Cold plate and computing device

Abstract

The embodiment of the utility model provides a cold plate and computing equipment. The cold plate comprises a cold plate body and an expansion substrate. The expansion substrate is arranged on the heat dissipation surface of the cold plate body. Wherein the expansion substrate and the cold plate body are of a split structure, the position, arranged on the heat dissipation surface, of the expansion substrate is determined according to the position of a heating element on a circuit board of the equipment to be subjected to heat dissipation, and the expansion substrate is used for being attached to the heating element so as to dissipate heat of the heating element. According to the cold plate provided by the embodiment of the invention, the problem of high production cost caused by low compatibility of the cold plate is solved.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of computing devices, and in particular, to a cold plate and a computing device. Background Art

[0002] Internet service providers, enterprise platforms, research institutions, etc. all have a large number of computing requirements. A job platform that bears requirements such as storage, computing, and networking is called a data center. Information and communication technology (ICT) devices in the data center generate heat during operation. Therefore, liquid cooling technology needs to be applied in the data center to ensure the normal operation of ICT devices in the data center.

[0003] As the core component of the cooling function of a cold-plate liquid-cooled server, a cold plate can be used to absorb the heat generated by the server. Among them, modules on the server that are prone to generate relatively large amounts of heat can be a central processing unit (CPU), an optical module, an image processor, etc. In the related art, some protrusions are formed on the cold plate to form heat dissipation bosses for fitting with heat-generating components.

[0004] However, since there are more and more types of network cards, and the distribution positions of heat-generating components of different network cards are different. Therefore, in order to ensure that the bosses on the cold plate can fit with the heat-generating components, it is necessary to match corresponding cold plates for different network cards, which easily leads to low compatibility of the cold plates and an increase in cost. Summary of the Utility Model

[0005] The embodiments of the present application provide a cold plate and a computing device, which can solve the problems of low compatibility of the cold plate and high production cost.

[0006] In a first aspect, the embodiments of the present application provide a cold plate, including a cold plate main body and an extended substrate. The extended substrate is arranged on the heat dissipation surface of the cold plate main body; wherein, the extended substrate and the cold plate main body are of a split structure, and the position of the extended substrate arranged on the heat dissipation surface can be determined according to the position of the heat-generating component on the circuit board of the device to be cooled, and the extended substrate is used to fit with the heat-generating component to dissipate heat from the heat-generating component.

[0007] The cold plate provided by the embodiment of the present application has a split structure with an extended substrate and a cold plate body, and the position of the extended substrate on the cold plate body can be flexibly set. Since the distribution positions of the heat-generating components on different types of circuit boards are different, when dissipating heat from different types of circuit boards, the extended substrate can be set at a position corresponding to the heat-generating component, and then the heat-generating component can be fixed on the cold plate body so that the extended substrate can remain corresponding to the heat-generating component. Thus, the cold plate can be adapted to more types of circuit boards, which is beneficial to improving the compatibility of the cold plate and reducing the production, processing, and maintenance costs. Moreover, since the extended substrate and the cold plate body have a split structure, there is no need to process a boss structure on the cold plate body, which can save processing procedures, reduce the processing difficulty of the cold plate body, and is beneficial to reducing the processing cost.

[0008] In a possible implementation manner, the cold plate includes an elastic connecting member. A part of the elastic connecting member is connected to the cold plate body, and another part of the elastic connecting member is connected to the extended substrate, so that the extended substrate is elastically connected to the cold plate body.

[0009] In the embodiment of the present application, taking the first substrate as an example, the tolerance existing in the first heat-generating unit itself and the installation tolerance between the circuit board and the cold plate are likely to cause a gap between the first substrate and the first heat-generating unit, so that the first heat-generating unit cannot transfer its own heat to the first substrate, resulting in the failure of the first substrate and affecting the heat dissipation efficiency of the first heat-generating unit. Therefore, by elastically connecting the first substrate to the cold plate body, the first substrate can float a certain distance relative to the cold plate body. The distance that the first substrate floats relative to the cold plate body can be used to compensate the above tolerances, so that the first substrate and the first heat-generating unit can maintain a connected state, which is beneficial to improving the connection reliability between the first substrate and the first heat-generating unit, and thus can improve the heat dissipation reliability of the first heat-generating unit.

[0010] In addition, when the circuit board needs to be replaced, since the distance between the first substrate and the heat dissipation surface of the cold plate body is adjustable, the first substrate and the corresponding heat-generating unit can still maintain a connected state.

[0011] In a possible implementation manner, the elastic connecting member includes a guide post and an elastic body. The guide post includes a first end and a second end. The first end of the guide post can pass through the extended substrate and is connected to the cold plate body. The elastic body is sleeved on the guide post. One end of the elastic body abuts against the second end of the guide post, and the other end of the elastic body abuts against the extended substrate. The elastic connecting member can generate compressive deformation to adjust the distance between the extended substrate and the cold plate body.

[0012] In the embodiments of the present application, the guide posts can guide the elastomer so that the elastomer can move along the thickness direction of the cold plate body. The elastomer can produce compressive deformation. By the compressive deformation of the elastomer, the distance between the extended substrate and the cold plate body can be adjusted. By adjusting this distance, it can be used to compensate for the tolerance of the heating element itself or the installation tolerance between the cold plate and the circuit board, so as to keep the extended substrate in close contact with the heating element, thereby having a better heat transfer effect compared with the indirect connection between the extended substrate and the heating element through other heat conduction structures, which is beneficial to improving the heat dissipation efficiency.

[0013] In a possible implementation manner, a heat-conducting medium layer is filled between the extended substrate and the cold plate body.

[0014] In the embodiments of the present application, when the extended substrate can float a certain distance relative to the cold plate body, a gap is likely to be generated between the extended substrate and the cold plate body, thus affecting the heat transfer from the extended substrate to the cold plate body. Therefore, a heat-conducting medium layer can be filled between the extended substrate and the cold plate body to transfer heat to the cold plate body through the heat-conducting medium layer.

[0015] In a possible implementation manner, the extended substrate includes a first substrate and a second substrate, and at least one of the first substrate and the second substrate is elastically connected to the cold plate body. Among them, the heating element includes a first heating unit and a second heating unit, and the first substrate and the second substrate are respectively in close contact with the first heating unit and the second heating unit.

[0016] In the embodiments of the present application, the first substrate can be fixedly connected to the cold plate body, and the first substrate is connected to the first heating unit. The second substrate can be elastically connected to the cold plate body, and the second substrate is connected to the second heating unit. Along the thickness direction of the cold plate body, the distance between the surface of the first substrate facing the first heating unit and the cold plate body is fixed. Therefore, during the installation of the cold plate and the circuit board, the first substrate and the first heating unit can be first set to be in close contact, and then the second substrate that can float relative to the cold plate body can be set, so as to improve the compatibility of the cold plate through the combination of the second substrate and the first substrate.

[0017] In a possible implementation manner, when the extended substrate is fixed relative to the cold plate body, a heat-conducting medium layer can be filled between the extended substrate and the heating element.

[0018] In the embodiments of the present application, since the extended substrate is fixed relative to the cold plate body, after the cold plate and the circuit board are installed, if there is a gap between the extended substrate and the heating element, the extended substrate and the heating element can be connected through the heat-conducting medium layer, so that the heat of the heating element can be transferred to the extended substrate through the heat-conducting medium layer and then transferred from the extended substrate to the cold plate body.

[0019] In a possible implementation, the area of the surface of the extended substrate facing the heating element is greater than or equal to the area of the surface of the heating element facing the extended substrate; and / or, the area of the surface of the fixed substrate facing the heating element is greater than or equal to the area of the surface of the heating element facing the fixed substrate.

[0020] In the embodiments of the present application, the extended substrate is taken as an example for description. When the heat generated by the heating element is transferred to the extended substrate, a part of the heat can be transferred to the cold plate body through the extended substrate for heat dissipation through the flow of the liquid cooling medium in the cold plate body, and another part of the heat can be dissipated through the relatively large surface area of the extended substrate itself.

[0021] In a possible implementation, the aluminum extended substrate is a heat dissipation substrate; or, the extended substrate is a copper heat dissipation substrate; or, the extended substrate is a vacuum chamber heat pipe; or, the extended substrate is a semiconductor refrigeration substrate.

[0022] In the embodiments of the present application, the vacuum chamber heat pipe has a heat-conducting phase change material. In the normal temperature state, the heat-conducting phase change material can be in a solid state. After the heating element generates heat, the solid heat-conducting phase change material on the vacuum chamber heat pipe in contact with the heating element absorbs heat and can turn into a liquid state, and then gradually vaporizes and dissipates outward to achieve heat dissipation for the heating element.

[0023] The semiconductor refrigeration substrate uses semiconductor materials to make thermoelectric elements. When the semiconductor refrigeration substrate is powered on, heat absorption and heat release phenomena will occur at both ends of the semiconductor material respectively. One end of the semiconductor refrigeration substrate connected to the heating element can generate a heat absorption phenomenon, and one end of the semiconductor refrigeration substrate connected to the cold plate body can generate a heat release phenomenon, thereby achieving heat dissipation for the heating element. Among them, the semiconductor refrigeration substrate as the extended substrate can also keep the heating element at a constant temperature, which is beneficial to maintaining the normal operation of the heating element.

[0024] In a possible implementation, the cold plate body is a pipe-type heat dissipation cold plate; or, the cold plate body is a shovel-tooth type heat dissipation cold plate; or, the cold plate body is a pin-fin type heat dissipation cold plate.

[0025] In the embodiments of the present application, through the cold plate bodies of the above-mentioned various structural forms, the extended substrates of various structural forms, various thicknesses, various sizes, and the flexibility of the position of the extended substrate arranged on the cold plate body, the cold plate body and the extended substrate can be flexibly combined to form a diversified cold plate. Thus, the cold plate can be used for heat dissipation of different specifications of heating units in the heating element, and further can be compatible with a variety of different types of circuit boards, which is beneficial to improving the compatibility and adaptability of the cold plate and is beneficial to reducing the processing cost.

[0026] In a possible implementation, the cold plate further includes at least one fixing structure for mounting the extended substrate on the cold plate body, and the fixing structure is detachably connected to the cold plate body.

[0027] In the embodiments of the present application, according to several general specifications of the circuit board, a plurality of preset mounting spaces may be provided on the heat dissipation surface of the cold plate body for accommodating circuit boards of different specifications, and the preset mounting spaces are used for mounting the extended substrate. The number of the fixing structures may be multiple, and the multiple fixing structures may be respectively fixed to each preset mounting space. When the cold plate is used for dissipating heat from a certain circuit board, a target mounting space corresponding to the position of the heating element of the circuit board is determined among the multiple preset mounting spaces, and the extended substrate is quickly mounted on the target mounting space through the fixing structure of the target mounting space. Thus, the cold plate can be compatible with multiple circuit boards of different specifications, and can realize the rapid assembly of the extended substrate and the cold plate body based on the corresponding circuit board.

[0028] In a possible implementation, the fixing structure includes a fixing post and a compaction part. One end of the fixing post is rotatably connected to the heat dissipation surface of the cold plate body, and the other end of the fixing post is provided with the compaction part. The compaction part is located on the side of the extended substrate facing away from the cold plate body. The fixing post rotates to adjust the distance between the compaction part and the cold plate body for pressing the extended substrate against the cold plate body.

[0029] In a second aspect, the embodiments of the present application further provide a computing device, including a circuit board and the cold plate in any of the above embodiments. The circuit board has a heating element. The extended substrate of the cold plate is correspondingly arranged with the heating element and is in contact connection with the heating element. Description of the Drawings

[0030] Figure 1 is a partial three-dimensional structural schematic diagram of the cold plate provided by the embodiments of the present application;

[0031] Figure 2 is a partial side view structural schematic diagram of a computing device provided by the embodiments of the present application;

[0032] Figure 3 is a partial side view structural schematic diagram of another computing device provided by the embodiments of the present application;

[0033] Figure 4 is a partial side view structural schematic diagram of yet another computing device provided by the embodiments of the present application;

[0034] Figure 5 is a partial side view structural schematic diagram of still another computing device provided by the embodiments of the present application;

[0035] Figure 6 is Figure 5 a bottom view structural schematic diagram of the provided cold plate;

[0036] Figure 7 It is a schematic partial side view structure diagram of another computing device provided by an embodiment of the present application;

[0037] Figure 8 It is a schematic partial side view structure diagram of another computing device provided by an embodiment of the present application.

[0038] Description of reference numerals:

[0039] 10. Computing device;

[0040] 100. Cold plate;

[0041] 110. Cold plate body;

[0042] 120. Extension substrate; 121. First substrate; 122. Second substrate;

[0043] 130. Elastic connecting member; 131. Guide post; 132. Elastic body;

[0044] 140. Heat-conducting medium layer;

[0045] 150. Fixing structure; 151. Fixing post; 152. Compacting part;

[0046] 200. Circuit board; 210. Heating element; 211. First heating unit; 212. Second heating unit;

[0047] X. Thickness direction. Detailed implementation manners

[0048] The computing device provided by the embodiment of the present application can be applied to a data center. Internet service providers, enterprise platforms, research institutions, etc. all require a large amount of computing needs. A job platform that bears storage, computing, network and other needs is called a data center. The data center may include at least one computing device. The computing device can be a server, or it can be other computing devices that need to dissipate heat from electronic components. For example, switch cabinets, power distribution cabinets, etc. Taking the computing device as a server as an example, the number of servers can be multiple. For example, the number of servers can be 10 - 50. Among them, a cooling system is also provided in the computer room. The cooling system can dissipate heat from the internal environment of the computer room to keep the servers running normally. In the embodiment of the present application, the specific structure and working principle of the cooling system in the computer room are not described in detail.

[0049] Among them, the server in the embodiment of the present application can be a whole cabinet server, a rack server, etc., or it can be an AI server, such as a GPU server. It is not limited in the embodiment of the present application.

[0050] With the improvement of the integration level of computing devices, the power consumption of the core components in the server is getting higher and higher, and the heat generated during their operation is also increasing. For example, the heat-generating components can be a central processing unit (CPU), a graphics processing unit (GPU), an optical module, etc. If the heat generated by each heat-generating component in the server is excessive and cannot be dissipated in time, the operating condition of the computing device will be affected. Therefore, in the design process of the computing device, the heat dissipation of the heat-generating components inside the server is particularly important.

[0051] It is easy to understand that the heat dissipation performance parameters such as the density and specific heat capacity of the liquid are much higher than those of the air. Therefore, in this context, liquid-cooled data centers applying liquid-cooling technologies and devices such as liquid-cooled servers have emerged, providing a new solution for the cooling of data centers.

[0052] Liquid-cooling technology refers to the technology of using liquid to replace air as the refrigerant to exchange heat for heat-generating components and take away heat. For example, the liquid used for cooling can be fluorinated liquid, mineral oil, etc. The efficient refrigeration of liquid-cooling technology can effectively improve the usage efficiency and stability of the server, and at the same time enable more servers to be arranged in a unit space in the data center, thereby improving the computing efficiency of the data center.

[0053] Among them, liquid-cooling technology mainly includes types such as immersion type, spray type, cold plate type, and heat pipe technology. The cold plate provided in the embodiments of the present application can be applied to cold plate liquid-cooling technology. Cold plate liquid-cooling technology is a cooling method in which the heat of the heat-generating component is indirectly transferred to the cooling medium in the circulation channel of the cold plate through the thermal conductive interface material of the cold plate, and the heat is taken away by the cooling medium. Among them, the cold plate can be a radiator made of high-thermal conductivity metals such as copper and aluminum, which can hermetically accommodate the liquid flow.

[0054] In the embodiments of the present application, the extended substrate can have a heat-conducting function. The extended substrate is connected to the cold plate main body and the heat-generating component on the circuit board. The heat generated by the heat-generating component can be transferred to the cold plate main body through the extended substrate, so that through the fluidity of the liquid-cooling medium in the cold plate main body, the heat can be removed to the outside of the server, realizing the heat dissipation of the heat-generating component.

[0055] Among them, the extended substrate and the cold plate body are of a split structure, and the extended substrate can be freely arranged at any position on the cold plate body. Therefore, when dissipating heat from different types of network cards, the position of the extended substrate can be freely set according to the position of the heating elements on different network cards, so that it can be kept corresponding to the heating elements and dissipate heat from the heating elements. In the embodiment of the present application, since the extended substrate can be freely arranged on the cold plate body, a diversified combination of the cold plate body and the extended substrate can be realized, so that it can be used to adapt to different types of network cards, which is beneficial to improving the compatibility of the cold plate and reducing the production, processing and maintenance costs.

[0056] The cold plate 100 and the computing device 10 provided in the embodiments of the present application will be described in detail below through specific implementation manners.

[0057] Embodiment 1

[0058] The embodiment of the present application provides a cold plate 100. Refer to Figure 1 and Figure 2 As shown, the cold plate 100 may include a cold plate body 110 and an extended substrate 120.

[0059] The cold plate body 110 can be used to accommodate a liquid cooling medium. In the actual application process, the liquid cooling medium in the cold plate body 110 can circulate. There is at least one heating element 210 on the circuit board 200 of the device to be cooled. The cold plate body 110 can be located on the side of the circuit board 200 where the heating element 210 is provided. The extended substrate 120 can be arranged on the heat dissipation surface of the cold plate body 110. The heat dissipation surface may refer to the surface of the cold plate body 110 facing the heating element 210.

[0060] Among them, the extended substrate 120 and the cold plate body 110 are of a split structure. The position where the extended substrate 120 is arranged on the heat dissipation surface of the cold plate body 110 can be determined according to the position of the heating element 210 on the circuit board 200 of the device to be cooled. The extended substrate 120 can be used to be in contact connection with the heating element 210 to dissipate heat from the heating element 210.

[0061] It should be noted that the fact that the extended substrate 120 and the cold plate body 110 are of a split structure means that the extended substrate 120 and the cold plate body 110 are not formed by an integral molding method, nor are they formed by secondary processing on the cold plate body 110 to form the extended substrate 120 on the cold plate body. In other words, the extended substrate 120 and the cold plate body 110 are two independent parts, and the extended substrate 120 needs to be installed on the cold plate body 110 by means of snap connection, screw connection, etc.

[0062] In some examples, a fixed connection may mean that the extension substrate 120 is not easily detachable from the cold plate body 110. For example, in the application scenario of the computing device 10, when the circuit board 200 needs to be replaced, a detachable connection manner may be adopted between the extension substrate 120 and the circuit board 200, so that when different circuit boards 200 are replaced, different extension substrates 120 can also be replaced, thereby enabling connection to the heat generating components 210 on different circuit boards 200 to be maintained.

[0063] Exemplarily, the detachable connection manner between the extension substrate 120 and the cold plate body 110 may mean that the extension substrate 120 and the cold plate body 110 are tightly connected by a locking member, or at least one of the extension substrate 120 and the cold plate body 110 may be provided with a engaging portion, and the extension substrate 120 and the cold plate body 110 can be connected through the engaging portion. The non-detachable connection manner between the extension substrate 120 and the cold plate body 110 may mean that the extension substrate 120 can be welded to the cold plate body 110, or the extension substrate 120 can be adhered to the cold plate body 110.

[0064] In the embodiments of the present application, by setting the extension substrate 120 and the cold plate body 110 as a split structure, the position of the extension substrate 120 on the cold plate body 110 can be flexibly set. Since the distribution positions of the heat generating components 210 on different types of circuit boards 200 are different, when dissipating heat from different types of circuit boards 200, the extension substrate 120 can be disposed at a position corresponding to the heat generating component 210, and then the heat generating component 210 can be fixed to the cold plate body 110, so that the extension substrate 120 can be kept corresponding to the heat generating component 210, thereby enabling the cold plate 100 to be compatible with more types of circuit boards 200, which is beneficial to improving the compatibility of the cold plate 100 and reducing production, processing, and maintenance costs. Moreover, since the extension substrate 120 and the cold plate body 110 are of a split structure, the cold plate body 110 does not need to be machined with a boss structure, which can save machining processes, reduce the machining difficulty of the cold plate body 110, and is beneficial to reducing machining costs.

[0065] Among them, the extension substrate 120 has good thermal conductivity. By connecting the heat generating component 210 and the cold plate body 110 through the extension substrate 120, the heat generated by the heat generating component 210 can be transferred to the cold plate body 110 through the extension substrate 120, and the heat of the heat generating component 210 can be exported through the circulating flow of the liquid cooling medium in the cold plate body 110.

[0066] In some examples, the thermal conductivity of the extended substrate 120 can be better than that of the cold plate body 110. Therefore, compared with the prior art in which the cold plate body 110 is provided with a boss structure for contact connection with the heating element 210, the cold plate body 110 and the boss structure in the prior art are of an integral structure and made of the same material. In the embodiment of the present application, the thermal conductivity of the extended substrate 120 can be set to be better than that of the cold plate body 110 to improve the heat conduction efficiency to the heating element 210.

[0067] In some examples, along the thickness direction X of the cold plate body 110, there is an installation gap between the cold plate body 110 and the circuit board 200. The heating element 210 is located in the installation gap. The extended substrate 120 has a certain thickness. The extended substrate 120 can protrude from the surface of the cold plate body 110 facing the heating element 210. Since the sizes of the heating elements 210 on different types of circuit boards 200 along the thickness direction X of the cold plate body 110 are different, multiple thickness specifications of the extended substrate 120 can be set so that when corresponding to heating elements 210 of different thicknesses, the extended substrate 120 can be kept in contact connection with the heating element 210, thereby enabling adaptation to more circuit boards 200.

[0068] It should be noted that after the cold plate body 110 and the circuit board 200 are fixedly connected in the computing device 10, the installation gap between the cold plate body 110 and the circuit board 200 remains unchanged. Therefore, when the thickness dimension of the heating element 210 is large, an extended substrate 120 with a smaller thickness specification can be selected. The extended substrate 120 with a smaller thickness specification can be correspondingly installed on the cold plate body 110 at a position corresponding to the heating element 210 with a larger thickness dimension. When the thickness dimension of the heating element 210 is small, an extended substrate 120 with a larger thickness specification can be selected. The extended substrate 120 with a larger thickness specification can be correspondingly installed on the cold plate body 110 at a position corresponding to the heating element 210 with a smaller thickness dimension.

[0069] In some examples, the surface of the extended substrate 120 facing the heating element 210 can be fitted together to transfer the heat generated by the heating element 210 to the extended substrate 120 and then to the cold plate body 110 through the extended substrate 120. Therefore, the larger the contact area between the extended substrate 120 and the heating element 210, the higher the heat dissipation efficiency of the heating element 210. The size of the extended substrate 120 can be greater than or equal to the size of the heating element 210 so that the heating element 210 and the extended substrate 120 can be fully contacted, thereby improving the heat dissipation efficiency. When the sizes of the heating elements 210 on different types of network cards are different, multiple area size specifications of the extended substrate 120 can be set to ensure that when fitting together with heating elements 210 of different sizes, a large contact area can be obtained.

[0070] In summary, since the extended substrate 120 and the cold plate body 110 are of a split structure, the position of the extended substrate 120 on the cold plate body 110 can be freely set according to requirements. Therefore, the cold plate 100 can be in various combined forms of the cold plate body 110 and the extended substrate 120. For example, the cold plate body 110 can be unified into one or more standard specifications. The cold plate body 110 can be configured with extended substrates 120 of various different thickness specifications, or the cold plate body 110 can be configured with extended substrates 120 of various different area size specifications. Different extended substrates 120 can be used to correspond to the heat-generating elements 210 on the circuit board 200, so that the cold plate 100 can be used to adapt to various different types of circuit boards 200.

[0071] In addition, the material of the extended substrate 120 in the embodiments of the present application can be designed according to the heat dissipation requirements. For example, the extended substrate 120 can be, but is not limited to, an aluminum heat dissipation substrate, a copper heat dissipation substrate, etc. The extended substrate 120 can be, but is not limited to, a vapor chamber (VC), a thermo electric cooler (TEC). Therefore, through different types of extended substrates 120, the diversified combination of the cold plate body 110 and the extended substrate 120 can also be realized, and the heat dissipation requirements of a wider range of circuit boards 200 can be met.

[0072] The extended substrate 120 can be a vapor chamber. The vapor chamber has a thermally conductive phase change material. In the normal temperature state, the thermally conductive phase change material can be in a solid state form. After the heat-generating element 210 generates heat, the solid thermally conductive phase change material on the vapor chamber attached to the heat-generating element 210 absorbs heat and can change into a liquid form, and then gradually vaporizes and dissipates outward to realize the heat dissipation treatment of the heat-generating element 210.

[0073] The extended substrate 120 can be a thermo electric cooler. The thermo electric cooler uses semiconductor materials to make thermoelectric elements. When the thermo electric cooler is powered on, heat absorption and heat release phenomena will occur at both ends of the semiconductor material respectively. One end of the thermo electric cooler in contact connection with the heat-generating element 210 can generate a heat absorption phenomenon, and one end of the thermo electric cooler connected to the cold plate body 110 can generate a heat release phenomenon, so as to realize the heat dissipation of the heat-generating element 210. Among them, the thermo electric cooler as the extended substrate 120 can also keep the heat-generating element 210 at a constant temperature, which is beneficial to maintaining the normal operation of the heat-generating element 210.

[0074] In some examples, the embodiments of the present application do not limit the structure of the cold plate body 110, and the cold plate body 110 can be set according to the heat dissipation requirements of the heating element 210. For example, when the heat dissipation requirement is low, a pipeline type heat dissipation cold plate can be used; when the heat dissipation requirement is high, a shovel tooth micro type heat dissipation cold plate can be used; when the heat dissipation requirement is medium, a pin fin type cold plate can be used.

[0075] Therefore, through the cold plate body 110 in the above-mentioned various structural forms, the extension substrates 120 in various structural forms, various thicknesses, various sizes, and the flexibility of the position where the extension substrate 120 is arranged on the cold plate body 110, the cold plate body 110 and the extension substrate 120 can be flexibly combined to form a diversified cold plate 100. Thus, the cold plate 100 can be used to dissipate heat from the heating elements 210 of different circuit boards 200, and further can be compatible with a variety of different types of circuit boards 200, which is beneficial to improving the compatibility and adaptability of the cold plate 100 and is beneficial to reducing the processing cost.

[0076] In some examples, the size of the surface of the extension substrate 120 facing the heating element 210 can be greater than or equal to the size of the heating element 210 facing the extension substrate 120. Therefore, when the heat generated by the heating element 210 is transferred to the extension substrate 120, a part of the heat can be transferred to the cold plate body 110 through the extension substrate 120 for heat dissipation through the flow of the liquid cooling medium in the cold plate body 110, and another part of the heat can be dissipated through the relatively large surface area of the extension substrate 120 itself.

[0077] Embodiment Two

[0078] The embodiments of the present application also provide a cold plate 100. The same features as those in Embodiment One will not be described in detail.

[0079] In some realizable ways, as shown in Figure 3 and Figure 4 the heating element 210 on the circuit board 200 can include a heating unit. For example, the first heating unit 211. Correspondingly, the extension substrate 120 can include the first substrate 121.

[0080] Specifically, if the heating element 210 includes the first heating unit 211, the extension substrate 120 can include the first substrate 121 for fitting with the first heating unit 211. Among them, the first substrate 121 can be fixed to the cold plate body 100 by means of snap connection, bonding, screw connection, welding, etc. After the first substrate 121 is installed on the cold plate body 110, the first substrate 121 is relatively stationary with respect to the cold plate body 110.

[0081] Alternatively, the first substrate 121 can also be elastically connected to the cold plate body 100 through an elastic structure. The distance between the first substrate 121 and the cold plate body 110 is adjustable to adapt to different types of first heating units 211.

[0082] In some other realizable ways, referring to Figure 2 and Figure 5 as shown, the extended substrate 120 can include a first substrate 121 and a second substrate 122. At least one of the first substrate 121 and the second substrate 122 is elastically connected to the cold plate body 100. Among them, the heating element 210 includes a first heating unit 211 and a second heating unit 212, and the first substrate 121 and the second substrate 122 are respectively attached to the first heating unit 211 and the second heating unit 212.

[0083] Among them, the first substrate 121 and the second substrate 122 can be fixed to the cold plate body 110 by means of snap connection, bonding, screw connection, welding, etc., or can be elastically connected to the cold plate body 110 through an elastic structure. Alternatively, one of the first substrate 121 and the second substrate 122 is fixed to the cold plate body 110, and the other is elastically connected to the cold plate body 110, which is not specifically limited in the embodiments of the present application.

[0084] Exemplarily, the first substrate 121 can be fixedly connected to the cold plate body 110, and the first substrate 121 is connected to the first heating unit 211. The second substrate 122 can be elastically connected to the cold plate body 110, and the second substrate 122 is connected to the second heating unit 212. Along the thickness direction X of the cold plate body 110, the distance between the surface of the first substrate 121 facing the first heating unit 211 and the cold plate body 110 is fixed. Therefore, during the installation process of the cold plate 100 and the circuit board 200, the first substrate 121 can be first set to be attached to the first heating unit 211, and then the second substrate 122 that can float relative to the cold plate body 110 can be set, so as to improve the compatibility of the cold plate 100 through the combination of the second substrate 122 and the first substrate 121.

[0085] It should be noted that the number of the first substrates 121 and the number of the second substrates 122 are not limited in the embodiments of the present application, and the number of the first substrates 121 and the number of the second substrates 122 can be set according to the structure of the heating element 210 and the heat dissipation requirements.

[0086] Embodiment III

[0087] In some realizable ways, referring to Figure 5As shown, the cold plate 100 may include an elastic connecting member 130. A part of the elastic connecting member 130 is connected to the cold plate main body 110, and another part of the elastic connecting member 130 may also be connected to the extension substrate 120. Therefore, the elastic connecting member 130 can elastically connect the extension substrate 120 to the cold plate main body 110.

[0088] It should be noted that when the extension substrate 120 includes a first substrate 121 and a second substrate 122 or even more substrates, both the first substrate 121 and the second substrate 122 can be elastically connected to the cold plate main body 110 through the elastic connecting member 130.

[0089] In the embodiment of the present application, taking the first substrate 121 as an example, the tolerance existing in the first heating unit 211 itself and the installation tolerance between the circuit board 200 and the cold plate 100 are likely to cause a gap between the first substrate 121 and the first heating unit 211, so that the first heating unit 211 cannot transfer its own heat to the first substrate 121, resulting in the failure of the first substrate 121 and affecting the heat dissipation efficiency of the first heating unit 211. Therefore, by elastically connecting the first substrate 121 to the cold plate main body 110, the first substrate 121 can float a certain distance relative to the cold plate main body 110. The distance that the first substrate 121 floats relative to the cold plate main body 110 can be used to compensate the above tolerances, so that the first substrate 121 and the first heating unit 211 can maintain a connected state, which is beneficial to improving the connection reliability between the first substrate 121 and the first heating unit 211, and thus can improve the heat dissipation reliability of the first heating unit 211.

[0090] In addition, when the circuit board 200 needs to be replaced, since the distance between the first substrate 121 and the heat dissipation surface of the cold plate main body 110 is adjustable, the first substrate 121 and the corresponding heating unit can still maintain a connected state.

[0091] In addition, due to the elastic connection between the extension substrate 120 and the cold plate main body 110, the extension substrate 120 can also have an elastic force relative to the heating element 210. Taking the first substrate 121 as an example, when the first heating unit 211 needs to be maintained, the first heating unit 211 can more easily overcome the friction force between the surfaces in contact with the first substrate 121 to pull out the first heating unit 211 from the side of the circuit board 200, which is beneficial to reducing the possibility that the first heating unit 211 is difficult to pull out due to the fixed connection between the first heating unit 211 and the first substrate 121, beneficial to reducing the maintenance difficulty and improving the maintenance efficiency.

[0092] In some implementable ways, refer to Figure 5As shown, the elastic connector 130 may include a guide post 131 and an elastic body 132. The guide post 131 includes a first end and a second end. The first end of the guide post 131 may pass through the extended substrate and be connected to the cold plate body 110. The elastic body 132 may be sleeved on the guide post 131. One end of the elastic body 132 abuts against the second end of the guide post 131, and the other end of the elastic body 132 may abut against the extended substrate 120. The elastic connector 130 may generate a compressive deformation to adjust the distance between the extended substrate 120 and the cold plate body 110.

[0093] In the embodiment of the present application, the guide post 131 may guide the elastic body 132 so that the elastic body 132 can move along the thickness direction X of the cold plate body 110. The elastic body 132 may generate a compressive deformation. By the compressive deformation of the elastic body 132, the distance between the extended substrate 120 and the cold plate body 110 can be adjusted. By adjusting this distance, it can be used to compensate for the tolerance of the heating element 210 itself or the installation tolerance between the cold plate 100 and the circuit board 200, so as to keep the extended substrate 120 and the heating element 210 in close contact with each other. Therefore, compared with the indirect contact connection between the extended substrate 120 and the heating element 210 through other heat conduction structures, it can have a better heat transfer effect and is beneficial to improving the heat dissipation efficiency.

[0094] Specifically, during the installation process of the cold plate 100 and the circuit board 200, the cold plate 100 and the circuit board 200 approach each other. When the extended substrate 120 is in contact with the heating element 210, the elastic body 132 generates a compressive deformation. Correspondingly, the elastic connector 130 has a relative abutting force with the extended substrate 120 under the elastic action. Thus, when the cold plate 100 and the circuit board 200 are fixedly connected, the elastic connector 130 can keep the extended substrate 120 and the heating element 210 in an abutting state, and further can keep the extended substrate 120 and the heating element 210 in close contact.

[0095] In some examples, along the thickness direction X of the cold plate body 110, the second end of the guide post 131 may protrude from the surface of the extended substrate 120 facing the heating element 210, or the second end of the guide post 131 may also be located within the extended substrate 120, which is not limited in the embodiment of the present application.

[0096] Exemplarily, the elastic connector 130 may be but is not limited to a spring screw.

[0097] In some examples, referring to Figure 5 and Figure 6 As shown, the number of the elastic connectors 130 may be multiple. The multiple elastic connectors 130 may be evenly corresponding to the extended substrate 120. For example, when the area of the heating element 210 is large, the size of the extended substrate 120 is also large, and the number of the elastic connectors 130 can be set relatively large.

[0098] Example 4

[0099] In some realizable ways, as shown in Figure 5 Figure, a heat-conducting medium layer 140 may be filled between the extended substrate 120 and the cold plate body 110.

[0100] In the embodiment of the present application, when the extended substrate 120 can float a certain distance relative to the cold plate body 110, a gap is likely to be generated between the extended substrate 120 and the cold plate body 110, thus affecting the heat transfer from the extended substrate 120 to the cold plate body 110. Therefore, a heat-conducting medium layer 140 may be filled between the extended substrate 120 and the cold plate body 110 to transfer heat to the cold plate body 110 through the heat-conducting medium layer 140.

[0101] In some examples, the heat-conducting medium layer 140 may be, but is not limited to, heat-conducting silicone grease.

[0102] In some realizable ways, as shown in Figure 7 Figure, when the extended substrate 120 is fixed relative to the cold plate body 110, a heat-conducting medium layer 140 may be filled between the extended substrate 120 and the heating element 210.

[0103] In the embodiment of the present application, since the extended substrate 120 is fixed relative to the cold plate body 110, after the cold plate 100 and the circuit board 200 are installed, if there is a gap between the extended substrate 120 and the heating element 210, the extended substrate 120 and the heating element 210 can be connected through the heat-conducting medium layer 140, so that the heat of the heating element 210 can be transferred to the extended substrate 120 through the heat-conducting medium layer 140 and then transferred from the extended substrate 120 to the cold plate body 110.

[0104] Example 5

[0105] In some realizable ways, the cold plate 100 further includes at least one fixing structure 150 for the extended substrate 120 to be installed on the cold plate body 110. The fixing structure 150 is detachably connected to the cold plate body 110.

[0106] In the embodiments of the present application, according to several general specifications of the circuit board 200, a plurality of preset installation spaces may be provided on the heat dissipation surface of the cold plate main body 110 to be compatible with circuit boards 200 of different specifications. The preset installation spaces are used to install the extension substrate 120. The number of the fixing structures 150 may be multiple, and the multiple fixing structures 150 may be respectively fixed to each preset installation space. When the cold plate 100 is used to dissipate heat for a certain circuit board 200, a target installation space corresponding to the position of the heating element 210 of the circuit board is determined among the multiple preset installation spaces, and the extension substrate is quickly installed in the target installation space through the fixing structure 150 of the target installation space. Thus, the cold plate 100 can be compatible with a variety of circuit boards 200 of different specifications, and can realize the quick assembly of the extension substrate 120 and the cold plate main body 110 based on the corresponding circuit board 200.

[0107] In some realizable ways, referring to Figure 8 As shown, the fixing structure 150 may include a fixing post 151 and a compaction part 152. One end of the fixing post 151 is rotatably connected to the heat dissipation surface of the cold plate main body 110, and the other end of the fixing post 151 is provided with the compaction part 152. The compaction part 152 may be located on the side of the extension substrate 120 facing away from the cold plate main body 110, and the fixing post 151 rotates to adjust the distance between the compaction part 152 and the cold plate main body 110 for pressing the extension substrate 120 against the cold plate main body 110.

[0108] Among them, the number of the fixing structures 150 is not limited in this embodiment.

[0109] The embodiments of the present application may further provide a computing device 10. The computing device 10 may include the cold plate 100 in any of the above embodiments. The computing device 10 may include a circuit board 200. The circuit board 200 is connected to the cold plate 100, and the extension substrate 120 on the cold plate 100 may be used to connect to the heating element 210 on the circuit board 200.

[0110] In some examples, the computing device 10 may include a housing. The circuit board 200 may be fixed to the housing. The cold plate 100 and the circuit board 200 may be connected by a locking member.

[0111] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it may be a fixed connection, or an indirect connection through an intermediate medium, or the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application may be understood according to specific situations.

[0112] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than limiting them; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A cold plate (100), characterized in that, Comprising: A cold plate main body (110); An extended substrate (120), which is arranged on the heat dissipation surface of the cold plate main body (110); Wherein, the extended substrate (120) and the cold plate main body (110) are of a split structure, and the position of the extended substrate (120) arranged on the heat dissipation surface is determined according to the position of the heating element (210) on the circuit board (200) of the device to be cooled, and the extended substrate (120) is used to be attached to the heating element (210) to dissipate heat from the heating element (210).

2. The cold plate (100) according to claim 1, characterized in that, The cold plate (100) includes an elastic connecting member (130), a part of the elastic connecting member (130) is connected to the cold plate main body (110), and another part of the elastic connecting member (130) is connected to the extended substrate (120) so that the extended substrate (120) is elastically connected to the cold plate main body (110).

3. The cold plate (100) according to claim 2, characterized in that, The elastic connecting member (130) includes a guide post (131) and an elastic body (132); The guide post (131) includes a first end and a second end. The first end of the guide post (131) can penetrate through the extended substrate (120) and is connected to the cold plate main body (110); The elastic body (132) is sleeved on the guide post (131). One end of the elastic body (132) abuts against the second end of the guide post (131), and the other end of the elastic body (132) abuts against the extended substrate (120). The elastic connecting member (130) can produce compressive deformation to adjust the distance between the extended substrate (120) and the cold plate main body (110).

4. The cold plate (100) according to any one of claims 1 to 3, characterized in that, A heat-conducting medium layer (140) is filled between the extended substrate (120) and the cold plate main body (110).

5. The cold plate (100) according to claim 1, characterized in that, The extended substrate (120) includes a first substrate (121) and a second substrate (122), and at least one of the first substrate (121) and the second substrate (122) is elastically connected to the cold plate main body (110); Wherein, the heating element (210) includes a first heating unit (211) and a second heating unit (212), and the first substrate (121) and the second substrate (122) are respectively attached to the first heating unit (211) and the second heating unit (212).

6. The cold plate (100) according to any one of claims 1 to 3, characterized in that, The extended substrate (120) is an aluminum heat dissipation substrate; or, the extended substrate (120) is a copper heat dissipation substrate; or, the extended substrate (120) is a vacuum chamber heat pipe; or, the extended substrate (120) is a semiconductor refrigeration substrate.

7. The cold plate (100) according to any one of claims 1 to 3, characterized in that, The cold plate main body (110) is a pipeline type heat dissipation cold plate; or, the cold plate main body (110) is a shovel tooth type heat dissipation cold plate; or, the cold plate main body (110) is a pin fin type heat dissipation cold plate.

8. The cold plate (100) according to any one of claims 1 to 3, characterized in that, The cold plate (100) further includes at least one fixing structure (150) for the extended substrate (120) to be installed on the cold plate main body (110), and the fixing structure (150) is detachably connected to the cold plate main body (110).

9. The cold plate (100) according to claim 8, characterized in that, The fixing structure (150) includes a fixing post (151) and a compaction part (152). One end of the fixing post (151) is rotatably connected to the heat dissipation surface of the cold plate body (110), and the other end of the fixing post (151) is provided with the compaction part (152). The compaction part (152) is located on the side of the extended substrate (120) facing away from the cold plate body. The fixing post (151) rotates to adjust the distance between the compaction part (152) and the cold plate body (110) so as to press the extended substrate (120) against the cold plate body (110).

10. A computing device (10), characterized in that, Comprising: A circuit board (200) having a heating element (210); The cold plate (100) according to any one of claims 1 to 9, wherein the extended substrate (120) of the cold plate (100) is arranged corresponding to the heating element (210) and is in contact connection with the heating element (210).

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