Heat dissipation table for testing hybrid integrated circuit

Abstract

The utility model provides a heat dissipation table for testing a hybrid integrated circuit. The heat dissipation table comprises a heat dissipation base, a support, a pressing rod, a pressing plate mechanism and a locking mechanism. Wherein the heat dissipation base is provided with a tested product placing area; the bracket comprises a first bracket and a second bracket which are arranged on the heat dissipation base; the first end of the pressing rod is rotatably connected with the first support, and the second end of the pressing rod and the second support can be locked or unlocked through a locking structure. The pressing plate mechanism comprises a pressing plate and an elastic piece, the pressing plate is movably connected with the pressing rod, and the elastic piece is arranged between the pressing plate and the pressing rod; the pressing plate is used for applying pressure to the tested product placing area when the second end of the pressing rod and the second support are locked. The heat dissipation table has better heat dissipation performance when the power parameters of the hybrid integrated circuit are tested; moreover, the disassembly and assembly time of the radiator by an operator is reduced, and the unnecessary time waste is effectively reduced, thereby improving the product testing efficiency, and reducing the production cost.

Description

Technical Field

[0001] The present disclosure relates to the technical field of hybrid integrated circuit manufacturing and testing, and particularly relates to a heat dissipation platform for hybrid integrated circuit testing. Background Art

[0002] Hybrid integrated circuits include thin-film hybrid integrated circuits and thick-film hybrid integrated circuits. The process of thick-film hybrid integrated circuits includes fabricating thick-film elements and their interconnections on a substrate by a film-forming method, and hybridly assembling discrete semiconductor chips, monolithic integrated circuit chips, and passive devices on the same substrate, and then adding an outer package. Thick-film hybrid circuits, with their wide range of component parameters, high precision and stability, great flexibility in circuit design, short research and development and production cycles, and suitability for various small-batch productions, can complement and penetrate each other with semiconductor integrated circuits, and have become an important part of integrated circuits, being widely used in electric control equipment systems and playing an important role in the miniaturization of electronic devices.

[0003] In terms of electrical performance, thick-film hybrid integrated circuits are required to withstand greater power, that is, to bear higher voltages and larger currents. This leads to the fact that power semiconductor devices such as insulated gate bipolar transistors (IGBTs), vertical double-diffused metal oxide semiconductor field effect transistors (VDMOSs), transient voltage suppression diodes (TVSs), etc. generate relatively high heat during operation. If the heat dissipation capacity is insufficient, it will affect the stable operation of the product, and in severe cases, it may even cause the product to fail or burn out. For different types of semiconductor products, the thermal designs adopted are mostly different. For thick-film hybrid integrated circuits, installing a heat sink is a relatively direct and effective way to enhance their heat dissipation capacity.

[0004] In order to accurately reflect the performance of thick-film hybrid integrated circuits and prevent product failures caused by insufficient heat dissipation capacity of the product, during the production and testing process of thick-film hybrid integrated circuits, it is also necessary to equip the products or semi-finished products to be tested with heat sinks. Currently, for the testing of thick-film hybrid integrated circuits, it is mostly manual to assemble the products to be tested with heat sinks and then conduct relevant performance tests such as full-power tests. However, assembling the heat sink manually has low efficiency and cannot meet the requirements of current large-scale production. Summary of the Utility Model

[0005] To solve the above problems existing in the prior art, an embodiment of the present disclosure provides a heat dissipation platform for hybrid integrated circuit testing. This heat dissipation platform includes a heat dissipation base, a bracket, a pressure rod, a pressing plate mechanism, and a locking mechanism;

[0006] The heat dissipation base has a placement area for the product to be tested;

[0007] The bracket includes a first bracket and a second bracket provided on the heat dissipation base;

[0008] The first end of the compression bar is rotatably connected to the first bracket, and the second end can be locked or unlocked with the second bracket through a locking structure;

[0009] The pressing plate mechanism includes a pressing plate and an elastic member. The pressing plate is movably connected to the compression bar, and the elastic member is disposed between the pressing plate and the compression bar;

[0010] The pressing plate is used to apply pressure to the area where the product to be measured is placed when the second end of the compression bar is locked with the second bracket.

[0011] In use, the product to be measured (such as a thick film hybrid integrated circuit to be tested) can be placed in the aforementioned area where the product to be measured is placed, and then the second end of the compression bar is pressed down and locked to the second bracket. With the elastic force of the elastic member, the pressing plate in the pressing plate mechanism can press the product to be measured on the heat dissipation base. Due to the good thermal conductivity of the pressing plate / heat dissipation base, the temperature of the product to be measured during testing can be well controlled, and the installation / dismantling is very fast, reducing the working time of the operator and improving the efficiency.

[0012] The aforementioned heat dissipation table can not only be applicable to thick film hybrid integrated circuits, but also be equally applicable to the testing of thin film hybrid integrated circuits. As long as tests that require full power testing and have requirements for heat dissipation performance can use the above heat dissipation table.

[0013] Optionally, a groove is provided at the end of the second bracket away from the heat dissipation base;

[0014] The locking structure includes:

[0015] A limiting piece, which is connected to the opening of the groove through a limiting piece rotating shaft;

[0016] Wherein, the limiting piece can close the opening of the groove by rotating, so that at least part of the compression bar is restricted within the groove.

[0017] In use, the second end of the compression bar can be placed in the groove at the end of the second bracket away from the heat dissipation base, and the limiting piece is rotated to restrict the second end of the compression bar within the groove, thereby realizing the locking of the compression bar.

[0018] Optionally, a compression bar notch is provided at the second end of the compression bar. The compression bar notch is used to reduce the cross-sectional area of the part of the compression bar restricted within the groove, that is, to make the part of the compression bar restricted within the groove thinner. Correspondingly, the groove at the end of the second bracket can be shallower, which can reduce the process time for grooving the second bracket and reduce the production cost of the heat dissipation table itself.

[0019] Optionally, another form of the locking structure includes:

[0020] A locking column, which is disposed at the end of the second bracket away from the heat dissipation base;

[0021] A self-locking member, rotatably connected to the second end of the pressure rod;

[0022] The self-locking member is provided with a hook groove, and can be rotated to embed the locking column into the hook groove to lock the pressure rod and the second bracket, or to disengage the locking column from the hook groove to unlock the pressure rod and the second bracket.

[0023] Optionally, a groove is provided at the end of the second bracket, and the locking column is arranged in the groove. The self-locking member is provided with a guiding inclined surface for guiding the rotation of the self-locking member when the self-locking member contacts the locking column, so that the locking column can be embedded into the hook groove.

[0024] The locking structure of the above structure can achieve self-locking, that is, when the second section of the pressure rod is pressed into the groove, the self-locking member can rotate by itself and hook the locking column, with fewer operating procedures.

[0025] Optionally, the elastic member is a spring, and the pressing plate mechanism further includes a hinge and a positioning column; wherein,

[0026] One end of the positioning column is rotatably connected to the pressing plate through a hinge, and the other end passes through a through hole on the pressure rod;

[0027] The spring is sleeved on the positioning column and is located between the hinge and the pressure rod.

[0028] Through the change in the length of the positioning column penetrating into the through hole on the pressure rod, the pressing plate can perform a certain degree of relative movement of approaching / separating from the pressure rod. When the pressing plate approaches the pressure rod, the spring between the two is compressed and generates an elastic force, and this elastic force enables the pressing plate to tightly press the product to be measured.

[0029] Optionally, the pressing plate has an arched protrusion, and a hinge hole is provided on the arched protrusion; the hinge passes through the hinge hole to enable the pressing plate and the positioning column to be rotatably connected. The pressing plate has a certain degree of rotational freedom relative to the positioning column, and can adapt to the angular deviation between the positioning column and the normal direction of the product to be measured, ensuring the balance of the pressure applied to the product to be measured.

[0030] Optionally, the pressing plate mechanism further includes a nut;

[0031] One end of the positioning column passing through the through hole on the pressure rod is provided with a thread and is screwed with the nut. The nut is used to prevent the positioning column, the pressing plate, the spring, etc. from disengaging from the through hole on the pressure rod.

[0032] Optionally, the heat dissipation base includes a first end portion of the heat dissipation base, a second end portion of the heat dissipation base, and a middle portion of the heat dissipation base;

[0033] The width of the middle portion of the heat dissipation base is equal to or less than the first end portion and the second end portion of the heat dissipation base;

[0034] The product placement area to be measured is arranged in the middle portion of the heat dissipation base, the first bracket is arranged at the first end portion of the heat dissipation base, and the second bracket is arranged at the second end portion of the heat dissipation base.

[0035] Optionally, the heat dissipation base is provided with test fixture fixing holes and bracket mounting holes; among them,

[0036] There are multiple test fixture fixing holes, which are respectively arranged at the corners of the heat dissipation base;

[0037] Two bracket mounting holes are respectively arranged at the first end and the second end of the heat dissipation base.

[0038] In summary, by using the heat dissipation table for testing hybrid integrated circuits provided in the present disclosure, not only can better heat dissipation be achieved when testing the power parameters of hybrid integrated circuits; but also the time for operators to disassemble and assemble the radiator is reduced, effectively reducing unnecessary time waste, thereby improving the product testing efficiency and reducing the production cost. Description of the Drawings

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the background art, the following will describe the drawings required to be used in the embodiments of the present disclosure or the background art.

[0040] Figure 1 It is a three-dimensional schematic diagram of the overall heat dissipation table in the present disclosure (self-locking part solution);

[0041] Figure 2 It is a side view schematic diagram of the overall heat dissipation table in the present disclosure (self-locking part solution);

[0042] Figure 3 It is a three-dimensional schematic diagram of the overall heat dissipation table in the present disclosure (self-locking part solution), which highlights the locking mechanism at the end of the pressure rod;

[0043] Figure 4 It is a three-dimensional schematic diagram of the overall heat dissipation table in the present disclosure (limit piece solution);

[0044] Figure 5 It is a schematic diagram of the pressure rod and pressure plate mechanism of the heat dissipation table in the present disclosure (limit piece solution);

[0045] Figure 6 It is a side view schematic diagram of the overall heat dissipation table in the present disclosure (limit piece solution);

[0046] Figure 7 It is a partial schematic diagram of the pressure plate mechanism connected to the pressure rod;

[0047] Figure 8 It is a schematic diagram of the heat dissipation base of the heat dissipation table in the present disclosure;

[0048] Figure 9 It is a three-dimensional schematic diagram of the heat dissipation base of the heat dissipation table in the present disclosure;

[0049] Figure 10 Schematic partial view of the self-locking part of the heat dissipation platform in the present disclosure;

[0050] Figure 11 Schematic view of the pressing plate of the heat dissipation platform in the present disclosure;

[0051] Figure 12 Schematic perspective view of the first bracket of the heat dissipation platform in the present disclosure;

[0052] Figure 13 Schematic side view of the first bracket of the heat dissipation platform in the present disclosure;

[0053] Figure 14 Schematic perspective view of the second bracket of the heat dissipation platform in the present disclosure;

[0054] Figure 15 Schematic side view of the second bracket of the heat dissipation platform in the present disclosure.

[0055] Annotations in the figure:

[0056] 100 Heat dissipation base, 101 First end of the heat dissipation base, 102 Second end of the heat dissipation base, 103 Middle part of the heat dissipation base, 110 Area for placing the product to be measured, 120 Fixing holes for the test tooling, 130 Mounting holes for the bracket;

[0057] 210 First bracket, 220 Second bracket;

[0058] 300 Pressing rod, 310 Notch of the pressing rod, 320 First rotating shaft, 330 Second rotating shaft;

[0059] 400 Pressing plate mechanism, 410 Pressing plate, 411 Arch-shaped protrusion, 420 Hinge, 430 Orientation column, 431 Connection end of the pressing plate, 440 Nut, 450 Spring;

[0060] 510 Limiting piece, 520 Rotating shaft of the limiting piece, 530 Self-locking part, 531 Hook groove, 532 Guide inclined surface, 540 Locking column. Detailed implementation manners

[0061] In this specification, it will also be understood that when an element is referred to as being relative to other elements, such as "connected to" other elements, the one element can be directly connected to or directly coupled to the one element, or there can also be an intermediate third element; in addition, in the embodiments of the present disclosure, "connection" is mainly a mechanical connection, and more specifically, it can include a rigid connection, a connection through a kinematic pair such as a rotating pair or a sliding pair, and can also include an elastic connection with an elastic member interposed therebetween.

[0062] The present disclosure will now be described more fully hereinafter with reference to the accompanying drawings. However, the present disclosure may be implemented in many different ways and should not be construed as limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. Like reference numerals refer to like elements throughout.

[0063] It should be understood that for the packaging of the hybrid integrated circuit involved in the embodiments of the present disclosure, the assembled thick film hybrid circuit is installed in the housing and then sealed. When the product under test mentioned in the embodiment can be a finished product, the product under test is a thick film hybrid integrated circuit product that has been packaged (i.e., sealed). When the product under test can be a semi-finished product, the product under test is one in which the assembled thick film hybrid integrated circuit has been installed in the housing but has not been sealed yet.

[0064] To at least solve the problems existing in the foregoing prior art, embodiments of the present disclosure provide a heat dissipation table for testing hybrid integrated circuits. Overall, as Figure 1 shown, such a heat dissipation table includes five parts: a heat dissipation base 100, brackets (exemplarily including a first bracket 210 and a second bracket 220 in the figure), a pressing rod 300, a pressing plate mechanism 400, and a locking mechanism (located between the pressing rod 300 and the second bracket 220).

[0065] Among them, the heat dissipation base 100 is used to provide a rapid heat dissipation function for the product under test. With the help of other components in the embodiment, during use, the heat dissipation base 100 fully and closely fits the product under test, and the heat dissipation base 100 is made of a good heat-conducting material or has a structure conducive to heat conduction. The present disclosure places no restrictions on the material of the heat dissipation base 100. Exemplarily, aluminum (alloy), copper, steel, molybdenum, heat-conducting plastic / composite materials, etc. can be selected, and structures such as heat dissipation fins can also be included, or heat-conducting phase change materials can be provided.

[0066] To place the product under test, as Figure 8 、 Figure 9 shown, the heat dissipation base 100 has a product under test placement area 110. Preferably, based on the material or structural characteristics, the heat dissipation base 100 is a solid structure, and the product under test placement area 110 is the area with the best heat conduction performance on the heat dissipation base 100.

[0067] As Figure 2 , Figure 3As shown, the bracket may include two, namely, a first bracket 210 and a second bracket 220 disposed on the heat dissipation base 100. Preferably, the first bracket 210 and the second bracket 220 are disposed at both ends of the heat dissipation base 100 and are perpendicular to the upper surface of the heat dissipation base 100, or the first bracket 210 and the second bracket 220 are both perpendicular to the surface of the measured product placement area 110.

[0068] As Figure 2 shown, the first end ( Figure 2 the left end in Figure 2 ) of the pressure bar 300 is rotatably connected to the first bracket 210, and the second end (

[0069] the right end in Figure 12 ) can be locked or unlocked with the second bracket 220 through a locking mechanism.

[0069] For the foregoing bracket, pressure bar 300 and the connection manner between the two, exemplarily as Figure 12 、 Figure 14 shown, grooves are provided at the tops of the first bracket 210 and the second bracket 220 facing away from the heat dissipation base 100. Preferably, the depth of the groove at the top of the first bracket 210 is greater than the depth of the groove at the top of the second bracket 220. As Figure 3 shown, the first end ( Figure 3 the right end in Figure 3 ) of the pressure bar 300 is connected to the groove at the top of the first bracket 210 through a first rotating shaft 320; the second end ( Figure 12 and Figure 13 the left end in Figure 7 ) of the pressure bar 300 is a free end, can rotate around the first rotating shaft 320 as the axis, and can be embedded in the groove at the top of the second bracket 220. In the embodiment, a locking mechanism is provided to connect / detach the second end of the pressure bar 300 with the groove at the top of the second bracket 220. In some embodiments, as Figure 12 and Figure 13 shown, circular through holes are provided on both sides of the groove at the top of the first bracket 210. At the same time, as Figure 7 shown, a circular through hole penetrating the first end of the pressure bar 300 horizontally is provided at the first end of the pressure bar 300, and the first rotating shaft 320 passes through the circular through hole penetrating the pressure bar 300 and is accommodated in the circular through holes on both sides of the groove at the top of the first bracket 210. In one embodiment, the first rotating shaft 320 is a hinge.

[0070] Preferably, when the second end of the pressure bar 300 is embedded in the groove at the top of the second bracket 220, the second end of the pressure bar 300 further extends distally beyond the second bracket 220 to form a grip, so as to facilitate the operator to operate the pressure bar 300. Preferably, the length of the pressure bar 300 is greater than the distance between the first bracket 210 and the second bracket 220 by about 3 cm to 10 cm to form a grip. Preferably, the shape of the pressure bar 300 is a cuboid. Optionally, both the first bracket 210 and the second bracket 220 are cuboids. Optionally, the grooves at the tops of the first bracket 210 and the second bracket 220 are both U-shaped grooves.

[0071] A through hole is provided in the middle of the pressure rod 300 for connecting with the pressing plate mechanism 400 and restricting the degree of freedom of relative movement between the pressure rod 300 and the pressing plate mechanism 400. The aforementioned through hole can be a circular through hole or a long slot through hole. In the embodiment where the through hole is a long slot through hole, rotation of the pressing plate mechanism 400 connected thereto can be prevented.

[0072] The function of the pressure rod 300 is to lift / lower the pressing plate mechanism 400 by rotation.

[0073] With reference to Figure 1 and Figure 7 As shown, the pressing plate mechanism 400 includes at least a pressing plate 410 and an elastic member. The pressing plate 410 is movably connected to the pressure rod 300, and the elastic member is disposed between the pressing plate 410 and the pressure rod 300; in a state where the second end of the pressure rod 300 is locked to the second bracket 220, the pressing plate 410 applies pressure to the measured product placement area 110.

[0074] In use, a thick film hybrid integrated circuit to be measured can be placed in the aforementioned measured product placement area 110, and then the second end of the pressure rod 300 is pressed down and locked to the second bracket 220. With the elastic force of the elastic member, the pressing plate 410 in the pressing plate mechanism 400 can press the thick film hybrid integrated circuit to be measured against the heat dissipation base 100. Due to the good thermal conductivity of the pressing plate 410 / heat dissipation base 100, the temperature during the test of the hybrid integrated circuit can be well controlled, and the installation / dismantling is very fast, reducing the working time of the operator and improving the efficiency.

[0075] Among them, the movable connection between the pressing plate 410 and the pressure rod 300 is specifically a connection method that enables the two to rotate relative to each other and enables the two to approach / separate. For example, when the pressure rod 300 is lifted, the pressing plate 410 slides away from the pressure rod 300 by virtue of its own gravity, or when the pressure rod 300 is pressed down, the pressing plate 410 presses on the measured product and slides towards the pressure rod 300 due to the reaction force of the measured product, while causing the elastic member to undergo elastic deformation. Another example is that when the pressure rod 300 is pressed down, the pressing plate 410 can rotate relative to the pressure rod 300 so that the pressing plate 410 is parallel to the upper surface of the measured product, thereby averaging the pressure applied by the pressing plate 410 to the upper surface of the measured product.

[0076] Preferably, the pressing plate 410 has a structure or material feature that is the same as or similar to that of the heat dissipation base 100 and is conducive to heat dissipation. In one embodiment, the shape of the pressing plate 410 is square.

[0077] For the locking mechanism, in a typical embodiment, a groove is provided at the end of the second bracket 220 opposite to the heat dissipation base 100, as Figure 4As shown in the figure, the locking structure specifically includes: a limiting piece 510 and a limiting piece rotating shaft 520. The limiting piece 510 is connected to the opening of the groove through the limiting piece rotating shaft 520, for example, connected to the end face of the second bracket 220 away from the heat dissipation base 100. Among them, the limiting piece 510 can close the opening of the groove by rotating, so that at least part of the pressing rod 300 (the part at the second end of the pressing rod 300) is restricted within the groove. In some embodiments, a limiting through hole is provided at one end of the limiting piece 510, and the limiting piece rotating shaft 520 passes through the limiting through hole to connect the limiting piece 510 to the second bracket 220. By rotating the other end of the limiting piece 510, the opening of the groove of the second bracket 220 is closed, so that at least part of the pressing rod 300 is restricted within the groove. In some embodiments, the limiting piece rotating shaft 520 can be a screw or a bolt.

[0078] In one embodiment, the limiting piece 510 can be "L"-shaped, including a long side and a short side that are perpendicular to each other. The short side is rotatably connected to the inner wall of the groove of the second bracket 220 through the limiting piece rotating shaft 520. When the limiting piece 510 rotates to a specific angle, the long side can be parallel to the top end of the second bracket 220 and close the opening of the groove of the second bracket 220, playing a role in restricting the pressing rod 300.

[0079] The present disclosure does not limit the shape of the limiting piece 510 and the position connected to the second bracket 220, as long as the limiting piece 510 can close the opening of the groove of the second bracket 220 by rotating.

[0080] As an alternative, the limiting piece 510 can be a slidable structure provided at the groove at the end of the second bracket 220. For example, a slide rail is provided at the groove at the end of the second bracket 220, and the limiting piece 510 is arranged on the slide rail. The limiting piece 510 can open / close the groove at the end of the second bracket 220 by sliding. For example, the limiting piece 510 can slide along the end face of the second bracket 220 away from the heat dissipation base 100 to open / close the groove at the end of the second bracket 220.

[0081] Preferably, as Figure 4 、 Figure 5 and Figure 6 shown, a pressing rod notch 310 is provided at the second end of the pressing rod 300, which is used to make the part of the pressing rod 300 restricted within the groove thinner. Correspondingly, the groove at the end of the second bracket 220 can be shallower, so that the process time for grooving the second bracket 220 can be reduced, and the production cost of the heat dissipation platform itself can be lowered.

[0082] In another typical embodiment, as Figure 2 、 Figure 3As shown, the locking structure includes a locking post 540 and a self-locking member 530. The locking post 540 is provided at the end of the second bracket 220 away from the heat dissipation base 100. The self-locking member 530 is rotatably connected to the second end of the pressure lever 300, for example, through Figure 3 the second rotating shaft 330 in Figure 2 and Figure 10 As shown, the self-locking member 530 is provided with a hook groove 531. By rotating the self-locking member 530, the locking post 540 can be inserted into the hook groove 531 to lock the pressure lever 300 and the second bracket 220, or the locking post 540 can be disengaged from the hook groove 531 to unlock the pressure lever 300 and the second bracket 220.

[0083] Preferably, as shown in Figure 2 and Figure 3 a self-locking member mounting hole slightly wider than the self-locking member 530 is formed at the second end of the pressure lever 300. The self-locking member 530 is inserted into the self-locking member mounting hole and is connected to the pressure lever 300 through the second rotating shaft 330. In some embodiments, as shown in Figure 3 、 Figure 14 and Figure 15 circular through holes are formed on both sides of the groove at the top of the second bracket 220. The locking post 540 is received in the circular through holes on both sides of the groove at the top of the second bracket 220. At the same time, a circular through hole horizontally penetrating the self-locking member 530 is formed in the part of the self-locking member 530 located in the self-locking member mounting hole. The third rotating shaft passes through the circular through hole of the self-locking member 530 to rotatably connect the self-locking member 530 to the second end of the pressure lever 300. The size of the self-locking member mounting hole is set such that the self-locking member 530 can rotate limitedly therein. Preferably, the rotation of the self-locking member 530 can respectively: rotate in the first direction to just avoid the locking post 540 so that the pressure lever 300 can fall, and rotate in the second direction to make the locking post 540 completely embedded in the groove 531.

[0084] Preferably, a spring is provided between the self-locking member 530 and the pressure lever 300 to make the self-locking member 530 tend to rotate. This tendency makes the hook groove 531 move towards the locking post 540. That is, Figure 2 the clockwise direction in Figure 2 、 Figure 3 As shown, the self-locking member 530 has an extending end extending upward from the pressure lever 300. When locking / unlocking is required, the user can toggle the extending end to control the capture / release of the locking post 540 by the hook groove 531.

[0085] In an alternative embodiment, the installation direction of the self-locking member 530 is such that the hook groove 531 faces inward, i.e., towards the direction of the area 110 where the product to be measured is placed.

[0086] Different from the embodiment using the limiting piece, the embodiment using the self-locking member 530 does not rely on the groove at the end of the second bracket 220. It only requires that the end of the second bracket 220 is provided with a locking post 540 that can be hooked by the hook groove 531. Optionally, the end of the second bracket 220 can also be provided with a groove, and the locking post 540 is arranged in the groove, which can increase the stability when the pressing rod 300 is locked.

[0087] In a preferred embodiment, as Figure 10 shown, the self-locking member 530 is provided with a guiding inclined surface 532, which is used to guide the rotation of the self-locking member when the self-locking member 530 contacts the locking post 540, so that the locking post 540 can be inserted into the hook groove 531. The guiding inclined surface 532 can be in the form of a planar inclined surface, a curved inclined surface, etc. Optionally, the shape of the self-locking member 530 is J-shaped.

[0088] In a typical embodiment, as Figure 7 shown, the elastic member is a spring 450, and the pressing plate mechanism 400 further includes a hinge 420 and a guiding post 430; wherein, one end of the guiding post 430 is rotatably connected to the pressing plate 410 through the hinge 420, and the other end passes through the through hole on the pressing rod 300; the spring 450 is sleeved on the guiding post 430 and is located between the hinge 420 and the pressing rod 300.

[0089] In a typical embodiment, the spring 450 is a cylindrical helical spring. In an embodiment, the guiding post 430 is a guiding bolt.

[0090] Optionally, during use, the relative movement amplitude of approach / separation between the guiding post 430 and the pressing rod 300 does not exceed 10% of the length of the guiding post 430.

[0091] In a typical embodiment, as Figure 7 shown, the guiding post 430 includes a pressing plate connection end 431, which is located Figure 7 at the lowermost position of the guiding post 430 in

[0092] . The pressing plate connection end 431 is connected to the pressing plate 410 through the hinge 420. The diameter of the pressing plate connection end 431 is larger than other parts of the guiding post 430 and also larger than the diameter of the spring 450. The spring 450 is arranged between the pressing plate connection end 431 and the pressing rod 300. One end of the spring 450 is fixedly connected to the pressing plate connection end 431, and the other end is not fixedly connected to other components, which is convenient for the disassembly of the pressing plate mechanism 400.

[0093] Preferably, as Figure 11As shown, the pressing plate 410 has an arched protrusion 411, and a hinge hole is provided on the arched protrusion 411; during installation, the hinge 420 passes through the hinge hole so that the pressing plate 410 and the orientation column 430 are rotatably connected.

[0094] Preferably, an insulating gasket is provided at the bottom of the pressing plate 410 to prevent the product under test from being scratched.

[0095] Preferably, as Figure 7 shown, the connection end 431 of the pressing plate has a groove for accommodating the arched protrusion 411.

[0096] Preferably, as Figure 7 shown, the end of the connection end 431 of the pressing plate has a tapered surface for increasing the movement range of the pressing plate 410 relative to the orientation column 430.

[0097] In a typical embodiment, as Figure 7 shown, the pressing plate mechanism 400 further includes a nut 440; and, one end of the orientation column 430 passing through the through hole on the pressing rod 300 is provided with a thread and is screwed with the nut 440.

[0098] Optionally, the part of the orientation column 430 sleeved with the spring 450 is not provided with a thread, and the diameter of this part is larger than the part of the orientation column 430 provided with a thread.

[0099] Optionally, in an embodiment where the through hole on the pressing rod 300 is a long slot through hole, the cross-sectional shape of the part of the orientation column 430 penetrating into the pressing rod 300 corresponds to the long slot through hole, which can prevent the orientation column 430 and the pressing plate mechanism 400 as a whole from rotating relative to the pressing rod 300.

[0100] In an embodiment, the pressing plate mechanism 400 may further include a gasket disposed between the nut 440 and the pressing rod 300.

[0101] In the embodiments of the present disclosure, the nut 440 is used to prevent the pressing plate mechanism 400 from falling off the pressing rod 300. In addition, by adjusting the depth of the nut 440 screwed into the threaded end of the orientation column 430, the movement range of the pressing plate 410 relative to the pressing rod 300 can be adjusted.

[0102] In one embodiment, the main body of the orientation column 430 is provided with a thread, one end of the orientation column 430 is provided with the aforementioned connection end 431 of the pressing plate, the spiral spring 450 is sleeved on the main body of the orientation column 430, and then the orientation column 430 passes through the through hole on the pressing plate 300 and a nut 440 is screwed on the penetrating part.

[0103] In some embodiments, the nut 440 can also be replaced with other structures that can limit the orientation column 430, such as a pin, a buckle, etc.

[0104] In some embodiments, the pressing plate 410 is square (e.g., a square). Preferably, the shape of the pressing plate 410 matches the shape of the product under test, or matches the shape of the placement area 110 of the product under test on the base 100.

[0105] In a typical embodiment, as Figure 8 shown, based on the directions in the figure, the heat dissipation base 100 includes a first end portion 101 of the heat dissipation base at the left and right ends, a second end portion 102 of the heat dissipation base, and a middle portion 103 of the heat dissipation base in the middle. The two end portions and the middle portion of the heat dissipation base 100 can be integrally formed, or can be manufactured in sections and assembled.

[0106] Optionally, the heat dissipation base 100 is integrally in an "I" shape, or in an "H" shape, that is, the width of the middle portion 103 of the heat dissipation base is smaller than that of the first end portion 101 and the second end portion 102 of the heat dissipation base. Preferably, as Figure 8 shown, the two end portions and the middle portion of the heat dissipation base 100 are transitioned by bevel edges. The aforementioned "I" shape structure facilitates the pins of the product under test to pass through the heat dissipation base 100 and be connected to the sockets of the test tooling below.

[0107] Optionally, the heat dissipation base 100 is integrally rectangular and is provided with pin holes to facilitate the pins of the product under test to pass through the pin holes and be connected to the sockets of the test tooling below.

[0108] Preferably, as Figure 8 shown, the placement area 110 of the product under test is arranged in the middle portion 103 of the heat dissipation base, the first bracket 210 is arranged at the first end portion 101 of the heat dissipation base, and the second bracket 220 is arranged at the second end portion 220 of the heat dissipation base.

[0109] Preferably, in order to facilitate the installation of the aforementioned brackets on the heat dissipation base 100 and fix the heat dissipation table on the test tooling to facilitate heat dissipation of the product under test during testing, as Figure 8 shown, the heat dissipation base 100 is provided with test tooling fixing holes 120 and bracket mounting holes 130. Preferably, there are four test tooling fixing holes 120, which are respectively arranged at the four corners of the heat dissipation base 100. Preferably, the first end portion 101 and the second end portion 102 of the heat dissipation base are respectively provided with two bracket mounting holes 130. Preferably, the bracket mounting holes 130 are arranged between two test tooling fixing holes 120 on the same side.

[0110] Corresponding to the aforementioned preferred embodiment, the bottoms of the first bracket 210 and the second bracket 220 are both provided with threaded holes, and the threaded holes correspond to the aforementioned bracket mounting holes 130. Bolts or screws can pass through the bracket mounting holes 130 and then be screwed into the threaded holes to fix the first bracket 210 and the second bracket 220.

[0111] In an embodiment, regardless of the shape of the heat dissipation base selected, the key is to ensure that the bottom of the product under test is tightly connected to the heat dissipation base 100 (mainly the placement area 110 of the product under test) to achieve the ultimate goal of heat dissipation.

[0112] To make the structural features and working principles of the heat dissipation table described in this disclosure clearer, the following is an exemplary description of the operation process of the heat dissipation table in the embodiment:

[0113] 1. The operator fixes the heat dissipation table to the test tooling at the bottom through the test tooling fixing holes 120 on the heat dissipation base 100;

[0114] 2. Rotate to open the limit plate 510, or toggle the self-locking member 530 to lift the pressure rod 300;

[0115] 3. Before placing the product under test, apply thermal grease or place a thermal pad on the bottom of the product to be placed, which is beneficial for heat dissipation during the test;

[0116] 4. Place the product under test in the placement area 110 of the product under test and connect its pins to the socket of the test tooling;

[0117] 5. Press down the pressure rod 300 so that the pressure plate 410 presses on the product under test. The free end of the pressure rod 300 is located in the groove of the second bracket 220. Close the limit plate 510, or confirm that the groove 531 on the self-locking member 530 has completely hooked the locking column 540;

[0118] 6. Turn on the switch of the test tooling to start the test;

[0119] 7. After the test is completed, first turn off the switch of the test tooling, then open the limit plate 510, or toggle the self-locking member 530 to lift the pressure rod 300 and remove the product under test.

[0120] Using the heat dissipation table for hybrid integrated circuit power testing provided in the embodiment can not only have better heat dissipation when testing the power parameters of hybrid integrated circuits, but also reduce the time for operators to disassemble and assemble the radiator. Originally, it took 5 minutes to assemble the radiator for a single product, 1 minute for testing, and 3 minutes to disassemble the radiator. On average, 6.67 products could be tested per hour. By using the power device heat dissipation table provided in the embodiment, the assembly and testing only take 1 minute, and on average, 60 products can be tested per hour, which is 9 times more efficient than the original radiator assembly method.

[0121] The heat dissipation table for thick film hybrid integrated circuit testing provided in the embodiment effectively reduces unnecessary time waste, thereby improving the product testing efficiency and reducing the production cost.

[0122] In addition, it should be understood that the foregoing embodiments are described by taking thick film hybrid integrated circuits as the products to be measured. In fact, the heat dissipation table in the embodiments can also be used for the testing of thin film hybrid integrated circuits, as long as tests with requirements for heat dissipation performance such as full power tests are to be carried out, the above heat dissipation table can be used.

[0123] As described above, only some specific embodiments of the present disclosure are provided, but the protection scope of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the embodiments of the present disclosure should be covered by the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A heat dissipation platform for hybrid integrated circuit testing, characterized in that, It includes a heat dissipation base (100), a bracket, a pressure lever (300), a pressing plate mechanism (400) and a locking mechanism; among them, the heat dissipation base (100) has a test product placement area (110); the bracket includes a first bracket (210) and a second bracket (220) arranged on the heat dissipation base (100); the first end of the pressure lever (300) is rotatably connected to the first bracket (210), and the second end of the pressure lever (300) can be locked or unlocked with the second bracket (220) through the locking structure; the pressing plate mechanism (400) includes a pressing plate (410) and an elastic member. The pressing plate (410) is movably connected to the pressure lever (300), and the elastic member is arranged between the pressing plate (410) and the pressure lever (300); the pressing plate (410) is used to apply pressure to the test product placement area (110) when the second end of the pressure lever (300) is locked with the second bracket (220).

2. The heat dissipation platform for hybrid integrated circuit testing according to claim 1, wherein A groove is provided at the end of the second bracket (220) away from the heat dissipation base (100); The locking structure includes: a limiting piece (510), connected to the opening of the groove through a limiting piece rotating shaft (520); wherein, the limiting piece (510) can close the opening of the groove by rotating, so that at least part of the pressure lever (300) is restricted in the groove.

3. The heat dissipation platform for hybrid integrated circuit testing according to claim 2, wherein A pressure lever notch (310) is provided at the second end of the pressure lever (300) to reduce the cross-sectional area of the part of the pressure lever (300) restricted in the groove.

4. The heat dissipation platform for hybrid integrated circuit testing according to claim 1, wherein The locking structure includes: a locking column (540), arranged at the end of the second bracket (220) away from the heat dissipation base (100); and a self-locking member (530), rotatably connected to the second end of the pressure lever (300); the self-locking member (530) is provided with a hook groove (531), and can lock the pressure lever (300) and the second bracket (220) by rotating to make the locking column (540) embed into the hook groove (531), or unlock the pressure lever (300) and the second bracket (220) by making the locking column (540) disengage from the hook groove (531).

5. The heat dissipation platform for hybrid integrated circuit testing according to claim 4, characterized in that, A groove is provided at the end of the second bracket (220), and the locking column (540) is arranged in the groove; The self-locking member (530) is provided with a guiding inclined surface (532) for guiding the rotation of the self-locking member (530) when the self-locking member (530) contacts the locking column (540), so that the locking column (540) can embed into the hook groove (531).

6. The heat dissipation platform for hybrid integrated circuit testing according to claim 1, wherein, The elastic member is a spring (450), and the pressing plate mechanism (400) further includes a hinge (420) and a guiding column (430); among them, one end of the guiding column (430) is rotatably connected to the pressing plate (410) through the hinge (420), and the other end passes through a through hole on the pressure lever (300); The spring (450) is sleeved on the orientation column (430) and is located between the hinge (420) and the pressure lever (300).

7. The heat dissipation platform for hybrid integrated circuit testing according to claim 6, wherein, The pressing plate (410) has an arched protrusion (411) provided with a hinge hole; the hinge (420) passes through the hinge hole to rotatably connect the pressing plate (410) and the orientation column (430).

8. The heat dissipation platform for hybrid integrated circuit testing according to claim 6, wherein, The pressing plate mechanism (400) further includes a nut (440); The other end of the orientation column (430) passing through the through hole on the pressure lever (300) is provided with a thread and is screwed with the nut (440).

9. The heat dissipation platform for hybrid integrated circuit testing according to claim 1, wherein The heat dissipation base (100) includes a first end portion (101) of the heat dissipation base, a second end portion (102) of the heat dissipation base, and a middle portion (103) of the heat dissipation base; The width of the middle portion (103) of the heat dissipation base is equal to or less than that of the first end portion (101) and the second end portion (102) of the heat dissipation base; The area (110) for placing the product to be measured is arranged on the middle portion (103) of the heat dissipation base, the first bracket (210) is arranged on the first end portion (101) of the heat dissipation base, and the second bracket (220) is arranged on the second end portion (102) of the heat dissipation base.

10. The heat dissipation platform for hybrid integrated circuit testing according to claim 9, characterized in that, The heat dissipation base (100) is provided with test tooling fixing holes (120) and bracket mounting holes (130); among them, There are a plurality of the test tooling fixing holes (120), which are respectively arranged at the corners of the heat dissipation base (100); Two of the bracket mounting holes (130) are respectively arranged on the first end portion (101) and the second end portion (102) of the heat dissipation base.

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