Silicon wafer fixing device
By designing a rotatable and removable connected sheet cover and target disc structure, combined with an elastic press ring and limiting part, the scratches and lobe problems during the upper and lower sheets of the silicon wafer in the prior art are solved, achieving greater operating space and safe fixation, and reducing the risk of silicon wafer damage.
Patent Information
- Application Number
- CN202421719832.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-17
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-07-17
AI Technical Summary
The existing injection machine target disc cover can only be opened to a certain angle when the upper and lower plates are on the upper and lower plates, which leads to difficulty in operation and can easily cause scratches or lobes of the silicon wafer.
A silicon wafer fixing device is designed, wherein the sheet cover is rotatably connected to the target disc and the other end is removably connected, allowing the sheet cover to be opened greater than 45° relative to the target disc, and is equipped with an elastic press ring and a limiting portion to fix the silicon wafer, providing greater operating space and buffer protection.
It reduces the probability of silicon wafer scratches and lobes when artificially loading and removing the sheets, improves the safety and convenience of operation, and prevents the silicon wafer from slipping during high-speed operation.
Smart Images
Figure CN223118534U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of semiconductor tooling, and in particular, to a wafer fixing device. Background Art
[0002] When performing ion implantation on 6-inch thin wafers, manual loading and unloading of wafers are required. For the existing design of the target disk wafer cover of the implanter, when loading and unloading wafers, it can only be opened to a certain angle at most, which is difficult during loading and unloading, and scratches or even fractures are likely to occur during operation. Summary of the Utility Model
[0003] In view of this, this application provides a wafer fixing device that can solve the problems of scratches or even fractures during manual loading and unloading of wafers.
[0004] To solve the above problems, the technical solutions provided in this application are as follows:
[0005] This application provides a wafer fixing device, which includes:
[0006] A target disk having a receiving groove; the receiving groove is used to receive wafers; and
[0007] A wafer cover located on one side of the target disk and used to cooperate with the target disk to fix the wafer;
[0008] Wherein, one end of the wafer cover is rotatably connected to the target disk, and the other end of the wafer cover is detachably connected to the target disk.
[0009] In some embodiments of this application, the wafer cover includes a first state and a second state;
[0010] When the wafer cover is in the first state, the wafer cover covers the target disk;
[0011] When the wafer cover is in the second state, the opening angle of the wafer cover relative to the target disk is greater than 45°.
[0012] In some embodiments of this application, the wafer cover includes a wafer cover body having an opening, and the orthographic projection of the opening on the target disk covers the receiving groove.
[0013] In some embodiments of this application, the wafer fixing device further includes an elastic pressing ring fixed on the wafer cover body and located on one side of the opening;
[0014] When the wafer cover is in the first state, the elastic pressing ring abuts against the wafer received in the target disk.
[0015] In some embodiments of this application, the target disk includes a target disk body, and the receiving groove is formed on the target disk body;
[0016] The silicon wafer fixing device further includes at least one limiting portion, which is fixed on the target disk body and located on one side of the receiving groove;
[0017] When the wafer cover is in the first state, the limiting portion abuts against the wafer cover body.
[0018] In some embodiments of the present application, the other end of the wafer cover is snap-connected to the target disk.
[0019] In some embodiments of the present application, the silicon wafer fixing device further includes a snap portion, which is fixed on the wafer cover body;
[0020] A card slot is formed on the target disk body, and the card slot is located on one side of the receiving groove and far from the end where the target disk body and the wafer cover are rotatably connected;
[0021] When the wafer cover is in the first state, the snap portion is received in the card slot and is snap-connected to the card slot.
[0022] In some embodiments of the present application, the limiting portion is located between the card slot and the receiving groove.
[0023] In some embodiments of the present application, the silicon wafer fixing device further includes a fixing block and a rotating shaft. The fixing block is fixed on the target disk body. The rotating shaft passes through the fixing block and can rotate relative to the fixing block. Both ends of the rotating shaft protrude from the fixing block. One end of the wafer cover has an avoidance groove, the fixing block is received in the avoidance groove, and both ends of the rotating shaft are fixed on the wafer cover.
[0024] In some embodiments of the present application, the target disk body further has a notch, and the notch extends from the end of the target disk body far from the end where the target disk and the wafer cover are rotatably connected to the receiving groove; and / or
[0025] The number of the limiting portions is two, and the two limiting portions are distributed on both sides of the notch.
[0026] The silicon wafer fixing device provided by the present application rotatably connects one end of the wafer cover to one end of the target disk, and the other end is detachably connected. It can not only fix the silicon wafer between the target disk and the wafer cover, but also make the wafer cover rotate a relatively large angle relative to the target disk. In this way, when manually loading and unloading the wafers, there is a larger operating space for operation, and the loading and unloading of the wafers are less affected by the wafer cover, thereby reducing the probability of scratching or even cracking of the silicon wafers during manual loading and unloading. Description of the Drawings
[0027] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0028] Figure 1 The structural schematic diagram of a silicon wafer fixing device provided by the present application in an open state;
[0029] Figure 2 is Figure 1 The schematic diagram of the silicon wafer fixing device shown in a fully closed state and partially sectioned;
[0030] Figure 3 is Figure 2 The top view of the silicon wafer fixing device shown.
[0031] Figure 4 is Figure 2 The front view of the silicon wafer fixing device shown. Specific embodiments
[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present application.
[0033] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "upper", "lower", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation of the present application. In addition, the terms "first", "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more, unless otherwise specifically defined.
[0034] The present application may repeat reference numerals and / or reference letters in different embodiments. This repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or arrangements discussed.
[0035] Please refer to Figures 1 to 4, this application provides a silicon wafer fixing device 100 for fixing a silicon wafer to facilitate ion implantation of the silicon wafer. The silicon wafer fixing device 100 includes a target disk 10 and a wafer cover 20. The wafer cover 20 is located on one side of the target disk 10. One end of the wafer cover 20 is rotatably connected to the target disk 10, and the other end of the wafer cover 20 is detachably connected to the target disk 10.
[0036] Specifically, the target disk 10 has a receiving groove 11 for receiving the silicon wafer 30. The wafer cover 20 is used to cooperate with the target disk 10 to fix the silicon wafer 30.
[0037] Since one end of the wafer cover 20 can be rotatably connected to one end of the target disk 10, the wafer cover 20 can be opened at a relatively large angle relative to the target disk 10. In this way, when loading and unloading the wafer manually, there is a larger operating space for operation, and the influence of the wafer cover 20 on loading and unloading the wafer is smaller. Furthermore, the probability of scratching or even cracking the silicon wafer during manual loading and unloading can be reduced to a certain extent.
[0038] In addition, the other end of the wafer cover 20 is detachably connected to the target disk 10, so that the silicon wafer 30 can be fixed between the target disk 10 and the wafer cover 20, and the silicon wafer 30 will not slip off or crack when the target disk 10 rotates at a high speed.
[0039] In some embodiments of this application, the wafer cover 20 includes a first state and a second state.
[0040] Please refer to Figures 2 to 4 , when the wafer cover 20 is in the first state, the wafer cover 20 covers the target disk 10.
[0041] Please refer to Figure 1 , when the wafer cover 20 is in the second state, the opening angle θ of the wafer cover 20 relative to the target disk 10 is greater than 45°. Preferably, the opening angle θ of the wafer cover 20 relative to the target disk 10 is greater than or equal to 90°
[0042] When the opening angle of the wafer cover 20 relative to the target disk 10 is greater than 45°, the distance between the target disk 10 and the wafer cover 20 is relatively large. In this way, when loading and unloading the wafer manually, the operating space is larger, which is convenient for loading and unloading the wafer. If the opening angle of the wafer cover 20 relative to the target disk 10 is less than 45°, it is difficult to load and unload the wafer manually, the operating space is small, and it is easy to cause scratches or even cracks on the silicon wafer during operation.
[0043] In some embodiments of the present application, the wafer cover 20 includes a wafer cover body 21, the wafer cover body 21 has an opening 22, and the orthographic projection of the opening 22 on the target disk 10 covers the receiving groove 11. Thus, when the wafer cover 20 covers the target disk 10, that is, when the wafer cover 20 is in the first state, the wafer cover 20 can press a part of the silicon wafer 30 to fix the silicon wafer 30. The opening 22 is beneficial for performing other operations on the silicon wafer 30.
[0044] Please refer to Figure 1 and Figure 2 , in some embodiments of the present application, the silicon wafer fixing device 100 further includes an elastic pressing ring 40, the elastic pressing ring 40 is fixed on the wafer cover body 21 and is located on one side of the opening 22. When the wafer cover 20 is in the first state, the elastic pressing ring 40 abuts against the silicon wafer 30 received in the target disk 10. The elastic pressing ring 40 has elasticity and can play a role in shock absorption and buffering to prevent damage to the silicon wafer 30 caused by external force collision with the wafer cover or other situations.
[0045] In this embodiment, the number of the elastic pressing rings 40 is two and they are distributed at intervals.
[0046] In this embodiment, the elastic pressing ring 40 is fixed by screws or the like.
[0047] In some embodiments of the present application, the target disk 10 includes a target disk body 12, and the receiving groove 11 is formed on the target disk body 12. The silicon wafer fixing device 100 further includes at least one limiting portion 50, the limiting portion 50 is fixed on the target disk body 12 and is located on one side of the receiving groove 11. When the wafer cover 20 is in the first state, the limiting portion 50 abuts against the wafer cover body 21. The limiting portion 50 is used to limit the silicon wafer 30.
[0048] In some embodiments of the present application, the limiting portion 50 is strip-shaped, the number of the limiting portions 50 is two, and the two limiting portions 50 are distributed at intervals along the receiving groove 11.
[0049] In some embodiments of the present application, the other end of the wafer cover 20 is snap-connected to the target disk 10 to fix the wafer cover 20 on the target disk 10. The snap connection is a common detachable connection method. Applying the snap connection to the silicon wafer fixing device 100 can not only fix the wafer cover 20 on the target disk 10, but also quickly release the fixation between the wafer cover 20 and the target disk 10 when needed.
[0050] In some embodiments of the present application, the silicon wafer fixing device 100 further includes a buckle portion 61, the buckle portion 61 is fixed on the wafer cover body 21, a card slot 62 is formed on the turntable body 12, and the card slot 62 is located on one side of the receiving groove 11 and away from one end of the turntable body 12 where it is rotatably connected to the wafer cover 20. When the wafer cover 20 is in the first state, the buckle portion 61 is received in the card slot 62 and is snap-connected to the card slot 62.
[0051] In some embodiments of the present application, the limiting portion 50 is located between the card slot 62 and the receiving groove 11.
[0052] In some embodiments of the present application, the number of the card slots 62 is two, the two card slots 62 are spaced along the receiving groove 11, and one limiting portion 50 is located between one card slot 62 and one receiving groove 11.
[0053] In some embodiments of the present application, the silicon wafer fixing device 100 further includes a fixing block 71 and a rotating shaft 72, the fixing block 71 is fixed on the turntable body 12, the rotating shaft 72 passes through the fixing block 71 and can rotate relative to the fixing block 71, both ends of the rotating shaft 72 protrude from the fixing block 71, one end of the wafer cover 20 has an avoidance groove 201, the fixing block 71 is received in the avoidance groove 201, and both ends of the rotating shaft 72 are fixed on the wafer cover 20. Through the fixing block 71 and the rotating shaft 72 and in cooperation with the avoidance groove 201, not only can the wafer cover 20 be rotatably connected to the turntable 10, but also it can be ensured that the wafer cover 20 covers the turntable 10 (that is, when the wafer cover 20 is in the first state), preventing the silicon wafer 30 from sliding out of the receiving groove 11 from this end.
[0054] In this embodiment, the elastic pressing ring 40 is close to one side of the opening 22 close to the fixing block 71.
[0055] In some embodiments of the present application, the turntable body 12 further has a notch 13, the notch 13 extends from one end of the turntable body 12 away from the end where the turntable 10 is rotatably connected to the wafer cover 20 into the receiving groove 11, so as to facilitate loading and unloading of silicon wafers. When the silicon wafer 30 is received in the receiving groove 11, from the side of the turntable 10 away from the wafer cover 20, a part of the silicon wafer 30 is exposed from the notch 13, and when loading and unloading the wafer, the silicon wafer 30 can be transferred from the notch 13 by a wafer clip or the like.
[0056] In some embodiments of the present application, it is also possible to load and unload silicon wafers without using a wafer clip, but by using a suction pen to load and unload wafers. This is not only convenient and fast in operation, but also can reduce the sliding contact between the silicon wafer 30 and the bottom of the turntable, reducing the probability of scratching.
[0057] In some embodiments of the present application, the two limiting portions 50 and the two card slots 62 are respectively distributed on both sides of the notch 13.
[0058] The wafer fixing device provided by the present application rotatably connects one end of the wafer cover to one end of the target disk, and the other end is detachably connected. It can not only fix the wafer between the target disk and the wafer cover, but also rotate the wafer cover at a relatively large angle relative to the target disk. In this way, when manually loading and unloading the wafer, there is a larger operating space for operation, and the influence of the wafer cover on loading and unloading is smaller. Furthermore, the probability of wafer scratching or even chipping during manual loading and unloading can be reduced.
[0059] Since the wafer fixing device provided by the present application has a larger operating space for operation when manually loading and unloading the wafer, the wafer is relatively safe, and the wafer can be loaded and unloaded by tools such as a suction pen. It is not only convenient and fast to operate, but also can reduce the sliding contact between the wafer and the bottom of the target disk, reducing the probability of scratching.
[0060] In addition, an elastic pressure ring is provided on the wafer cover. The elastic pressure ring has elasticity and can play a role in shock absorption and buffering to prevent damage to the wafer caused by external force collision with the wafer cover and other situations.
[0061] In summary, although the present application has been disclosed above with preferred embodiments, the above preferred embodiments are not intended to limit the present application. Those of ordinary skill in the art can make various modifications and refinements without departing from the spirit and scope of the present application. Therefore, the protection scope of the present application is subject to the scope defined by the claims.
Claims
1. A silicon wafer fixing device, characterized in that, Comprising: A target disk having a receiving groove; the receiving groove is used for receiving a silicon wafer; And A wafer cover located on one side of the target disk and used to cooperate with the target disk to fix the silicon wafer; Wherein, one end of the wafer cover is rotatably connected to the target disk, and the other end of the wafer cover is detachably connected to the target disk.
2. The silicon wafer fixing device according to claim 1, wherein, The wafer cover includes a first state and a second state; When the wafer cover is in the first state, the wafer cover covers the target disk; When the wafer cover is in the second state, the opening angle of the wafer cover relative to the target disk is greater than 45°.
3. The silicon wafer fixing device according to claim 2, characterized in that, The wafer cover includes a wafer cover body having an opening, and the orthographic projection of the opening on the target disk covers the receiving groove.
4. The silicon wafer fixing device according to claim 3, characterized in that, The silicon wafer fixing device further includes an elastic pressing ring fixed on the wafer cover body and located on one side of the opening; When the wafer cover is in the first state, the elastic pressing ring abuts against the silicon wafer received in the target disk.
5. The silicon wafer fixing device according to claim 3, characterized in that, The target disk includes a target disk body having the receiving groove formed therein; The silicon wafer fixing device further includes at least one limiting portion fixed on the target disk body and located on one side of the receiving groove; When the wafer cover is in the first state, the limiting portion abuts against the wafer cover body.
6. The silicon wafer fixing device according to claim 5, wherein, The other end of the wafer cover is snap-connected to the target disk.
7. The silicon wafer fixing device according to claim 6, characterized in that, The silicon wafer fixing device further includes a snap portion fixed on the wafer cover body; A card slot is formed in the target disk body, and the card slot is located on one side of the receiving groove and away from the end where the target disk body and the wafer cover are rotatably connected; When the wafer cover is in the first state, the snap portion is received in the card slot and is snap-connected to the card slot.
8. The silicon wafer fixing device according to claim 7, characterized in that, The limiting portion is located between the card slot and the receiving groove.
9. The silicon wafer fixing device according to claim 1, wherein, The silicon wafer fixing device further includes a fixing block and a rotating shaft. The fixing block is fixed on the target disk body. The rotating shaft passes through the fixing block and can rotate relative to the fixing block. Both ends of the rotating shaft protrude from the fixing block. One end of the wafer cover has an avoidance groove, the fixing block is received in the avoidance groove, and both ends of the rotating shaft are fixed on the wafer cover.
10. The silicon wafer fixing device according to claim 5, wherein, The target disk body further has a notch extending from the end of the target disk body away from the end where the target disk and the wafer cover are rotatably connected to the inside of the receiving groove; and / or The number of the limiting portions is two, and the two limiting portions are distributed on both sides of the notch.