Silicon wafer cutting sewage recovery device

Abstract

The utility model discloses a silicon wafer cutting sewage recovery device which comprises a working table, a through opening is formed in the top of the working table in a penetrating mode, a containing plate is fixedly installed on the inner wall of the through opening, a silicon wafer body is in lap joint with the top of the containing plate, a clamping assembly is arranged at the top of the containing plate, and a lifting assembly is arranged at the top of the working table. A blocking cover is arranged at the top of the workbench through a lifting assembly, a hydraulic push rod is fixedly installed in the blocking cover, a cutting assembly is arranged at the output end of the hydraulic push rod, a water tank is fixedly installed at the top of the workbench, a conveying assembly is arranged in the water tank, and a spray head is arranged at the top of the water tank through the conveying assembly. And the spray head is fixedly connected with the blocking cover, a collecting box is fixedly installed at the bottom of the workbench, and a sealing assembly is arranged on the front side of the collecting box. And the sprayed and splashed cutting fluid can be conveniently blocked, so that the cutting fluid can be better recycled, and the waste of the cutting fluid can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of sewage recovery, in particular to a sewage recovery device for silicon wafer cutting. Background Art

[0002] A silicon wafer refers to an object with semiconductor properties made of high-purity monocrystalline silicon material, which is the basic material for microelectronic components such as integrated circuits and solar cells. Silicon wafers are divided into three categories: monocrystalline silicon, polycrystalline silicon, and amorphous silicon.

[0003] The existing patent (application number: CN202122115442.9) discloses a recycling and treatment device for the diamond wire cutting fluid of polycrystalline silicon wafers, including a workbench. A bracket is fixedly arranged on the upper side wall of the workbench. A cutting device is fixedly arranged at the lower end of the bracket. A cavity is opened on the side wall of the workbench. A monocrystalline silicon is fixedly arranged at the upper end of the cavity through a clamping device. A cutting fluid collection tank is fixedly arranged on the lower side wall of the workbench. Symmetric limiting grooves are opened on the inner wall of the cutting fluid collection tank. A filter screen is horizontally slidably arranged at the upper end inside the cutting fluid collection tank. Limiting blocks are fixedly arranged at both ends of the filter screen. The limiting blocks are slidably connected with the limiting grooves. An outlet pipe is fixedly arranged on the lower side wall of the cutting fluid collection tank.

[0004] However, the above patent has certain defects. Although the above patent can spray a large amount of cutting fluid through a water spray pipe to cool down the diamond wire during the cutting process of the silicon wafer, during the process of spraying and cooling the diamond wire, the cutting fluid is prone to splashing everywhere, thus easily splashing out of the workbench, resulting in waste of the cutting fluid and being unfavorable for recycling the cutting fluid. Therefore, the utility model provides a sewage recovery device for silicon wafer cutting. Summary of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides a sewage recovery device for silicon wafer cutting to solve the problems put forward in the above background art.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A silicon wafer cutting sewage recycling device, including a workbench, a through hole is penetrated through the top of the workbench, a placement plate is fixedly installed on the inner wall of the through hole, a silicon wafer body is lapped on the top of the placement plate, a clamping component is arranged on the top of the placement plate, a lifting component is arranged on the top of the workbench, a blocking cover is arranged on the top of the workbench through the lifting component, a hydraulic push rod is fixedly installed inside the blocking cover, a cutting component is arranged at the output end of the hydraulic push rod, a water tank is fixedly installed on the top of the workbench, a conveying component is arranged inside the water tank, a spray head is arranged on the top of the water tank through the conveying component, and the spray head is fixedly connected with the blocking cover, a collection box is fixedly installed at the bottom of the workbench, a slide rail is fixedly installed on the inner wall of the collection box, a filter plate is slidably connected inside the slide rail, a sealing component is arranged on the front side of the collection box, a liquid return component is arranged inside the collection box, and support legs are fixedly installed at the bottom of the workbench.

[0008] Preferably, the clamping component includes a mounting plate arranged on the top of the placement plate, an adjusting rod is threadedly connected inside the mounting plate, a turntable is fixedly installed at the top end of the adjusting rod, and a pressing plate is rotatably connected to the bottom end of the adjusting rod.

[0009] Preferably, the lifting component includes a support plate arranged on the top of the workbench, a fixing plate is fixedly installed on the front side of the support plate, a first motor is fixedly installed on the top of the fixing plate, the output end of the first motor penetrates through the fixing plate and extends to the bottom of the fixing plate and is fixedly installed with a screw rod, a moving block is threadedly connected to the surface of the screw rod, and the moving block is fixedly connected with the blocking cover, a guide rod is slidably connected inside the moving block, and the guide rod is fixedly connected with the fixing plate.

[0010] Preferably, the cutting component includes a moving plate arranged at the output end of the hydraulic push rod, a second motor is fixedly installed on the front side of the moving plate, the output end of the second motor penetrates through the moving plate and extends to the rear side of the moving plate and is fixedly installed with a rotating rod, a rotating wheel is fixedly installed on the surface of the rotating rod, a diamond wire is arranged on the rotating wheel, and a protective cover is fixedly installed on the front side of the moving plate.

[0011] Preferably, the conveying component includes a water suction pipe arranged inside the water tank, a water pump is fixedly installed at the top end of the water suction pipe, a hose is fixedly installed on the top of the water pump, and the hose is connected with the spray head.

[0012] Preferably, the sealing component includes a sealing door arranged on the front side of the collection box, the sealing door is connected with the collection box through a hinge, and a handle is fixedly installed on the front side of the sealing door.

[0013] Preferably, the liquid return component includes a connecting pipe arranged inside the collection box, a delivery pump is fixedly installed at the right end of the connecting pipe, a liquid return pipe is fixedly installed on the right side of the delivery pump, and the liquid return pipe is connected with the water tank.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows: After fixing the silicon wafer body, the blocking cover is moved downward through the lifting assembly until the bottom of the blocking cover contacts the workbench. Subsequently, the cutting assembly is moved downward through the hydraulic push rod, and the silicon wafer body is cut by the cutting assembly. The cutting fluid in the water tank is conveyed to the nozzle through the conveying assembly and sprayed out. The blocking cover can block the splashing cutting fluid. Finally, the cutting fluid will fall on the filter plate through the through hole, and then enter the bottom of the collection box after being filtered by the filter plate. The filtered cutting fluid in the collection box can be conveyed to the water tank through the liquid return assembly, which is convenient for blocking the splashing cutting fluid, so as to better recycle the cutting fluid and reduce the waste of cutting fluid. Description of the Drawings

[0015] Figure 1 is a three-dimensional perspective view of the present utility model;

[0016] Figure 2 is a front sectional view of the structure of the present utility model;

[0017] Figure 3 is the present utility model Figure 2 magnified view of part A in;

[0018] Figure 4 is a rear sectional view of the partial structure of the present utility model;

[0019] Figure 5 is the present utility model Figure 4 magnified view of part B in;

[0020] Figure 6 is a top sectional view of the cutting assembly of the present utility model.

[0021] In the figure: 1, workbench; 2, through hole; 3, placement plate; 4, silicon wafer body; 5, mounting plate; 6, adjusting rod; 7, turntable; 8, pressing plate; 9, support plate; 10, fixing plate; 11, first motor; 12, screw rod; 13, moving block; 14, guide rod; 15, blocking cover; 16, hydraulic push rod; 17, moving plate; 18, second motor; 19, rotating rod; 20, rotating wheel; 21, diamond wire; 22, protective cover; 23, water tank; 24, water suction pipe; 25, water pump; 26, hose; 27, nozzle; 28, collection box; 29, slide rail; 30, filter plate; 31, sealing door; 32, handle; 33, connecting pipe; 34, conveying pump; 35, liquid return pipe; 36, support leg. Detailed Embodiments

[0022] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0023] Refer to Figures 1 - 5, a silicon wafer cutting sewage recycling device, including a workbench 1. There is a through hole 2 penetrating through the top of the workbench 1. A placement plate 3 is fixedly installed on the inner wall of the through hole 2. A silicon wafer body 4 is lapped on the top of the placement plate 3. A clamping assembly is arranged on the top of the placement plate 3. A lifting assembly is arranged on the top of the workbench 1. A blocking cover 15 is arranged on the top of the workbench 1 through the lifting assembly. The lifting assembly includes a support plate 9 arranged on the top of the workbench 1. A fixing plate 10 is fixedly installed on the front side of the support plate 9. A first motor 11 is fixedly installed on the top of the fixing plate 10. The output end of the first motor 11 penetrates through the fixing plate 10 and extends to the bottom of the fixing plate 10 and is fixedly installed with a screw rod 12. A moving block 13 is threadedly connected to the surface of the screw rod 12, and the moving block 13 is fixedly connected to the blocking cover 15. A guide rod 14 is slidably connected inside the moving block 13, and the guide rod 14 is fixedly connected to the fixing plate 10. Start the first motor 11, so that the screw rod 12 rotates, so that the moving block 13 moves downward along the guide rod 14, so that the blocking cover 15 moves downward until the bottom of the blocking cover 15 contacts the workbench 1, sealing the cutting working environment, so as to facilitate the subsequent blocking of the splashing cutting fluid. And the inner wall size of the blocking cover 15 is adapted to the through hole 2, so that the cutting fluid splashing on the blocking cover 15 enters the collection box 28 from the through hole 2 along the blocking cover 15, thus reducing the waste of cutting fluid. A hydraulic push rod 16 is fixedly installed inside the blocking cover 15. A cutting assembly is arranged at the output end of the hydraulic push rod 16. The cutting assembly includes a moving plate 17 arranged at the output end of the hydraulic push rod 16. A second motor 18 is fixedly installed on the front side of the moving plate 17. The output end of the second motor 18 penetrates through the moving plate 17 and extends to the rear side of the moving plate 17 and is fixedly installed with a rotating rod 19. A rotating wheel 20 is fixedly installed on the surface of the rotating rod 19. A diamond wire 21 is arranged on the rotating wheel 20. A protective cover 22 is fixedly installed on the front side of the moving plate 17. Start the second motor 18, so that the rotating rod 19 rotates, so that the rotating wheel 20 rotates, so that the diamond wire 21 rotates. When the diamond wire 21 contacts the silicon wafer body 4, it is convenient to cut the silicon wafer body 4. A water tank 23 is fixedly installed on the top of the workbench 1. A conveying assembly is arranged inside the water tank 23. A spray head 27 is arranged on the top of the water tank 23 through the conveying assembly, and the spray head 27 is fixedly connected to the blocking cover 15. The conveying assembly includes a water suction pipe 24 arranged inside the water tank 23. The top end of the water suction pipe 24 is fixedly installed with a water pump 25. A hose 26 is fixedly installed on the top of the water pump 25, and the hose 26 is connected to the spray head 27. Through the setting of the conveying assembly, it is convenient to convey the cutting fluid in the water tank 23 to the spray head 27 for spraying, so as to facilitate the spraying and cooling of the diamond wire 21. A collection box 28 is fixedly installed at the bottom of the workbench 1. A slide rail 29 is fixedly installed on the inner wall of the collection box 28. A filter plate 30 is slidably connected inside the slide rail 29. A sealing assembly is arranged on the front side of the collection box 28. A liquid return assembly is arranged inside the collection box 28. The liquid return assembly includes a connecting pipe 33 arranged inside the collection box 28. A delivery pump 34 is fixedly installed at the right end of the connecting pipe 33.A liquid return pipe 35 is fixedly installed on the right side of the transfer pump 34, and the liquid return pipe 35 is connected to the water tank 23. When the transfer pump 34 is started, the cutting fluid filtered at the bottom of the collection box 28 can be transported to the connecting pipe 33, and then enter the water tank 23 from the liquid return pipe 35, which is convenient for recycling the cutting fluid filtered in the collection box 28 into the water tank 23 for reuse. Support legs 36 are fixedly installed at the bottom of the workbench 1. For this silicon wafer cutting sewage recycling device, after the silicon wafer body 4 is fixed, the blocking cover 15 is moved downward through the lifting assembly until the bottom of the blocking cover 15 contacts the workbench 1. Subsequently, the cutting assembly is moved downward through the hydraulic push rod 16 to cut the silicon wafer body 4. The cutting fluid in the water tank 23 is transported to the nozzle 27 by the conveying assembly and sprayed out. The splashing cutting fluid can be blocked by the blocking cover 15. Finally, the cutting fluid will fall on the filter plate 30 from the through hole 2, and then enter the bottom of the collection box 28 after being filtered by the filter plate 30. The filtered cutting fluid in the collection box 28 can be transported to the water tank 23 by the liquid return assembly, which is convenient for blocking the splashing cutting fluid, so that the cutting fluid can be better recycled, and thus the waste of cutting fluid can be reduced.

[0024] According to Figure 3 As shown, the clamping assembly includes a mounting plate 5 arranged on the top of the placing plate 3. The mounting plate 5 is internally threadedly connected with an adjusting rod 6. The top end of the adjusting rod 6 is fixedly installed with a turntable 7, and the bottom end of the adjusting rod 6 is rotatably connected with a pressing plate 8. The silicon wafer body 4 is placed on the placing plate 3. By rotating the turntable 7, the adjusting rod 6 is rotated. Since the adjusting rod 6 is threadedly connected with the mounting plate 5, the pressing plate 8 can be pushed downward until the silicon wafer body 4 is pressed tightly by the pressing plate 8, which is convenient for fixing the silicon wafer body 4, thus avoiding the phenomenon of the silicon wafer body 4 being displaced during cutting, and thus the silicon wafer body 4 can be better cut.

[0025] According to Figure 1 As shown, the sealing assembly includes a sealing door 31 arranged on the front side of the collection box 28. The sealing door 31 is connected to the collection box 28 through a hinge. A handle 32 is fixedly installed on the front side of the sealing door 31. After the sealing door 31 is opened through the handle 32, it is convenient to pull out the filter plate 30 from the slide rail 29, so that the filter plate 30 can be better maintained.

[0026] This silicon wafer cutting sewage recycling device is connected to the 220V mains electricity, and the main controller can be a conventional known device such as a computer for control.

[0027] During use: Place the silicon wafer body 4 on the placement plate 3, rotate the turntable 7, so that the adjusting rod 6 rotates. Since the adjusting rod 6 is threadedly connected to the mounting plate 5, it can push the pressing plate 8 downward until the silicon wafer body 4 is pressed tightly by the pressing plate 8. Subsequently, start the first motor 11 to rotate the screw rod 12, so that the moving block 13 moves downward along the guide rod 14, and the blocking cover 15 moves downward until the bottom of the blocking cover 15 contacts the workbench 1. Start the second motor 18 to rotate the rotating rod 19, so that the rotating wheel 20 rotates, and the diamond wire 21 rotates. Start the hydraulic push rod 16 to move the moving plate 17 downward, which can move the diamond wire 21 downward, so that the diamond wire 21 contacts the silicon wafer body 4 to cut the silicon wafer body 4. At the same time, start the water pump 25 to transport the cutting fluid in the water tank 23 to the hose 26 through the water suction pipe 24, and then spray it out from the nozzle 27 to spray and cool the diamond wire 21. The splashing cutting fluid can be blocked by the blocking cover 15. Finally, the cutting fluid will fall on the filter plate 30 from the through hole 2, and then enter the bottom of the collection box 28 after being filtered by the filter plate 30. Start the delivery pump 34 to transport the cutting fluid filtered at the bottom of the collection box 28 to the connecting pipe 33, and then enter the water tank 23 from the return pipe 35. When the filter plate 30 needs to be repaired, open the sealing door 31 through the handle 32, and pull out the filter plate 30 from the slide rail 29 to repair the filter plate 30.

[0028] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprising", "including" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0029] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cutting sewage recycling device, including a workbench (1), characterized in that, A through-opening (2) is provided through the top of the workbench (1). A placing plate (3) is fixedly installed on the inner wall of the through-opening (2). A silicon wafer body (4) is lapped on the top of the placing plate (3). A clamping assembly is arranged on the top of the placing plate (3). A lifting assembly is arranged on the top of the workbench (1). A blocking cover (15) is arranged on the top of the workbench (1) through the lifting assembly. A hydraulic push rod (16) is fixedly installed inside the blocking cover (15). A cutting assembly is arranged at the output end of the hydraulic push rod (16). A water tank (23) is fixedly installed on the top of the workbench (1). A conveying assembly is arranged inside the water tank (23). A spray head (27) is arranged on the top of the water tank (23) through the conveying assembly, and the spray head (27) is fixedly connected to the blocking cover (15). A collecting box (28) is fixedly installed at the bottom of the workbench (1). A slide rail (29) is fixedly installed on the inner wall of the collecting box (28). A filter plate (30) is slidably connected inside the slide rail (29). A sealing assembly is arranged on the front side of the collecting box (28). A liquid return assembly is arranged inside the collecting box (28). Support legs (36) are fixedly installed at the bottom of the workbench (1).

2. The silicon wafer cutting sewage recycling device according to claim 1, characterized in that, The clamping assembly includes a mounting plate (5) arranged on the top of the placing plate (3). An adjusting rod (6) is threadedly connected inside the mounting plate (5). A turntable (7) is fixedly installed at the top end of the adjusting rod (6). A pressing plate (8) is rotatably connected to the bottom end of the adjusting rod (6).

3. The silicon wafer cutting sewage recycling device according to claim 1, wherein The lifting assembly includes a support plate (9) arranged on the top of the workbench (1). A fixing plate (10) is fixedly installed on the front side of the support plate (9). A first motor (11) is fixedly installed on the top of the fixing plate (10). The output end of the first motor (11) penetrates through the fixing plate (10) and extends to the bottom of the fixing plate (10) and is fixedly installed with a screw rod (12). A moving block (13) is threadedly connected to the surface of the screw rod (12), and the moving block (13) is fixedly connected to the blocking cover (15). A guide rod (14) is slidably connected inside the moving block (13), and the guide rod (14) is fixedly connected to the fixing plate (10).

4. A silicon wafer cutting sewage recycling device according to claim 1, characterized in that, The cutting assembly includes a moving plate (17) arranged at the output end of the hydraulic push rod (16). A second motor (18) is fixedly installed on the front side of the moving plate (17). The output end of the second motor (18) penetrates through the moving plate (17) and extends to the rear side of the moving plate (17) and is fixedly installed with a rotating rod (19). A rotating wheel (20) is fixedly installed on the surface of the rotating rod (19). A diamond wire (21) is arranged on the rotating wheel (20). A protective cover (22) is fixedly installed on the front side of the moving plate (17).

5. The silicon wafer cutting sewage recycling device according to claim 1, characterized in that, The conveying assembly includes a water suction pipe (24) arranged inside the water tank (23). A water pump (25) is fixedly installed at the top end of the water suction pipe (24). A hose (26) is fixedly installed on the top of the water pump (25), and the hose (26) is connected to the spray head (27).

6. The silicon wafer cutting sewage recycling device according to claim 1, characterized in that, The sealing assembly includes a sealing door (31) disposed on the front side of the collection box (28). The sealing door (31) is connected to the collection box (28) by a hinge, and a handle (32) is fixedly installed on the front side of the sealing door (31).

7. A silicon wafer cutting sewage recycling device according to claim 1, characterized in that, The liquid return assembly includes a connecting pipe (33) disposed inside the collection box (28). A delivery pump (34) is fixedly installed at the right end of the connecting pipe (33), and a liquid return pipe (35) is fixedly installed on the right side of the delivery pump (34), and the liquid return pipe (35) is connected to the water tank (23).

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