the present application, the food processor further includes: a display board 90. The display board 90 is connected to the drive module 1; the display board 90 is configured to display the working state of the food processor and receive a power control signal.

[0087] As an alternative embodiment of the present application, the food processor further includes: a Hall board 100. The Hall board 100 is connected to the drive module 1; the Hall board 100 is configured to be connected to the charging module 60 and an external charging cable to provide a charging circuit.

[0088] Exemplarily, in the case where the power supply is a battery, in combination with Figure 5 As shown, the entire brushless control system of the food processor is composed of a display board 90, a Hall board 100, a drive module 1, a motor assembly 130, and a battery assembly 120. Among them, the display board 90 is electrically connected to the drive module 1 through a 5-pin cable, and is configured to display the working state of the food processor and receive a power control signal. The Hall board 100 is electrically connected to the drive module 1 through a 4-pin cable, and is configured to connect an external charging cable to the charging module of the drive module to provide a charging circuit. The battery assembly 120 is electrically connected to the drive module 1 through a 4-pin cable, and the motor assembly 130 is electrically connected to the drive module 1 through a 3-pin cable. It can be understood that the motor assembly 130 includes a brushless motor 110. The battery assembly 120 includes a battery.

[0089] In the present application, a battery, a brushless motor, a drive module for controlling the brushless motor, and a Hall board are provided in the housing of the food processor, and a display board is provided on the housing of the food processor. Among them, the drive module 1 includes an IPM module 20 disposed on the first side of the board body 10, a power connection module 30, a power control module 40, an MCU module 50 disposed on the second side of the board body 10 opposite to the first side, a charging module 60 disposed on the third side of the board body 10, a charging detection module 70 disposed on the third side of the board body 10, and a lid opening detection module 80 disposed on the third side of the board body 10. It can enable the food processor to have effects such as a large speed regulation range, low noise, long life, large starting torque, good heat dissipation effect, low device temperature rise, miniaturization, convenient wiring of each module, each module is not easily interfered, and the board layout area is more refined.

[0090] The technical solution protected by the present utility model is not limited to the above embodiments. It should be noted that the combination of the technical solution of any one embodiment with the technical solutions of one or more other embodiments is within the protection scope of the present utility model. Although the present utility model has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it on the basis of the present utility model, which is obvious to those skilled in the art. Therefore, these modifications or improvements made without departing from the spirit of the present utility model all fall within the scope of protection required by the present utility model.

Claims

1. A drive module for a brushless motor applied to a food processor, characterized in that The driving module includes: A board body; An IPM module, disposed on the first side of the board body, and the IPM module is used to connect to a brushless motor; A power connection module, disposed on the second side of the board body opposite to the first side, and the power connection module is connected to the IPM module; the power connection module is used to connect to a power supply; A power control module, disposed on the second side, and the power control module is connected to the power connection module. The power control module is used to receive a power control signal and control the on / off of the power signal of the driving module of the brushless motor according to the power control signal; An MCU module, disposed on the second side of the board body, and the MCU module and the power control module are located on different surfaces of the board body; the MCU module is electrically connected to the power control module and the IPM module, and the MCU module is used to control the operation of the driving module of the brushless motor.

2. The drive module according to claim 1, wherein The IPM module includes a three-phase inverter bridge; the upper bridge of the three-phase inverter bridge and the power control module are located on the same surface of the board body; the lower bridge of the three-phase inverter bridge and the MCU module are located on the same surface of the board body.

3. The drive module according to claim 2, characterized in that, The MOS transistors constituting the upper bridge of the three-phase inverter bridge and the MOS transistors constituting the lower bridge of the three-phase inverter bridge are staggered.

4. The drive module according to any one of claims 1 to 3, characterized in that The driving module further includes: a charging module, disposed on the third side of the board body, and the charging module is electrically connected to the power connection module.

5. The drive module according to claim 4, characterized in that, The components constituting the charging module are dispersedly placed on both sides of the board body.

6. The drive module according to any one of claims 1 to 3, characterized in that, The driving module further includes: a charging detection module, disposed on the third side of the board body, and the charging detection module and the MCU module are located on the same surface of the board body; the charging detection module is connected to the MCU module.

7. The drive module according to any one of claims 1 to 3, characterized in that The driving module further includes: an open cover detection module, disposed on the third side of the board body, and the open cover detection module and the power control module are located on the same surface of the board body; the open cover detection module is connected to the MCU module.

8. The drive module according to any one of claims 1 to 3, characterized in that, The driving module further includes: a display board, connected to the MCU module and the power control module; the display board is used to display the working state of the food processor and receive the power control signal.

9. The drive module according to claim 4, wherein The driving module further includes: a Hall board, connected to the charging module; the Hall board is used to connect to the charging module and an external charging cable to provide a charging circuit.

10. A food processor, characterized in that, Comprising: A housing, having a receiving cavity; A power supply, disposed in the receiving cavity; A brushless motor, disposed in the receiving cavity; The driving module according to any one of claims 1 to 9, disposed in the receiving cavity.

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