Main machine for surgical operation
A modular, multi-layered internal structure with insulating foam layers and ventilation channels addresses heat dissipation issues in ultrasonic surgical systems, ensuring stable and continuous operation.
Patent Information
- Application Number
- CN202521070886.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-28
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2035-05-28
AI Technical Summary
The main unit of the existing ultrasound and high-frequency surgical system has poor heat dissipation, resulting in local high temperatures and interruption of operation, affecting the persistence and safety of the operation.
The inner shell design with a multi-layer foam structure is adopted, combined with the design of the air inlet and air outlet, modular assembly is formed, and circuit boards and components are arranged layer by layer to achieve layer by layer, and assembly stability is enhanced through the snap structure.
It improves heat dissipation efficiency, ensures the temperature balance and stability of the host, avoids local high temperatures, and ensures the continuity and safety of the operation.
Smart Images

Figure CN223110327U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of medical devices, and particularly relates to a mainframe for surgical operations. Background Art
[0002] An ultrasonic high-frequency surgical system generally includes a mainframe and a surgical instrument (ultrasonic scalpel or electrosurgical knife) electrically connected to the mainframe. To ensure the accuracy of ultrasonic surgery, the mainframe needs to provide safe, stable, and continuous energy to the surgical instrument.
[0003] During the operation of the ultrasonic scalpel or high-frequency electrosurgical knife, both the mainframe and the electrode of the electrosurgical knife will generate a lot of heat. The mainframe housing with a conventional setting is integrated with a cooling fan for forced air cooling, but the cooling effect is not good and the noise is relatively large. To ensure safety, a measure of circuit thermal protection shutdown is set for heat dissipation. Although this disconnection method ensures the safe use of the mainframe, it destroys the energy supply continuity of the mainframe, resulting in an operation interruption of the surgical instrument and being unfavorable for the completion of the overall operation. In addition, components for providing energy and transmitting energy need to be arranged inside the mainframe, but these components are not evenly distributed, which makes the temperature inside the mainframe not rise as a whole, but locally high. Therefore, the single-layer structure for heat dissipation of the overall interior cannot provide a good heat dissipation effect. Content of the Utility Model
[0004] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a mainframe for surgical operations.
[0005] The purpose of the utility model is realized by the following technical solutions:
[0006] A mainframe for surgical operations includes an outer housing and an inner housing disposed inside the outer housing. The inner housing includes a bottom support foam, a partition foam, a top cover foam, and side plate foams. The bottom support foam and the top cover foam are arranged at intervals up and down relatively, and a hollow cavity is formed between the two, and the side parts of the two together form a card slot. The side plate foams are clamped in the card slot to be fixedly connected with the bottom support foam and the top cover foam into a whole. At least one layer of partition foam is horizontally arranged between the bottom support foam and the top cover foam to partition the hollow cavity. The bottom support foam, the partition foam, and the top cover foam are stacked in sequence, and a group of air inlets are formed on the front side walls of the three, and a group of air outlets are formed on the rear side walls of the three, so that each layer of the hollow cavity is communicated with the outside. A circuit board is arranged in each layer of the hollow cavity, and a group of components are arranged on the circuit board. Insulating boards are also arranged between the hollow cavities in pairs to separate the circuit boards.
[0007] Preferably, a set of upper buckles are provided on the side of the top cover foam, a set of lower buckles are provided on the side of the bottom support foam, and upper and lower card slots are respectively provided on the upper and lower outer walls of the side plate foam to be respectively clamped with the upper and lower buckles, so as to limit the side plate foam within the card slots.
[0008] Preferably, the inner side wall of the lower buckle is an inclined surface extending outwardly to squeeze the bottom of the side plate foam.
[0009] Preferably, a tight fit is formed, and the upper and lower buckles are staggered.
[0010] Preferably, the outer housing includes a top cover, a bottom cover, a front cover and a rear cover that can be assembled together. A set of insertion rods are vertically provided within the bottom cover, and vertically extending slots are respectively provided on the four sides of the inner housing. The set of insertion rods are respectively inserted into the slots to limit the inner housing within the outer housing.
[0011] Preferably, the partition foam includes a first partition foam and a second partition foam. The first partition foam and the second partition foam are stacked in sequence from bottom to top and divide the hollow cavity into three layers. A set of air inlets correspond to the positions of a set of components within each layer of the hollow cavity.
[0012] Preferably, insulating plates are respectively provided on the inner surface of the first partition foam and the bottom of the second partition foam.
[0013] Preferably, the corners between the bottom support foam, the first partition foam, the second partition foam, and the top cover foam are clamped in sequence.
[0014] Preferably, convex blocks protruding upward are evenly distributed on the top of the top cover foam, and the top surface of the convex blocks is an arc surface. After the outer housing is assembled, the convex blocks are in contact with the inner surface of the top cover.
[0015] Preferably, a set of through holes are provided on the rear cover opposite to the air outlet to connect the air outlet with the external atmosphere.
[0016] The beneficial effects of the present utility model are mainly reflected in:
[0017] 1. An inner housing matching with the outer housing is provided within the outer housing to form modular assembly, improving the assembly efficiency. And the inner housing forms a multi-layered structure by providing partition foam. On the one hand, circuit boards can be arranged layer by layer in this way to meet the laying of a larger area circuit board without increasing the floor area of the overall host; on the other hand, different components can be arranged in layers to separately arrange the components that are prone to generate high temperature, so as to ensure that excessive high temperature will not be generated within the hollow cavity of each layer, reducing the heat dissipation pressure;
[0018] 2. On the basis of the multi-layer inner shell, ventilation heat dissipation channels are provided in each hollow cavity for real-time heat dissipation. Compared with the single-layer heat dissipation structure, multi-layer synchronous heat dissipation can expand the heat dissipation area, improve the heat dissipation efficiency, achieve good temperature balance, and can achieve hierarchical heat dissipation by setting air inlets and outlets of different sizes and corresponding them one by one with the positions of the components, improve the heat dissipation accuracy of the heat dissipation duct, and improve the heat dissipation efficiency;
[0019] 3. Set side panel foams to be respectively snap-connected with the top cover foam and the bottom support foam from the side, and set upper and lower snap-fasteners to be respectively snap-connected with the side panel foams to enhance the tensile force between the side panel foams and the top cover foam and the bottom support foam, ensure the stability of the overall assembly of the inner shell, and avoid shaking during handling. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The technical solution of the present utility model will be further described below in conjunction with the accompanying drawings:
[0021] Figure 1 : Schematic diagram of an embodiment of the present utility model;
[0022] Figure 2 : Exploded view of the inner shell in an embodiment of the present utility model;
[0023] Figure 3 : Partial schematic diagram of the inner shell in an embodiment of the present utility model;
[0024] Figure 4 : Partial structural sectional view of the inner shell in an embodiment of the present utility model;
[0025] Figure 5 : Schematic diagram of another angle of the inner shell in an embodiment of the present utility model;
[0026] Figure 6 : Schematic diagram of heat dissipation inside the first partition foam in an embodiment of the present utility model;
[0027] Figure 7 : Schematic diagram of heat dissipation inside the second partition foam in an embodiment of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0028] The present utility model will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments are not limited to the present utility model, and any structural, method, or functional transformation made by those of ordinary skill in the art based on these embodiments is included in the protection scope of the present utility model.
[0029] In the description of the solution, it should be noted that the orientation or positional relationship indicated by terms such as "center", "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of description and simplification, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. Also, in the description of the solution, with the operator as a reference, the direction close to the operator is the proximal end, and the direction away from the operator is the distal end.
[0030] As Figures 1 to 7 shown, the present utility model discloses a mainframe for surgical operations, which includes an outer housing and an inner housing disposed inside the outer housing. The inner housing includes a bottom support foam 101, a spacer foam, a top cover foam 102, and side plate foams 103. The bottom support foam 101 and the top cover foam 102 are arranged at intervals up and down relatively. A hollow cavity is formed between the two, and the sides of the two together form a card slot. The side plate foams 103 are clamped in the card slot to be fixedly connected with the bottom support foam 101 and the top cover foam 102 into a whole. At least one layer of spacer foam is horizontally arranged between the bottom support foam 101 and the top cover foam 102 to separate the hollow cavity. The bottom support foam 101, the spacer foam, and the top cover foam 102 are stacked in sequence, and a group of air inlets 105 are opened on the front side walls of the three, and a group of air outlets 106 are opened on the rear side walls of the three, so that each layer of the hollow cavity is communicated with the outside. A circuit board 3 is arranged in each layer of the hollow cavity, and a group of components 4 are arranged on the circuit board 3. Insulating plates 5 are also arranged between the hollow cavities in pairs to separate the circuit boards 3.
[0031] In this solution, an inner housing matching the outer housing is arranged inside the outer housing to form a modular assembly, improving the assembly efficiency. And the inner housing forms a multi-layer structure by arranging spacer foams. On the one hand, the circuit board 3 can be arranged layer by layer in this way to meet the laying of a circuit board with a large area without expanding the floor area of the overall mainframe; on the other hand, different components 4 can be arranged in layers in this way to separate the components 4 that are prone to generating high temperature, so as to ensure that excessive high temperature will not be generated in each layer of the hollow cavity and reduce the heat dissipation pressure. The circuit board 3 and the components 4 are necessary structures required in the mainframe, which is the prior art and not the focus of this solution. The specific types of the circuit board 3 and the components 4 are not elaborated here.
[0032] Specifically, as Figures 1 - 5As shown, a set of upper buckles 107 are provided on the side of the top cover foam 102, a set of lower buckles 104 are provided on the side of the bottom support foam 101, and upper card slots 109 and lower card slots 110 are respectively provided on the upper and lower outer walls of the side plate foam 103 to be respectively clamped with the upper buckles 107 and the lower buckles 104, so as to limit the side plate foam 103 within the card slots. The upper buckles 107 and the lower buckles 104 are provided to be respectively clamped with the side plate foam 103 to enhance the tension between the side plate foam 103 and the top cover foam 102 and the bottom support foam 101, ensure the stability of the overall assembly of the inner shell, and avoid shaking during handling.
[0033] Further, the inner side wall of the lower buckle 104 is an inclined surface extending outwardly, to squeeze the bottom of the side plate foam 103 to form a tight fit, so that the bottom of the side plate foam 103 is tightly clamped within the card slot without shaking.
[0034] Preferably, the upper buckles 107 and the lower buckles 104 are staggered to further lock the side plate foam 103.
[0035] As Figure 1 shown, the outer shell includes a top cover 201, a bottom cover 202, a front cover 203 and a rear cover 204 that can be assembled together. The top cover 201, the bottom cover 202, the front cover 203 and the rear cover 204 cooperate, and bolts are used to lock the connection parts between the four to form the outer shell.
[0036] A set of insertion rods 205 are vertically provided within the bottom cover 202, and vertically extending slots 111 are respectively provided on the four sides of the inner shell. The set of insertion rods 205 are respectively inserted into the slots 111 to limit the inner shell within the outer shell, so as to facilitate the fitting and assembly between the outer shell and the inner shell.
[0037] In this preferred embodiment, the partition foam includes a first partition foam 113 and a second partition foam 114. The first partition foam 113 and the second partition foam 114 are stacked in sequence from bottom to top and divide the hollow cavity into three layers. Each layer of the hollow cavity has a heat dissipation channel composed of the air inlet 105 and the air outlet 106. The sizes of the set of air inlets 105 are not unique, and the specific sizes of the set of air inlets 105 correspond to the positions of a set of components 4 within each layer of the hollow cavity, so that the components 4 can dissipate heat quickly. A set of through holes are provided on the rear cover 204 opposite to the air outlets 106 to connect the air outlets 106 with the external atmosphere, and cooperate with the positions of the air outlets 106 of each layer for rapid heat dissipation.
[0038] Based on the multi-layer inner housing, a ventilation heat dissipation channel is provided in each of the hollow cavities for real-time heat dissipation. Compared with a single-layer heat dissipation structure, multi-layer synchronous heat dissipation can expand the heat dissipation area, improve the heat dissipation efficiency, achieve good temperature balance, and can achieve hierarchical heat dissipation by setting air inlets 105 and air outlets 106 of different sizes and corresponding to the positions of the components 4 one by one, improving the heat dissipation accuracy of the heat dissipation air duct and the heat dissipation efficiency.
[0039] Insulating plates 5 are respectively provided on the inner surface of the first partition foam 113 and the bottom of the second partition foam 114. The insulating plates 5 can withstand high voltage insulation to ensure that the circuit boards 3 in each hollow cavity do not interfere with each other.
[0040] The corners between the bottom foam 101, the first partition foam 113, the second partition foam 114, and the top cover foam 102 are sequentially snap-connected. Any suitable connection structure can be adopted among the four. In this preferred embodiment, connection columns are respectively provided at the bottom corners of the bottom foam 101, the first partition foam 113, the second partition foam 114, and the top cover foam 102, and connection holes matching the connection columns are correspondingly provided at the top corners of the bottom foam 101, the first partition foam 113, the second partition foam 114, and the top cover foam 102. After the bottom foam 101, the first partition foam 113, the second partition foam 114, and the top cover foam 102 are sequentially stacked, the connection columns at the corners between them will be clamped in the connection holes to achieve connection, achieving a reliable and stable effect.
[0041] Furthermore, convex blocks 112 protruding upward are evenly distributed on the top of the top cover foam 102, and the top surface of the convex blocks 112 is an arc surface. After the outer housing is assembled, the convex blocks 112 are in contact with the inner surface of the upper cover 201 to further ensure that the inner housing does not shake inside the outer housing and ensure the internal stability of the host.
[0042] It should be understood that although this specification is described according to embodiments, not each embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.
[0043] The series of detailed descriptions listed above are only specific descriptions of the feasible embodiments of the present invention, and they are not used to limit the protection scope of the present invention. Any equivalent embodiments or changes made without departing from the technical spirit of the present invention should be included in the protection scope of the present invention.
Claims
1. Surgical mainframe, characterized in that: It includes an outer housing and an inner housing disposed inside the outer housing. The inner housing includes a bottom support foam (101), a partition foam, a top cover foam (102), and side panel foams (103). The bottom support foam (101) and the top cover foam (102) are arranged at intervals up and down relatively, with a hollow cavity formed therebetween, and the sides of the two together form a card slot. The side panel foams (103) are clamped in the card slot and fixedly connected to the bottom support foam (101) and the top cover foam (102) to form an integral body. At least one layer of partition foam is horizontally arranged between the bottom support foam (101) and the top cover foam (102) to separate the hollow cavity. The bottom support foam (101), the partition foam, and the top cover foam (102) are stacked in sequence, and a set of air inlets (105) are opened on the front side walls of the three, and a set of air outlets (106) are opened on the rear side walls of the three, so that a heat dissipation channel communicating with the outside can be formed in each layer of the hollow cavity. A circuit board (3) is arranged in each layer of the hollow cavity, and a set of components (4) are arranged on the circuit board (3). Insulating plates (5) are also arranged between the two-by-two hollow cavities to separate the circuit boards (3).
2. The surgical mainframe according to claim 1, wherein: A set of upper buckles (107) are arranged on the side of the top cover foam (102), and a set of lower buckles (104) are arranged on the side of the bottom support foam (101). Upper card slots (109) and lower card slots (110) are respectively arranged on the upper and lower outer walls of the side panel foam (103) to be respectively clamped with the upper buckles (107) and the lower buckles (104), so as to limit the side panel foam (103) in the card slot.
3. The surgical mainframe according to claim 2, characterized in that: The upper buckles (107) and the lower buckles (104) are arranged staggeredly.
4. The surgical mainframe according to claim 3, characterized in that: The inner side wall of the lower buckle (104) is an inclined surface extending outward obliquely to squeeze the bottom of the side panel foam (103) to form a tight fit.
5. The surgical mainframe according to claim 4, characterized in that: The outer housing includes a top cover (201), a bottom cover (202), a front cover (203), and a rear cover (204) that can be assembled together. A set of insertion rods (205) are vertically arranged inside the bottom cover (202). Vertically extending slots (111) are respectively arranged on the four sides of the inner housing. The set of insertion rods (205) are inserted into the slots (111) one by one to limit the inner housing in the outer housing.
6. The surgical mainframe according to claim 5, characterized in that: The partition foam includes a first partition foam (113) and a second partition foam (114). The first partition foam (113) and the second partition foam (114) are stacked in sequence from bottom to top and divide the hollow cavity into three layers. A set of air inlets (105) correspond to the positions of a set of components (4) in each layer of the hollow cavity.
7. The surgical mainframe according to claim 6, wherein: Insulating plates (5) are respectively arranged on the inner surface of the bottom of the first partition foam (113) and the outer surface of the bottom of the second partition foam (114).
8. The surgical mainframe according to claim 7, wherein: The corners between the bottom support foam (101), the first partition foam (113), the second partition foam (114), and the top cover foam (102) are clamped in sequence.
9. The surgical mainframe according to claim 7, characterized in that: The top of the top cover foam (102) is evenly distributed with convex bumps (112), and the top surface of the convex bumps (112) is an arc surface. After the outer housing is assembled, the convex bumps (112) are in contact with the inner surface of the upper cover (201).
10. The surgical mainframe according to claim 9, characterized in that: A set of through holes facing the air outlet (106) are provided on the rear cover (204) to communicate the air outlet (106) with the external atmosphere.