Heat dissipation component and circuit board assembly with same

Abstract

A heat dissipation component is used for solving the problem that an existing shielding body is poor in heat dissipation. Comprising a shielding cover which is used for covering a circuit substrate and an electronic element to form a liquid-tight space; and the fluid driving piece is positioned in the shielding case. The utility model further relates to a circuit board assembly with the heat dissipation component. Therefore, the effect of preventing high temperature from influencing the operation efficiency of the electronic component can be achieved.

Description

Technical Field

[0001] The utility model relates to a heat dissipation component, in particular to a heat dissipation component capable of shielding electromagnetic interference and a circuit board assembly having the heat dissipation component. Background Art

[0002] Electromagnetic interference (EMI) refers to the phenomenon that the performance of electronic components is reduced due to the action of electromagnetic energy such as voltage or current. Therefore, an existing shielding body is usually used to block or attenuate the electromagnetic energy between the electronic components and the outside, so as to achieve the effect of shielding electromagnetic interference. Generally, a metal cover is covered on the electronic component to shield the electromagnetic interference on the electronic component by the metal cover. However, after the metal cover covers the electronic component, if heat dissipation components such as a fan and fins are additionally installed, a component with a large volume and a high stacked thickness will be formed, which is not conducive to the thinning of electronic products. In addition, the insufficient heat dissipation effect of the fan or fins will also cause poor heat dissipation of the electronic component, thereby affecting the operation efficiency of the electronic component.

[0003] In view of this, there is indeed a need to improve the existing shielding body. Summary of the Utility Model

[0004] To solve the above problems, the purpose of the utility model is to provide a heat dissipation component and a circuit board assembly having the heat dissipation component, which can have good shielding and heat dissipation effects on electronic components.

[0005] All directional terms or similar terms described throughout the text of the present utility model, such as "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "side", etc., mainly refer to the directions in the attached drawings. Each directional term or similar term is only used to assist in explaining and understanding the embodiments of the present utility model, and is not used to limit the present utility model.

[0006] The quantifiers "a" or "one" used for the elements and components described throughout the text of the present utility model are only for convenience of use and provide the general meaning of the scope of the present utility model; in the present utility model, it should be interpreted as including one or at least one, and the single concept also includes the case of multiple, unless it clearly means otherwise.

[0007] All approximate terms such as "combination", "assembly" or "assembling" described throughout the text of the present utility model mainly include forms such as being separable without damaging the components after connection, or being inseparable after connection. Those skilled in the art can select according to the material of the components to be connected or the assembly requirements.

[0008] The heat dissipation component of the present utility model includes: a shielding cover for covering a circuit board and an electronic component to form a liquid-tight space; and a fluid driving member located inside the shielding cover.

[0009] Therefore, for the heat dissipation component and circuit board assembly of the present utility model, due to the liquid-tight space within the shielding cover, the working liquid can be present in the liquid-tight space. By the fluid driving member disturbing the working liquid, while the shielding cover blocks or attenuates electromagnetic interference for the electronic components of the circuit board, the working liquid can absorb the heat energy generated by the electronic components and then dissipate it to the external space, having the effect of avoiding the influence of high temperature on the operation efficiency of the electronic components.

[0010] Among them, the shielding cover has a ring wall, one end of the ring wall is liquid-tightly combined with a cover body, and the other end of the ring wall is used to be liquid-tightly combined with the circuit board to cover the electronic components. In this way, it has the effect of avoiding the leakage of the working liquid in the liquid-tight space.

[0011] Among them, the ring wall has an inner wall and an outer wall, a glue-filling space is formed between the inner wall and the outer wall, a sealing colloid is filled in the glue-filling space, and a ring flange of the cover body is located in the glue-filling space. In this way, the sealing colloid can form a liquid-tight combination with the ring flange, having the effect of avoiding the leakage of the working liquid.

[0012] Among them, the inner wall and the outer wall are connected by a bottom plate. In this way, the ring wall can be combined with the heat conducting part by the bottom plate, which can further ensure the liquid-tightness effect between the ring wall and the heat conducting part.

[0013] Among them, the cover body has a top and a side wall part, one end of the side wall part is connected to the periphery of the top, the other end of the side wall part has the ring flange, and the side wall part abuts against the inner wall. In this way, the cover body and the ring wall can have a better liquid-tightness effect.

[0014] Among them, the fluid driving member has a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are connected to the liquid-tight space, and there is a flow channel between the liquid inlet and the liquid outlet. In this way, the fluid driving member can drive the working liquid to enter the flow channel from the liquid inlet and then be discharged to the liquid-tight space from the liquid outlet, having the effect of driving the working liquid to circulate.

[0015] Among them, the cover body has a shell cover, the shell cover is connected to the top of the cover body to form a chamber within the shell cover, and the fluid driving member is accommodated in the chamber. In this way, the fluid driving member can drive the working liquid into and then out of the chamber, having the effect of driving the working liquid to circulate.

[0016] Among them, the shell cover is formed by detachably combining a cover plate with a ring wall part, and the ring wall part is combined with the top. In this way, it has the effect of facilitating the repair or replacement of the fluid driving member.

[0017] The circuit board assembly of the present utility model includes a circuit substrate; an electronic component located on a surface of the circuit substrate; and the above-mentioned heat dissipation member, which is combined with the surface of the circuit substrate to cover the electronic component. The heat dissipation member and the circuit substrate form the liquid-tight space, and the liquid-tight space has a working liquid, and the fluid driving member drives the working liquid to flow in the liquid-tight space. In this way, while the shielding cover blocks or attenuates electromagnetic interference of the electronic components on the circuit substrate, the heat generated by the electronic components can be absorbed by the working liquid and then dissipated to the external space, having the effect of avoiding the influence of high temperature on the operation efficiency of the electronic components.

[0018] Wherein, a waterproof part is located between the shielding cover and the circuit substrate. The waterproof part surrounds and is adjacent to the electronic component, and the waterproof part is liquid-tightly combined with the ring wall. In this way, the waterproof part can prevent the working liquid from causing a short circuit of the electronic component.

[0019] Wherein, the waterproof part is a waterproof adhesive layer or a waterproof paint layer. In this way, the waterproof adhesive layer can block the working liquid in the liquid-tight space from the electronic component, having the effect of preventing the working liquid from causing a short circuit of the electronic component.

[0020] The heat dissipation member of the present utility model includes: a shielding cover having a liquid-tight space with a working liquid. The shielding cover is used to cover an electronic component so that the electronic component is located between the shielding cover and a circuit substrate; and a fluid driving member located in the liquid-tight space to drive the working liquid to flow in the liquid-tight space. In this way, while the shielding cover blocks or attenuates electromagnetic interference of the electronic components on the circuit substrate, the heat generated by the electronic components can be absorbed by the working liquid and then dissipated to the external space, having the effect of avoiding the influence of high temperature on the operation efficiency of the electronic components.

[0021] Wherein, the shielding cover has a heat conduction part for absorbing the heat energy of the electronic component. The shielding cover has a ring wall, one end of the ring wall is liquid-tightly combined with the heat conduction part, and the other end of the ring wall is liquid-tightly combined with a cover body. The heat conduction part, the ring wall and the cover body surround and form the liquid-tight space. In this way, the heat energy of the electronic component can be transferred to the working liquid in the liquid-tight space.

[0022] Wherein, the heat conduction part is a plate body. In this way, the heat energy of the electronic component can be absorbed by directly or indirectly contacting the electronic component through the heat conduction part.

[0023] The circuit board assembly of the present utility model may further include a circuit substrate; an electronic component located on one surface of the circuit substrate; and the above-mentioned heat dissipation member, with the shielding cover covering the electronic component such that the electronic component is located between the shielding cover and the circuit substrate. In this way, while the shielding cover blocks or attenuates electromagnetic interference to the electronic component on the circuit substrate, the working liquid can absorb the heat energy generated by the electronic component and then dissipate it to the external space, having the effect of avoiding the influence of high temperature on the operation efficiency of the electronic component.

[0024] The circuit substrate of the present utility model may further include a shielding wall surrounding the electronic component. One end of the shielding wall is coupled to the circuit substrate, and the other end of the shielding wall has an opening, and the shielding cover is coupled to the shielding wall through the opening. In this way, the shielding cover and the shielding wall can jointly block or attenuate external electromagnetic energy, having the effect of avoiding electromagnetic interference to the electronic component.

[0025] Wherein, the shielding cover is coupled to the shielding wall through the annular wall. In this way, the shielding cover and the shielding wall can jointly block or attenuate external electromagnetic energy, having the effect of avoiding electromagnetic interference to the electronic component.

[0026] Wherein, the annular wall has a positioning flange protruding towards the shielding wall, and the positioning flange abuts against one end edge of the opening of the shielding wall. In this way, the positioning flange can position the shielding cover on the shielding wall, having the effect of avoiding the shielding cover overly pressing the electronic component and causing damage to the electronic component.

[0027] Wherein, the shielding wall has an abutting convex portion protruding towards the annular wall, and the abutting convex portion abuts against the annular wall. In this way, the annular wall can form a partial tight fit with the abutting convex portion, and a relatively small frictional force is formed between the annular wall and the shielding wall, having the effect of easily coupling the shielding cover to the shielding wall through the opening. Description of the Drawings

[0028] Figure 1 : Exploded perspective view of the first embodiment of the present utility model;

[0029] Figure 2 : Schematic diagram of the assembly process of the first embodiment of the present utility model;

[0030] Figure 3 : Cross-sectional view of the first embodiment of the present utility model;

[0031] Figure 4 : As Figure 3 shown, enlarged view of the local structure of A;

[0032] Figure 5 : Exploded perspective view of the second embodiment of the present utility model;

[0033] Figure 6 : Cross-sectional view of the second embodiment of the present utility model;

[0034] Figure 7 : As shown in Figure 6 Enlarged view of the partial structure of B shown;

[0035] Figure 8 : As shown in Figure 7 Combined view of another embodiment of the shielding cover and the shielding wall of the present utility model shown;

[0036] Figure 9 : Cross-sectional view of the electronic component of the second embodiment of the present utility model combined with the heat conducting member.

[0037] Explanation of reference numerals:

[0038] 1: Shielding cover

[0039] 11: Waterproof part

[0040] 12: Ring wall

[0041] 12a: Inner wall

[0042] 12b: Outer wall

[0043] 12c: Bottom plate

[0044] 121: Positioning flange

[0045] 13: Cover body

[0046] 13a: Ring flange

[0047] 131: Top

[0048] 132: Side wall part

[0049] 14: Shell cover

[0050] 14a: Cover plate

[0051] 14b: Ring wall part

[0052] 15: Heat conducting part

[0053] 2: Fluid driving member

[0054] 2a: Liquid inlet

[0055] 2b: Liquid outlet

[0056] 2c: Flow channel

[0057] 21: Impeller

[0058] 3: Shielding wall

[0059] 3a: End edge

[0060] 31: Opening

[0061] 32: Contact projection

[0062] K: Heat dissipation component

[0063] S1: Liquid-tight space

[0064] S2: Glue-filling space

[0065] G: Sealing colloid

[0066] L: Working liquid

[0067] E: Electronic component

[0068] P: Circuit board

[0069] R: Chamber

[0070] F: Circuit board assembly

[0071] M: Heat conducting member. Detailed implementation manner

[0072] To make the above and other objects, features, and advantages of the present utility model more obvious and understandable, the following specifically gives the preferred embodiments of the present utility model and makes detailed descriptions in conjunction with the accompanying drawings; in addition, the same symbols marked in different drawings are regarded as the same, and their descriptions will be omitted.

[0073] Please refer to Figure 1 、 Figure 3 As shown, it is the first embodiment of the heat dissipation component K of the present utility model, including a shielding cover 1 and a fluid driving member 2, and the fluid driving member 2 is located inside the shielding cover 1.

[0074] The shielding cover 1 can be made of a metal material with high thermal conductivity and high electrical conductivity, such as iron, aluminum, or copper, so that the shielding cover 1 can be used to cover an electronic component E to block or attenuate the electromagnetic interference of external electromagnetic energy on the electronic component E. The shielding cover 1 has a liquid-tight space S1, and the liquid-tight space S1 has a working liquid L. Further, the liquid-tight space S1 can be a closed space, and the working liquid L can be only located in the liquid-tight space S1 and will not be exported. The working liquid L can be water or a non-conductive liquid. The shielding cover 1 can be used to contact the electronic component E. Further, the electronic component E can be located on a circuit board assembly F. The circuit board assembly F can have a circuit substrate P, and the electronic component E can be located on a surface of the circuit substrate P. Preferably, a heat-conducting member M can contact the electronic component E so that the electronic component E is located between the circuit substrate P and the heat-conducting member M. The heat-conducting member M can be made of a metal material with high thermal conductivity, such as iron, aluminum, or copper. The shielding cover 1 can cover the circuit substrate P so that the electronic component E can be within the range of the shielding cover 1. In this way, the heat energy of the electronic component E can be further transferred to the working liquid L through the heat-conducting member M, thereby dissipating heat from the electronic component E. Specifically, the shielding cover 1 can have a waterproof portion 11, and the waterproof portion 11 can be located between the shielding cover 1 and the circuit substrate P. The waterproof portion 11 is used to contact the electronic component E. For example, when the working liquid L is water, the waterproof portion 11 can prevent the working liquid L from causing a short circuit of the electronic component E. In this embodiment, the waterproof portion 11 is a waterproof glue layer or a waterproof paint layer, and the waterproof portion 11 can surround and be adjacent to the electronic component E.

[0075] Please refer to Figure 2 、 Figure 3 As shown, the shielding cover 1 can have a ring wall 12, and one end of the ring wall 12 is liquid-tightly combined with the waterproof portion 11. In this embodiment, after welding one end of the ring wall 12 to the circuit substrate P, a waterproof glue or a waterproof paint can be coated within the range surrounded by the ring wall 12 on the circuit substrate P, and the waterproof glue layer or the waterproof paint layer formed by the waterproof glue or the waterproof paint is adjacent to the electronic component E and the ring wall 12. Wait for the waterproof glue layer or the waterproof paint layer to solidify to form the waterproof portion 11. For example, the electronic component E can be covered first and then the waterproof glue or the waterproof paint can be coated. After the waterproof glue layer or the waterproof paint layer solidifies, the cover of the electronic component E can be removed, and then the heat-conducting member M can be combined with the electronic component E. In this way, the ring wall 12 and the waterproof portion 11 can have liquid-tightness.

[0076] The annular wall 12 may have an inner wall 12a and an outer wall 12b. The inner wall 12a is adjacent to the liquid-tight space S1. The inner wall 12a and the outer wall 12b may be respectively joined to the circuit board P by welding. For example, the inner wall 12a and the outer wall 12b may be joined to holes on the circuit board P and then welded from the bottom of the circuit board P. The welding may be laser welding, reflow soldering or tin soldering, which is not limited in the present utility model. In another embodiment, the inner wall 12a and the outer wall 12b may be connected by a bottom plate 12c, and the annular wall 12 may be welded to the circuit board P by the bottom plate 12c. Thus, the liquid-tightness between the annular wall 12 and the circuit board P can be further ensured. A glue-filling space S2 may be formed between the inner wall 12a and the outer wall 12b, and the glue-filling space S2 may be filled with a sealing colloid G.

[0077] Please refer to Figure 3 、 Figure 4 As shown, the other end of the annular wall 12 is liquid-tightly joined to a cover 13. Thus, the annular wall 12 and the cover 13 can surround the circuit board P to form the liquid-tight space S1. Preferably, the waterproof part 11 can be located between the annular wall 12 and the cover 13 of the shielding cover 1 and the circuit board P. The annular wall 12 and the cover 13 may be joined by welding, or the annular wall 12 and the cover 13 may be integrally formed so that the annular wall 12 and the cover 13 form a liquid-tight joint. In this embodiment, a ring flange 13a of the cover 13 may be located in the glue-filling space S2 so that the ring flange 13a can be immersed in the sealing colloid G. The cover 13 may be bent towards the glue-filling space S2 so that the ring flange 13a extends into the glue-filling space S2, or the lower surface of the cover 13 may protrude to form the ring flange 13a, which is not limited in the present utility model. Thus, after the glue-filling space S2 is filled with the sealing colloid G, the sealing colloid G can cover the ring flange 13a, so that the annular wall 12 and the ring flange 13a form a liquid-tight joint. In this embodiment, the cover 13 may have a top 131 and a side wall portion 132. One end of the side wall portion 132 is connected to the periphery of the top 131, and the other end of the side wall portion 132 has the ring flange 13a, and the side wall portion 132 abuts against the inner wall 12a. Thus, the cover 13 and the annular wall 12 can have better liquid-tightness.

[0078] Please refer to Figure 1 、 Figure 3As shown, the fluid driver 2 is located in the liquid-tight space S1. The fluid driver 2 is used to drive the flow of the working liquid L so that the heat transferred from the electronic component E to the working liquid L can be evenly transferred to the entire working liquid L, and then the heat can be easily dissipated. For example, the fluid driver 2 may have an impeller 21 enclosed. By rotating the impeller 21, the working liquid L is disturbed, and the heat can be evenly transferred. In this embodiment, the fluid driver 2 may be a pump. The fluid driver 2 may have an inlet 2a and an outlet 2b. The inlet 2a and the outlet 2b are connected to the liquid-tight space S1, and there is a flow channel 2c between the inlet 2a and the outlet 2b. By rotating the impeller 21, the working liquid L can be driven to enter the flow channel 2c from the inlet 2a and then discharged to the liquid-tight space S1 from the outlet 2b. In this way, the fluid driver 2 can drive the working liquid L to circulate, having the effect of making the heat transfer to the working liquid L more evenly.

[0079] In this embodiment, the cover 13 may have a housing 14. The housing 14 may be connected to the top 131 of the cover 13 to form a chamber R inside the housing 14. The fluid driver 2 may be accommodated in the chamber R. The housing 14 may be combined with the top 131 by welding or locking. For example, the housing 14 may have a cover plate 14a and a ring wall portion 14b. The ring wall portion 14b may be combined with the top 131 by welding, or the ring wall portion 14b and the top 131 are integrally formed. The cover plate 14a may be detachably combined with the ring wall portion 14b by screwing or the like. In this way, the fluid driver 2 can be conveniently repaired or replaced. In addition, the heat dissipation member K of the present utility model may be further connected to, for example, a heat pipe or fins to dissipate the heat of the working liquid L or transfer it to other heat dissipation components, or the heat of the working liquid L may be dissipated by guiding air flow through the heat dissipation member K or the above heat pipe or fins and other components by a fan.

[0080] Please refer to Figure 5 、 Figure 6As shown, this is the second embodiment of the heat dissipation component K of the present utility model. This embodiment is substantially the same as the above-mentioned first embodiment. In this embodiment, the heat dissipation component K further includes a shielding wall 3, which is combined with the circuit board P to surround the electronic component E. The shielding wall 3 can be combined with the circuit board P by means of welding or snapping. The shielding wall 3 can be made of a metal material, and the shielding cover 1 can be combined with the shielding wall 3. Specifically, one end of the shielding wall 3 is combined with the circuit board P. For example, the shielding wall 3 can be welded to the copper foil forming a ground on the circuit board P so that the shielding wall 3 can form a ground. The other end of the shielding wall 3 can have an opening 31, and the shielding cover 1 can be combined with the shielding wall 3 through the opening 31. Thus, the shielding cover 1 and the shielding wall 3 can jointly block or attenuate the external electromagnetic energy to avoid electromagnetic interference to the electronic component E.

[0081] Furthermore, in this embodiment, the shielding cover 1 can have a heat-conducting portion 15, which can be a plate body and can be made of a high heat-conducting metal material such as copper, aluminum or iron. The heat-conducting portion 15 can abut against the electronic component E so that the electronic component E is located between the heat-conducting portion 15 and the circuit board P. Or, the heat-conducting portion 15 can abut against the heat-conducting member M (such as Figure 9 ). Thus, the heat-conducting portion 15 can absorb the heat energy of the electronic component E. The annular wall 12 can be combined with the heat-conducting portion 15 by welding so that there is liquid tightness between the annular wall 12 and the heat-conducting portion 15. That is, the heat-conducting portion 15, the annular wall 12 and the cover body 13 jointly form the liquid-tight space S1. Also, the inner wall 12a and the outer wall 12b of the annular wall 12 can be combined with the heat-conducting portion 15 by welding so that the filling glue space S2 can be formed between the inner wall 12a and the outer wall 12b. In another embodiment, the heat-conducting portion 15 can be integrally formed with the annular wall 12. For example, the inner wall 12a and the outer wall 12b are both integrally formed with the heat-conducting portion 15 to form better liquid tightness. More specifically, the shielding cover 1 can be combined with the shielding wall 3 through the annular wall 12. For example, the annular wall 12 can be combined with the shielding wall 3 through the outer wall 12b. The annular wall 12 or the outer wall 12b can be combined with the shielding wall 3 by means of tight fit, snapping, locking or welding, which is not limited in the present utility model. In this way, the shielding cover 1 and the shielding wall 3 can form electrical conduction and can play a role in blocking or attenuating electromagnetic interference. It should be noted that in this embodiment, the electronic component E does not directly contact the working liquid L. Therefore, the working liquid L can be water or a non-conductive liquid.

[0082] Please refer to Figure 7 、 Figure 8As shown. The annular wall 12 or the outer wall 12b may have a positioning flange 121 that protrudes towards the shielding wall 3. The positioning flange 121 can abut against an end edge 3a of the shielding wall 3 to prevent the shielding cover 1 from pressing excessively against the electronic component E and causing damage to the electronic component E. Also, the shielding wall 3 may have an abutting protrusion 32 that protrudes towards the annular wall 12. The abutting protrusion 32 can be used to abut against the annular wall 12 so that the shielding wall 3 and the annular wall 12 can form electrical conduction. Further, the annular wall 12 can form a partial tight fit with the abutting protrusion 32, resulting in a relatively small frictional force between the annular wall 12 and the shielding wall 3. In this way, the shielding cover 1 can be easily assembled and combined with the shielding wall 3 through the opening 31.

[0083] In summary, for the heat dissipation component and the circuit board assembly of the present utility model, with the liquid-tight space provided inside the shielding cover, the working liquid can be contained in the liquid-tight space. By the fluid driving member disturbing the working liquid, while the shielding cover blocks or attenuates electromagnetic interference to the electronic components on the circuit board, the heat energy generated by the electronic components can be absorbed by the working liquid and then dissipated to the external space, having the effect of avoiding the influence of high temperature on the operation efficiency of the electronic components.

[0084] Although the present utility model has been disclosed by using the above-mentioned preferred embodiments, it is not intended to limit the present utility model. Any person skilled in the art, without departing from the spirit and scope of the present utility model, making various changes and modifications to the above-mentioned embodiments still belongs to the technical scope protected by the present utility model. Therefore, the protection scope of the present utility model should include the meaning recorded in the appended claims and all changes within the equivalent scope. Also, when the above-mentioned several embodiments can be combined, the present utility model includes any combined implementation modes.

Claims

1. A heat dissipation component, characterized in that, Comprising: A shielding cover for covering a circuit board and an electronic component to form a liquid-tight space; And A fluid driving member located within the shielding cover.

2. The heat dissipation member according to claim 1, wherein, The shielding cover has an annular wall, one end of the annular wall is liquid-tightly bonded to a cover body, and the other end of the annular wall is used to be liquid-tightly bonded to the circuit board to cover the electronic component.

3. The heat dissipation component according to claim 2, wherein The annular wall has an inner wall and an outer wall, a caulking space is formed between the inner wall and the outer wall, the caulking space is filled with a sealing colloid, and a ring flange of the cover body is located in the caulking space.

4. The heat dissipation member according to claim 3, wherein The inner wall and the outer wall are connected by a bottom plate.

5. The heat dissipation member according to claim 3, wherein The cover body has a top portion and a side wall portion, one end of the side wall portion is connected to the periphery of the top portion, the other end of the side wall portion has the ring flange, and the side wall portion abuts against the inner wall.

6. The heat dissipation member according to claim 1, wherein The fluid driving member has a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are connected to the liquid-tight space, and there is a flow channel between the liquid inlet and the liquid outlet.

7. The heat dissipation member according to claim 2, wherein The cover body has a housing cover, the housing cover is connected to the top portion of the cover body to form a chamber inside the housing cover, and the fluid driving member is accommodated in the chamber.

8. The heat dissipation member according to claim 7, wherein The housing cover is formed by detachably combining a cover plate with an annular wall portion, and the annular wall portion is combined with the top portion.

9. A circuit board assembly, characterized in that, Comprising: A circuit board; An electronic component located on a surface of the circuit board; And A heat dissipation member according to any one of claims 1 to 8, the heat dissipation member is combined with the surface of the circuit board to cover the electronic component, the heat dissipation member and the circuit board form the liquid-tight space, the liquid-tight space has a working liquid, and the fluid driving member drives the working liquid to flow in the liquid-tight space.

10. The circuit board assembly according to claim 9, wherein A waterproof portion is located between the shielding cover and the circuit board, the waterproof portion surrounds and is adjacent to the electronic component, and the waterproof portion is liquid-tightly bonded to the annular wall.

11. The circuit board assembly according to claim 10, characterized in that, The waterproof portion is a waterproof glue layer or a waterproof paint layer.

12. A heat dissipation component, characterized in that, Comprising: A shielding cover having a liquid-tight space with a working liquid, the shielding cover is used to cover an electronic component so that the electronic component is located between the shielding cover and a circuit board; And A fluid driving member located in the liquid-tight space for driving the working liquid to flow in the liquid-tight space.

13. The heat dissipation member according to claim 12, wherein The shielding cover has a heat conducting portion for absorbing the heat energy of the electronic component, the shielding cover has an annular wall, one end of the annular wall is liquid-tightly bonded to the heat conducting portion, and the other end of the annular wall is liquid-tightly bonded to a cover body, and the heat conducting portion, the annular wall and the cover body surround and form the liquid-tight space.

14. The heat dissipation component according to claim 13, wherein The heat conducting portion is a plate body.

15. The heat dissipation member according to claim 13, wherein, The annular wall has an inner wall and an outer wall, the inner wall is adjacent to the liquid-tight space, a caulking space is formed between the inner wall and the outer wall, the caulking space is filled with a sealing colloid, and a ring flange of the cover body is located in the caulking space.

16. The heat dissipation member according to claim 15, characterized in that, The cover body has a top portion and a side wall portion, one end of the side wall portion is connected to the periphery of the top portion, the other end of the side wall portion has the ring flange, and the side wall portion abuts against the inner wall.

17. The heat dissipation member according to claim 15, wherein The inner wall and the outer wall are connected by a bottom plate.

18. A circuit board assembly, characterized in that, Comprising: A circuit board; An electronic component located on a surface of the circuit board; A heat dissipation member as described in any one of claims 12 to 17, wherein the shielding cover covers the electronic component such that the electronic component is located between the shielding cover and the circuit board.

19. The circuit board assembly according to claim 18, wherein It further includes a shielding wall that surrounds the electronic component. One end of the shielding wall is coupled to the circuit board, and the other end of the shielding wall has an opening. The shielding cover is coupled to the shielding wall through the opening.

20. The circuit board assembly according to claim 19, wherein The shielding cover is coupled to the shielding wall through the annular wall.

21. The circuit board assembly according to claim 20, wherein, The annular wall has a positioning flange that protrudes towards the shielding wall, and the positioning flange abuts against an edge of the opening of the shielding wall.

22. The circuit board assembly according to claim 20, characterized in that, The shielding wall has a butting protrusion that protrudes towards the annular wall, and the butting protrusion abuts against the annular wall.

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