Electronic speed regulator with good heat dissipation

Abstract

The utility model discloses an electronic speed regulator with good heat dissipation, and relates to the heat dissipation field of RC model motor control. The electronic speed regulator comprises a shell, a first circuit board and a second circuit board, the first circuit board and the second circuit board are arranged in the shell, and aiming at a first electronic device which is arranged on the first circuit board with a power conversion function and has a relatively serious heating condition, the first electronic device is provided with a heat conducting sheet comprising a fixing part, a connecting part and a heat conducting part; heat can be transmitted to the shell through the heat conduction part for heat dissipation, meanwhile, the heat conduction piece can be conveniently welded and fixed to the first circuit board through the fixing part and the connecting part, good heat dissipation performance is achieved on the whole, potential safety hazards are eliminated, and the electronic speed regulator can continuously and safely operate in the large-current state.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation of RC model motor control, in particular to an electronic speed controller with good heat dissipation. Background Technique

[0002] At present, for RC models (such as car models, aircraft models, drones, etc.), the main power source is the motor installed inside. The output power is determined by the rotational speed of the motor, and the rotational speed of the motor is controlled by an electronic speed controller.

[0003] The electronic speed controller mainly consists of a control processing part and a power conversion part. The control processing part receives the remote control signal from the remote controller, decodes it to obtain an effective control signal, and the electronic speed controller controls the power conversion part according to the obtained effective control signal. At the same time, the power conversion part bears the function of overcurrent. The higher the working voltage and the greater the current passing through, the more severely the power tube heats up and the faster the temperature rise.

[0004] Taking the car model system as an example, the temperature of the environment where such models are usually used is relatively high, and the heat dissipation environmental conditions are relatively poor. However, the larger the scale of the car model, the greater the motor power. The lithium battery pack used in the car model is mainly in the low-voltage range, and often requires the electronic speed controller to output a larger current to meet the motor speed control. The greater the current of the electronic speed controller, the greater the heat generated.

[0005] Since the exterior of the car model needs to be designed to be consistent with the corresponding vehicle model, the internal installation space is often very compact. The volume of the car electronic speed controller is limited by the car model design. At the same time, considering the large current output, the heat dissipation efficiency often cannot meet the heat dissipation requirements. This not only easily causes the electronic speed controller to reach the temperature protection value and reduces the working time of the electronic speed controller, but also the electronic speed controller is prone to overheat and ignite in special cases, resulting in potential safety hazards.

[0006] In summary, the internal heat dissipation efficiency of the existing electronic speed controller is low and cannot meet the heat dissipation requirements, which not only affects the overcurrent performance of the electronic speed controller but also is prone to potential safety hazards. Content of the Utility Model

[0007] To solve the problems existing in the prior art, the main purpose of the utility model is to provide an electronic speed controller with good heat dissipation, which can improve the internal heat dissipation efficiency of the electronic speed controller and eliminate potential safety hazards.

[0008] To achieve the above purpose, the utility model adopts the following technical solutions:

[0009] An electronic speed controller with good heat dissipation, comprising a housing, and a first circuit board and a second circuit board disposed within the housing. Among them, the first circuit board and the second circuit board are electrically connected to each other. The first circuit board is provided with a first electronic device and a heat-conducting sheet, and the first electronic device is soldered to the first circuit board in a way that one side is attached.

[0010] The heat-conducting sheet includes a fixing portion, a connecting portion and a heat-conducting portion.

[0011] The fixing portion is soldered to the first circuit board.

[0012] The heat-conducting portion is disposed between the inner wall of the housing and the side of the first electronic device facing away from the first circuit board.

[0013] The connecting portion connects the fixing portion and the heat-conducting portion respectively.

[0014] Optionally, the housing includes an upper housing, a middle housing and a lower housing. The upper housing and the middle housing cooperate to form a first cavity, and the middle housing and the lower housing cooperate to form a second cavity. The first circuit board is installed in the first cavity, and the second circuit board is installed in the second cavity. The upper surface and / or the lower surface of the first circuit board is provided with a first electronic device, and the heat-conducting portion is disposed between the side of the first electronic device facing away from the first circuit board and the inner wall of the first cavity.

[0015] Optionally, the first electronic device is a MOS device, and the heat-conducting portion of one heat-conducting sheet can cover at least two first electronic devices.

[0016] Optionally, the heat-conducting sheet is formed by secondary bending of a rectangular copper sheet to form a fixing portion, a connecting portion and a heat-conducting portion, and the fixing portion and the heat-conducting portion are parallel to each other.

[0017] Optionally, the first circuit board is provided with a plug, the second circuit board is provided with a socket, the middle housing is provided with a through hole, and the plug of the first circuit board passes through the through hole and is plugged and connected to the socket on the second circuit board. There are multiple groups of plugs and sockets, and they are distributed on the opposite sides of the first circuit board and the second circuit board.

[0018] Optionally, it further includes a fan, and the fan is installed on the outer side wall of the upper housing. The outer side wall of the upper housing is further provided with a heat dissipation tooth array, and the fan is disposed above the heat dissipation tooth array.

[0019] Optionally, a protruding portion of one side edge of the second circuit board relative to the corresponding side edge of the first circuit board is provided. An indicator lamp cover and an electrical connector are provided on the protruding portion of the second circuit board. The middle housing and the lower housing are provided with protruding structures corresponding to the protruding portion to wrap the protruding portion of the second circuit board. A through hole is provided on the protruding structure of the middle housing to expose the indicator lamp cover and the electrical connector. The fan is connected to the electrical connector of the second circuit board through a wire.

[0020] Optionally, the upper housing, the middle housing, and the lower housing are respectively made of metal. A screw seat is provided inside the upper housing. The middle housing is provided with screw through holes. The lower housing is provided with screw mounting holes. Screws are provided in the screw mounting holes. The screws are sequentially fixedly connected to the screw seat through the mounting holes and the through holes to fix the upper housing, the middle housing, and the lower housing to each other. The edge shape of the first cavity is matched with the edge shape of the first circuit board so that the first circuit board is snap-fitted within the first cavity. The edge shape of the second cavity is matched with the edge shape of the second circuit board so that the second circuit board is snap-fitted within the second cavity.

[0021] Optionally, a first silicone pad is provided between the heat conducting portion of the heat conducting sheet and the outer shell.

[0022] Optionally, the second circuit board is provided with a second electronic device. The second electronic device is an inductor device. The second electronic device is soldered to the lower surface of the second circuit board in a one-side fitting manner. A second silicone pad is provided between the side of the second electronic device facing away from the second circuit board and the outer shell.

[0023] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0024] (1) For the electronic speed regulator of the present utility model, a first electronic device with a relatively serious heating condition is provided on the first circuit board having a power conversion function. By providing a heat conducting sheet including a fixing portion, a connecting portion, and a heat conducting portion on the first electronic device, heat can be transferred to the outer shell through the heat conducting portion for heat dissipation. At the same time, the fixing portion and the connecting portion enable the heat conducting sheet to be conveniently welded and fixed to the first circuit board, achieving good heat dissipation performance overall, thus eliminating potential safety hazards and enabling the large-current state of the electronic speed regulator to operate safely continuously.

[0025] (2) Further, for the electronic speed regulator of the present utility model, the outer shell is configured to be composed of an upper housing, a middle housing, and a lower housing, forming two cavities for respectively installing the first circuit board and the second circuit board to separate the two. At the same time, a first electronic device and a heat conducting sheet are provided on the lower surface of the first circuit board, enabling the first electronic device on the lower surface to transfer heat to the middle housing for heat dissipation through the heat conducting sheet. Similarly, a first electronic device and a heat conducting sheet are also provided on the upper surface of the first circuit board, enabling the first electronic device on the upper surface to have good heat dissipation performance.

[0026] (3) For the electronic speed governor of the present utility model, further, a first silicone pad is further provided between the heat conducting sheet and the inner side wall of the housing, so that heat can be evenly dispersed from the first electronic device through the heat conducting sheet and the first silicone pad to the housing, thereby further improving the heat dissipation efficiency.

[0027] (4) For the electronic speed governor of the present utility model, further, considering the insufficient heat dissipation configuration of the second circuit board, a second silicone pad is configured on the second electronic device that is prone to heat generation on the second circuit board, so that the heat of the second electronic device is dissipated to the housing through the second silicone pad, thereby reducing the temperature inside the electronic speed governor as a whole and reducing the performance degradation of the electronic speed governor caused by excessive temperature.

[0028] The present utility model will be further described below in conjunction with the accompanying drawings. Description of the Drawings

[0029] Figure 1 Schematic perspective view of an electronic speed governor with good heat dissipation according to the present utility model.

[0030] Figure 2 Schematic cross-sectional view of an electronic speed governor with good heat dissipation according to the present utility model.

[0031] Figure 3 According to the present utility model Figure 2 Enlarged schematic cross-sectional view.

[0032] Figure 4 One of the exploded structural schematic diagrams of the components of an electronic speed governor with good heat dissipation according to the present utility model.

[0033] Figure 5 Another exploded structural schematic diagram of the components of an electronic speed governor with good heat dissipation according to the present utility model.

[0034] Figure 6 The third exploded structural schematic diagram of the components of an electronic speed governor with good heat dissipation according to the present utility model.

[0035] Reference numerals: 10, upper housing; 11, heat dissipation tooth array; 20, middle housing; 30, lower housing; 12, first cavity; 32, second cavity; 40, first circuit board; 41, first electronic device; 42, plug; 50, second circuit board; 51, second electronic device; 52, socket; 53, protrusion; 54, indicator light cover; 55, electrical connector; 60, heat conducting sheet; 61, fixing part; 62, connecting part; 63, heat conducting part; 70, first silicone pad; 80, second silicone pad; 90, fan; 91, wire. Detailed Description of the Preferred Embodiments

[0036] To better illustrate the purpose, technical solution and advantages of the present utility model, the following further describes in detail the specific implementation manners of the present utility model in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present utility model, but do not limit the scope of the present utility model.

[0037] As Figures 1 to 6 shown, it is an electronic speed controller with good heat dissipation according to an embodiment of the present utility model. The electronic speed controller includes a first circuit board 40, a second circuit board 50, a housing composed of an upper housing 10, a middle housing 20 and a lower housing 30, and a fan 90. The first circuit board 40 is configured to have a power conversion function. The second circuit board 50 is configured to have a control and processing function. The upper housing 10 and the middle housing 20 cooperate to form a first cavity 12, and the first circuit board 40 is installed in the first cavity 12. The middle housing 20 and the lower housing 30 cooperate to form a second cavity 32, and the second circuit board 50 is installed in the second cavity 32. In other words, the first circuit board 40 and the second circuit board 50 are installed within the housing and are separated by the middle housing 20 to avoid mutual influence between the two. The first circuit board 40 and the second circuit board 50 are electrically connected to each other to achieve the electronic speed control function. The fan 90 is installed on the outer side wall of the upper housing 10 to dissipate heat from the housing, especially to dissipate heat from the first circuit board 40 in the first cavity 12.

[0038] Referring to Figure 2 and Figure 3 , wherein, a first electronic device 41 is provided on the first circuit board 40. To save space, the first electronic device 41 is soldered to the first circuit board 40 in a manner that one of its surfaces is attached to the surface of the first circuit board 40. This first electronic device 41 usually generates a relatively large amount of heat during the power conversion process, such as a MOS device. For this reason, in this embodiment, a heat conducting sheet 60 is provided on the first circuit board 40. The heat conducting sheet 60 includes a fixing portion 61, a connecting portion 62 and a heat conducting portion 63. The fixing portion 61 is soldered to the first circuit board 40, so that the heat conducting sheet 60 is fixed on the first circuit board 40. The soldering can be in the form of surface mounting or via hole soldering. The connecting portion 62 connects the fixing portion 61 and the heat conducting portion 63 respectively, so that the fixing portion 61, the connecting portion 62 and the heat conducting portion 63 form an integral body. After the fixing portion 61 is soldered to the first circuit board 40, the heat conducting portion 63 is located on the side of the first electronic device 41 facing away from the first circuit board 40. After the first circuit board 40 is installed into the housing, the heat conducting portion 63 is disposed between the inner wall of the housing and the side of the first electronic device 41 facing away from the first circuit board 40. The heat generated by the first electronic device 41 is transferred to the housing through the heat conduction of the heat conducting sheet 60, thereby achieving rapid heat dissipation.

[0039] In one aspect, a plurality of first electronic devices 41 are provided on the lower surface of the first circuit board 40. A heat conducting sheet 60 is provided for each first electronic device 41 on the lower surface. The heat conducting portion 63 of the heat conducting sheet 60 is disposed between the inner side wall of the middle housing 20 and the side of the first electronic device 41 facing away from the first circuit board 40, so that the heat generated by the first electronic device 41 on the lower surface is transferred to the middle housing 20 through the heat conduction of the heat conducting sheet 60, realizing heat dissipation by means of the middle housing 20 and avoiding poor heat dissipation caused by being far away from the fan 90.

[0040] In another aspect, a plurality of first electronic devices 41 are also provided on the upper surface of the first circuit board 40. A heat conducting sheet 60 is provided for each first electronic device 41 on the upper surface. The heat conducting portion 63 of the heat conducting sheet 60 is disposed between the inner side wall of the upper housing 10 and the side of the first electronic device 41 facing away from the first circuit board 40, so that the heat generated by the first electronic device 41 on the upper surface is transferred to the upper housing 10 through the heat conduction of the heat conducting sheet 60 and then quickly dissipated by the fan 90. Compared with the case where the electronic device transfers heat to the upper housing 10 through air, the heat dissipation efficiency in this embodiment is greatly increased.

[0041] It can be seen that in the present utility model, on the first circuit board 40 having a power conversion function, a heat conducting sheet 60 is configured for the first electronic device 41 with higher heat generation, so that the heat is transferred to the middle housing 20 and the upper housing 10 for heat dissipation, achieving good heat dissipation performance, thereby eliminating potential safety hazards and improving the operation efficiency of the electronic speed regulator in the high-current state.

[0042] Further, a first silica gel pad 70 is further provided between the heat conducting portion 63 of the heat conducting sheet 60 on the lower surface of the first circuit board 40 and the inner side wall of the middle housing 20. The heat of the heat conducting sheet 60 can be more evenly transferred to the middle housing 20 through the heat conduction of the first silica gel pad 70, thereby further improving the heat dissipation efficiency. Similarly, a first silica gel pad 70 is also provided between the heat conducting portion 63 of the heat conducting sheet 60 on the upper surface of the first circuit board 40 and the inner side wall of the upper housing 10, so that the heat is better transferred to the upper housing 10 through the first silica gel pad 70. In a preferred solution, all the heat conducting sheets 60 on the lower surface are spaced apart and connected to the inner side wall of the upper housing 10 only through one first silica gel pad 70; all the heat conducting sheets 60 on the lower surface are also spaced apart and connected to the inner side wall of the middle housing 20 only through one first silica gel pad 70.

[0043] It can be seen that in the present utility model, on the first circuit board 40 having a power conversion function, a first silica gel pad 70 is still provided on the heat conducting sheet 60, and the heat is further evenly conducted to the middle housing 20 and the upper housing 10 through the first silica gel pad 70, further improving the heat dissipation efficiency.

[0044] Generally speaking, the operating current of the second circuit board 50 is relatively low, so the heat generation is also relatively light. However, since the second circuit board 50 is far from the fan 90, the temperature of the second circuit board 50 is also likely to rise. For this reason, a second electronic device 51 with control and processing functions is provided on the second circuit board 50. The second electronic device 51 also generates a relatively large amount of heat during operation, such as an inductor device. The second electronic device 51 is soldered to the lower surface of the second circuit board 50 in a one-sided fitting manner, and a second silica gel pad 80 is provided between the side of the second electronic device 51 facing away from the second circuit board 50 and the inner surface of the lower housing 30, so that the heat generated by the second electronic device 51 is transferred to the lower housing 30 through the heat conduction of the second silica gel pad 80 for heat dissipation.

[0045] It can be seen from this that in the present utility model, not only the first electronic device 41 of the first circuit board 40 that is prone to heat generation is cooled, but also the second electronic device 51 of the second circuit board 50 that is prone to heat generation and has fewer heat dissipation methods is cooled, thereby overall reducing the temperature inside the electronic speed regulator and improving the operating efficiency of the electronic speed regulator in a high-current state.

[0046] To further improve the heat dissipation efficiency, in this embodiment, the upper housing 10, the middle housing 20, and the lower housing 30 are respectively made of metal, so that the heat from the heat conduction sheet 60, the first silica gel pad 70, and the second silica gel pad 80 can be quickly dissipated to the outside. A heat dissipation tooth array 11 is further provided on the outer side wall of the upper housing 10, and the fan 90 is arranged above the heat dissipation tooth array 11, so as to facilitate the flowing air to take away the heat on the heat dissipation tooth array 11.

[0047] Reference Figures 3 to 6 , specifically in this embodiment, generally speaking, the first electronic device 41 as a MOS device is in the shape of a flat cuboid block and is mounted in a manner that one of its largest-sized surfaces faces the first circuit board 40, and the heat conduction portion 63 of the heat conduction sheet 60 covers the largest-sized surface of the first electronic device 41 opposite. In a preferred structural solution of the heat conduction sheet 60, the heat conduction sheet 60 is formed by secondary bending of a rectangular copper sheet to form a fixing portion 61, a connecting portion 62, and a heat conduction portion 63. The length of the heat conduction portion 63 extending from the connecting portion 63 is slightly greater than the width of the first electronic device 41. The width of the heat conduction portion 63 can be greater than the length between two juxtaposed first electronic devices 41, so as to cover two first electronic devices 41 at the same time. The width of the heat conduction portion 63 can be greater than the length between three juxtaposed first electronic devices 41, so as to cover three first electronic devices 41 at the same time. An exposed copper foil line can be provided beside the position where the first electronic device 41 is arranged on the first circuit board 40. This copper foil line is not electrically connected to other copper foil lines on the first circuit board 40, but is used to solder the fixing portion 61 of the heat conduction sheet 60, so that the heat conduction sheet 60 can be soldered and fixed to the first circuit board 40 by means of mounting.

[0048] ReferenceFigures 3 to 6 Specifically, in this embodiment, a protrusion 53 is provided on one side edge of the second circuit board 50 relative to the side edge of the first circuit board 40, and an indicator light cover 54 and three electrical connectors 55 are provided on the protrusion 53 of the second circuit board 50. The middle shell 20 and the lower shell 30 are provided with a protruding structure corresponding to the protrusion 53 to wrap the protrusion 53 of the second circuit board 50. A through hole is provided on the protruding structure of the middle shell 20 to expose the indicator light cover 54 and the electrical connector 55. The fan 90 is connected to one of the electrical connectors 55 of the second circuit board 50 through a wire 91. The other two electrical connectors 55 can be used to connect the balanced charging interface and the RC signal receiver respectively.

[0049] refer to Figures 3 to 6 Specifically, in this embodiment, the first circuit board 40 is provided with a plug 42, the second circuit board 50 is provided with a socket 52 at a position corresponding to the plug 42, and the middle housing 20 is provided with a through hole at a position corresponding to the plug 42 and the socket 52. The plug 42 of the first circuit board 40 passes through the through hole and is plugged and connected with the socket 52 on the second circuit board 50. There are three groups of plugs 42 and sockets 52, and they are distributed on opposite sides of the first circuit board 40 and the second circuit board 50. The plugging of the plug 42 and the socket 52 can not only realize the electrical connection between the first circuit board 40 and the second circuit board 50, and realize the electronic speed regulation function, but also play the role of fixing the first circuit board 40 and the second circuit board 50 to each other.

[0050] refer to Figures 3 to 6 Specifically, in this embodiment, a screw seat is provided in the upper shell 10, a screw through hole is provided in the middle shell 20, and a screw mounting hole is provided in the lower shell 30. A screw is provided in the screw mounting hole. The screw is fixedly connected to the screw seat through the mounting hole and the through hole in sequence, so that the upper shell 10, the middle shell 20 and the lower shell 30 are fixed to each other. The edge shape of the first cavity 12 matches the edge shape of the first circuit board 40, so that the first circuit board 40 is clamped in the first cavity 12. At the same time, the edge shape of the second cavity 32 matches the edge shape of the second circuit board 50, so that the second circuit board 50 is clamped in the second cavity 32, so that the process step of installing screws is not required. At the same time, the plug 42 of the first circuit board 40 and the socket 52 of the second circuit board 50 can fix the two circuit boards to each other when they are plugged into each other. With the first silicone pad 70 and the second silicone pad 80, it can be achieved to fix each circuit board from different directions. In the case of no screws, the first circuit board 40 and the second circuit board 50 are firmly fixed in the shell.

[0051] The above embodiments mainly describe the basic principles, main features and advantages of the present utility model. Those skilled in the art should understand that the present utility model is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principle of the present utility model. Without departing from the spirit and scope of the present utility model, the present utility model will have various changes and improvements, and these changes and improvements all fall within the scope of the present utility model claimed.

Claims

1. An electronic speed governor with good heat dissipation, comprising a housing, and a first circuit board (40) and a second circuit board (50) arranged within the housing, characterized in that, The first circuit board (40) is electrically connected to the second circuit board (50). A first electronic device (41) and a heat conducting sheet (60) are provided on the first circuit board (40). The first electronic device (41) is soldered to the first circuit board (40) in a manner of one-side fitting. The heat conducting sheet (60) includes a fixing portion (61), a connecting portion (62), and a heat conducting portion (63). The fixing portion (61) is soldered to the first circuit board (40). The heat conducting portion (63) is disposed between the inner wall of the housing and the side of the first electronic device (41) facing away from the first circuit board (40). The connecting portion (62) connects the fixing portion (61) and the heat conducting portion (63) respectively.

2. The electronic speed regulator with good heat dissipation according to claim 1, characterized in that, The housing includes an upper housing (10), a middle housing (20), and a lower housing (30). The upper housing (10) and the middle housing (20) cooperate to form a first cavity (12). The middle housing (20) and the lower housing (30) cooperate to form a second cavity (32). The first circuit board (40) is installed in the first cavity (12). The second circuit board (50) is installed in the second cavity (32). A first electronic device (41) is provided on the upper surface and / or the lower surface of the first circuit board (40). The heat conducting portion (63) is disposed between the side of the first electronic device (41) facing away from the first circuit board (40) and the inner wall of the first cavity (12).

3. The electronic speed governor with good heat dissipation according to claim 2, characterized in that, The first electronic device (41) is a MOS device. The heat conducting portion (63) of one heat conducting sheet (60) can cover at least two first electronic devices (41).

4. The electronic speed governor with good heat dissipation according to claim 2, wherein, The heat conducting sheet (60) is formed by secondary bending of a rectangular copper sheet to form the fixing portion (61), the connecting portion (62), and the heat conducting portion (63). The fixing portion (61) and the heat conducting portion (63) are parallel to each other.

5. The electronic speed governor with good heat dissipation according to claim 2, characterized in that, The first circuit board (40) is provided with a plug (42), and the second circuit board (50) is provided with a socket (52). The middle housing (20) is provided with a through hole. The plug (42) of the first circuit board (40) passes through the through hole and is plug-connected to the socket (52) on the second circuit board (50). Multiple groups of the plug (42) and the socket (52) are provided and are distributed on the opposite sides of the first circuit board (40) and the second circuit board (50).

6. The electronic speed governor with good heat dissipation according to claim 2, wherein, A fan (90) is further included. The fan (90) is installed on the outer side wall of the upper housing (10). A heat dissipation tooth array (11) is further provided on the outer side wall of the upper housing (10). The fan (90) is disposed above the heat dissipation tooth array (11).

7. An electronic speed governor with good heat dissipation according to claim 6, characterized in that, One side edge of the second circuit board (50) is provided with a protrusion (53) relative to the side edge of the first circuit board (40). An indicator lamp cover (54) and an electrical connector (55) are provided on the protrusion (53) of the second circuit board (50). The middle housing (20) and the lower housing (30) are provided with protruding structures corresponding to the protrusion (53) to wrap the protrusion (53) of the second circuit board (50). A through hole is provided on the protruding structure of the middle housing (20) to expose the indicator lamp cover (54) and the electrical connector (55). The fan (90) is connected to the electrical connector (55) of the second circuit board (50) through a wire (91).

8. The electronic speed governor with good heat dissipation according to claim 2, characterized in that, The upper housing (10), the middle housing (20) and the lower housing (30) are respectively made of metal. A screw seat is provided inside the upper housing (10). The middle housing (20) is provided with screw through holes. The lower housing (30) is provided with screw mounting holes. Screws are provided in the screw mounting holes. The screws are fixedly connected to the screw seat through the mounting holes and the through holes in sequence, so that the upper housing (10), the middle housing (20) and the lower housing (30) are fixed to each other. The edge shape of the first cavity (12) is matched with the edge shape of the first circuit board (40) so that the first circuit board (40) is clamped within the first cavity (12). The edge shape of the second cavity (32) is matched with the edge shape of the second circuit board (50) so that the second circuit board (50) is clamped within the second cavity (32).

9. The electronic speed governor with good heat dissipation according to claim 1, characterized in that, A first silicone pad (70) is provided between the heat conducting portion (63) of the heat conducting sheet (60) and the outer shell.

10. The electronically controlled speed regulator with good heat dissipation according to claim 1, characterized in that, The second circuit board (50) is provided with a second electronic device (51). The second electronic device (51) is an inductor device. The second electronic device (51) is soldered to the lower surface of the second circuit board (50) in a one-sided fitting manner. A second silicone pad (80) is provided between the side of the second electronic device (51) facing away from the second circuit board (50) and the outer shell.

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