Electric control box and air conditioner with same

Abstract

The electric control box comprises a circuit board and a heat dissipation structure, the circuit board comprises a substrate and a heating device arranged on the substrate, the heat dissipation structure comprises a heat dissipation body and a heat pipe, the heat dissipation body comprises a first part and a second part, and the first part and the second part are arranged on the substrate. The first part is arranged on a heating device and is in heat transfer fit with the heating device, the second part is separated from the first part and is provided with a matching part for embedding a refrigerant pipe, and the heat pipe comprises a first pipe section matched with the first part, a second pipe section matched with the second part and a heat pipe extending from the first part to the second part, and the third pipe section is connected with the first pipe section and the second pipe section. The second part provided with the refrigerant pipe is separated from the first part, so that the size of the electric control box in the thickness direction of the substrate can be reduced, and the pulling stress of the pin of the heating device is reduced. The heat pipe is arranged for heat transfer, the heat transfer efficiency of the heat pipe is high, and the heat dissipation speed of the heating device can be increased.

Description

Technical Field

[0001] The utility model relates to the field of air conditioning equipment, and in particular to an electric control box and an air conditioner having the same. Background Art

[0002] In an air conditioning system, good heat dissipation design for the electric control is very important for the air conditioner, which is related to whether the air conditioner can operate reliably, continuously and at full load. In the related art, there is room for improvement in the radiator of the electric control equipment. Summary of the Utility Model

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. For this reason, the utility model provides an electric control box, and the radiator of the electric control box can reduce the size of the electric control box, reduce the pulling force on the pins of the heat generating device, and improve the heat dissipation efficiency.

[0004] The utility model also provides an air conditioner having the above electric control box.

[0005] The electric control box according to the first aspect of the utility model includes: a circuit board, the circuit board includes a substrate and a heat generating device disposed on the substrate; a heat dissipation structure, the heat dissipation structure includes a heat dissipation body and a heat pipe, the heat dissipation body includes a first part and a second part, the first part is disposed on the heat generating device and is in heat transfer cooperation with the heat generating device, the second part is separated from the first part, and the second part has a mating portion for embedding a heat dissipation pipe, the heat pipe includes a first pipe section cooperating with the first part, a second pipe section cooperating with the second part, and a third pipe section extending from the first part to the second part and connecting the first pipe section and the second pipe section.

[0006] According to the electric control box of the embodiment of the utility model, by separating the second part provided with the refrigerant pipe from the first part, the size of the electric control box in the thickness direction of the substrate can be reduced, which is beneficial to reducing the volume of the electric control box, and the pulling force on the pins of the heat generating device is reduced, the service life of the heat generating device can be prolonged, and the working reliability of the electric control box is improved. And by arranging the heat pipe to transfer heat between the first part and the second part, the heat transfer efficiency of the heat pipe is fast, and the heat dissipation speed of the heat generating device can be improved.

[0007] In some embodiments, the heat pipes are multiple and arranged at intervals.

[0008] In some embodiments, the third pipe sections of the multiple heat pipes are arranged in parallel.

[0009] In some embodiments, the first pipe section is a straight pipe, or a curved pipe, or a bent pipe; the second pipe section is a straight pipe, or a curved pipe, or a bent pipe; the third pipe section is a straight pipe, or a curved pipe, or a bent pipe.

[0010] In some embodiments, the first part and the second part are spaced apart, and the heat dissipation body does not include a part connecting the first part and the second part.

[0011] In some embodiments, the second part includes a first heat dissipation plate and a second heat dissipation plate. The first heat dissipation plate and the second heat dissipation plate are stacked in the same thickness direction, and the second pipe section cooperates with at least one of the first heat dissipation plate and the second heat dissipation plate.

[0012] In some embodiments, the first pipe section is embedded in the first part, and the second pipe section is embedded in one of the first heat dissipation plate and the second heat dissipation plate.

[0013] In some embodiments, the heat dissipation body further includes a third part. The third part is connected between the first part and the second part, and the third pipe section is in heat transfer cooperation with the third part.

[0014] In some embodiments, the heat dissipation structure includes a heat conduction plate. The heat conduction plate is an integrally formed part and includes a first plate part, a second plate part, and a third plate part. The first plate part constitutes the first part, the second plate part participates in constituting the second part, the third plate part constitutes the third part. The first pipe section cooperates with the first plate part, the second pipe section cooperates with the second plate part, and the third pipe section cooperates with the third plate part.

[0015] In some embodiments, the heat pipe is integrally embedded in the heat conduction plate.

[0016] In some embodiments, the heat dissipation structure further includes a radiator. The radiator cooperates with the second plate part to jointly constitute the second part. The cooperation part is formed between the radiator and the second plate part, or formed on the radiator.

[0017] In some embodiments, the second part is located on the circumferential side of the first part. Taking the plane of the side surface of the substrate close to the first part as the reference plane, the orthographic projection of the second part on the reference plane is located outside the contour range of the orthographic projection of the first part on the reference plane.

[0018] In some embodiments, in the direction from the first part to the second part, the third pipe section gradually extends in a direction away from the reference plane, or gradually extends in a direction close to the reference plane, or extends along a direction parallel to the reference plane.

[0019] In some embodiments, the second part and the first part are located on two sides in the thickness direction of the substrate, and the third pipe section is bent from one side in the thickness direction of the substrate to the other side in the thickness direction of the substrate.

[0020] The air conditioner according to the second aspect of the present invention includes the electric control box according to the first aspect of the present invention.

[0021] By providing the electric control box according to the first aspect, the working reliability of the air conditioner is improved according to the air conditioner of the present invention.

[0022] In some embodiments, the electric control box is provided in the outdoor unit of the air conditioner, and at least part of the refrigerant pipe in the outdoor unit serves as the heat dissipation pipe.

[0023] The additional aspects and advantages of the present invention will be partly given in the following description, partly become obvious from the following description, or be understood through the practice of the present invention. Description of the Drawings

[0024] Figure 1 is a front view structural schematic diagram of an electric control box according to an embodiment of the present invention;

[0025] Figure 2 is a structural schematic diagram of an electric control box according to Embodiment 1 of the present invention;

[0026] Figure 3 is an arrangement schematic diagram of a heat pipe and a heat dissipation body according to an embodiment of the present invention;

[0027] Figure 4 is an arrangement schematic diagram of a heat pipe and a heat dissipation body according to another embodiment of the present invention;

[0028] Figure 5 is an arrangement schematic diagram of a heat pipe and a heat dissipation body according to still another embodiment of the present invention;

[0029] Figure 6 is an arrangement schematic diagram of a heat pipe and a heat dissipation body according to yet another embodiment of the present invention;

[0030] Figure 7 is a structural schematic diagram of an electric control box according to Embodiment 2 of the present invention;

[0031] Figure 8 is a structural schematic diagram of an electric control box according to Embodiment 3 of the present invention

[0032] Figure 9 is a structural schematic diagram of an electric control box according to Embodiment 4 of the present invention;

[0033] Figure 10It is a front - view structural schematic diagram of an electronic control box according to another embodiment of the utility model;

[0034] Figure 11 It is a structural schematic diagram of an electronic control box according to Embodiment 5 of the present utility model;

[0035] Figure 12 It is an arrangement schematic diagram of a heat pipe and a heat - conducting plate according to an embodiment of the present utility model;

[0036] Figure 13 It is an arrangement schematic diagram of a heat pipe and a heat - conducting plate according to another embodiment of the present utility model;

[0037] Figure 14 It is an arrangement schematic diagram of a heat pipe and a heat - conducting plate according to still another embodiment of the present utility model;

[0038] Figure 15 It is an arrangement schematic diagram of a heat pipe and a heat - conducting plate according to yet another embodiment of the present utility model;

[0039] Figure 16 It is a structural schematic diagram of an electronic control box according to Embodiment 6 of the present utility model;

[0040] Figure 17 It is a structural schematic diagram of an outdoor unit of an air conditioner according to an embodiment of the present utility model.

[0041] Reference numerals:

[0042] Air conditioner 1000;

[0043] Electronic control box 100;

[0044] Circuit board 10; Substrate 11; Heat - generating device 12;

[0045] Heat - dissipation structure 20;

[0046] Heat - conducting plate 2; First plate part 21; Second plate part 22; Third plate part 23;

[0047] Heat - dissipation body 3; First part 31; Second part 32; Fitting part 32a; First heat - dissipation plate 321; Second heat - dissipation plate 322; Third part 33;

[0048] Heat pipe 4; First pipe section 41; Second pipe section 42; Third pipe section 43;

[0049] Radiator 5;

[0050] Heat - dissipation pipe 60;

[0051] Box body 70;

[0052] First fastener 81; Second fastener 82;

[0053] Outdoor unit 200; refrigerant pipe 300. Detailed implementation mode

[0054] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0055] The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, the components and settings of specific examples are described below. Of course, they are only examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplification and clarity and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those of ordinary skill in the art can realize the applicability of other processes and / or the use of other materials.

[0056] The electric control box 100 according to the embodiment of the first aspect of the present invention will be described below with reference to the drawings.

[0057] The electric control box 100 according to the embodiment of the present invention, as Figure 1 and Figure 2 shown,

[0058] The electric control box 100 includes: a circuit board 10 and a heat dissipation structure 20. The circuit board 10 includes a substrate 11 and heat generating devices 12 provided on the substrate 11. The heat dissipation structure 20 includes a heat dissipation body 3 and a heat pipe 4. The heat dissipation body 3 includes a first part 31 and a second part 32. The first part 31 is disposed on the heat generating device 12 and is in heat transfer cooperation with the heat generating device 12. The second part 32 is separated from the first part 31, and the second part 32 has a mating portion 32a for embedding a heat dissipation pipe 60. The heat pipe 4 includes a first pipe section 41 that cooperates with the first part 31, a second pipe section 42 that cooperates with the second part 32, and a third pipe section 43 that extends from the first part 31 to the second part 32 and connects the first pipe section 41 and the second pipe section 42.

[0059] A heating device 12 is provided on the substrate 11. The heating device 12 generates heat when working. As the power of the electric control box 100 increases, the heat generated by the heating device 12 also increases. If the heat of the heating device 12 cannot be discharged in time, it will affect the normal operation of the electric control box 100. Therefore, the electric control box 100 is provided with a heat dissipation structure 20. The heat dissipation structure 20 accelerates the discharge of the heat of the heating device 12 and speeds up the heat dissipation of the heating device 12, thereby improving the working reliability of the electric control box 100.

[0060] The heat dissipation structure 20 is embedded with a heat dissipation pipe 60, which has a relatively low temperature. The heat dissipation speed of the heat dissipation device 12 can be accelerated by using the heat dissipation pipe 60 to cool the heat dissipation device 12. In addition, the heat dissipation pipe 60 is embedded in the heat dissipation structure 20, which can improve the layout stability of the heat dissipation pipe 60.

[0061] In the related art, the heat sink is arranged in the direction of the thickness of the substrate directly opposite to the heating device, and the heat sink contacts the heating device for heat transfer, which increases the size of the electric control box in the direction of the thickness of the substrate and increases the volume of the electric control box. At the same time, when the heat sink is subjected to force and shakes, it will produce a pulling force on the pins of the heating device, which is easy to cause damage to the heating device. For example, there is circulating refrigerant flowing in the heat pipe, and when the pump drives the refrigerant to flow, the heat pipe will produce continuous vibration, causing the pins of the heating device to be continuously subjected to a force perpendicular to the direction of the substrate, which is easy to cause damage to the heating device, and reduce the working reliability of the electric control box.

[0062] The heat dissipation body 3 of the embodiment of the utility model includes a first part 31 and a second part 32. The first part 31 cooperates with the heat-generating device 12 in heat transfer. The heat dissipation pipe 60 is arranged on the second part 32. The second part 32 is separated from the first part 31. The second part 32 and the heat-generating device 12 are staggered, so that the size of the electric control box 100 at the heat-generating device 12 can be reduced, which is beneficial to reducing the volume of the electric control box 100. Exemplarily, the second part 32 can be arranged close to the substrate 11 relative to the first part 31, so that the size of the electric control box 100 in the thickness direction of the substrate 11 can be reduced. Among them, the second part 32 is separated from the first part 31, which can be understood as: the second part 32 is not adjacent to the first part 31, and there is a certain distance between the second part 32 and the first part 31, but the second part 32 and the first part 31 can be connected (for example Figure 8 as shown), or without a connection (e.g. Figure 2 shown).

[0063] The second part 32 is arranged separately from the first part 31, and the second part 32 does not directly contact the heating device 12, so the vibration generated by the heat pipe 60 arranged on the second part 32 will not be directly transmitted to the heating device 12, which can reduce the pulling force on the pins of the heating device 12, thereby extending the service life of the heating device 12. In addition, the arrangement of the second part 32 is more flexible, and the fixing of the second part 32 is simpler, which can further reduce the vibration of the heating device 12.

[0064] The first part 31 and the second part 32 are separately arranged, and heat is transferred between the first part 31 and the second part 32 through the heat pipe 4. It is worth noting that the heat pipe 4 is filled with a phase change medium, and the heat transfer efficiency of the heat pipe 4 is fast, and heat can be quickly transferred from the first part 31 to the second part 32, thereby improving the heat dissipation efficiency of the heat dissipation structure 20. The heat pipe 4 includes a first pipe segment 41 that cooperates with the first part 31, a second pipe segment 42 that cooperates with the second part 32, and a third pipe segment 43 connected to the first pipe segment 41 and the second pipe segment 42. The first pipe segment 41 cooperates with the first part 31 for heat transfer, the second pipe segment 42 cooperates with the second part 32 for heat transfer, and the third pipe segment 43 transfers heat between the first pipe segment 41 and the second pipe segment 42.

[0065] According to the electric control box 100 of the embodiment of the utility model, by separating the second part 32 provided with the heat pipe 60 from the first part 31, the size of the electric control box 100 in the thickness direction of the substrate 11 can be reduced, which is conducive to reducing the volume of the electric control box 100, and the pulling force of the pins of the heating device 12 is reduced, which can extend the service life of the heating device 12 and improve the working reliability of the electric control box 100. In addition, by arranging the heat pipe 4 to transfer heat between the first part 31 and the second part 32, the heat transfer efficiency of the heat pipe 4 is fast, and the heat dissipation speed of the heating device 12 can be improved.

[0066] In some embodiments of the present invention, Figure 1 and Figure 2 As shown, the electric control box 100 further includes a box body 70 , and the circuit board 10 and the heat dissipation structure 20 are both arranged in the box body 70 . The box body 70 protects the circuit board 10 and the heat dissipation structure 20 .

[0067] It is worth mentioning that Figure 1 and Figure 2 Only a portion of the box body 70 located on the side of the substrate 11 away from the heating device 12 is shown, and the box body 70 located on the side of the substrate 11 where the heating device 12 is provided is not shown. The box body 70 of the electric control box 100 is an enclosing structure that can enclose the circuit board 10 and the heat dissipation structure 20 to prevent external dust or condensed water from contacting the circuit board 10, thereby improving the working reliability of the electric control box 100.

[0068] The electronic control box 100 of the present utility model dissipates heat from the circuit board 10 through the heat dissipation structure 20 in which the heat dissipation pipe 60 is embedded. Therefore, the box body 70 can be set as a sealed box body 70, and only the heat dissipation pipe 60 is used to dissipate heat from the heating device 12, without using air cooling for heat dissipation, which can further improve the use safety of the electronic control box 100.

[0069] Optionally, the box body 70 can also be a structure that allows air flow. Not only can the heat dissipation pipe 60 be used to dissipate heat from the heating device 12, but also the air flow can be used to dissipate heat from the heating device 12, improving the heat dissipation effect of the electronic control box 100.

[0070] In some embodiments of the present utility model, as Figures 3 - 6 shown, there are multiple heat pipes 4 arranged at intervals. By arranging multiple heat pipes 4, the heat transfer efficiency can be further improved, and the heat dissipation speed of the heating device 12 can be increased.

[0071] In some embodiments of the present utility model, as Figure 1 shown, a plurality of heating devices 12 are arranged on the substrate 11, and the heat pipes 4 and the heating devices 12 are arranged at intervals in sequence. By arranging multiple heat pipes 4 to cooperate with multiple heating devices 12, the heat generated by the heating devices 12 can be quickly transferred to the heat dissipation pipe 60 of the second part 32, which is beneficial to improving the heat dissipation speed of the heating devices 12. And by arranging multiple heat pipes 4 to cooperate with multiple heating devices 12, the heat dissipation of multiple heating devices 12 is balanced, which is beneficial to improving the working reliability of the circuit board 10.

[0072] In some embodiments of the present utility model, as Figures 3 - 6 shown, the third pipe sections 43 of the multiple heat pipes 4 are arranged in parallel.

[0073] The parallel arrangement of the third pipe sections 43 of the multiple heat pipes 4 can reduce mutual interference and improve the working stability of the heat pipes 4.

[0074] In some embodiments of the present utility model, as Figures 3 - 6 shown, the first pipe section 41 is a straight pipe, or a curved pipe, or a bent pipe; the second pipe section 42 is a straight pipe, or a curved pipe, or a bent pipe; the third pipe section 43 is a straight pipe, or a curved pipe, or a bent pipe, which can be selected according to the actual available space of the heat pipe 4 to improve the application range of the heat dissipation structure 20.

[0075] As Figure 1 、 Figure 3 and Figure 12 shown, in some embodiments of the present utility model, the first pipe section 41 is a straight pipe, the second pipe section 42 is a straight pipe, and the third pipe section 43 is a bent pipe to connect the first pipe section 41 and the second pipe section 42. And there are multiple heat pipes 4, and the third pipe sections 43 of the multiple heat pipes 4 are arranged in parallel.

[0076] AsFigure 4 and Figure 13 As shown in Figure 13 , in some embodiments of the present invention, there are two heat pipes 4. The first pipe section 41 of one heat pipe 4 is a bent pipe with a relatively large contact area with the first part 31. The second pipe section 42 is a straight pipe, and the third pipe section 43 is a straight pipe to connect the first pipe section 41 and the second pipe section 42. The first pipe section 41 of the other heat pipe 4 is a straight pipe, the second pipe section 42 is a bent pipe with a relatively large contact area with the second part 32, and the third pipe section 43 is a straight pipe to connect the first pipe section 41 and the second pipe section 42. The third pipe sections 43 of the two heat pipes 4 are arranged in parallel.

[0077] As Figure 5 and Figure 14 As shown in Figure 14 , in some embodiments of the present invention, there are two heat pipes 4. The first pipe section 41 of the heat pipe 4 is a bent pipe with a relatively large contact area with the first part 31. The second pipe section 42 is a bent pipe with a relatively large contact area with the second part 32, and the third pipe section 43 is a straight pipe to connect the first pipe section 41 and the second pipe section 42. The two heat pipes 4 are arranged axially symmetrically, and the third pipe sections 43 of the two heat pipes 4 are arranged in parallel.

[0078] As Figure 6 and Figure 15 As shown in Figure 15 , in some embodiments of the present invention, the first pipe section 41 is a straight pipe, the second pipe section 42 is a straight pipe, and the third pipe section 43 is a curved pipe to connect the first pipe section 41 and the second pipe section 42. The third pipe section 43 is bent in the direction away from the spacing between the first part 31 and the second part 32, so as to avoid the space between the first part 31 and the second part 32 and reduce interference.

[0079] In some embodiments of the present invention, as Figure 2 and Figure 7 As shown in Figure 7 , the first part 31 and the second part 32 are arranged at intervals, and the heat dissipation body 3 does not include the part connecting the first part 31 and the second part 32.

[0080] The first part 31 and the second part 32 are arranged at intervals, and the second part 32 does not directly contact the heat generating device 12. Therefore, the transmission of vibration generated by the heat dissipation pipes 60 arranged on the second part 32 can be reduced, the pulling force on the pins of the heat generating device 12 can be reduced, and the service life of the heat generating device 12 can be extended.

[0081] And by arranging the first part 31 and the second part 32 at intervals, the heat dissipation body 3 connecting the first part 31 and the second part 32 can also be saved, which is beneficial to saving manufacturing costs.

[0082] The heat dissipation body 3 does not include the part connecting the first part 31 and the second part 32. As Figures 3 - 6 shown in Figures 3 - 6 , several embodiments of the cooperation between the heat pipes 4 and the heat dissipation body 3 are shown.

[0083] In some embodiments of the present utility model, such as Figure 2 and Figure 7 shown, the second part 32 includes a first heat dissipation plate 321 and a second heat dissipation plate 322. The first heat dissipation plate 321 and the second heat dissipation plate 322 are stacked in the same thickness direction, and the second pipe section 42 cooperates with at least one of the first heat dissipation plate 321 and the second heat dissipation plate 322.

[0084] Such as Figure 2 shown, taking the circuit board 10 as a reference, the substrate 11 is located on the inner side, the heat generating device 12 is located on the outer side, and the first heat dissipation plate 321 is located on the inner side of the second heat dissipation plate 322.

[0085] Optionally, as Figure 2 shown, the second pipe section 42 can cooperate with the first heat dissipation plate 321 alone; or, alternatively, the second pipe section 42 can cooperate with the second heat dissipation plate 322 alone; or, alternatively, the second pipe section 42 can be clamped between the first heat dissipation plate 321 and the second heat dissipation plate 322 and cooperate with both the first heat dissipation plate 321 and the second heat dissipation plate 322.

[0086] In some embodiments of the present utility model, such as Figure 2 and Figure 7 shown, a fitting groove for embedding the heat dissipation pipe 60 is formed between the first heat dissipation plate 321 and the second heat dissipation plate 322, and the first heat dissipation plate 321 and the second heat dissipation plate 322 jointly limit the heat dissipation pipe 60. After the first part 31 is fitted with the heat generating device 12, the heat dissipation pipe 60, the first heat dissipation plate 321 and the second heat dissipation plate 322 can be assembled; or the heat dissipation pipe 60, the first heat dissipation plate 321 and the second heat dissipation plate 322 can be assembled first, and then the first part 31 and the heat generating device 12 can be assembled, which can be selected according to actual needs.

[0087] In some embodiments of the present utility model, such as Figure 2 and Figure 7 shown, the first pipe section 41 is embedded in the first part 31, and the second pipe section 42 is embedded in one of the first heat dissipation plate 321 and the second heat dissipation plate 322. The connection stability between the heat pipe 4 and the heat dissipation body 3 can be improved, and the embedded arrangement of the heat pipe 4 can also protect the heat pipe 4 and improve the working reliability of the heat pipe 4.

[0088] In some embodiments of the present utility model, such as Figures 8 - 11 shown, the heat dissipation body 3 further includes a third part 33. The third part 33 is connected between the first part 31 and the second part 32, and the third pipe section 43 is in heat transfer cooperation with the third part 33.

[0089] The third part 33 is connected between the first part 31 and the second part 32. The third part 33 can also transfer heat between the first part 31 and the second part 32, and the third part 33 is in heat transfer cooperation with the third pipe section 43, which can further improve the heat transfer speed of the heat dissipation structure 20.

[0090] In addition, by connecting the third part 33 between the first part 31 and the second part 32, the third part 33 can also support the third pipe section 43, thereby improving the layout stability of the third pipe section 43 and enhancing the working reliability of the heat pipe 4.

[0091] In some embodiments of the present invention, as Figures 8 - 11 shown, the heat dissipation structure 20 includes a heat conducting plate 2. The heat conducting plate 2 is an integrally formed part and includes a first plate portion 21, a second plate portion 22, and a third plate portion 23. The first plate portion 21 constitutes the first part 31, the second plate portion 22 participates in constituting the second part 32, the third plate portion 23 constitutes the third part 33. The first pipe section 41 cooperates with the first plate portion 21, the second pipe section 42 cooperates with the second plate portion 22, and the third pipe section 43 cooperates with the third plate portion 23.

[0092] The first pipe section 41, the second pipe section 42, and the third pipe section 43 of the heat pipe 4 all cooperate with the heat conducting plate 2, which can not only improve the contact heat transfer effect between the heat pipe 4 and the heat conducting plate 2, but also the heat conducting plate 2 can support the heat pipe 4 and improve the layout stability of the heat pipe 4.

[0093] In some embodiments of the present invention, as Figure 8 、 Figure 9 and Figure 11 shown, the heat pipe 4 is integrally embedded in the heat conducting plate 2. This can not only improve the contact heat transfer effect between the heat pipe 4 and the heat conducting plate 2, but also the embedded layout of the heat pipe 4 can protect the heat pipe 4, improve the layout stability of the heat pipe 4, and enhance the working reliability of the heat pipe 4.

[0094] The heat conducting plate 2 is an integrally formed part, and the heat pipe 4 is integrally embedded in the heat conducting plate 2. As Figures 12 - 15 shown, several embodiments of the cooperation between the heat pipe 4 and the heat conducting plate 2 are shown.

[0095] In some embodiments of the present invention, as Figure 9 and Figure 11 shown, the heat dissipation structure 20 further includes a radiator 5. The radiator 5 cooperates with the second plate portion 22 to jointly constitute the second part 32, and a mating portion 32a is formed between the radiator 5 and the second plate portion 22, or is formed on the radiator 5.

[0096] Optionally, as Figure 8As shown, a fitting portion 32a for embedding the heat dissipation pipe 60 is formed between the radiator 5 and the second plate portion 22. The fitting portion 32a constitutes a fitting groove, and the radiator 5 and the second plate portion 22 jointly limit the heat dissipation pipe 60.

[0097] Optionally, the fitting portion 32a is formed on the radiator 5. After the heat dissipation pipe 60 and the radiator 5 are assembled, the integral formed by the heat dissipation pipe 60 and the radiator 5 is assembled with the second plate portion 22, which facilitates the assembly of the heat dissipation structure 20 and the heat dissipation pipe 60.

[0098] In some embodiments of the present invention, the heat conduction plate 2 and the radiator 5 are metal parts. The metal parts have good heat transfer performance and relatively high structural strength, which is beneficial to improving the heat dissipation efficiency of the heat dissipation structure 20.

[0099] In some embodiments of the present invention, as Figure 7 shown, the substrate 11 and the first plate portion 21 are fixedly connected by the first fastener 81, and the radiator 5 and the second plate portion 22 are fixedly connected by the second fastener 82.

[0100] In some embodiments of the present invention, as Figure 2 , Figure 7 , Figure 8 , Figure 9 and Figure 11 shown, the second part 32 is located on the circumferential side of the first part 31. Taking the plane of the side surface of the substrate 11 close to the first part 31 as the reference plane, the orthographic projection of the second part 32 on the reference plane is located outside the contour range of the orthographic projection of the first part 31 on the reference plane.

[0101] It should be noted that the circumferential side in which the second part 32 is located on the circumferential side of the first part 31 means the position perpendicular to the thickness direction of the substrate 11. The orthographic projection of the first plate on the reference plane 11a has the front direction as the attached Figure 1 shown drawing direction, that is, the thickness direction of the substrate 1111 in the attached Figure 2 figure.

[0102] The second part 32 is located on the circumferential side of the first part 31 so that the orthographic projection of the second part 32 is located outside the orthographic projection contour range of the first part 31, which can reduce the size of the electronic control box 100 in the thickness direction of the substrate 11 and is beneficial to reducing the volume of the electronic control box 100; and compared with setting the second part 32 on the side in the thickness direction of the substrate 11 of the first part 31, the bending amplitude of the heat pipe 4 can be reduced, which is convenient for the forming and assembly of the heat dissipation structure 20.

[0103] In some embodiments of the present invention, as Figure 7As shown, the third pipe section 43 gradually extends in the direction away from the reference plane in the direction from the first part 31 to the second part 32. The second part 32 is arranged relatively farther from the substrate 11 than the first part 31, which can increase the space on the side of the second part 32 facing the substrate 11 and reduce the interference with the circuit board 10.

[0104] In some embodiments of the present invention, as Figure 2 , Figure 8 and Figure 9 shown, the third pipe section 43 gradually extends in the direction close to the reference plane in the direction from the first part 31 to the second part 32. The second part 32 is arranged relatively closer to the substrate 11 than the first part 31, which can reduce the overall height of the heat dissipation structure 20 and is beneficial to reducing the volume of the electric control box 100.

[0105] In some embodiments of the present invention, as Figure 11 shown, the third pipe section 43 extends along a direction parallel to the reference plane in the direction from the first part 31 to the second part 32. The second part 32 is arranged parallel to the substrate 11 relative to the first part 31, which can reduce the overall height of the heat dissipation structure 20 and is beneficial to reducing the volume of the electric control box 100.

[0106] In the first embodiment of the present invention, as Figure 1 and Figure 2 shown, the heat dissipation body 3 does not include the part connecting the first part 31 and the second part 32. The second part 32 is arranged relatively closer to the substrate 11 than the first part 31. The third pipe section 43 gradually extends in the direction close to the reference plane in the direction from the first part 31 to the second part 32. The distance between the surface of the second part 32 away from the substrate 11 and the substrate 11 is smaller than the distance between the surface of the first part 31 away from the substrate 11 and the substrate 11, which can reduce the overall height of the heat dissipation structure 20 and is beneficial to reducing the volume of the electric control box 100.

[0107] In the second embodiment of the present invention, as Figure 7 shown, the heat dissipation body 3 does not include the part connecting the first part 31 and the second part 32. The second part 32 is arranged relatively farther from the substrate 11 than the first part 31. The third pipe section 43 gradually extends in the direction away from the reference plane in the direction from the first part 31 to the second part 32.

[0108] In the third embodiment of the present invention, as Figure 8 shown, the heat dissipation structure 20 includes a heat conducting plate 2. The heat conducting plate 2 is an integrally formed part and includes a first plate portion 21, a second plate portion 22 and a third plate portion 23. The first plate portion 21 constitutes the first part 31, the second plate portion 22 and the radiator 5 together constitute the second part 32, the third plate portion 23 constitutes the third part 33, and the heat pipe 4 is integrally embedded in the heat conducting plate 2.

[0109] The third plate portion 23 gradually extends in the direction from the first plate portion 21 to the second plate portion 22 towards the direction close to the reference plane, and the radiator 5 is stacked outside the second plate portion 22. The third pipe section 43 gradually extends in the direction from the first plate portion 21 to the second plate portion 22 towards the direction close to the reference plane. The distance from the outer surface of the radiator 5 to the reference plane is less than the distance from the outer surface of the first plate portion 21 to the reference plane, which can reduce the overall height of the heat dissipation structure 20 and is beneficial to reducing the volume of the electronic control box 100.

[0110] In the fourth embodiment of the present utility model, as Figure 9 shown, the heat dissipation structure 20 includes a heat conducting plate 2. The heat conducting plate 2 is an integrally formed part and includes a first plate portion 21, a second plate portion 22 and a third plate portion 23. The first plate portion 21 constitutes the first part 31, the second plate portion 22 and the radiator 5 together constitute the second part 32, the third plate portion 23 constitutes the third part 33, and the heat pipe 4 is integrally embedded in the heat conducting plate 2.

[0111] The third plate portion 23 gradually extends in the direction from the first plate portion 21 to the second plate portion 22 towards the direction close to the reference plane, and the radiator 5 is stacked inside the second plate portion 22. The third pipe section 43 gradually extends in the direction from the first plate portion 21 to the second plate portion 22 towards the direction close to the reference plane. The distance from the outer surface of the third plate portion 23 to the reference plane is less than the distance from the outer surface of the first plate portion 21 to the reference plane, which can reduce the overall height of the heat dissipation structure 20 and is beneficial to reducing the volume of the electronic control box 100.

[0112] In the fifth embodiment of the present utility model, as Figure 10 and Figure 11 shown, the heat dissipation structure 20 includes a heat conducting plate 2. The heat conducting plate 2 is an integrally formed part and includes a first plate portion 21, a second plate portion 22 and a third plate portion 23. The first plate portion 21 constitutes the first part 31, the second plate portion 22 and the radiator 5 together constitute the second part 32, the third plate portion 23 constitutes the third part 33, and the heat pipe 4 is integrally embedded in the heat conducting plate 2. The heat conducting plate 2 is a flat plate.

[0113] The first plate portion 21, the second plate portion 22 and the third plate portion 23 are all straight plate-shaped, and the distances from the outer surfaces of the first plate portion 21, the second plate portion 22 and the third plate portion 23 to the reference plane are the same. The third pipe section 43 extends along a direction parallel to the reference plane in the direction from the first part 31 to the second part 32. It can not only improve the structural complexity of the heat conducting plate 2 and reduce the manufacturing difficulty, but also reduce the overall height of the heat dissipation structure 20

[0114] In the sixth embodiment of the present utility model, as Figure 16As shown, the second part 32 and the first part 31 are located on both sides in the thickness direction of the substrate 11, and the third pipe segment 43 is bent from one side in the thickness direction of the substrate 11 to the other side in the thickness direction of the substrate 11.

[0115] The first part 31 and the second part 32 are respectively located on both sides in the thickness direction of the substrate 11, which can reduce the occupation of the space perpendicular to the thickness direction of the substrate 11. And the second part 32 is far from the heating device 12, which can reduce the pulling force on the pins of the heating device 12, thereby extending the service life of the heating device 12.

[0116] The first pipe segment 41 cooperates with the first part 31, and the second pipe segment 42 cooperates with the second part 32. Therefore, the first pipe segment 41 and the second pipe segment 42 are respectively located on both sides in the thickness direction of the substrate 11, and the third pipe segment 43 is bent from one side in the thickness direction of the substrate 11 to the other side in the thickness direction of the substrate 11 to connect the first pipe segment 41 and the second pipe segment 42.

[0117] The air conditioner 1000 according to the second aspect of the present invention will be described below with reference to the accompanying drawings.

[0118] The air conditioner 1000 according to an embodiment of the present invention includes the electric control box 100 of the first aspect of the present invention.

[0119] The air conditioner 1000 according to an embodiment of the present invention can improve the working reliability of the air conditioner 1000 by applying the electric control box 100 of the first aspect.

[0120] In some embodiments of the present invention, as Figure 17 shown, the electric control box 100 is provided in the outdoor unit 200 of the air conditioner 1000, and at least part of the refrigerant pipe 300 in the outdoor unit 200 serves as the heat dissipation pipe 60.

[0121] Using the refrigerant pipe 300 in the outdoor unit 200 as the heat dissipation pipe 60 to dissipate heat from the electric control box 100 eliminates the need to additionally provide a heat dissipation component to cooperate with the electric control box 100, which not only reduces the manufacturing cost but also improves the working reliability of the air conditioner 1000.

[0122] In some embodiments of the present invention, the air conditioner 1000 includes: a compressor, a condenser, an evaporator, and a throttling device. The condenser is provided on the first refrigerant flow path from the exhaust port of the compressor to the throttling device, the evaporator is provided between the throttling device and the suction port of the compressor on the second refrigerant flow path, and the refrigerant pipe 300 in the outdoor unit 200 on the second refrigerant flow path is embedded in the fitting portion 32a.

[0123] The compressor compresses the refrigerant into a high-temperature and high-pressure gaseous refrigerant. After the high-temperature and high-pressure gaseous refrigerant is discharged from the exhaust port of the compressor, it flows along the first refrigerant flow path to the condenser. The refrigerant liquefies and releases heat in the condenser, heating the flowing air stream. Subsequently, the liquefied low-temperature and high-pressure liquid refrigerant flows along the first refrigerant flow path to the throttling device. The throttling device reduces the pressure of the refrigerant, and the low-temperature and low-pressure liquid refrigerant flows along the second refrigerant flow path to the evaporator. The refrigerant vaporizes and absorbs heat in the evaporator, cooling the flowing air stream. Subsequently, the vaporized low-temperature and low-pressure gaseous refrigerant flows back to the compressor along the second refrigerant flow path.

[0124] The refrigerant in the second refrigerant flow path is a low-temperature refrigerant. Therefore, at least part of the refrigerant pipe 300 of the second refrigerant flow path located in the outdoor unit 200 is embedded in the fitting portion 32a as a heat dissipation pipe 60 to dissipate heat from the electronic control box 100, thereby improving the heat dissipation efficiency of the electronic control box 100.

[0125] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present invention.

[0126] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, "a plurality" means two or more, unless otherwise specifically defined.

[0127] In the present invention, unless otherwise clearly specified and defined, the terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0128] In the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "below" and "beneath" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply indicates that the horizontal height of the first feature is less than that of the second feature.

[0129] In the description of this specification, the descriptions referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0130] Although the embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and purposes of the present utility model, and the scope of the present utility model is defined by the claims and their equivalents.

Claims

1. An electronic control box, characterized in that, Comprising: A circuit board, the circuit board including a substrate and a heating device disposed on the substrate; A heat dissipation structure, the heat dissipation structure including a heat dissipation body and a heat pipe, the heat dissipation body including a first part and a second part, the first part being disposed on the heating device and in heat transfer cooperation with the heating device, the second part being separated from the first part, and the second part having a mating portion for embedding the heat dissipation pipe, the heat pipe including a first pipe section mating with the first part, a second pipe section mating with the second part, and a third pipe section extending from the first part to the second part and connecting the first pipe section and the second pipe section.

2. The electronic control box according to claim 1, characterized in that, A plurality of the heat pipes are spaced apart.

3. The electronic control box according to claim 2, characterized in that, The third pipe sections of the plurality of heat pipes are arranged in parallel.

4. The electronic control box according to claim 1, characterized in that, The first pipe section is a straight pipe, or a curved pipe, or a bent pipe; the second pipe section is a straight pipe, or a curved pipe, or a bent pipe; the third pipe section is a straight pipe, or a curved pipe, or a bent pipe.

5. The electronic control box according to claim 1, characterized in that, The first part and the second part are spaced apart, and the heat dissipation body does not include a part connecting the first part and the second part.

6. The electronic control box according to claim 5, wherein, The second part includes a first heat dissipation plate and a second heat dissipation plate, the first heat dissipation plate and the second heat dissipation plate being stacked in the same thickness direction, and the second pipe section mating with at least one of the first heat dissipation plate and the second heat dissipation plate.

7. The electronic control box according to claim 6, characterized in that, The first pipe section is embedded in the first part, and the second pipe section is embedded in one of the first heat dissipation plate and the second heat dissipation plate.

8. The electronic control box according to claim 1, characterized in that, The heat dissipation body further includes a third part, the third part being connected between the first part and the second part, and the third pipe section being in heat transfer cooperation with the third part.

9. The electronic control box according to claim 8, characterized in that, The heat dissipation structure includes a heat conduction plate, the heat conduction plate being an integrally formed part and including a first plate part, a second plate part, and a third plate part, the first plate part constituting the first part, the second plate part participating in constituting the second part, the third plate part constituting the third part, the first pipe section mating with the first plate part, the second pipe section mating with the second plate part, and the third pipe section mating with the third plate part.

10. The electronic control box according to claim 9, characterized in that, The heat pipe is integrally embedded in the heat conduction plate.

11. The electronic control box according to claim 9, wherein, The heat dissipation structure further includes a radiator, the radiator mating with the second plate part to jointly constitute the second part, and the mating portion being formed between the radiator and the second plate part, or being formed on the radiator.

12. The electronic control box according to claim 1, characterized in that, The second part is located on the circumferential side of the first part. Taking the plane of the side surface of the substrate close to the first part as a reference plane, the orthographic projection of the second part on the reference plane is located outside the contour range of the orthographic projection of the first part on the reference plane.

13. The electronic control box according to claim 12, characterized in that, In the direction from the first part to the second part, the third pipe section gradually extends in a direction away from the reference plane, or gradually extends in a direction close to the reference plane, or extends along a direction parallel to the reference plane.

14. The electronic control box according to claim 1, characterized in that, The second part and the first part are located on both sides in the thickness direction of the substrate, and the third pipe section is bent from one side in the thickness direction of the substrate to the other side in the thickness direction of the substrate.

15. An air conditioner, characterized in that, Comprising: The electronic control box according to any one of claims 1-14.

16. The air conditioner according to claim 15, characterized in that, The electronic control box is disposed in the outdoor unit of the air conditioner, and at least part of the refrigerant pipe in the outdoor unit serves as the heat dissipation pipe.

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