Capillary enhanced vapor chamber at heat source
Through the heat-smoothing plate designed with stainless steel material and capillary copper sheet structure, the problem of heat cannot be evenly dispersed at the heat source position is solved, and efficient heat conduction and stable heat dissipation effect are achieved.
Patent Information
- Application Number
- CN202422354034.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-26
AI Technical Summary
When the traditional heat-smoothing plate is concentrated in the heat source position, the capillary structure's thermal conduction performance decreases, resulting in the inability to quickly and uniformly disperse the heat and reduce the heat dissipation efficiency.
The top cover, bottom plate, positioning frame and capillary copper sheet structure is adopted, combined with the airway and vaporization layer design, to enhance the uniform dispersion and condensation of heat, and through the cooperation of capillary copper sheet and condensation plate, the stable conduction of heat is achieved.
The heat dissipation efficiency and structural stability of the heat equalization plate are improved, the fluid drying at the heat source position is avoided, and the rapid and uniform dispersion ability of heat is enhanced.
Smart Images
Figure CN223122016U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat pipes, in particular to a capillary enhanced heat pipe at the heat source. Background Technique
[0002] The heat pipe, also known as the heat equalizing plate, uses the phase change evaporation of the cooling working fluid in the sealed space to quickly spread the heat to the cavity. At the condensation end, after the working fluid condenses into a liquid, it returns to the heat source end through capillary force and gravity. The heat pipe is widely used. In the electronics industry, when the chips and operating components in many electronic products work, a large amount of heat will be generated, and the heat source position is relatively concentrated. In order to achieve a stable and rapid heat dissipation effect, it is necessary to use a heat pipe for auxiliary heat dissipation;
[0003] Some traditional heat pipes, in order to meet the space requirements of thinner electronic products, have gradually evolved in the direction of thinning. In this way, there are some problems that the heat conduction performance of the capillary structure inside the heat pipe decreases. Especially in some positions where the heat source is concentrated, the working fluid vaporizes quickly when heated, resulting in the drying of the fluid at the heat source position and unable to circulate quickly, so that the heat cannot be evenly conducted and dissipated quickly, thus reducing the heat conduction and heat dissipation efficiency of the entire heat pipe. Content of the Utility Model
[0004] The purpose of the utility model is to solve the defects existing in the prior art, and to propose a capillary enhanced heat pipe at the heat source.
[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme: a capillary enhanced heat pipe at the heat source, including a heat pipe body, the heat pipe body includes a top cover above and a bottom plate below, an inner cavity is arranged in the top cover and the bottom plate, a positioning frame one and a positioning frame two are respectively arranged in the inner cavity, a positioning groove one is arranged in the positioning frame one, a capillary copper sheet is arranged in the positioning groove one, an air duct is arranged on the capillary copper sheet, and a vaporization layer is arranged at the top of the capillary copper sheet, a positioning groove two is arranged in the positioning frame two, a condensation plate is arranged in the positioning groove two, and a liquid injection port communicated with the inner cavity is arranged on the heat pipe body.
[0006] As a further description of the above technical scheme:
[0007] The top cover, the bottom plate, the positioning frame one and the positioning frame two are all made of stainless steel.
[0008] As a further description of the above technical scheme:
[0009] A plurality of the air ducts are arranged and evenly distributed on the capillary copper sheet.
[0010] As a further description of the above technical scheme:
[0011] A fixing opening one is provided on the first positioning frame, the vaporization layer is located within the fixing opening one, a fixing opening two is provided on the second positioning frame, and the second positioning groove is arranged within the fixing opening two.
[0012] As a further description of the above technical solution:
[0013] A through opening is provided at the connection position between the first positioning frame and the second positioning frame, and the position of the through opening corresponds to the liquid injection port.
[0014] As a further description of the above technical solution:
[0015] Corresponding positions on one side of the outer surfaces of the top cover and the bottom plate are fixedly connected with liquid injection frames respectively, and liquid injection holes communicating with the liquid injection port are arranged on the liquid injection frames.
[0016] The utility model has the following beneficial effects:
[0017] For this capillary enhanced heat pipe at the heat source, through the arrangement of structures such as the top cover, the bottom plate, the first positioning frame, the second positioning frame, the capillary copper sheet, the condensation plate, and the vaporization layer, a stable heat pipe structure can be combined. The main body of the structure is made of stainless steel material, which can ensure the heat dissipation efficiency while having better structural durability, and is not prone to distortion and deformation, enhancing the stability of the entire heat pipe; through the liquefied heat-conducting working fluid injected into the internal cavity and the cooperation with the capillary copper sheet, the heat at the heat source position can be stably guided and evenly distributed and then dissipated. The vaporization layer located at the heat source position on the capillary copper sheet can adsorb and concentrate the fluid and assist in enhancing the divergence speed at the heat source position, thereby assisting in enhancing the heat conduction and dissipation efficiency of the entire heat pipe, improving the heat dissipation effect of the heat pipe, and not easily occurring the situation that the fluid at the heat source position dries up and cannot stably conduct heat. Description of the Drawings
[0018] Figure 1 It is a schematic diagram of the overall structure of a capillary enhanced heat pipe at the heat source proposed by the utility model;
[0019] Figure 2 It is a schematic diagram of the internal structure of the heat pipe of a capillary enhanced heat pipe at the heat source proposed by the utility model;
[0020] Figure 3 It is a front view of a capillary enhanced heat pipe at the heat source proposed by the utility model;
[0021] Figure 4 It is a Figure 3 magnified view of A in a capillary enhanced heat pipe at the heat source proposed by the utility model.
[0022] Legend Explanation:
[0023] 1. Heat pipe body; 2. Top cover; 3. Bottom plate; 4. Built-in cavity; 5. First positioning frame; 6. First positioning groove; 7. Capillary copper sheet; 8. Air duct; 9. First fixing port; 10. Second positioning frame; 11. Second positioning groove; 12. Condensing plate; 13. Second fixing port; 14. Liquid injection port; 15. Through port; 16. Liquid injection frame; 17. Liquid injection hole; 18. Vaporization layer. Detailed implementation manners
[0024] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0025] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention; the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance. In addition, unless otherwise clearly defined and limited, the terms "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.
[0026] Refer to Figures 1-4, an embodiment provided by the present utility model: a capillary enhanced heat pipe at the heat source, including a heat pipe body 1, the heat pipe body 1 includes a top cover 2 above and a bottom plate 3 below, and an internal cavity 4 is provided in the top cover 2 and the bottom plate 3. A positioning frame one 5 and a positioning frame two 10 are respectively arranged in the internal cavity 4. The top cover 2, the bottom plate 3, the positioning frame one 5, and the positioning frame two 10 are all made of stainless steel. The stainless steel material can not only ensure that the entire heat pipe has good heat conduction effect, but also enhance the structural stability of the entire heat pipe, making it not easy to bend, twist and deform, and enhancing the durability of the entire heat pipe structure. A positioning groove one 6 is arranged in the positioning frame one 5, a capillary copper sheet 7 is arranged in the positioning groove one 6, an air duct 8 is arranged on the capillary copper sheet 7, and a plurality of air ducts 8 are arranged and evenly distributed on the capillary copper sheet 7. A vaporization layer 18 is arranged at the top of the capillary copper sheet 7. The capillary copper sheet 7 cooperating with the air duct 8 can evenly dissipate the heat generated at the heat source position, and the setting of the vaporization layer 18 can assist in enhancing the rapid vaporization of the working medium, thereby accelerating the uniform heat dissipation work at the heat source position and enhancing the heat conduction efficiency of the entire heat pipe. A positioning groove two 11 is arranged in the positioning frame two 10, and a condensation plate 12 is arranged in the positioning groove two 11. The setting of the condensation plate 12 can assist in the cooling work of the vaporized working medium, so as to achieve rapid heat dissipation. A liquid injection port 14 communicating with the internal cavity 4 is arranged on the heat pipe body 1. The setting of the liquid injection port 14 can facilitate the injection of the liquefied heat-conducting working medium into the internal cavity 4.
[0027] A fixing port one 9 is arranged on the positioning frame one 5, and the vaporization layer 18 is located in the fixing port one 9. A fixing port two 13 is arranged on the positioning frame two 10, and the positioning groove two 11 is arranged in the fixing port two 13. The structural position of the fixing port can facilitate the liquefied heat-conducting working medium to have a stable vaporization and operation space, so as to achieve a stable heat pipe and heat dissipation effect.
[0028] A through port 15 is arranged at the connecting position of the positioning frame one 5 and the positioning frame two 10, and the position of the through port 15 corresponds to the liquid injection port 14. The setting of the through port 15 can facilitate the injection of the liquefied heat-conducting working medium into the structure.
[0029] Corresponding positions on one side of the outer surfaces of the top cover 2 and the bottom plate 3 are fixedly connected with a liquid injection frame 16, and a liquid injection hole 17 communicating with the liquid injection port 14 is arranged on the liquid injection frame 16. The setting of the liquid injection frame 16 and the liquid injection hole 17 can facilitate the injection of the liquefied heat-conducting working medium.
[0030] Working principle: When using the capillary enhanced heat pipe at the heat source, the center position of the bottom plate 3 is attached to the heat source position. The heat emitted by the heat source is conducted to the capillary copper sheet 7 through the liquefied heat-conducting working medium. The capillary copper sheet 7 cooperates with the air duct 8 to evenly dissipate heat. At the same time, the setting of the vaporization layer 18 can assist in enhancing the heat dissipation efficiency at the heat source position, thereby enhancing the heat dissipation effect of the entire heat pipe. The working medium that is vaporized by heat contacts the condensation plate 12 and can exchange heat with the top cover 2 to achieve stable heat dissipation.
[0031] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A capillary-enhanced heat pipe at a heat source, comprising a heat pipe body (1), characterized in that: The heat pipe body (1) includes a top cover (2) above and a bottom plate (3) below. An internal cavity (4) is provided in the top cover (2) and the bottom plate (3). A first positioning frame (5) and a second positioning frame (10) are respectively provided in the internal cavity (4). A first positioning groove (6) is provided in the first positioning frame (5). A capillary copper sheet (7) is provided in the first positioning groove (6). An air passage (8) is provided on the capillary copper sheet (7), and a vaporization layer (18) is provided at the top of the capillary copper sheet (7). A second positioning groove (11) is provided in the second positioning frame (10). A condensation plate (12) is provided in the second positioning groove (11). A liquid injection port (14) communicating with the internal cavity (4) is provided on the heat pipe body (1).
2. The capillary enhanced heat pipe according to claim 1, wherein: The top cover (2), the bottom plate (3), the first positioning frame (5), and the second positioning frame (10) are all made of stainless steel.
3. The capillary enhanced heat pipe according to claim 1, wherein: A plurality of the air passages (8) are provided and are evenly distributed on the capillary copper sheet (7).
4. A capillary enhanced heat pipe at the heat source according to claim 1, characterized in that: A first fixing port (9) is provided on the first positioning frame (5). The vaporization layer (18) is located in the first fixing port (9). A second fixing port (13) is provided on the second positioning frame (10). The second positioning groove (11) is provided in the second fixing port (13).
5. A capillary enhanced heat pipe at the heat source according to claim 1, characterized in that: A through port (15) is provided at the connection position of the first positioning frame (5) and the second positioning frame (10). The position of the through port (15) corresponds to the liquid injection port (14).
6. The capillary enhanced heat pipe according to claim 1, wherein: Liquid injection frames (16) are fixedly connected to the corresponding positions on one side of the outer surfaces of the top cover (2) and the bottom plate (3). Liquid injection holes (17) communicating with the liquid injection port (14) are provided on the liquid injection frames (16).