Temperature and pressure sensor applied to EGR (Exhaust Gas Recirculation) requirement

By using protective glue in the sensor to protect the welding parts and combining ultrasonic welding design, the failure problem of TMAP sensors due to corrosion in EGR technology is solved, and reliability and durability in harsh environments are achieved.

CN223122259UActive Publication Date: 2025-07-18SHANGHAI WENXIANG AUTOMOTIVE SENSORS
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Patent Information

Application Number
CN202422368659.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2025-07-18
Estimated Expiration
2034-09-27

AI Technical Summary

Technical Problem

During the application of existing TMAP sensors in the EGR technology, the welding position on the PCB board is easily corroded and the product fails.

Method used

The welding parts of the pressure integrated chip and NTC probe are filled with protective glue, combined with ultrasonic welding and removable upper cover design, enhance the protection of the welding parts and meet the needs of use in harsh environments.

Benefits of technology

Through the protection of the protective glue, the compatibility of the sensor in harsh environments is improved, corrosion in the welding area is avoided, and the reliability and service life of the sensor is ensured.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a temperature and pressure sensor applied to EGR (exhaust gas recirculation) requirements, which comprises a shell, a PCBA (printed circuit board assembly) board is mounted in the shell, an air inlet nozzle rod is mounted on a first side of the shell, a channel communicated with the PCBA board and the outside is formed in the air inlet nozzle rod, a pressure integrated chip is arranged at a position, corresponding to the air inlet nozzle rod, on the PCBA board, and the pressure integrated chip is connected with the PCBA board. The PCBA board is welded with an NTC probe extending into the air inlet nozzle rod, the space between the periphery of the pressure integrated chip and the inner side wall of the shell is filled with protective glue, the protective glue covers the welding portion between the pressure integrated chip and the PCBA board and the welding portion between the NTC probe and the PCBA board, and the protective glue can protect the welding portion. The compatibility to a product application environment medium is high, and the device can be used in a severe environment to meet the requirements of an EGR system.
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Description

Technical Field

[0001] The utility model relates to the technical field of automotive power system sensors, and particularly to a temperature and pressure sensor applied to EGR requirements. Background Technique

[0002] The TMAP sensor is a sensor that detects the absolute pressure of the intake manifold behind the throttle valve. It can detect the change of the absolute pressure in the manifold according to the engine speed and load, and convert this information into a signal voltage and send it to the engine control unit (ECU). The ECU controls the size of the basic fuel injection volume according to the size of this signal voltage. The role of the TMAP sensor is very important. It can help the engine control computer more accurately control the fuel injection volume and ignition advance angle, thereby improving the performance and efficiency of the engine; by measuring the air density, the intake manifold pressure sensor can provide more accurate data, enabling the engine to operate normally under different working conditions.

[0003] The EGR technology is to connect an exhaust gas recirculation pipeline to the exhaust system, draw out the exhaust gas and then introduce it into the intake system, so that the exhaust gas is fully mixed with fresh air before entering the cylinder. Since the exhaust gas contains a large amount of polyatomic gases such as CO2, and gases such as CO2 cannot burn but absorb a large amount of heat due to their high specific heat capacity, the highest combustion temperature of the mixture in the cylinder is reduced, thereby reducing the generation amount of NOx.

[0004] At present, due to the corrosive gas contained in the exhaust gas, the conventional TMAP sensor will directly contact the pressure chip pads and NTC pads on the product PCB. During long-term use, the pressure chip pads and NTC pads will be slowly corroded, which will cause the circuit to be corroded and interrupted, and then the product will fail. Content of the Utility Model

[0005] The utility model provides a temperature and pressure sensor applied to EGR requirements, which can solve the problem that the welding positions on the PCB board of the existing TMAP sensor are easily corroded during the application of EGR technology, resulting in product failure.

[0006] To achieve the above object, the present utility model provides the following technical solution: A temperature and pressure sensor applied to EGR requirements, including a housing. A PCBA board is installed inside the housing. An air inlet nozzle rod is installed on the first side of the housing. A channel communicating the PCBA board with the outside is formed inside the air inlet nozzle rod. A pressure integration chip is disposed at a position corresponding to the air inlet nozzle rod on the PCBA board. An NTC probe extending into the air inlet nozzle rod is welded on the PCBA board. A protective glue is filled between the periphery of the pressure integration chip and the inner side wall of the housing. The protective glue covers the welding parts between the pressure integration chip, the NTC probe and the PCBA board. By providing the protective glue, the welding parts can be protected. It has strong compatibility with the media in the product application environment and can be used in harsh environments, meeting the requirements of the EGR system.

[0007] Preferably, a detachable upper cover is provided on the second side of the housing. The PCBA board is installed inside the upper cover, which is convenient for installation and maintenance.

[0008] Preferably, the PCBA board is connected to the housing by a plurality of screws. A sealing ring is installed at the position where the PCBA board is connected to the housing. The PCBA board is firmly installed, and the medium entering through the air inlet nozzle rod will not enter other parts of the PCBA board.

[0009] Preferably, the air inlet nozzle rod and the housing are connected by ultrasonic welding, and at least one circle of welding ribs is provided on the end face of the air inlet nozzle rod connected to the housing, which can ensure the bonding strength between the air inlet nozzle rod and the housing and meet the sealing requirements.

[0010] Preferably, the cross section of the welding rib is in an inverted V shape, which is beneficial to ultrasonic sealing welding.

[0011] Preferably, an outer sealing ring is installed on the outside of the air inlet nozzle rod to meet the use requirements.

[0012] Compared with the prior art, the beneficial effects of the present utility model are:

[0013] By providing a protective glue around the pressure integration chip, the welding parts can be protected. It has strong compatibility with the media in the product application environment and can be used in harsh environments, meeting the requirements of the EGR system. The structure is reasonable, and the installation process is simple and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional exploded state structure diagram of the present utility model;

[0015] Figure 2 It is a three-dimensional structure diagram of the housing of the present utility model;

[0016] Figure 3 Cross-sectional structure diagram of the air inlet nozzle rod of the present utility model;

[0017] Figure 4 Cross-sectional structure diagram of the assembled state of the present utility model.

[0018] Reference numerals:

[0019] 1. Upper cover, 2. Screw, 3. PCBA board, 4. Pressure integration chip, 5. Sealing ring, 6. Outer shell, 7. Protective glue, 8. Air inlet nozzle rod, 9. Outer sealing ring, 10. NTC probe, 11. Welding rib. Specific implementation manners

[0020] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model.

[0021] As Figures 1-4 shown, in order to solve the problem that the welding position on the PCB board of the existing TMAP sensor is easily corroded during the application of the EGR technology, resulting in product failure, the present utility model provides the following technical solutions: A temperature and pressure sensor applied to EGR requirements, an outer shell 6, a PCBA board 3 is installed inside the outer shell 6, an air inlet nozzle rod 8 is installed on the first side of the outer shell 6, a channel communicating the PCBA board 3 with the outside is formed inside the air inlet nozzle rod 8, a pressure integration chip 4 is arranged at a position corresponding to the air inlet nozzle rod 8 on the PCBA board 3, an NTC probe 10 extending into the air inlet nozzle rod 8 is welded on the PCBA board 3, a protective glue 7 is filled between the periphery of the pressure integration chip 4 and the inner side wall of the outer shell 6, and the protective glue 7 covers the welding parts between the pressure integration chip 4 and the NTC probe 10 and the PCBA board 3. By setting the protective glue 7, the welding parts can be protected, and the compatibility with the medium of the product application environment is relatively strong, and it can be used in a harsh environment to meet the requirements of the EGR system.

[0022] Specifically, the protective glue 7 can be a gel or an epoxy glue, and is arranged on the PCBA board 3 by coating. The pressure integration chip 4 is surface-mounted and welded on the PCBA board 3. When assembling the temperature and pressure sensor in this embodiment, first surface-mount and weld the pressure integration chip 4 on the PCBA board 3, then weld the NTC probe 10 on the PCBA board 3, and then connect the PCBA board 3 to the outer shell 6 through a plurality of screws 2. A sealing ring 5 is installed at the connection position between the PCBA board 3 and the outer shell 6. The PCBA board 3 is firmly installed, and the medium entering through the air inlet nozzle rod 8 will not enter other parts of the PCBA board 3.

[0023] Next, turn the outer shell 6 over so that the first side of the outer shell 6 faces upward, and apply a protective glue 7 to the area between the periphery of the pressure integration chip 4 and the inner wall of the outer shell 6, making sure to cover the welding position. Then, connect the air inlet nozzle rod 8 to the outer shell 6 by ultrasonic welding, so that the air inlet nozzle rod 8 and the outer shell 6 can meet the sealing requirement of up to 700 kPa.

[0024] For the convenience of installation and maintenance, a detachable upper cover 1 is provided on the second side of the outer shell 6. The PCBA board 3 is installed inside the upper cover 1. When installing the PCBA board 3, remove the upper cover 1 and then snap it onto the outer shell 6. The inner side of the upper cover 1 holds the PCBA board 3, ensuring the reliability of the installation of the PCBA board 3.

[0025] Among them, at least one circle of welding ribs 11 is provided on the end surface of the air inlet nozzle rod 8 connected to the outer shell 6, which can ensure the bonding strength between the air inlet nozzle rod 8 and the outer shell 6 and meet the sealing requirements. At the same time, the cross-section of the welding rib 11 is in an inverted V shape, which is beneficial to ultrasonic sealing welding.

[0026] In this embodiment, an outer sealing ring 9 is installed on the outer side of the air inlet nozzle rod 8 to meet the use requirements.

[0027] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative positional relationship and movement conditions between components in a certain specific posture (as shown in the drawings). If this specific posture changes, then the directional indications will also change accordingly.

[0028] In addition, in the present invention, descriptions such as "first" and "second" are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0029] In the present invention, unless otherwise clearly specified and limited, terms such as "connection" and "fixation" should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In addition, the technical solutions between the various embodiments of the present utility model can be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement it. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

Claims

1. A temperature and pressure sensor applied to EGR requirements, characterized in that Comprising: A housing (6), inside which a PCBA board (3) is installed. An air inlet nozzle rod (8) is installed on the first side of the housing (6). A channel communicating the PCBA board (3) with the outside is formed inside the air inlet nozzle rod (8). A pressure integration chip (4) is arranged at a position corresponding to the air inlet nozzle rod (8) on the PCBA board (3). An NTC probe (10) extending into the air inlet nozzle rod (8) is welded on the PCBA board (3). A protective glue (7) is filled between the periphery of the pressure integration chip (4) and the inner side wall of the housing (6), and the protective glue (7) covers the welding parts between the pressure integration chip (4) and the NTC probe (10) and the PCBA board (3).

2. The temperature and pressure sensor applied to the EGR requirement according to claim 1, wherein: A detachable upper cover (1) is arranged on the second side of the housing (6), and the PCBA board (3) is installed inside the upper cover (1).

3. The temperature and pressure sensor applied to the EGR requirement according to claim 1, characterized in that: The PCBA board (3) is connected to the housing (6) by a plurality of screws (2), and a sealing ring (5) is installed at the connection position between the PCBA board (3) and the housing (6).

4. The temperature and pressure sensor applied to the EGR requirement according to claim 1, characterized in that: The air inlet nozzle rod (8) is connected to the housing (6) by ultrasonic welding, and at least one circle of welding ribs (11) is arranged on the end face of the air inlet nozzle rod (8) connected to the housing (6).

5. The temperature and pressure sensor applied to the EGR requirement according to claim 4, characterized in that: The cross section of the welding rib (11) is in an inverted V shape.

6. The temperature and pressure sensor applied to the EGR requirement according to claim 1, characterized in that: An outer sealing ring (9) is installed on the outer side of the air inlet nozzle rod (8).