PCB film alignment equipment

Abstract

The utility model discloses a PCB film alignment device, which comprises a placement rack and a PCB film adjusting rack, the placement rack comprises a supporting seat, a vertical plate, a lifting cylinder and a PCB mounting rack, the lifting cylinder and the PCB mounting rack are fixedly connected, the bottom end of the vertical plate is connected with the supporting seat, the lifting cylinder penetrates through the end part of the vertical plate and is connected with the PCB mounting rack, and the PCB film adjusting rack is connected with the PCB mounting rack. The PCB film adjusting frame comprises an adjusting device and a fixing device, the adjusting device comprises a rotating air cylinder, an alignment adjusting seat and an adjusting mechanism, a stabilizing round block connected with the rotating air cylinder is arranged on the surface of the supporting seat, and a fixing transverse rod connected with the rotating air cylinder is arranged on the side face of the alignment adjusting seat. According to the utility model, the gas pressure difference is utilized to realize the firm adsorption of the PCB film, the adjusting screw rod and the transmission gear are in a rotating state, the connecting plate, the firm seat and the PCB film placing seat move integrally, and the PCB film can be finely adjusted in the alignment process of the PCB film and the PCB.

Description

Technical Field

[0001] The utility model belongs to the technical field of PCB production and processing, and specifically relates to a PCB film alignment device. Background Art

[0002] The PCB film, namely the printed circuit board film, is a key material for manufacturing PCB (printed circuit board). In the PCB manufacturing process, the useless copper foil on the PCB is etched, and the PCB film transfers the circuit pattern and protects the surface of the copper foil from being corroded. The Chinese utility model authorized patent application number CN201821579501.X discloses a PCB film alignment device, and the PCB film is a conventional material for manufacturing PCB boards.

[0003] In the existing PCB film alignment device, the PCB film moves to a position and aligns with the PCB board. However, the moving range of the PCB film is large and fine adjustment cannot be performed to accurately align the PCB film with the PCB board. When the PCB film is aligned with the PCB board, there is a problem that the PCB film cannot be finely adjusted. Therefore, this application proposes a PCB film alignment device. Summary of the Utility Model

[0004] The purpose of the present utility model is to provide a PCB film alignment device to solve the problem that the PCB film cannot be finely adjusted during the alignment process with the PCB board as proposed in the above background art.

[0005] To achieve the above object, the present utility model provides the following technical solutions: A PCB film alignment device, comprising a mounting machine frame and a PCB film adjustment frame. The mounting machine frame includes a support base, a vertical plate, a lifting cylinder and a PCB board mounting frame fixedly connected. The bottom end of the vertical plate is connected to the support base, and the lifting cylinder penetrates through the end of the vertical plate and is connected to the PCB board mounting frame. The PCB film adjustment frame includes an adjustment device and a fixing device. The adjustment device includes a rotary cylinder, a alignment adjustment seat and an adjustment mechanism. A stable circular block connected to the rotary cylinder is provided on the surface of the support base, and a fixed cross bar connected to the rotary cylinder is provided on the side surface of the alignment adjustment seat. The adjustment mechanism includes a connecting plate, an adjustment screw, a transmission gear and a moving tooth plate. The adjustment screw penetrates through the alignment adjustment seat and the transmission gear. The transmission gear is installed inside the alignment adjustment seat. The connecting plate is connected to the moving tooth plate. The fixing device includes a PCB film placement seat and a vacuum adsorption assembly. The vacuum adsorption assembly includes a fixing seat and a vacuum pump installed on the side surface of the fixing seat. The bottom surface of the fixing seat is connected to the connecting plate. A first installation groove is provided on the top surface of the fixing seat. An air cavity is provided inside the fixing seat. A first air hole communicating with the air cavity is provided on the inner surface of the fixing seat located in the first installation groove. The PCB film placement seat penetrates through the side surface of the fixing seat. A PCB film placement groove is provided on the top surface of the PCB film placement seat. A second air hole is provided on the inner surface of the PCB film placement seat located in the PCB film placement groove.

[0006] Preferably, the moving tooth plate is meshed and connected with the transmission gear. The adjustment screw and the center of the transmission gear are on the same axis. One end of the adjustment screw is connected to the inner surface of the alignment adjustment seat through a bearing. The bottom surface of the connecting plate fits with the top surface of the alignment adjustment seat.

[0007] Preferably, the connecting plate is of an "I" - shaped structure. The fixing seat and the connecting plate move in the same direction. The vacuum pump is communicated with the air cavity. Symmetrically distributed support plates are provided on the surface of the support base. The bottom surface of the alignment adjustment seat is flush with the top surface of the support plates. The support plates are of an inverted "U" - shaped structure.

[0008] Preferably, the second air hole corresponds to the first air hole. The second air hole is in the shape of a tapered hole that is narrow at the top and wide at the bottom.

[0009] Preferably, the PCB film placement seat is slidably connected to the fixing seat. The distance between the top surface of the fixing seat and the top surface of the PCB film placement seat is 2 millimeters. The bottom surface of the PCB film placement seat fits with the inner surface of the fixing seat located in the first installation groove.

[0010] Preferably, a lifting mechanism is provided at the center of the inner surface of the PCB film placement seat within the PCB film placement groove. The lifting mechanism includes a lifting round block, a connecting column, and a piston head. The connecting column is installed between the lifting round block and the piston head.

[0011] Preferably, a communicating circular groove and an activity cavity are formed at the center of the inner surface of the PCB film placement seat. The lifting round block is located within the circular groove, and the piston head is located inside the activity cavity. The top surface of the lifting round block is flush with the inner surface of the PCB film placement seat. The piston head is a tapered structure that is wider at the top and narrower at the bottom.

[0012] Preferably, an air inlet channel and an air outlet channel that communicate with the activity cavity are respectively provided on the side surfaces of both sides of the PCB film placement seat. The air inlet channel and the air outlet channel are distributed on both sides of the activity cavity.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] In the present utility model, by utilizing the gas pressure difference, the adsorption of the PCB film is made firm. The adjusting screw and the transmission gear are in a rotating state, and the connecting plate, the firm seat, and the PCB film placement seat move as a whole. During the alignment process of the PCB film and the PCB board, fine adjustment of the PCB film can be performed. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a schematic structural diagram of the present utility model;

[0016] Figure 2 is a three-dimensional structural diagram of the alignment adjusting seat of the present utility model;

[0017] Figure 3 is the Figure 2 structural diagram of the alignment adjusting seat of the present utility model in the A-A direction;

[0018] Figure 4 is a three-dimensional structural diagram of the firm seat of the present utility model;

[0019] Figure 5 is a three-dimensional structural diagram of the lifting mechanism of the present utility model;

[0020] Figure 6 is a sectional structural diagram of the firm seat of the present utility model;

[0021] Figure 7 is the Figure 4 structural diagram of the PCB film placement seat of the present utility model in the B-B direction;

[0022] In the figure: 2, stable round block; 3, rotating cylinder; 4, alignment adjusting seat; 6, connecting plate; 7, firm seat; 8, PCB film placement seat; 9, lifting mechanism; 11, support seat; 12, vertical plate; 13, lifting cylinder; 14, PCB board mounting rack; 41, fixed cross bar; 51, adjusting screw; 52, driving gear; 53, moving toothed plate; 71, vacuum pump; 72, first mounting groove; 73, first air hole; 74, air cavity; 81, PCB film placement groove; 82, second air hole; 83, intake passage; 84, exhaust passage; 91, lifting round block; 92, connecting column; 93, piston head; 111, support plate. Detailed implementation manners

[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0024] Embodiment 1

[0025] Please refer to Figures 1 to 4, the present utility model provides a technical solution: a PCB film alignment device, including a placement machine frame and a PCB film adjustment frame. The placement machine frame includes a support base 11, a vertical plate 12, a lifting cylinder 13 fixedly connected thereto, and a PCB board mounting frame 14. The PCB board is mounted on the PCB board mounting frame 14, and the PCB film is mounted on the PCB film adjustment frame. When the lifting cylinder 13 operates and changes from a shortened state to an extended state, the PCB board mounting frame 14 moves downward, so that the PCB board on the PCB board mounting frame 14 is attached to the PCB film. The bottom end of the vertical plate 12 is connected to the support base 11. The bottom end of the "L"-shaped vertical plate 12 is screwed to the side surface of the support base 11. The end of the lifting cylinder 13 passes through the vertical plate 12 and is connected to the PCB board mounting frame 14. The lifting cylinder 13 is screwed to the PCB board mounting frame 14. The PCB film adjustment frame includes an adjustment device and a fixing device. The adjustment device includes a rotary cylinder 3, an alignment adjustment seat 4, and an adjustment mechanism. A stable circular block 2 connected to the rotary cylinder 3 is provided on the surface of the support base 11. The stable circular block 2 is screwed to the rotary cylinder 3 and the support base 11. A fixed cross bar 41 connected to the rotary cylinder 3 is provided on the side surface of the alignment adjustment seat 4. The fixed cross bar 41 is welded to the alignment adjustment seat 4. The fixed cross bar 41 is screwed to the rotary cylinder 3. When the rotary cylinder 3 operates, the rotary cylinder 3 drives the fixed cross bar 41 and the alignment adjustment seat 4 to rotate a certain angle, and the PCB film can be picked up and placed. The adjustment mechanism includes a connecting plate 6, an adjustment screw 51, a transmission gear 52, and a moving tooth plate 53. The adjustment screw 51 passes through the alignment adjustment seat 4 and the transmission gear 52. The adjustment screw 51 is firmly screwed to the transmission gear 52. The adjustment screw 51 and the transmission gear 52 rotate in the same direction. The transmission gear 52 is installed inside the alignment adjustment seat 4. The connecting plate 6 is connected to the moving tooth plate 53. The connecting plate 6 is firmly screwed to the moving tooth plate 53. The transmission gear 52 is meshed with the moving tooth plate 53. When the adjustment screw 51 and the transmission gear 52 are in a rotating state, the connecting plate 6, the fixing seat 7, and the PCB film placement seat 8 move as a whole, and the PCB film can be finely adjusted during the alignment process with the PCB board.The fixing device includes a PCB film placement seat 8 and a vacuum adsorption component. The PCB film is installed inside the PCB film placement seat 8. The vacuum adsorption component includes a fixing seat 7 and a vacuum pump 71 installed on the side of the fixing seat 7. The vacuum pump 71 is fixed to the side of the fixing seat 7 by screws. The bottom surface of the fixing seat 7 is connected to the connecting plate 6. The fixing seat 7 and the connecting plate 6 are screwed together. A first installation groove 72 is formed on the top surface of the fixing seat 7. An air cavity 74 is provided inside the fixing seat 7. A first air hole 73 communicating with the air cavity 74 is formed on the inner surface of the fixing seat 7 at the first installation groove 72. When the vacuum pump 71 operates and sucks air, the inside of the air cavity 74 is in a vacuum state, and the PCB film is tightly adsorbed on the inner surface of the PCB film placement seat 8 under the action of air pressure, achieving the effect of fixing the PCB film. The PCB film placement seat 8 penetrates the side of the fixing seat 7, and the PCB film placement seat 8 is slidably connected to the fixing seat 7. A PCB film placement groove 81 is formed on the top surface of the PCB film placement seat 8. The PCB film is placed inside the PCB film placement groove 81. A second air hole 82 is formed on the inner surface of the PCB film placement seat 8 at the PCB film placement groove 81. The second air hole 82 is opposite to and in communication with the first air hole 73, without affecting the adsorption of the PCB film.;

[0026] In this embodiment, the moving toothed plate 53 is meshed with the transmission gear 52. When the adjusting screw 51 and the transmission gear 52 are in a rotating state, the connecting plate 6, the fixing seat 7 and the PCB film placement seat 8 move as a whole, and the PCB film can be finely adjusted during the alignment process between the PCB film and the PCB board. The centers of the adjusting screw 51 and the transmission gear 52 are on the same axis. One end of the adjusting screw 51 is connected to the inner surface of the alignment adjusting seat 4 through a bearing, without affecting the rotation of the adjusting screw 51. The bottom surface of the connecting plate 6 fits with the top surface of the alignment adjusting seat 4.

[0027] In this embodiment, the connecting plate 6 has an "I" - shaped structure. The fixing seat 7 and the connecting plate 6 move in the same direction. The vacuum pump 71 is in communication with the air cavity 74. When the vacuum pump 71 operates, the inside of the alignment adjusting seat 4 is in a vacuum state, and the PCB film can be adsorbed. Symmetrically distributed support plates 111 are provided on the surface of the support seat 11. The bottom surface of the alignment adjusting seat 4 is flush with the top surface of the support plates 111. The support plates 111 have an inverted "U" - shaped structure, and the support plates 111 support the alignment adjusting seat 4 to keep the alignment adjusting seat 4 in a stable state.

[0028] In this embodiment, the second air hole 82 corresponds to the first air hole 73. The second air hole 82 is in the shape of a tapered hole with a narrow upper part and a wide lower part. The second air hole 82 is opposite to and in communication with the first air hole 73. When the vacuum pump 71 operates to pump vacuum, the PCB film can be adsorbed.

[0029] In this embodiment, the PCB film placement seat 8 is slidably connected to the fixing seat 7. The PCB film placement seat 8 can be slid outwards. The distance between the top surface of the fixing seat 7 and the top surface of the PCB film placement seat 8 is 2 mm. The bottom surface of the PCB film placement seat 8 fits with the inner surface of the fixing seat 7 in the first installation groove 72, and the PCB film placement seat 8 is located inside the fixing seat 7.

[0030] Steps for PCB film alignment:

[0031] First, install the PCB board at a fixed position on the PCB board mounting frame 14. Pull the fixing seat 7 outwards, place the PCB film inside the fixing seat 7, and push the fixing seat 7 back to its original position. The fixing seat 7 is located inside the PCB film placement seat 8.

[0032] Second, operate the vacuum pump 71 to suck air, making the inside of the air chamber 74 in a vacuum state. The second air hole 82 is opposite to and in communication with the first air hole 73. Under the action of air pressure, the PCB film is tightly adsorbed on the inner surface of the PCB film placement seat 8, achieving the effect of fixing the PCB film firmly.

[0033] Third, operate the rotary cylinder 3. The rotary cylinder 3 drives the fixed cross bar 41 and the alignment adjustment seat 4 to rotate a certain angle, making the PCB film on the PCB film placement seat 8 opposite to the PCB board on the PCB board mounting frame 14.

[0034] Fourth, rotate the adjusting screw 51. The adjusting screw 51 and the transmission gear 52 are in a rotating state, and the connecting plate 6, the fixing seat 7, and the PCB film placement seat 8 move as a whole. During the process of aligning the PCB film with the PCB board, the PCB film can be finely adjusted.

[0035] Fifth, operate the lifting cylinder 13. The lifting cylinder 13 changes from a shortened state to an extended state, and the PCB board mounting frame 14 moves downwards, making the PCB board on the PCB board mounting frame 14 fit with the PCB film.

[0036] In summary: The adjusting screw 51 and the transmission gear 52 are in a rotating state, and the connecting plate 6, the fixing seat 7, and the PCB film placement seat 8 move as a whole. During the process of aligning the PCB film with the PCB board, the PCB film can be finely adjusted.

[0037] Embodiment 2

[0038] Please refer to Figures 1 to 7, which is the second embodiment of the present utility model. This embodiment is based on the previous embodiment. To facilitate the removal of the PCB film, a lifting mechanism 9 is provided at the center position of the inner surface of the PCB film placement seat 8 within the PCB film placement groove 81. The lifting mechanism 9 includes a lifting round block 91, a connecting column 92, and a piston head 93. The connecting column 92 is installed between the lifting round block 91 and the piston head 93. A communicating circular groove and an activity cavity are opened at the center of the inner surface of the PCB film placement seat 8. The lifting round block 91 is located within the circular groove, and the piston head 93 is located inside the activity cavity. The top surface of the lifting round block 91 is flush with the inner surface of the PCB film placement seat 8. The piston head 93 is a tapered structure that is wider at the top and narrower at the bottom. Air inlet channels 83 and air outlet channels 84 that communicate with the activity cavity are respectively provided on the side surfaces of both sides of the PCB film placement seat 8. The air inlet channels 83 and the air outlet channels 84 are distributed on both sides of the activity cavity. When an external conventional inflation device inflates, gas is conveyed through the air inlet channel 83, and the air pressure within the activity cavity of the PCB film placement seat 8 increases. The piston head 93 rises under the impact of the gas. The piston head 93 lifts the connecting column 92 and the lifting round block 91, and the lifting round block 91 lifts the PCB film inside the PCB film placement seat 8. There is a gap between the PCB film and the PCB film placement seat 8, which facilitates the removal of the PCB film and avoids bending and damage when manually removing the PCB film.

[0039] In summary: By utilizing the air pressure effect, the air pressure within the activity cavity of the PCB film placement seat 8 increases, the piston head 93 lifts the connecting column 92 and the lifting round block 91, and the lifting round block 91 lifts the PCB film, facilitating the removal of the PCB film.

[0040] Although the embodiments of the present utility model have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the appended claims and their equivalents.

Claims

1. A PCB film alignment device, including a placement machine frame and a PCB film adjustment frame, is characterized in that: The pick-and-place machine frame includes a support base (11), a vertical plate (12), a lifting cylinder (13) fixedly connected to a PCB board mounting frame (14). The bottom end of the vertical plate (12) is connected to the support base (11). The lifting cylinder (13) passes through the end of the vertical plate (12) and is connected to the PCB board mounting frame (14). The PCB film adjusting frame includes an adjusting device and a fixing device. The adjusting device includes a rotary cylinder (3), a positioning adjusting seat (4), and an adjusting mechanism. A stable circular block (2) connected to the rotary cylinder (3) is provided on the surface of the support base (11). A fixed crossbar (41) connected to the rotary cylinder (3) is provided on the side surface of the positioning adjusting seat (4). The adjusting mechanism includes a connecting plate (6), an adjusting screw (51), a transmission gear (52), and a moving toothed plate (53). The adjusting screw (51) passes through the positioning adjusting seat (4) and the transmission gear (52). The transmission gear (52) is installed inside the positioning adjusting seat (4). The connecting plate (6) is connected to the moving toothed plate (53). The fixing device includes a PCB film placement seat (8) and a vacuum adsorption assembly. The vacuum adsorption assembly includes a fixing seat (7) and a vacuum pump (71) installed on the side surface of the fixing seat (7). The bottom surface of the fixing seat (7) is connected to the connecting plate (6). A first installation groove (72) is provided on the top surface of the fixing seat (7). An air chamber (74) is provided inside the fixing seat (7). A first air hole (73) communicating with the air chamber (74) is provided on the inner surface of the fixing seat (7) located in the first installation groove (72). The PCB film placement seat (8) passes through the side surface of the fixing seat (7). A PCB film placement groove (81) is provided on the top surface of the PCB film placement seat (8). A second air hole (82) is provided on the inner surface of the PCB film placement seat (8) located in the PCB film placement groove (81).

2. The PCB film alignment device according to claim 1, wherein: The moving toothed plate (53) is meshed and connected with the transmission gear (52). The centers of the adjusting screw (51) and the transmission gear (52) are on the same axis. One end of the adjusting screw (51) is connected to the inner surface of the positioning adjusting seat (4) through a bearing. The bottom surface of the connecting plate (6) fits with the top surface of the positioning adjusting seat (4).

3. A PCB film alignment device according to claim 1, characterized in that: The connecting plate (6) is of an "I" shape. The fixing seat (7) and the connecting plate (6) move in the same direction. The vacuum pump (71) is communicated with the air chamber (74). Symmetrically distributed support plates (111) are provided on the surface of the support base (11). The bottom surface of the positioning adjusting seat (4) is flush with the top surface of the support plate (111). The support plate (111) is of an inverted "U" shape.

4. A PCB film alignment device according to claim 1, characterized in that: The second air hole (82) corresponds to the first air hole (73). The second air hole (82) is in the shape of a tapered hole that is narrow at the top and wide at the bottom.

5. A PCB film alignment device according to claim 1, characterized in that: The PCB film placement seat (8) is slidably connected to the fixing seat (7). The distance between the top surface of the fixing seat (7) and the top surface of the PCB film placement seat (8) is 2 mm. The bottom surface of the PCB film placement seat (8) fits with the inner surface of the fixing seat (7) located in the first installation groove (72).

6. The PCB film alignment device according to claim 1, characterized in that: A lifting mechanism (9) is provided at the center of the inner surface of the PCB film placement seat (8) within the PCB film placement groove (81). The lifting mechanism (9) includes a lifting round block (91), a connecting column (92), and a piston head (93). The connecting column (92) is installed at the position between the lifting round block (91) and the piston head (93).

7. A PCB film alignment device according to claim 6, characterized in that: A communicating circular groove and an activity cavity are formed at the center of the inner surface of the PCB film placement seat (8). The lifting round block (91) is located within the circular groove, and the piston head (93) is located inside the activity cavity. The top surface of the lifting round block (91) is flush with the inner surface of the PCB film placement seat (8). The piston head (93) has a tapered structure that is wider at the top and narrower at the bottom.

8. A PCB film alignment device according to claim 7, characterized in that: An air inlet channel (83) and an air outlet channel (84) that communicate with the activity cavity are respectively provided on the side surfaces of both sides of the PCB film placement seat (8). The air inlet channel (83) and the air outlet channel (84) are distributed on both sides of the activity cavity.

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