Novel LED packaging structure

Abstract

The utility model discloses a novel LED packaging structure, which comprises a substrate, a frame, a first fluorescent glue layer and a second fluorescent glue layer, and is characterized in that the substrate is provided with an LED wafer; the frame is connected with the substrate to form a bowl cup with the substrate, and the LED wafer is located in the bowl cup; the first fluorescent glue layer is formed in the bowl cup through a centrifugal precipitation process, and the first fluorescent glue layer covers the LED wafer; the second fluorescent glue layer is located in the bowl cup, and the second fluorescent glue layer is formed on the first fluorescent glue layer through a dispensing packaging process. The LED packaging structure is novel in structure, and the fluorescent glue layers in two different states are arranged in the LED lamp bead bowl cup, so that secondary excitation and utilization of blue light of the LED wafer are achieved. The LED packaging structure finished product is high in brightness, the usage amount of fluorescent powder is greatly reduced, and the material cost is saved.

Description

Technical Field

[0001] The utility model relates to the technical field of LED packaging, and particularly relates to a novel LED packaging structure. Background Art

[0002] As a new type of solid semiconductor device, LED has been widely used in various industries due to its advantages of small size, light weight, high luminous efficiency, energy conservation and environmental protection. With the rapid development of the white LED industry, people have put forward higher requirements for the performance of white LED products.

[0003] At present, the common production processes in white LED packaging are the traditional dispensing packaging process and the centrifugal precipitation process. The traditional dispensing packaging process is to apply the phosphor mixed colloid to the LED wafer at a fixed point and in a fixed quantity through a dispenser. Since there is a propagation loss process when the blue light emitted by the LED wafer excites the phosphor in the phosphor mixed colloid, this leads to a relatively low brightness of the finished product in the traditional dispensing packaging process. The centrifugal precipitation process is to quickly classify and precipitate the phosphor in the phosphor mixed colloid after dispensing by the dispenser around the LED wafer by using centrifugal force, so that the blue light emitted by the LED wafer can directly excite the phosphor, thereby achieving the effect of improving the LED luminous performance. Since the phosphor in the mixed colloid precipitates around the LED wafer, a layering phenomenon occurs between the phosphor and the encapsulation glue. The remaining blue light after the LED wafer excites the phosphor cannot be reused, and the thickness of the phosphor in the mixed colloid decreases. Therefore, to obtain a product with corresponding parameters, it is necessary to increase the thickness of the phosphor around the LED wafer, resulting in the proportion of the phosphor in the encapsulation glue being about 1.1 - 1.3 times higher than that in the traditional dispensing packaging process, increasing the material cost. In addition, the dispenser applies the phosphor mixed colloid to the LED wafer through a small-diameter needle. Therefore, when the proportion of the phosphor and the encapsulation glue is relatively large (for example, ≥1.4:1) in a product with a high proportion of high-concentration phosphor, it will lead to a decrease in the fluidity and adhesiveness of the mixed colloid, affecting the operability of the dispensing operation, and easily causing abnormal alarms such as uneven glue dispensing and frequent needle clogging. Summary of the Utility Model

[0004] The technical problem solved by the utility model is to provide a novel LED packaging structure with high brightness of the finished product and less phosphor usage.

[0005] To solve the above technical problem, the technical scheme adopted by the utility model is as follows: A novel LED packaging structure, comprising:

[0006] A substrate, on which an LED wafer is provided;

[0007] A frame, which is connected to the substrate to form a bowl cup with the substrate, and the LED wafer is located in the bowl cup;

[0008] A first fluorescent glue layer, which is formed in the bowl cup by a centrifugal precipitation process, and the first fluorescent glue layer covers the LED wafer;

[0009] A second fluorescent glue layer, which is located in the bowl cup, and the second fluorescent glue layer is formed on the first fluorescent glue layer by a dispensing encapsulation process.

[0010] In one embodiment, the type of phosphor in the first fluorescent glue layer is the same as the type of phosphor in the second fluorescent glue layer.

[0011] In one embodiment, the proportion of phosphor in the first fluorescent glue layer is the same as the proportion of phosphor in the second fluorescent glue layer.

[0012] In one embodiment, the total volume of the first fluorescent glue layer is less than or equal to the total volume of the second fluorescent glue layer.

[0013] In one embodiment, the top of the second fluorescent glue layer does not protrude above the top surface of the frame.

[0014] In one embodiment, the top surface of the second fluorescent glue layer is a concave arc surface.

[0015] The beneficial effects of the present utility model are as follows:

[0016] The structure of this LED packaging structure is novel. By arranging two fluorescent glue layers in different states in the bowl cup of the LED lamp bead, the secondary excitation and utilization of the blue light of the LED wafer are achieved.

[0017] Compared with the traditional dispensing-encapsulated LED packaging structure, the finished product of this LED packaging structure has a higher brightness; on the premise of the same finished product brightness, compared with the traditional dispensing-encapsulated LED packaging structure and the centrifugal precipitation LED packaging structure, the usage amount of phosphor in this LED packaging structure is greatly reduced, thus saving material costs. Moreover, since the proportion of phosphor in the encapsulating glue liquid can be greatly reduced, the fluidity and adhesiveness of the encapsulating glue liquid are improved, which is beneficial to improving the operability of the dispensing operation. Description of the Drawings

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.

[0019] Figure 1Cross-sectional view of the novel LED packaging structure according to the first embodiment of the present utility model.

[0020] Explanation of the reference numerals in the attached drawings:

[0021] 1. Bowl cup; 11. Substrate; 12. Frame;

[0022] 2. LED chip; 21. Gold wire bonding wire;

[0023] 3. First fluorescent glue layer;

[0024] 4. Second fluorescent glue layer; 41. Concave arc surface;

[0025] 5. Phosphor. Specific implementation manners

[0026] The realization of the object, functional features and advantages of the present utility model will be further described with reference to the embodiments and the attached drawings.

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described with reference to the attached drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0028] It should be noted that if there are directional indications such as up, down, left, right, front, back... in the embodiments of the present utility model, the directional indications are only used to explain the relative positional relationship and movement conditions between the components in a specific posture as shown in the attached drawings. If the specific posture changes, the directional indications will also change accordingly.

[0029] In addition, if there are descriptions such as "first", "second", etc. in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one such feature.

[0030] In addition, the meaning of "and / or" appearing throughout the text is that it includes three parallel solutions. Taking "and / or" as an example, it includes the solution, or the solution, or the solution that satisfies both simultaneously. In addition, the technical solutions between the embodiments can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the protection scope required by the present utility model.

[0031] In this application, unless otherwise clearly specified and defined, terms such as "installation", "connection", "linkage", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0032] Embodiment 1

[0033] Please refer to Figure 1 , Embodiment 1 of the present utility model is: a novel LED packaging structure, including a substrate 11, a frame 12, a first phosphor layer 3 and a second phosphor layer 4. An LED chip 2 is provided on the substrate 11. Optionally, the LED chip 2 is electrically connected to the substrate 11 through a gold wire bonding wire 21; the frame 12 is connected to the substrate 11 to form a bowl 1 with the substrate 11, and the LED chip 2 is located inside the bowl 1; the first phosphor layer 3 is formed in the bowl 1 by a centrifugal sedimentation process, and the first phosphor layer 3 covers the LED chip 2; the second phosphor layer 4 is located inside the bowl 1, and the second phosphor layer 4 is formed on the first phosphor layer 3 by a dispensing packaging process.

[0034] The type of phosphor 5 in the first phosphor layer 3 is the same as that of the phosphor 5 in the second phosphor layer 4, and the proportion of the phosphor 5 in the first phosphor layer 3 in the encapsulation glue solution forming the first phosphor layer 3 is the same as that of the phosphor 5 in the second phosphor layer 4 in the encapsulation glue solution forming the second phosphor layer 4. It can be easily seen from this that the encapsulation glue solution forming the first phosphor layer 3 and the encapsulation glue solution forming the second phosphor layer 4 are the same kind of encapsulation glue solution, except that the distribution states of the phosphor 5 in the first phosphor layer 3 and the phosphor 5 in the second phosphor layer 4 are different.

[0035] Optionally, the total volume of the first phosphor layer 3 is less than or equal to the total volume of the second phosphor layer 4.

[0036] The top surface of the second phosphor layer 4 does not protrude above the top surface of the frame 12. In this embodiment, the top surface of the second phosphor layer 4 is an inward concave arc surface 41. In other embodiments, the top surface of the second phosphor layer 4 and the top surface of the frame 12 can also be flush, or the top surface of the second phosphor layer 4 slightly protrudes relative to the top surface of the frame 12.

[0037] This embodiment also provides a method for manufacturing a novel LED packaging structure, including the following steps:

[0038] Obtain the encapsulation glue liquid mixed with the phosphor 5 and the cup 1 carrying the LED chip 2. The cup 1 includes a substrate 11 and a frame 12 provided on the substrate 11. The LED chip 2 is provided on the substrate 11 and located within the frame 12;

[0039] Use a dispensing machine to apply a part of the encapsulation glue liquid onto the LED chip 2 to obtain a semi-finished product;

[0040] Use a centrifuge to perform centrifugation on the semi-finished product, so that the phosphor 5 in the encapsulation glue liquid in the cup 1 quickly undergoes fractional precipitation around the LED chip 2;

[0041] Perform a first curing on the encapsulation glue liquid in the cup 1, such as high-temperature curing, so that the encapsulation glue liquid in the cup 1 forms a first fluorescent glue layer 3;

[0042] Use a dispensing machine to apply another part of the encapsulation glue liquid onto the first fluorescent glue layer 3;

[0043] Perform a second curing on the encapsulation glue liquid in the cup 1, such as high-temperature curing, so that the encapsulation glue liquid forms a second fluorescent glue layer 4 on the first fluorescent glue layer 3.

[0044] The total volume of the first fluorescent glue layer 3 is less than or equal to the total volume of the second fluorescent glue layer 4. The total volumes of the first fluorescent glue layer 3 and the second fluorescent glue layer 4 can both be controlled by the amount of the encapsulation glue liquid injected into the cup 1.

[0045] The above is only an optional embodiment of the present invention, and does not limit the patent scope of the present invention accordingly. All equivalent structural transformations made under the inventive concept of the present invention by using the content of the specification and drawings of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A novel LED packaging structure, characterized in that: including a substrate, on which an LED chip is provided; a frame, which is connected to the substrate to form a bowl cup with the substrate, and the LED chip is located in the bowl cup; a first fluorescent glue layer, which is formed in the bowl cup by a centrifugal precipitation process, and the first fluorescent glue layer covers the LED chip; a second fluorescent glue layer, which is located in the bowl cup and is formed on the first fluorescent glue layer by a dispensing encapsulation process.

2. The novel LED packaging structure according to claim 1, wherein: The type of phosphor in the first fluorescent glue layer is the same as that in the second fluorescent glue layer.

3. The novel LED packaging structure according to claim 2, wherein: The proportion of phosphor in the first fluorescent glue layer is the same as that in the second fluorescent glue layer.

4. The novel LED packaging structure according to claim 1, wherein: The total volume of the first fluorescent glue layer is less than or equal to the total volume of the second fluorescent glue layer.

5. The novel LED packaging structure according to claim 1, wherein: The top of the second fluorescent glue layer is not protruded above the top surface of the frame.

6. The novel LED packaging structure according to claim 1, wherein: The top surface of the second fluorescent glue layer is an inward concave arc surface.

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