Rapid heat dissipation structure of memory bank

Abstract

The utility model relates to the technical field of memory bank heat dissipation, in particular to a quick heat dissipation structure of a memory bank, which comprises a memory bank body, heat dissipation fins are arranged on two side surfaces of the memory bank body, adhesive layers are arranged on the inner walls of the two side surfaces of the heat dissipation fins, a PET (polyethylene terephthalate) release film is arranged between the adhesive layers, and the heat dissipation fins are arranged on the inner walls of the heat dissipation fins. And heat dissipation silicone grease is arranged in the middle of the inner wall of the memory bank body. The memory bank has the advantages that the contact area with air is increased, the heat dissipation efficiency is improved, the copper-aluminum alloy has good heat conduction performance, heat generated by the memory bank can be rapidly conducted to the cooling fins from a heat source (namely memory particles), the surface area of the cooling fins can be further increased by conducting sand blasting treatment on the cooling fins, the heat dissipation efficiency is improved, and the service life of the memory bank is prolonged. The heat dissipation silicone grease layer is arranged on the heat dissipation fin, so that heat generated by the memory bank body can be quickly transmitted to the heat dissipation fin, the heat dissipation efficiency is improved, the heat dissipation holes are formed in the heat dissipation fin, the heat dissipation area can be increased, air flow is promoted, and therefore the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of memory module heat dissipation, in particular to a rapid heat dissipation structure for a memory module. Background Art

[0002] As a key component in a laptop or desktop computer, the memory module is responsible for storing and transmitting data. During the operation of the memory module, heat is generated. If the heat dissipation is poor, it may lead to performance degradation or even damage. Therefore, in scenarios where the external temperature is high or the memory module is overloaded, a heat dissipation structure needs to be added to the memory module to improve the heat dissipation effect. However, the existing memory module heat dissipation structure is large in volume and prone to interference with surrounding components, and the structure is complex and inconvenient to install. Summary of the Utility Model

[0003] The purpose of the utility model is to overcome the shortcomings of the prior art and provide a rapid heat dissipation structure for a memory module, effectively solving the deficiencies of the prior art.

[0004] The purpose of the utility model is achieved through the following technical solutions: a rapid heat dissipation structure for a memory module, including a memory module body. Heat sinks are provided on both sides of the memory module body. Adhesive layers are provided on the inner walls of both sides of the heat sinks. A PET release film is provided between the adhesive layers. Heat dissipation silicone grease is provided in the middle of the inner wall of the memory module body.

[0005] Optionally, the heat sink is made of copper-aluminum alloy, and the surface of the heat sink is sandblasted.

[0006] By adopting the above technical solutions: by providing heat sinks made of copper-aluminum alloy on both sides of the memory module body, the memory module body can increase the contact area with air, accelerate heat dissipation, and improve the heat dissipation efficiency. Copper-aluminum alloy has good thermal conductivity and can quickly conduct the heat generated by the memory module from the heat source (i.e., memory particles) to the heat sink. Sandblasting the heat sink can further increase its surface area and improve the heat dissipation efficiency.

[0007] Optionally, a heat dissipation silicone grease layer is fixedly connected to the bottom of the heat sink. A plurality of heat dissipation holes are opened at the top of the heat dissipation silicone grease layer, and the heat dissipation holes are equidistantly distributed on the heat sink.

[0008] By adopting the above technical solutions: by providing a heat dissipation silicone grease layer on the heat sink, the heat generated by the memory module body can be quickly transferred to the heat sink, accelerating the heat dissipation efficiency. Providing heat dissipation holes on the heat sink can increase the heat dissipation area and promote air flow, thereby improving the heat dissipation efficiency.

[0009] Optionally, the material of the adhesive layer is thermal conductive adhesive. The width of the PET release film is adapted to the width of the adhesive layer. Both ends of the PET release film are respectively located at the tops of the two adhesive layers. The PET release film covers the adhesive layer from top to bottom and then bends upward and overlaps.

[0010] Adopting the above technical solution: By arranging a double-layer PET release film on the surfaces of the two adhesive layers, after clamping the heat sink on both sides of the memory module body and adjusting the position, pulling the connecting part at the top of the PET release film upward can pull out the overlapping PET release films on both sides upward, making the adhesive layer directly contact the memory module body to complete pasting. This enables the heat dissipation structure to quickly complete pasting and fixing only by pulling the PET release film after completing positioning and alignment, improving the installation efficiency of the heat dissipation structure.

[0011] Optionally, a connecting plate is fixedly connected to the top of the inner side surface of one of the heat sinks. One end of the connecting plate is rotatably connected to a rotating shaft. The two heat sinks are rotatably connected through the connecting plate and the rotating shaft. The length of the connecting plate is adapted to the thickness of the memory module body.

[0012] Adopting the above technical solution: By arranging a connecting plate and a rotating shaft between the tops of the heat sinks to combine them into a whole, it is convenient for storage and overall installation.

[0013] Optionally, torsion springs are sleeved on the middle parts of the rotating shafts. The torsion of the torsion springs makes the two heat sinks parallel to each other.

[0014] Adopting the above technical solution: By arranging torsion springs on the rotating shafts of the heat sinks, after the heat sinks are opened and attached to both side surfaces of the memory module body, the torsion springs can make the two heat sinks automatically rotate and merge, initially clamping and fixing the memory module body, making the installation and fixing of this memory module heat dissipation structure more convenient and fast.

[0015] The utility model has the following advantages:

[0016] 1. For the quick heat dissipation structure of this memory module, by arranging heat sinks made of copper-aluminum alloy on both side surfaces of the memory module body, the memory module body can increase the contact area with air, accelerate heat dissipation, and improve heat dissipation efficiency. Copper-aluminum alloy has good thermal conductivity and can quickly conduct the heat generated by the memory module from the heat source (i.e., memory particles) to the heat sink. Sandblasting treatment on the heat sink can further increase its surface area and improve heat dissipation efficiency. By arranging a heat dissipation silicone grease layer on the heat sink, the heat generated by the memory module body can be quickly transferred to the heat sink, accelerating heat dissipation efficiency. Arranging heat dissipation holes on the heat sink can increase the heat dissipation area and promote air flow, thereby improving heat dissipation efficiency.

[0017] 2. The quick heat dissipation structure of the memory module. By setting a double-layer PET release film on the surfaces of the adhesive layers on both sides, after clamping the heat sink on both sides of the memory module body and adjusting the position, pulling up the connecting part at the top of the PET release film can pull out the overlapping PET release films on both sides upward, making the adhesive layer directly contact the memory module body to complete pasting. This enables the heat dissipation structure to quickly complete pasting and fixing only by pulling the PET release film after positioning and alignment, improving the installation efficiency of the heat dissipation structure.

[0018] 3. The quick heat dissipation structure of the memory module. By setting a connecting plate and a rotating shaft between the tops of the heat sinks to combine them into a whole, it is convenient for storage and overall installation. By setting a torsion spring on the rotating shaft of the heat sink, after the heat sinks are opened and attached to both sides of the memory module body, the torsion spring can automatically rotate and combine the heat sinks on both sides to preliminarily clamp and fix the memory module body, making the installation and fixing of the memory module heat dissipation structure more convenient and fast. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic structural diagram of the assembled state of the present utility model;

[0020] Figure 2 is a schematic cross-sectional structural diagram of the assembled state of the present utility model;

[0021] Figure 3 of the present utility model Figure 2 is an enlarged schematic structural diagram of part A in;

[0022] Figure 4 of the present utility model Figure 2 is an enlarged schematic structural diagram of part B in;

[0023] Figure 5 is a schematic structural diagram of the heat dissipation structure of the present utility model;

[0024] Figure 6 is a schematic front cross-sectional structural diagram of the heat dissipation structure of the present utility model;

[0025] Figure 7 is a schematic side cross-sectional structural diagram of the heat dissipation structure of the present utility model;

[0026] Figure 8 of the present utility model Figure 7 is an enlarged schematic structural diagram of part C in.

[0027] In the figure: 1 - memory module body, 2 - heat sink, 3 - adhesive layer, 4 - PET release film, 5 - thermal grease, 6 - thermal grease layer, 7 - heat dissipation holes, 8 - connecting plate, 9 - rotating shaft, 10 - torsion spring. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are intended to explain the present utility model, and should not be construed as a limitation to the present utility model.

[0029] As Figures 1 to 8 shown, a rapid heat dissipation structure for a memory module includes a memory module body 1. Heat sinks 2 are provided on both side surfaces of the memory module body 1. Adhesive layers 3 are provided on the inner walls of both side surfaces of the heat sinks 2. A PET release film 4 is provided between the adhesive layers 3. Heat dissipation silicone grease 5 is provided in the middle of the inner wall of the memory module body 1.

[0030] Embodiment 1: The material of the heat sink 2 is copper-aluminum alloy. The surface of the heat sink 2 is subjected to sandblasting treatment. By providing copper-aluminum alloy heat sinks 2 on both side surfaces of the memory module body 1, the memory module body 1 can increase the contact area with air, accelerate heat dissipation, and improve the heat dissipation efficiency. Copper-aluminum alloy has good thermal conductivity and can quickly conduct the heat generated by the memory module from the heat source (i.e., memory particles) to the heat sink. Sandblasting treatment of the heat sink 2 can further increase its surface area and improve the heat dissipation efficiency.

[0031] Embodiment 2: A heat dissipation silicone grease layer 6 is fixedly connected to the bottom of the heat sink 2. A plurality of heat dissipation holes 7 are provided at the top of the heat dissipation silicone grease layer 6. The heat dissipation holes 7 are equidistantly distributed on the heat sink 2. By providing a heat dissipation silicone grease layer 6 on the heat sink 2, the heat generated by the memory module body 1 can be quickly transferred to the heat sink 2, accelerating the heat dissipation efficiency. Providing heat dissipation holes 7 on the heat sink 2 can increase the heat dissipation area and promote air flow, thereby improving the heat dissipation efficiency.

[0032] Embodiment 3: The material of the adhesive layer 3 is thermal conductive adhesive. The width of the PET release film 4 is adapted to the width of the adhesive layer 3. The two ends of the PET release film 4 are respectively located at the top of the two side adhesive layers 3. The PET release film 4 covers the adhesive layer 3 from top to bottom and then bends upward and overlaps. By providing a double-layer PET release film 4 on the surfaces of the two side adhesive layers 3, after the heat sinks 2 are clamped on both side surfaces of the memory module body 1 and the positions are adjusted, pulling the connecting part at the top of the PET release film 4 upward can pull out the overlapping PET release films 4 on both sides upward, so that the adhesive layer 3 is directly in contact with the memory module 1 body to complete pasting. This enables the heat dissipation structure to be quickly pasted and fixed only by pulling the PET release film 4 after positioning and alignment, improving the installation efficiency of the heat dissipation structure.

[0033] Embodiment 4: A connection plate 8 is fixedly connected to the top of the inner side of one heat sink 2. One end of the connection plate 8 is rotatably connected to a rotating shaft 9. The two heat sinks 2 are rotatably connected through the connection plate 8 and the rotating shaft 9. The length of the connection plate 8 is adapted to the thickness of the memory module body 1. By arranging the connection plate 8 and the rotating shaft 9 between the tops of the heat sinks 2, they are combined into a whole, which is convenient for storage and overall installation.

[0034] Embodiment 5: Torsion springs 10 are sleeved on the middle parts of the rotating shafts 9. The torsion of the torsion springs 10 makes the two heat sinks 2 parallel to each other. By arranging the torsion springs 10 on the rotating shafts 9 of the heat sinks 2, after the heat sinks 2 are opened and attached to the two side surfaces of the memory module body 1, the torsion springs 10 can make the two heat sinks 2 automatically rotate and merge, initially clamping and fixing the memory module body 1, making the installation and fixation of the memory module heat dissipation structure more convenient and fast.

[0035] The working principle of the present utility model is as follows:

[0036] S1. Heat sinks 2 made of copper-aluminum alloy are arranged on the two side surfaces of the memory module body 1. The memory module body 1 can increase the contact area with air, accelerate heat dissipation, and improve the heat dissipation efficiency. Copper-aluminum alloy has good thermal conductivity and can quickly conduct the heat generated by the memory module from the heat source (i.e., memory particles) to the heat sinks. Sandblasting the heat sinks 2 can further increase their surface area and improve the heat dissipation efficiency;

[0037] S2. A heat dissipation silicone grease layer 6 is arranged on the heat sinks 2, so that the heat generated by the memory module body 1 can be quickly transferred to the heat sinks 2, accelerating the heat dissipation efficiency. Arranging heat dissipation holes 7 on the heat sinks 2 can increase the heat dissipation area and promote air flow, thereby improving the heat dissipation efficiency.

[0038] Compared with the prior art, the present utility model has the following beneficial effects compared with the prior art:

[0039] 1. For the fast heat dissipation structure of the memory module, by arranging heat sinks 2 made of copper-aluminum alloy on the two side surfaces of the memory module body 1, the memory module body 1 can increase the contact area with air, accelerate heat dissipation, and improve the heat dissipation efficiency. Copper-aluminum alloy has good thermal conductivity and can quickly conduct the heat generated by the memory module from the heat source (i.e., memory particles) to the heat sinks. Sandblasting the heat sinks 2 can further increase their surface area and improve the heat dissipation efficiency. By arranging a heat dissipation silicone grease layer 6 on the heat sinks 2, the heat generated by the memory module body 1 can be quickly transferred to the heat sinks 2, accelerating the heat dissipation efficiency. Arranging heat dissipation holes 7 on the heat sinks 2 can increase the heat dissipation area and promote air flow, thereby improving the heat dissipation efficiency.

[0040] 2. The quick heat dissipation structure of the memory module, by setting a double-layer PET release film 4 on the surface of the glue layers 3 on both sides. After clamping the heat sink 2 on both sides of the memory module body 1 and adjusting the position, pulling up the connecting part at the top of the PET release film 4 can pull out the overlapping PET release films 4 on both sides upward, making the glue layer 3 directly contact the memory module 1 body to complete the pasting. This enables the heat dissipation structure to quickly complete the pasting and fixing only by pulling the PET release film 4 after completing the positioning and alignment, improving the installation efficiency of the heat dissipation structure.

[0041] 3. The quick heat dissipation structure of the memory module, by setting a connecting plate 8 and a rotating shaft 9 between the tops of the heat sinks 2 to combine them into a whole, which is convenient for storage and overall installation. By setting a torsion spring 10 on the rotating shaft 9 of the heat sink 2, after the heat sinks 2 are opened and attached to both sides of the memory module body 1, the torsion spring 10 can make the heat sinks 2 on both sides automatically rotate and merge to initially clamp and fix the memory module body 1, making the installation and fixing of the memory module heat dissipation structure more convenient and fast.

Claims

1. A fast heat dissipation structure for a memory module, characterized in that: It includes a memory module body (1), heat sinks (2) are arranged on both side surfaces of the memory module body (1), adhesive layers (3) are arranged on the inner walls of both side surfaces of the heat sinks (2), a PET release film (4) is arranged between the adhesive layers (3), and heat-conducting silicone grease (5) is arranged in the middle of the inner wall of the memory module body (1).

2. The rapid heat dissipation structure of a memory module according to claim 1, wherein: The material of the heat sink (2) is copper-aluminum alloy, and the surface of the heat sink (2) is subjected to sandblasting treatment.

3. The rapid heat dissipation structure of a memory module according to claim 2, wherein: A heat-conducting silicone grease layer (6) is fixedly connected to the bottom of the heat sink (2), and a plurality of heat dissipation holes (7) are formed in the top of the heat-conducting silicone grease layer (6), and the heat dissipation holes (7) are equidistantly distributed on the heat sink (2).

4. The rapid heat dissipation structure of a memory module according to claim 3, wherein: The material of the adhesive layer (3) is heat-conducting adhesive. The width of the PET release film (4) is adapted to the width of the adhesive layer (3). The two ends of the PET release film (4) are respectively located on the tops of the two adhesive layers (3). The PET release film (4) covers the adhesive layer (3) from top to bottom and then bends upward and overlaps.

5. The rapid heat dissipation structure of a memory module according to claim 4, characterized in that: A connecting plate (8) is fixedly connected to the top of the inner side surface of one of the heat sinks (2). One end of the connecting plate (8) is rotatably connected to a rotating shaft (9). The two heat sinks (2) are rotatably connected through the connecting plate (8) and the rotating shaft (9). The length of the connecting plate (8) is adapted to the thickness of the memory module body (1).

6. The rapid heat dissipation structure of a memory module according to claim 5, characterized in that: Torsion springs (10) are sleeved on the middle parts of the rotating shafts (9), and the torsion of the torsion springs (10) makes the two heat sinks (2) parallel to each other.

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