Power device heat dissipation structure of compact variable frequency controller

Abstract

The utility model discloses a power device heat radiation structure of a compact frequency conversion controller, which comprises a heat radiation fin and a printed circuit board which are oppositely arranged, a power type device is arranged between the heat radiation fin and the printed circuit board, the power type device is electrically connected with the printed circuit board, an insulating spacer is arranged between the power type device and the heat radiation fin in a fitting manner, and the insulating spacer is electrically connected with the printed circuit board. A sinking table structure far away from the power type device is arranged at the position, corresponding to the power type device, of the cooling fin, the two ends of the insulation spacer are in lap joint with the upper side and the lower side of the sinking table structure, and a sinking table cavity used for improving the heat dissipation and insulation performance is defined by the insulation spacer and the sinking table structure; through the optimized and improved design of the product, the sinking platform structure is additionally arranged and the plastic nut is cushioned, so that the safety insulation performance and the heat dissipation performance of the variable-frequency controller are further optimized and improved, and the high-precision requirement on a traditional screw preformed hole is replaced; therefore, the technical effects of improving the performance and reducing the process requirement and the production cost are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of variable frequency controllers, and more specifically, to a heat dissipation structure for power devices of a compact variable frequency controller. Background Art

[0002] Variable frequency controllers have been widely used in the household appliance industry due to their advantages such as high energy efficiency, precise temperature control, low noise, strong compatibility, and effectively improving the reliability of household refrigeration products, especially in the commercial industry where the demand is increasing.

[0003] However, the power density level used in commercial products is far above that of the household appliance industry. Therefore, it is required that our variable frequency control board meets the requirements of high power density in design, and at the same time, it also needs to meet the heat dissipation problem of power devices and the problem of safety insulation. Only by truly solving these two problems can the high reliability performance of variable frequency products be achieved.

[0004] In the prior art, typical commercial high-power variable frequency controllers mostly use the method of fixing the power devices on the controller with heat sinks and screws, and an insulating gasket is additionally installed between the heat sink and the power device to handle the safety insulation between the power device and the heat sink (as Figure 4 shown).

[0005] In the detailed prior art, an insulating gasket is additionally installed between the power device and the heat sink and fixed together with screws. The screw first passes through the reserved screw hole on the printed circuit board (PCB), then through the reserved screw hole on the power device, then through the reserved screw hole on the insulating gasket, and finally through the reserved screw hole on the heat sink of the prior art, and all the above components are fixed by screw installation.

[0006] In the more detailed prior art, the reserved screw hole and the screw adopt a clearance fit to ensure that the screw can be easily screwed in for installation and fixation, and at the same time, a certain degree of flexibility is retained. The cross-section of the reserved screw hole on the heat sink of the prior art is (as Figure 3 shown).

[0007] The points to be improved in the prior art are as follows:

[0008] With the continuous upgrading of the usage scenarios in the terminal market, the usage requirements for our commercial high-power variable frequency controllers are also constantly upgrading. As the power density of the variable frequency controller continues to increase, the first thing is to increase the specification model of the power device on the PCB to meet the increasingly stringent terminal usage scenarios. However, with the improvement of the power device specification, it will also bring the negative impact of the increase in the temperature of the power device. If the variable frequency controller cannot solve the heat dissipation problem, this will directly affect the stability and service life of the variable frequency controller. Therefore, it is also extremely urgent to improve the heat generation problem of the power device;

[0009] Meanwhile, with the increasing emphasis on safety requirements and safety standards in the terminal market, the first thing to do is to widen the thickness of the insulating gasket or improve the quality of the insulating gasket. However, such a treatment method will directly lead to an increase in material costs. For manufacturing enterprises, this is not the optimal solution;

[0010] In addition, in the prior art, the dimensions of components such as screw holes reserved on printed circuit boards (PCBs), screw holes reserved on power devices, screw holes reserved on insulating gaskets, and screw holes reserved on heat sinks need to be matched with high precision. If the production accuracy error of the manufacturer is too large, the insulation distance between the components and the heat sink will be reduced, which is likely to lead to a decrease in insulation performance and affect the safety test results of the terminal market. Summary of the Invention

[0011] In view of the above technical problems in the related art, the present invention provides a heat dissipation structure for power devices of a compact frequency converter controller, which can overcome the above-mentioned deficiencies of the prior art.

[0012] To achieve the above technical purpose, the technical solution of the present invention is realized as follows:

[0013] A heat dissipation structure for power devices of a compact frequency converter controller;

[0014] The heat dissipation structure for power devices of the compact frequency converter controller includes a heat sink and a printed circuit board arranged opposite to each other. A power device is provided between the heat sink and the printed circuit board. The power device is electrically connected to the printed circuit board. An insulating gasket is disposed in a fitting manner between the power device and the heat sink. A counterbore structure away from the power device is provided at a position corresponding to the power device on the heat sink. Both ends of the insulating gasket are lapped on the upper and lower sides of the counterbore structure. A counterbore chamber for improving heat dissipation and insulation performance is formed by enclosing the insulating gasket and the counterbore structure.

[0015] Further, the counterbore structure on the heat sink is made by a stamping process.

[0016] Further, universal screw holes are provided at corresponding positions of the heat sink, the insulating gasket, and the power device. The heat sink, the insulating gasket, and the power device are fixedly connected by screws passing through the universal screw holes.

[0017] Further, the universal screw holes are of a universal size.

[0018] Further, a plastic nut for further improving insulation performance is provided in the counterbore chamber formed by enclosing the insulating gasket and the counterbore structure.

[0019] Further, the cross-sectional view of the sunken chamber formed by enclosing between the insulating gasket and the sunken structure is an isosceles trapezoid.

[0020] Beneficial effects of the present utility model: Through the optimized and improved design of the product of the present utility model, a sunken structure is added and a plastic nut is padded, so that the safety insulation performance and heat dissipation performance of the variable frequency controller are further optimized and improved, and the high-precision requirement for the traditional screw reserved hole is replaced, thereby achieving the technical effects of improving performance, reducing process requirements and production costs. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 is the overall structural schematic diagram of the power device heat dissipation structure of a compact variable frequency controller according to an embodiment of the present utility model;

[0023] Figure 2 is the partial side view of the power device heat dissipation structure of a compact variable frequency controller according to an embodiment of the present utility model;

[0024] Figure 3 is the overall structural schematic diagram of the power device heat dissipation structure of the traditional variable frequency controller according to an embodiment of the present utility model;

[0025] Figure 4 is the partial side view of the power device heat dissipation structure of the traditional variable frequency controller according to an embodiment of the present utility model;

[0026] In the figure: 1. Heat sink; 2. Insulating gasket; 3. Power device; 4. Printed circuit board; 5. Sunken structure; 6. Screw; 7. Plastic nut; 8. High-precision screw reserved hole; 9. General screw hole. Detailed Embodiments

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model with reference to the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present utility model.

[0028] It should be understood that in the description of the embodiments of the present utility model, the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the embodiments of the present utility model. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the embodiments of the present utility model, the meaning of "several" is two or more, unless otherwise specifically defined.

[0029] As Figure 1-2 shown, a power device heat dissipation structure of a compact frequency conversion controller according to an embodiment of the present utility model includes heat sinks 1 and a printed circuit board 4 arranged opposite to each other. A power device 3 is provided between the heat sink 1 and the printed circuit board 4. The power device 3 is electrically connected to the printed circuit board 4. An insulating gasket 2 is disposed in a fitting manner between the power device 3 and the heat sink 1. A counterbore structure 5 away from the power device 3 is provided at a position corresponding to the power device 3 on the heat sink 1. Both ends of the insulating gasket 2 are lapped on the upper and lower sides of the counterbore structure 5. A counterbore chamber for improving heat dissipation and insulation performance is formed by enclosing the insulating gasket 2 and the counterbore structure 5.

[0030] In a specific embodiment of a power device heat dissipation structure of a compact frequency conversion controller according to an embodiment of the present utility model, the counterbore structure 5 on the heat sink 1 is made by stamping process.

[0031] In a specific embodiment of a power device heat dissipation structure of a compact frequency conversion controller according to an embodiment of the present utility model, universal screw holes 9 are provided at corresponding positions of the heat sink 1, the insulating gasket 2, and the power device 3. The heat sink 1, the insulating gasket 2, and the power device 3 are fixedly connected by screws 6 passing through the universal screw holes 9.

[0032] In a specific embodiment of a power device heat dissipation structure of a compact frequency conversion controller according to an embodiment of the present utility model, the universal screw holes 9 are of universal size.

[0033] A heat dissipation structure for power devices of a compact variable frequency controller according to an embodiment of the present invention. In a specific embodiment, a plastic nut 7 for further improving the insulation performance is provided in the sunken chamber formed by enclosing between the insulating gasket 2 and the sunken structure 5.

[0034] A heat dissipation structure for power devices of a compact variable frequency controller according to an embodiment of the present invention. In a specific embodiment, the cross-sectional view of the sunken chamber formed by enclosing between the insulating gasket 2 and the sunken structure 5 is an isosceles trapezoid.

[0035] To facilitate the understanding of the above technical solutions of the present invention, the above technical solutions of the present invention will be described in detail below in terms of specific usage methods.

[0036] In specific use, for a heat dissipation structure for power devices of a compact variable frequency controller according to the present invention, on the basis of the existing heat sink 1, a stamping process with high efficiency, low cost and wide applicability is selected for processing. A sunken structure 5 is stamped on the existing heat sink 1, and other components remain unchanged as a whole (as Figure 2 shown).

[0037] In a more detailed technical solution of the present invention, after the heat sink 1 is processed by the stamping process, the gap between the insulating gasket 2 and the heat sink 1 is significantly increased compared with the traditional way of fitting and stacking. The increase in the gap between the insulating gasket 2 and the heat sink 1 will no longer require the setting of high-precision screw reserved holes 8 on the insulating gasket 2, that is: the high-precision requirement for the screw reserved holes of the insulating gasket 2 is no longer a necessary condition, and the insulation performance can be achieved simultaneously by replacing the traditional high-precision screw reserved holes 8 with the general screw holes 9;

[0038] During use, after the heat sink 1 is processed by the stamping process, on the basis of the existing design scheme, the contact area between the heat sink 1 and the air is increased. According to the thermal resistance formula θ = the thickness L of the heat sink material / (thermal conductivity λ * air contact area S), it can be known that the thermal resistance is reduced, thereby improving the temperature rise effect of the power devices 3 on the printed circuit board 4, and effectively ensuring the stability and reliability of the power devices 3 on the printed circuit board 4 under high-temperature and high-load working conditions by improving the heat dissipation efficiency;

[0039] In a more optimal technical solution of the present invention, a plastic nut 7 can also be installed between the insulating gasket 2 and the heat sink 1 according to the actual use situation to further enhance the insulation performance, so as to meet the interests and attention of the end market to the safety standard requirements.

[0040] As Figure 1 shown, the plastic nut 7 adopts a general size according to the size of the sunken structure 5 on the heat sink 1, with a compact structure and small occupied space.

[0041] Based on the problem points feedback from the previous market, the technical solution of the present utility model optimizes and improves the existing technical solution, and proposes a heat dissipation structure for power devices of a compact frequency conversion controller. This technical solution improves the safety and insulation performance of the frequency conversion controller in the existing technology from 1500V to 3000V, and the heat dissipation performance is improved by about 10%. It can meet the requirement that the power density of the frequency conversion controller rises to about 1500W. Finally, the high-precision requirement that the screw holes on the power device 3, the insulating gasket 2, and the heat sink 1 on the printed circuit board 4 in the existing technology must be set as high-precision screw reserved holes 8 is cancelled, and the general screw holes 9 are used in cooperation with the counterbore structure 5 to achieve the insulation performance requirements. The technical solution of the present utility model can reduce the material cost, installation cost, special installation process cost of components, etc.; on the premise of maintaining the same insulation performance, the process requirements and production costs are effectively reduced.

[0042] In summary, by means of the above technical solution of the present utility model, through the optimization and improvement design of the product of the present utility model, the counterbore structure is added and the plastic nut is padded, so that the safety and insulation performance and heat dissipation performance of the frequency conversion controller are further optimized and improved, and the high-precision requirement for the traditional screw reserved hole is replaced, thereby achieving the technical effects of improving performance, reducing process requirements and production costs.

[0043] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A heat dissipation structure for power devices of a compact frequency conversion controller, characterized in that, It includes a relatively arranged heat sink (1) and a printed circuit board (4). A power device (3) is provided between the heat sink (1) and the printed circuit board (4). The power device (3) is electrically connected to the printed circuit board (4). An insulating gasket (2) is disposed in a fitting manner between the power device (3) and the heat sink (1). A counterbore structure (5) away from the power device (3) is provided at a position corresponding to the power device (3) on the heat sink (1). Both ends of the insulating gasket (2) are lapped on the upper and lower sides of the counterbore structure (5). A counterbore chamber for improving heat dissipation and insulation performance is formed by enclosing the insulating gasket (2) and the counterbore structure (5).

2. The heat dissipation structure of the power device of a compact frequency conversion controller according to claim 1, characterized in that The counterbore structure (5) on the heat sink (1) is made by stamping process.

3. The heat dissipation structure of the power device of a compact frequency conversion controller according to claim 1, characterized in that, Universal screw holes (9) are provided at corresponding positions of the heat sink (1), the insulating gasket (2), and the power device (3). The heat sink (1), the insulating gasket (2), and the power device (3) are fixedly connected by screws (6) passing through the universal screw holes (9).

4. The heat dissipation structure of the power device of a compact frequency conversion controller according to claim 3, characterized in that, The universal screw holes (9) are of universal size.

5. The heat dissipation structure of the power device of a compact variable frequency controller according to claim 1, characterized in that, A plastic nut (7) for further improving insulation performance is provided in the counterbore chamber formed by enclosing the insulating gasket (2) and the counterbore structure (5).

6. The heat dissipation structure of the power device of a compact variable frequency controller according to any one of claims 1-5, characterized in that The cross-sectional view of the counterbore chamber formed by enclosing the insulating gasket (2) and the counterbore structure (5) is an isosceles trapezoid on its side.

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