Multi-layer high-conductivity aluminum-based circuit board

Abstract

The utility model relates to the technical field of circuit boards, in particular to a multi-layer high-conductivity aluminum-based circuit board, which comprises an aluminum substrate, a circuit layer is arranged above the aluminum substrate, a heat-conducting insulating block is embedded in the upper surface of the aluminum substrate, the upper end of the heat-conducting insulating block corresponds to the lower surface of the circuit layer, and the lower end of the heat-conducting insulating block corresponds to the lower surface of the circuit layer. The heat conduction insulation block and the circuit layer are bonded and fixed through a first heat conduction glue layer, a grounding piece is arranged on the edge of the aluminum substrate, one end of the grounding piece is welded and fixed to the outer ring wall of the aluminum substrate, a wiring hole penetrating through the interior of the grounding piece is formed in the grounding piece, a heat conduction base is arranged below the aluminum substrate, and the interior of the heat conduction base is coated with a second heat conduction glue layer. By means of the heat conduction insulation block structure, stable installation of the circuit layer and the aluminum substrate structure is guaranteed, meanwhile, a good heat conduction effect can be achieved when the circuit layer works continuously, heat can be further conducted and dispersed in cooperation with the heat conduction base structure installed at the lower end of the aluminum substrate, and the heat dissipation effect of the whole circuit board during continuous work is guaranteed.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a multi-layer high-conductivity aluminum-based circuit board. Background Art

[0002] A circuit board is an important component in electronic devices, used to achieve electrical connection and mechanical support between electronic components.

[0003] There are usually elements such as copper foil traces, vias, isolation areas, etc. on the circuit board, which are made through processes such as etching, lamination, drilling, etc. According to different application requirements, circuit boards can be divided into types such as single-sided boards, double-sided boards, multi-layer boards, etc.

[0004] The main function of the circuit board is to provide a platform for electronic components to be interconnected and assembled according to design requirements. In circuit design, the design of the circuit board is also very important because it directly affects the performance, reliability, and production cost of electronic devices.

[0005] An excellent circuit board design can improve the efficiency of signal transmission, reduce electromagnetic interference, and improve the stability of the system. The circuit board can achieve a high component packaging density, which is very important for miniaturized and integrated electronic products. Since the circuit board adopts automated production.

[0006] The circuit board reduces manual operation, so it has high manufacturing quality and reliability. Since the components on the circuit board are fixed, if there is a fault, only the problematic board needs to be replaced, rather than the entire device.

[0007] A lighting layout circuit board refers to installing LED lights or other types of lamps on a specific circuit board.

[0008] Currently, for the LED circuit boards used at some event sites, especially those applied to advertising playback and lighting layout circuits, they will continuously work during the event, so it is necessary to ensure that they have good heat dissipation effects. At the same time, due to the different times and locations of the events, such circuit boards will also be frequently disassembled. Therefore, the contact surface between the circuit board and the installation point also needs to have good wear resistance. Summary of the Utility Model

[0009] The purpose of the utility model is to propose a multi-layer high-conductivity aluminum-based circuit board to solve the above-mentioned disadvantages in the prior art.

[0010] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0011] Design a multi-layer high-conductivity aluminum-based circuit board, including an aluminum substrate. Above the aluminum substrate is provided a circuit layer. The upper surface of the aluminum substrate is embedded with a heat-conducting insulating block, and the upper end of the heat-conducting insulating block corresponds to the lower surface of the circuit layer. The heat-conducting insulating block and the circuit layer are adhesively fixed through a first heat-conducting adhesive layer. A grounding piece is arranged at the edge of the aluminum substrate, and one end of the grounding piece is welded and fixed to the outer wall of the aluminum substrate. A wiring hole penetrating through its interior is opened on the grounding piece. Below the aluminum substrate is provided a heat-conducting seat, and a second heat-conducting adhesive layer is coated inside the heat-conducting seat. The lower end of the aluminum substrate is adhesively arranged with the second heat-conducting adhesive layer. Below the heat-conducting seat is provided an installation seat, and a third heat-conducting adhesive layer is coated inside the installation seat. The outer wall surface of the heat-conducting seat is adhesively arranged with the third heat-conducting adhesive layer. Installation holes that penetrate and communicate with each other are provided on the aluminum substrate, the heat-conducting seat, and the installation seat, and the number of the installation holes is four, and they are evenly distributed on the aluminum substrate, the heat-conducting seat, and the installation seat.

[0012] Specifically, the circuit layer is made of copper foil material.

[0013] Specifically, the heat-conducting insulating block is made of heat-conducting polyphenylene sulfide material.

[0014] Specifically, the grounding piece is made of copper-aluminum alloy material.

[0015] Specifically, the first heat-conducting adhesive layer, the second heat-conducting adhesive layer, and the third heat-conducting adhesive layer are all made of heat-conducting silicone grease material.

[0016] Specifically, the heat-conducting seat is made of aluminum alloy material.

[0017] Specifically, the installation seat is made of heat-conducting polyamide material.

[0018] The design scheme proposed by the present utility model has the following beneficial effects during application:

[0019] 1. Through the heat-conducting insulating block structure, while ensuring the stable installation of the circuit layer and the aluminum substrate structure, it can have a good heat-conducting effect when the circuit layer is working continuously. Coupled with the heat-conducting seat structure installed at the lower end of the aluminum substrate, the heat can be further conducted and dispersed, ensuring the heat dissipation effect of the entire circuit board during continuous operation.

[0020] 2. Through the installation seat structure, the durability, wear resistance, and stability of the entire circuit board during frequent disassembly and assembly can be ensured. Through the installation holes distributed through the aluminum substrate, the heat-conducting seat, and the installation seat, it can be assembled with the equipment using plastic screws. Moreover, the material of the installation seat has the ability of wear resistance, corrosion resistance, and insulation when it comes into frequent contact with the installation points of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the overall structure of the present utility model;

[0022] Figure 2 Schematic diagram of the back of the overall structure of the present utility model;

[0023] Figure 3 Schematic diagram of the front structure of the present utility model;

[0024] Figure 4 Schematic diagram of the position of the heat-conducting insulating block of the present utility model;

[0025] Figure 5 Schematic diagram of the installation cross-section of the aluminum substrate, heat-conducting seat and mounting seat of the present utility model.

[0026] In the figure: 10, aluminum substrate; 11, heat-conducting insulating block; 12, first heat-conducting adhesive layer; 13, circuit layer; 14, grounding tab; 15, wiring hole; 16, heat-conducting seat; 17, mounting seat; 20, mounting hole; 30, second heat-conducting adhesive layer; 40, third heat-conducting adhesive layer. Specific embodiments

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments.

[0028] Refer to Figures 1 - 5 , a multi-layer high-conductivity aluminum-based circuit board, including an aluminum substrate 10, a circuit layer 13 is arranged above the aluminum substrate 10, a heat-conducting insulating block 11 is embedded in the upper surface of the aluminum substrate 10, and the upper end of the heat-conducting insulating block 11 corresponds to the lower surface of the circuit layer 13. The heat-conducting insulating block 11 and the circuit layer 13 are adhesively fixed through a first heat-conducting adhesive layer 12. A grounding tab 14 is arranged at the edge of the aluminum substrate 10, and one end of the grounding tab 14 is welded and fixed to the outer wall of the aluminum substrate 10. A wiring hole 15 penetrating through its interior is opened on the grounding tab 14. A heat-conducting seat 16 is arranged below the aluminum substrate 10, and a second heat-conducting adhesive layer 30 is coated inside the heat-conducting seat 16. The lower end of the aluminum substrate 10 is adhesively arranged with the second heat-conducting adhesive layer 30. A mounting seat 17 is arranged below the heat-conducting seat 16, and a third heat-conducting adhesive layer 40 is coated inside the mounting seat 17. The outer wall surface of the heat-conducting seat 16 is adhesively arranged with the third heat-conducting adhesive layer 40. Mounting holes 20 that penetrate and communicate with each other are provided on the aluminum substrate 10, the heat-conducting seat 16 and the mounting seat 17, and the number of the mounting holes 20 is four, and they are evenly distributed on the aluminum substrate 10, the heat-conducting seat 16 and the mounting seat 17.

[0029] Further, it should be noted that the circuit layer 13 is made of copper foil material. The copper foil circuit base layer is an important part of the printed circuit board. It is usually attached to the substrate of the circuit board by electroplating or chemical deposition methods. The main function of the copper foil layer is to provide a conductive path, enabling current to flow efficiently in a three-dimensional space and connecting all components of the electronic device.

[0030] Further, it should be noted that the heat-conducting insulating block 11 is made of heat-conducting polyphenylene sulfide material, which is an engineering plastic with good heat conduction performance. It belongs to the polyarylene sulfide polymer and is made by adding heat-conducting fillers (such as metal powder, graphite, boron nitride, alumina, etc.) to the polyphenylene sulfide (PPS) matrix. Heat-conducting PPS not only inherits the excellent properties of PPS itself, such as high temperature resistance, chemical corrosion resistance, good mechanical strength, etc., but also has a high heat conductivity.

[0031] Further, it should be noted that the grounding plate 14 is made of copper-aluminum alloy material and plays a crucial role on the circuit board. It can help eliminate noise, reduce electromagnetic interference (EMI), and protect the circuit from electric shock damage.

[0032] Further, it should be noted that the first heat-conducting adhesive layer 12, the second heat-conducting adhesive layer 30, and the third heat-conducting adhesive layer 40 are all made of heat-conducting silicone grease material. Heat-conducting silicone grease, also known as thermal paste, is a silicon-based compound, usually used to improve the heat transfer efficiency between heat sources (such as CPU, GPU or other power semiconductors) and radiators in electronic devices. It fills the microscopic gaps between solid surfaces, thereby reducing the contact thermal resistance and enabling heat to be conducted more effectively from the heat source to other structures.

[0033] Further, it should be noted that the heat-conducting seat 16 is made of aluminum alloy material and has good heat conduction ability. At the same time, it also has a certain structural strength to ensure the stability of the bearing structure in the middle position of the circuit board.

[0034] Further, it should be noted that the mounting seat 17 is made of heat-conducting polyamide material. Heat-conducting polyamide is a polyamide (nylon) material modified by adding heat-conducting fillers. Its basic component is polyamide resin, and its heat conduction performance is achieved by adding different heat-conducting fillers. For example: polyamide 6 (PA6), its additives: alumina, boron nitride, graphite, metal glass fiber, etc. These fillers are mixed with PA6 resin and then made into parts by injection molding or other processing methods.

[0035] Working mode: Through the structure of the heat-conducting insulating block 11, while ensuring the stable installation of the circuit layer 13 and the aluminum substrate 10 structure, when the circuit layer 13 is continuously working, it has a good heat-conducting effect. Coupled with the heat-conducting seat 16 structure installed at the lower end of the aluminum substrate 10, it can further conduct and disperse heat, ensuring the heat dissipation effect of the entire circuit board during continuous operation.

[0036] Through the structure of the mounting seat 17, the durability, wear resistance and stability of the entire circuit board during frequent disassembly and assembly can be ensured. Through the mounting holes distributed through the aluminum substrate 10, the heat-conducting seat 16 and the mounting seat 17, it can be assembled with the equipment using plastic screws. Moreover, the material of the mounting seat 17 has the ability of wear resistance, corrosion resistance and insulation when it comes into frequent contact with the equipment installation points.

[0037] The above is only the preferred specific implementation mode of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution and the inventive concept of the present utility model, making equivalent replacements or changes should be covered within the protection scope of the present utility model.

Claims

1. A multi-layer high-conductivity aluminum-based circuit board, comprising an aluminum substrate (10), characterized in that: Above the aluminum substrate (10), a circuit layer (13) is provided. A heat-conducting insulating block (11) is embedded in the upper surface of the aluminum substrate (10), and the upper end of the heat-conducting insulating block (11) corresponds to the lower surface of the circuit layer (13). The heat-conducting insulating block (11) and the circuit layer (13) are adhesively fixed through a first heat-conducting adhesive layer (12). A grounding piece (14) is provided at the edge of the aluminum substrate (10), and one end of the grounding piece (14) is welded and fixed to the outer wall of the aluminum substrate (10). A wiring hole (15) penetrating through its interior is formed in the grounding piece (14). A heat-conducting seat (16) is provided below the aluminum substrate (10), and a second heat-conducting adhesive layer (30) is coated inside the heat-conducting seat (16). The lower end of the aluminum substrate (10) is adhesively arranged with the second heat-conducting adhesive layer (30). An installation seat (17) is provided below the heat-conducting seat (16), and a third heat-conducting adhesive layer (40) is coated inside the installation seat (17). The outer wall of the heat-conducting seat (16) is adhesively arranged with the third heat-conducting adhesive layer (40). Mounting holes (20) that penetrate and communicate with each other are formed in the aluminum substrate (10), the heat-conducting seat (16), and the installation seat (17), and the number of the mounting holes (20) is four, and they are evenly distributed on the aluminum substrate (10), the heat-conducting seat (16), and the installation seat (17).

2. The multilayer high-conductivity aluminum-based circuit board according to claim 1, characterized in that: The circuit layer (13) is made of copper foil material.

3. A multi-layer high-conductivity aluminum-based circuit board according to claim 1, characterized in that: The heat-conducting insulating block (11) is made of heat-conducting polyphenylene sulfide material.

4. A multi-layer high-conductivity aluminum-based circuit board according to claim 1, characterized in that: The grounding piece (14) is made of copper-aluminum alloy material.

5. A multi-layer high-conductivity aluminum-based circuit board according to claim 1, characterized in that: The first heat-conducting adhesive layer (12), the second heat-conducting adhesive layer (30), and the third heat-conducting adhesive layer (40) are all made of heat-conducting silicone grease material.

6. A multi-layer high-conductivity aluminum-based circuit board according to claim 1, characterized in that: The heat-conducting seat (16) is made of aluminum alloy material.

7. The multilayer high-conductivity aluminum-based circuit board according to claim 1, characterized in that: The installation seat (17) is made of heat-conducting polyamide material.

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