High-efficiency silicon wafer defect detection device

Abstract

According to the technical scheme, the efficient silicon wafer defect detection device is characterized in that the efficient silicon wafer defect detection device comprises a detection box, a control computer is fixedly installed on one side of a box door, an electron microscope is fixedly installed on the top face of the detection box, a connecting hole is formed in the top face of the detection box, and the control computer is fixedly installed on the control computer; a detection head of the electron microscope extends into the detection box through the connecting hole; the overturning assembly is arranged in the detection box and used for overturning the detected silicon wafer, by arranging the overturning assembly, the two faces of the silicon wafer can be fully detected, the problem of missing detection possibly existing in a traditional detection mode is avoided, the single-time detection range is wider and more comprehensive, the detection effect is improved, and the detection efficiency is improved. According to the silicon wafer detection device, the detection period is shortened, the detection efficiency is improved, the comprehensiveness, timeliness and reliability of the detection effect are further improved, and the silicon wafer to be detected can be placed in the placement groove in the placement plate through the arrangement of the placement plate.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to an efficient silicon wafer defect detection device. Background Art

[0002] The main application fields of silicon carbide wafers are LED solid lighting and high-frequency devices. This material has excellent properties such as a bandgap, drift velocity, breakdown voltage, thermal conductivity, and high temperature resistance that are several times higher than those of traditional silicon. It has irreplaceable advantages in electronic application fields such as high temperature, high pressure, high frequency, high power, optoelectronics, radiation resistance, and microwave, as well as in extreme environment applications such as aerospace, military, and nuclear energy. Currently, the observation of silicon wafer defects is mainly through microscopic observation, and the characteristic morphologies exhibited by microtubes are used to distinguish and measure them.

[0003] For example, the Chinese patent with the publication number CN216622212U proposes a microtube defect detection device for silicon carbide wafers after corrosion. The assembly includes: a base and a detection box fixedly installed on one side of the top of the base. It also includes a maintenance mechanism, an adjustment support mechanism, a light source adjustment mechanism, a rotation detection mechanism, and an angle adjustment mechanism. The maintenance mechanism is fixedly installed on both sides of the inner wall of the detection box. By setting the adjustment support mechanism and the rotation detection mechanism, pulling the drawplate causes the drawplate to drive the pulley to move and extract inside the slide rail, thereby driving the electric lifting sleeve rod to move and extract, which can place the wafer more conveniently. The staff does not need to put their hands into the detection box, making the placement of the wafer more stable, avoiding the wafer position deviation and affecting the inspection effect. Then, pushing the anti-slip pad causes the anti-slip pad to drive the movable hook at the bottom to contact both sides of the movable block. Continuing to push makes the two sides of the movable hook fold inward until it passes through the movable block, and then the movable hook rebounds.

[0004] The above solution still has the following disadvantages: During the detection process, the silicon wafer cannot be directly flipped, resulting in low detection efficiency and missed detection during detection. Summary of the Utility Model

[0005] Aiming at the deficiencies of the prior art, the utility model provides an efficient silicon wafer defect detection device, which solves the problems that the silicon wafer cannot be directly flipped during the detection process, resulting in low detection efficiency and missed detection during detection.

[0006] The above technical objectives of the utility model are achieved through the following technical solutions:

[0007] An efficient silicon wafer defect detection device, comprising: a detection box, inside which a box door is provided, on one side of the box door, a control computer is fixedly installed, on the top surface of the detection box, an electron microscope is fixedly installed, a connection hole is opened on the top surface of the detection box, and the detection head of the electron microscope extends into the detection box through the connection hole; a flipping assembly, which is arranged inside the detection box and is used to flip the silicon wafer to be detected.

[0008] By adopting the above technical solution, by setting the flipping assembly, both sides of the silicon wafer can be fully detected, avoiding the possible missed detection problems in the traditional detection method, making the single detection range wider and more comprehensive, improving the detection effect, shortening the detection cycle, improving the detection efficiency, and further improving the comprehensiveness, timeliness and reliability of the detection effect.

[0009] Preferably, the flipping assembly includes: a moving plate, which is arranged inside the detection box, on the top surface of the moving plate, a support plate is fixedly installed, on the top surface of the moving plate, a supporting plate is fixedly installed, a rotating frame is arranged between the support plate and the supporting plate, inside the support plate, a brake motor is fixedly installed, one end of the rotating shaft of the brake motor is fixedly installed with the rotating frame, the rotating shaft on one side of the rotating frame is inserted into the inside of the supporting plate, inside the rotating frame, a placing plate is arranged, and a placing groove is opened on the top surface of the placing plate.

[0010] By adopting the above technical solution, by setting the placing plate, the silicon wafer to be detected can be placed in the placing groove inside the placing plate. During the detection process, by starting the brake motor, the rotating frame is driven to make the placing plate inside it rotate, so that the silicon wafer can be more comprehensively detected by the electron microscope, improving the detection effect.

[0011] Preferably, two linear guide rails are fixedly installed on the inner wall of the rotating frame, on one side of the slider of the linear guide rail, a mounting plate is fixedly installed, on one side of the mounting plate, a sliding rod is fixedly installed, sliding holes are opened on both sides of the placing plate, and the sliding rod is inserted into the inside of the sliding hole.

[0012] By adopting the above technical solution, by setting the linear guide rail, when the linear guide rail is started, it can drive the mounting plate to move, thereby adjusting the horizontal position of the placing plate and improving the detection accuracy.

[0013] Preferably, a retaining disc is threadedly connected inside the placing groove, and both the placing plate and the retaining disc are made of transparent acrylic material.

[0014] By adopting the above technical solution, by setting the retaining plate, the position of the silicon wafer placed inside the placement groove can be limited, preventing it from falling off from the inside of the placement groove during the flipping process. At the same time, the placement plate and the retaining plate are made of transparent materials, enabling the detection light of the control computer to pass through the placement plate and the retaining plate to detect the silicon wafer inside the placement groove, improving the detection effect.

[0015] Preferably, two moving rods are fixedly installed inside the detection box, and two moving holes are opened on one side thereof. The moving rods are inserted into the moving holes.

[0016] By adopting the above technical solution, by setting the moving rods, the staff can pull out the placement plate from the inside of the detection box by pulling the moving plate, facilitating the installation and disassembly of the silicon wafer, improving the practicability, and further improving the detection efficiency.

[0017] Preferably, a limiting plate is fixedly installed on the bottom surface of the moving plate, and a baffle is fixedly installed on the inner bottom surface of the detection box.

[0018] By adopting the above technical solution, by setting the limiting plate, when the moving plate is pulled out to a certain position, the limiting plate contacts the baffle, preventing it from being pulled out again and avoiding the phenomenon of the moving plate falling off, improving the safety of the equipment.

[0019] In summary, the main beneficial effects of the present utility model are as follows:

[0020] By setting the flipping assembly, both sides of the silicon wafer can be fully detected, avoiding the possible missed detection problems in the traditional detection method, making the single detection range wider and more comprehensive, improving the detection effect, shortening the detection cycle, improving the detection efficiency, and further improving the comprehensiveness, timeliness and reliability of the detection effect.

[0021] By setting the linear guide rail, when the linear guide rail is started, it can drive the mounting plate to move, thereby adjusting the horizontal position of the placement plate and improving the detection accuracy. By setting the retaining plate, the position of the silicon wafer placed inside the placement groove can be limited, preventing it from falling off from the inside of the placement groove during the flipping process. At the same time, the placement plate and the retaining plate are made of transparent materials, enabling the detection light of the control computer to pass through the placement plate and the retaining plate to detect the silicon wafer inside the placement groove, improving the detection effect. By setting the moving rods, the staff can pull out the placement plate from the inside of the detection box by pulling the moving plate, facilitating the installation and disassembly of the silicon wafer, improving the practicability, and further improving the detection efficiency. By setting the limiting plate, when the moving plate is pulled out to a certain position, the limiting plate contacts the baffle, preventing it from being pulled out again and avoiding the phenomenon of the moving plate falling off, improving the safety of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0023] Figure 2 is a structural schematic diagram of the detection box of the present utility model;

[0024] Figure 3 is a structural schematic diagram of the rotating frame of the present utility model;

[0025] Figure 4 is a structural schematic diagram of the placement plate of the present utility model.

[0026] Reference numerals: 1, detection box; 2, box door; 3, control computer; 4, electron microscope; 5, connection hole; 6, moving plate; 7, support plate; 8, support board; 9, rotating frame; 10, brake motor; 11, placement plate; 12, placement groove; 13, linear guide rail; 14, mounting plate; 15, sliding rod; 16, sliding hole; 17, retaining disc; 18, moving rod; 19, moving hole; 20, limiting plate; 21, baffle plate. Detailed implementation manners

[0027] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0028] Reference Figure 1 , Figure 2 , Figure 3 and Figure 4, An efficient silicon wafer defect detection device, including a detection box 1. Inside the detection box 1, there is a box door 2. On one side of the box door 2, a control computer 3 is fixedly installed. On the top surface of the detection box 1, an electron microscope 4 is fixedly installed. A connection hole 5 is opened on the top surface of the detection box 1. The detection head of the electron microscope 4 extends into the detection box 1 through the connection hole 5. Inside the detection box 1, there is a flipping component for flipping the silicon wafer to be detected. The flipping component includes a moving plate 6. The moving plate 6 is arranged inside the detection box 1. On the top surface of the moving plate 6, a support plate 7 is fixedly installed. On the top surface of the moving plate 6, a supporting plate 8 is fixedly installed. Between the support plate 7 and the supporting plate 8, there is a rotating frame 9. Inside the support plate 7, a brake motor 10 is fixedly installed. One end of the rotating shaft of the brake motor 10 is fixedly installed with the rotating frame 9. The rotating shaft on one side of the rotating frame 9 is inserted into the inside of the supporting plate 8. Inside the rotating frame 9, there is a placement plate 11. On the top surface of the placement plate 11, a placement groove 12 is opened. By setting the placement plate 11, the silicon wafer to be detected can be placed in the placement groove 12 inside the placement plate 11. During the detection process, by starting the brake motor 10, the rotating frame 9 is driven to make the placement plate 11 inside it rotate, so that the silicon wafer can be more comprehensively detected by the electron microscope 4, improving the detection effect.

[0029] Reference Figure 2 , Figure 3 and Figure 4, two linear guide rails 13 are fixedly installed on the inner wall of the rotating frame 9. One side of the slider of the linear guide rail 13 is fixedly installed with a mounting plate 14. One side of the mounting plate 14 is fixedly installed with a sliding rod 15. Sliding holes 16 are opened on both sides of the placing plate 11. The sliding rod 15 is inserted into the sliding hole 16. By setting the linear guide rail 13, when the linear guide rail 13 is started, it can drive the mounting plate 14 to move, so as to adjust the horizontal position of the placing plate 11 and improve the detection accuracy. A retaining disc 17 is threadedly connected inside the placing groove 12. Both the placing plate 11 and the retaining disc 17 are made of transparent acrylic material. By setting the retaining disc 17, the position of the silicon wafer placed inside the placing groove 12 can be limited to prevent it from falling out of the placing groove 12 during the flipping process. At the same time, since the placing plate 11 and the retaining disc 17 are made of transparent materials, the detection light of the control computer 3 can pass through the placing plate 11 and the retaining disc 17 to detect the silicon wafer inside the placing groove 12, improving the detection effect. Two moving rods 18 are fixedly installed inside the detection box 1. Two moving holes 19 are opened on one side. The moving rods 18 are inserted into the moving holes 19. By setting the moving rods 18, the staff can pull out the placing plate 11 from inside the detection box 1 by pulling the moving plate 6, which is convenient for the installation and disassembly of the silicon wafer, improving the practicability and further improving the detection efficiency. A limiting plate 20 is fixedly installed on the bottom surface of the moving plate 6. A baffle 21 is fixedly installed on the inner bottom surface of the detection box 1. By setting the limiting plate 20, when the moving plate 6 is pulled out to a certain position, the limiting plate 20 contacts the baffle 21, making it impossible to be pulled out again and avoiding the phenomenon of the moving plate 6 falling off, improving the safety of the equipment.

[0030] Working principle: Please refer to Figures 1-4As shown, during use, by setting up the electron microscope 4, the silicon wafer placed inside the detection box 1 can be scanned and detected. By setting up the placement plate 11, the silicon wafer to be detected can be placed in the placement groove 12 inside the placement plate 11. During the detection process, by starting the brake motor 10, the rotating frame 9 is driven to make the placement plate 11 inside it rotate, so that the silicon wafer can be more comprehensively detected by the electron microscope 4, improving the detection effect. By setting up the linear guide rail 13, when the linear guide rail 13 is started, it can drive the mounting plate 14 to move, thereby adjusting the horizontal position of the placement plate 11 and improving the detection accuracy. By setting up the retaining disk 17, the position of the silicon wafer placed inside the placement groove 12 can be limited to prevent it from falling off the inside of the placement groove 12 during the flipping process. At the same time, the placement plate 11 and the retaining disk 17 are made of transparent materials, enabling the detection light of the control computer 3 to pass through the placement plate 11 and the retaining disk 17 to detect the silicon wafer inside the placement groove 12, improving the detection effect. By setting up the moving rod 18, the staff can pull out the placement plate 11 from the inside of the detection box 1 by pulling the moving plate 6, which is convenient for the installation and disassembly of the silicon wafer, improving the practicality and further improving the detection efficiency. By setting up the limiting plate 20, when the moving plate 6 is pulled out to a certain position, the limiting plate 20 contacts the baffle 21, making it impossible to be pulled out again and avoiding the phenomenon of the moving plate 6 falling off, improving the safety of the equipment.

[0031] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An efficient silicon wafer defect detection device, characterized in that, Comprising: A detection box (1), inside which there is a box door (2). On one side of the box door (2), a control computer (3) is fixedly installed. On the top surface of the detection box (1), an electron microscope (4) is fixedly installed. A connection hole (5) is opened on the top surface of the detection box (1), and the detection head of the electron microscope (4) extends into the detection box (1) through the connection hole (5). A flipping assembly, which is arranged inside the detection box (1) and is used for flipping the silicon wafer to be detected.

2. The high-efficiency silicon wafer defect detection device according to claim 1, characterized in that, The flipping assembly includes: A moving plate (6), which is arranged inside the detection box (1). On the top surface of the moving plate (6), a support plate (7) is fixedly installed. On the top surface of the moving plate (6), a support board (8) is fixedly installed. A rotating frame (9) is arranged between the support plate (7) and the support board (8). Inside the support plate (7), a brake motor (10) is fixedly installed. One end of the rotating shaft of the brake motor (10) is fixedly installed with the rotating frame (9). The rotating shaft on one side of the rotating frame (9) is inserted into the inside of the support board (8). Inside the rotating frame (9), a placement plate (11) is arranged. A placement groove (12) is opened on the top surface of the placement plate (11).

3. The high-efficiency silicon wafer defect detection device according to claim 2, wherein On the inner wall of the rotating frame (9), two linear guide rails (13) are fixedly installed. On one side of the slider of the linear guide rail (13), a mounting plate (14) is fixedly installed. On one side of the mounting plate (14), a sliding rod (15) is fixedly installed. Sliding holes (16) are opened on both sides of the placement plate (11), and the sliding rod (15) is inserted into the sliding holes (16).

4. An efficient silicon wafer defect detection device according to claim 2, characterized in that, A retaining disc (17) is threadedly connected inside the placement groove (12). Both the placement plate (11) and the retaining disc (17) are made of transparent acrylic material.

5. The highly efficient silicon wafer defect detection device according to claim 2, characterized in that, Two moving rods (18) are fixedly installed inside the detection box (1). Two moving holes (19) are opened on one side, and the moving rods (18) are inserted into the moving holes (19).

6. The high-efficiency silicon wafer defect detection device according to claim 2, characterized in that, A limiting plate (20) is fixedly installed on the bottom surface of the moving plate (6). A baffle (21) is fixedly installed on the inner bottom surface of the detection box (1).

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