Heat dissipation device and electronic equipment

Abstract

The utility model relates to a heat dissipation device and electronic equipment, and the heat dissipation device is used for the electronic equipment and comprises a connecting piece, a heat conduction piece and a heat dissipation piece. The connecting piece is used for being connected with a to-be-cooled device. The heat conduction piece comprises a heat absorption part and a heat dissipation part which are roughly located on the same plane, the heat dissipation part is located in the side direction of the heat absorption part, and the connecting piece is connected to the heat absorption part. The heat dissipation piece is connected to the heat dissipation part. The heat dissipation device can save the space occupation in the thickness direction of the heat conduction piece, and can reduce the thickness of the electronic equipment to a certain extent.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation, and in particular, to a heat dissipation device and an electronic device. Background Art

[0002] When a processor of an electronic device (such as a laptop computer), such as a CPU, is working, it will generate a large amount of heat. If this heat is not dissipated in time, it will cause the system to freeze at best, and may even burn out the CPU at worst. Therefore, it is necessary to design a corresponding heat dissipation device to dissipate heat for the CPU.

[0003] In the related art, usually a heat sink and a cooling fan are sequentially installed above the CPU, and the heat of the CPU absorbed by the heat sink is taken away by the gas generated by the rotation of the cooling fan. However, the heat sink and the cooling fan will occupy a large space and cannot meet the requirement that electronic devices are getting thinner and thinner. Summary of the Utility Model

[0004] The purpose of the present disclosure is to provide a heat dissipation device and an electronic device. The heat dissipation device can save the space occupied in the thickness direction of the heat conducting member and can reduce the thickness of the electronic device to which it is applied to a certain extent.

[0005] To achieve the above object, according to the first aspect of the present disclosure, there is provided a heat dissipation device for an electronic device, including:

[0006] A connecting member for connecting with a device to be heat-dissipated;

[0007] A heat conducting member including a heat absorption part and a heat dissipation part, the heat absorption part and the heat dissipation part are substantially in the same plane, and the heat dissipation part is located laterally of the heat absorption part, and the connecting member is connected to the heat absorption part; and

[0008] A heat dissipation member connected to the heat dissipation part.

[0009] Optionally, the heat conducting member is a VC heat pipe; and / or

[0010] The connecting member and the heat dissipation member are respectively connected to the same side of the heat conducting member in a first direction.

[0011] Optionally, the connecting member is configured as a plate shape, the connecting member includes a first side surface and a second side surface opposite to each other in a first direction, the first side surface is used for connecting with the device to be heat-dissipated, and the heat absorption part is connected to the second side surface.

[0012] Optionally, there are a plurality of the heat dissipation parts;

[0013] The heat conducting member further includes a transition part, and a plurality of the heat dissipation parts are connected to the heat absorption part through the transition part, and one heat dissipation member is arranged on each heat absorption part.

[0014] Optionally, a plurality of the heat dissipation parts are arranged at intervals in a second direction, and the plurality of the heat dissipation parts are arranged at intervals from the heat absorption part in a third direction;

[0015] Wherein, the second direction is perpendicular to the third direction.

[0016] Optionally, there are two heat dissipation parts, and the two heat dissipation parts are arranged at intervals in the second direction and are located on opposite sides of the heat absorption part.

[0017] Optionally, the heat dissipation device further includes a fixing part connected to the connecting part and the heat conducting part, and the fixing part is formed with a mounting part for fixedly mounting the heat dissipation device.

[0018] Optionally, the fixing part is configured as a fixing bracket, and the fixing bracket is formed with mounting through holes for screws to pass through, and the mounting through holes form the mounting part.

[0019] Optionally, the mounting through holes of part of the fixing bracket extend to the heat conducting part, and the heat conducting part is formed with mating holes corresponding to the mounting through holes, so that screws can pass through the mating holes and the mounting through holes to fix the connecting part and the heat conducting part.

[0020] Optionally, a mounting space recessed towards the first side surface is formed on the second side surface of the connecting part, the fixing part is arranged in the mounting space, and the fixing part is located between the connecting part and the heat conducting part.

[0021] Optionally, there are two mounting spaces, and they are arranged at intervals in the second direction, and each mounting space is provided with one fixing part;

[0022] The fixing part is respectively formed with a mounting part in the third direction, the mounting part extends to the outside of the connecting part, and one mounting part extends to the transition part of the heat conducting part.

[0023] Optionally, a first mounting position for arranging a first heat-conducting adhesive is formed on the first side surface of the connecting part, and the first mounting position is located between the two mounting spaces, and the first heat-conducting adhesive is used for connecting with the device to be heat-dissipated.

[0024] Optionally, a second heat-conducting adhesive is further provided at a position on the first side surface of the connecting part corresponding to the mounting space.

[0025] Optionally, the heat dissipation part includes a plurality of heat dissipation air ducts for allowing air flow to pass through.

[0026] Optionally, the plurality of heat dissipation air ducts extend in the third direction and are arranged at intervals in the second direction.

[0027] According to a second aspect of the present disclosure, there is also provided an electronic device, the electronic device comprising a device to be cooled and the cooling device described above;

[0028] The connecting portion of the heat dissipation device is connected to the device to be cooled.

[0029] Optionally, the electronic device further comprises a heat dissipation fan, and the heat dissipation fan corresponds to the heat dissipation element and faces the heat dissipation element.

[0030] Optionally, the electronic device is a laptop computer.

[0031] Optionally, the electronic device comprises a housing, and the housing is provided with an air inlet and an air outlet;

[0032] The heat sink is arranged close to the air outlet.

[0033] Optionally, there are two air inlets, and the two air inlets are respectively located on two opposite sides of the shell in the second direction, and the air outlet is located on one side of the shell in the third direction.

[0034] Through the above technical solution, that is, the heat dissipation device of the present invention includes a connector, a heat conductor and a heat sink, wherein the heat conductor includes a heat absorbing portion and a heat dissipating portion that are larger than the heat absorbing portion and are in the same plane, and the heat dissipating portion is located on the side of the heat absorbing portion. When the connector is connected to the heat absorbing portion and the heat sink is connected to the heat dissipating portion, the projections of the connector and the heat sink on the heat conductor are staggered. Therefore, the space occupied by the heat conductor in the thickness direction can be saved, and the thickness of the electronic device to which it is applied can be reduced to a certain extent.

[0035] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings:

[0037] Figure 1 It is a structural diagram of a heat dissipation device provided in some embodiments of the present disclosure.

[0038] Figure 2 is an exploded view of a heat dissipation device provided in some embodiments of the present disclosure.

[0039] Figure 3 It is a structural schematic diagram of the heat dissipation device provided in some embodiments of the present disclosure from another perspective.

[0040] Figure 4 is a top view of a heat dissipation device provided in some embodiments of the present disclosure.

[0041] Figure 5 is a bottom view of a heat dissipation device provided by some embodiments of the present disclosure.

[0042] Figure 6 is a side view of a heat dissipation device provided by some embodiments of the present disclosure.

[0043] Figure 7 is based on Figure 6 the enlarged view of part A in

[0044] Figure 8 is a structural diagram of a heat conduction member of a heat dissipation device provided by some embodiments of the present disclosure.

[0045] Figure 9 is a schematic structural diagram of an electronic device provided by some embodiments of the present disclosure.

[0046] Description of Reference Numerals

[0047] 10 - Heat dissipation device; 100 - Connecting member; 110 - Installation space; 120 - First installation position; 200 - Heat conduction member; 201 - Fitting hole; 210 - Heat absorption part; 220 - Heat dissipation part; 230 - Transition part; 300 - Heat dissipation member; 310 - Heat dissipation air duct; 400 - Fixing member; 401 - Installation part; 410 - Fixing bracket; 411 - Installation through hole; 500 - Screw; 610 - First thermal conductive adhesive; 620 - Second thermal conductive adhesive; 700 - Buffer member;

[0048] 20 - Housing; 21 - Air inlet; 22 - Air outlet;

[0049] 30 - Heat dissipation fan. Detailed Embodiments

[0050] The following detailed description of the specific embodiments of the present disclosure is provided in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only for the purpose of illustration and explanation of the present disclosure, and are not intended to limit the present disclosure.

[0051] In the present disclosure, unless otherwise stated, the orientation terms such as "upper, lower, left, right" generally refer to the upper, lower, left, and right in the relative drawings; "inner, outer" refer to the inside and outside of the contour of the corresponding component; "far, near" refer to the corresponding structure or component being far from or close to another structure or component. In the accompanying drawings of the present disclosure, X represents the first direction; Y represents the second direction; Z represents the third direction. In addition, the terms "first", "second", etc. used in the present disclosure are for distinguishing one element from another, and do not have sequentiality and importance. Furthermore, in the following description, when referring to the accompanying drawings, unless otherwise explained, the same reference numerals in different drawings represent the same or similar elements. The above definitions are only for the purpose of explaining and illustrating the present disclosure, and should not be construed as a limitation of the present disclosure.

[0052] The objective of the present disclosure is to provide a heat dissipation device 10 and an electronic device. The heat dissipation device 10 can save the space occupied in the thickness direction of the heat conducting member 200, and can reduce the thickness of the electronic device to which it is applied to a certain extent.

[0053] To achieve the above objective, as Figures 1 to 8 shown, according to the first aspect of the present disclosure, a heat dissipation device 10 for an electronic device is provided. The heat dissipation device 10 includes a connecting member 100, a heat conducting member 200, and a heat dissipating member 300. The connecting member 100 is used to connect with the device to be dissipated. The heat conducting member 200 includes a heat absorption portion 210 and a heat dissipation portion 220. The heat absorption portion 210 and the heat dissipation portion 220 are generally in the same plane, and the heat dissipation portion 220 is located on the side of the heat absorption portion 210. The connecting member 100 is connected to the heat absorption portion 210. The heat dissipating member 300 is connected to the heat dissipation portion 220.

[0054] Through the above technical solution, that is, the heat dissipation device 10 of the present disclosure includes a connecting member 100, a heat conducting member 200, and a heat dissipating member 300. Among them, the heat conducting member 200 includes a heat absorption portion 210 and a heat dissipation portion 220 that are greater than being in the same plane, and the heat dissipation portion 220 is located on the side of the heat absorption portion 210. When the connecting member 100 is connected to the heat absorption portion 210 and the heat dissipating member 300 is connected to the heat dissipation portion 220, the projections of the connecting member 100 and the heat dissipating member 300 on the heat conducting member 200 are staggered. Therefore, it is possible to save the space occupied in the thickness direction of the heat conducting member 200, and it is possible to reduce the thickness of the electronic device to which it is applied to a certain extent.

[0055] Optionally, the heat conducting member 200 is a VC heat pipe; and / or, the connecting member 100 and the heat dissipating member 300 are respectively connected to the same side of the heat conducting member 200 in the first direction.

[0056] The connecting member 100 and the heat conducting member 200 can adopt any suitable structure and material. Among them, in some embodiments, the heat conducting member 200 can adopt a VC heat pipe. Among them, the VC (Vapor Chamber) heat pipe is named according to the main characteristics of the component. According to the principle that it uses the latent heat possessed by the working fluid (medium) during phase change to transfer a large amount of heat, it belongs to a flat heat pipe. The VC heat pipe has a low starting temperature, a fast heat transfer speed, good temperature uniformity performance, a large output power, a low manufacturing cost, a long service life, and a light weight.

[0057] Due to the structural characteristics of the VC heat pipe, the application scope of the VC heat pipe is particularly suitable for the heat dissipation requirements in a narrow space environment where the height space is strictly limited. It is very suitable for a working environment with a high junction temperature and a need for rapid stepwise cooling. Such as the heat dissipation of high-power LEDs, the heat dissipation of the hot end of a semiconductor refrigeration chip, and thermoelectric power generation. Therefore, as a heat transfer component, the heat pipe can meet the heat dissipation requirements of the electronic industry and many other industries.

[0058] The structure of the VC heat pipe can be a completely enclosed flat cavity formed by a bottom plate, a frame, and a cover plate. The inner wall surface of the cavity is provided with a liquid-absorbing capillary structure, which can be a metal wire mesh, a microgroove, a fiber filament, a sintered metal powder core, or a combination of several structures. A support structure is required to be provided inside the cavity when necessary to overcome the deformation caused by the negative pressure during vacuum pumping and the thermal expansion.

[0059] It should be noted that the heat conducting member 200 can also be composed of multiple heat pipe components. The heat absorption part 210 of the heat conducting member 200 corresponds to the heat absorption section of the heat pipe, the transition part 230 of the heat conducting member 200 corresponds to the heat transfer section of the heat pipe, and the heat dissipation part 220 of the heat conducting member 200 corresponds to the heat dissipation section of the heat pipe, which can also achieve the purpose of transferring heat.

[0060] In some embodiments, the connecting member 100 and the heat dissipation member 300 are respectively connected to the same side of the heat conducting member 200 in the first direction. With this setting, when the device to be cooled (such as a CPU) is connected to the connecting member 100 and the heat dissipation member 300 is connected to the heat dissipation part 220 of the heat conducting member 200, the device to be cooled 300 and the heat dissipation member 300 can be located on the same side of the heat conducting member 200 in the first direction, avoiding occupying more space because they are on both sides of the heat conducting member 200 in the third direction.

[0061] It can be understood that in some other embodiments, the connecting member 100 and the heat dissipation member 300 can also be respectively connected to the opposite sides of the heat conducting member 200 in the first direction. When the position of the device to be cooled is relatively fixed, the position arrangement of the heat dissipation member 300 is more flexible, so as to make better use of the internal space of the electronic device.

[0062] In some embodiments, the connecting member 100 can be configured as a plate. The connecting member 100 includes a first side surface and a second side surface that are opposite to each other in the first direction. The first side surface is used to connect to the device to be cooled, and the heat absorption part 210 is connected to the second side surface. Among them, a first installation position 120 can be formed on the first side of the connecting member 100, and the device to be cooled can be connected to the first installation position 120. For example, it can be connected through a heat-conducting adhesive provided in the first installation position 120, and the heat absorption part 210 of the heat conducting member 200 can be fixedly connected to the second side surface of the connecting member 100. The connecting member 100 can play a role in connecting the heat conducting member 200 and the device to be cooled. At the same time, considering that the strength of the heat conducting member 200 is limited, the connecting member 100 can also play a supporting role. In some embodiments, the connecting member 100 can be made of stainless steel, such as austenitic stainless steel that is easily cold-worked and strengthened.

[0063] In order to improve heat dissipation, in some embodiments, there are multiple heat dissipation parts 220; the heat conducting member 200 further includes a transition part 230, and the multiple heat dissipation parts 220 are connected to the heat absorption part 210 through the transition part 230, and one heat dissipation member 300 is arranged on each heat absorption part 210. By designing the heat conducting member 200 to have a structure with multiple heat dissipation parts 220, and the multiple heat dissipation parts 220 can be connected through one or more transition parts 230, the heat absorbed by the heat absorption part 210 is transferred to the multiple heat dissipation parts 220, and heat dissipation is achieved through the multiple heat dissipation members 300 arranged on the multiple heat dissipation parts 220, realizing the cooling of the device to be cooled.

[0064] It can be understood that the multiple heat dissipation parts 220 can be arranged in any suitable manner. In some embodiments, the multiple heat dissipation parts 220 are arranged at intervals in the second direction, and the multiple heat dissipation parts 220 are arranged at intervals from the heat absorption part 210 in the third direction; wherein, the second direction is perpendicular to the third direction. Among them, the multiple heat dissipation parts 220 can be arranged at intervals along the second direction, and the multiple heat dissipation parts 220 are arranged at intervals from the heat absorption part 210 in the third direction. In this way, the multiple heat dissipation parts 220 are all located on the sides of the heat absorption part 210. On the one hand, it avoids interference with the device to be cooled installed on the connecting member 100, and on the other hand, it increases the heat dissipation area and improves the heat dissipation capacity.

[0065] As Figure 1 and Figure 2 shown, there can be two heat dissipation parts 220, and the two heat dissipation parts 220 are arranged at intervals in the second direction and are located on the opposite sides of the heat absorption part 210. The heat conducting member 200 can be in a "T" shape or approximately a "T" shape. Among them, the two heat dissipation parts 220 are arranged at intervals in the second direction on the two wings of the "T" shape, and the heat absorption part 210 is arranged at the lower position of the "T" shape, that is, arranged at intervals from the two heat dissipation parts 220 in the third direction. The two heat dissipation parts 220 are located on the opposite sides of the heat absorption part 210 in the second direction. The purpose of such a setting is that usually, when the device to be cooled (such as a CPU) is located near the middle position in the second direction of the electronic device, the two heat dissipation parts 220 are arranged on both sides of the heat absorption part 210 in the second direction, which is convenient for the connecting member 100 at the heat absorption part 210 to be connected to the device to be cooled. At the same time, the two heat dissipation parts 220 are also convenient for arranging heat dissipation fans 30 for heat dissipation.

[0066] For the convenience of connecting and fixing the heat dissipation device 10 inside the electronic device, as Figure 2 、 Figure 4 、 Figure 5 and Figure 7As shown, optionally, the heat dissipation device 10 further includes a fixing member 400 connected to the connecting member 100 and the heat conducting member 200. The fixing member 400 is formed with an installation portion 401 for fixedly installing the heat dissipation device 10. Among them, the fixing member 400 can be respectively connected to the connecting member 100 and the heat conducting member 200, and an installation portion 401 can be provided thereon. The installation portion 401 is used to connect to the structure inside the electronic device, so as to realize its own fixation.

[0067] The above-mentioned fixed connection of the fixing member 400 to the connecting member 100 and the heat conducting member 200 respectively is exemplary. When the connecting member 100 and the heat conducting member 200 are fixedly connected, the fixing member 400 can also be fixedly connected only to the connecting member 100, as long as the fixed installation of the heat dissipation device 10 can be realized.

[0068] The fixing member 400 can be constructed in any suitable structure. In some embodiments, the fixing member 400 can be constructed as a fixing bracket 410. An installation through hole 411 for the screw 500 to pass through is formed on the fixing bracket 410, and the installation through hole 411 forms the installation portion 401. Among them, the fixing bracket 410 can be respectively connected to the connecting member 100 and the heat conducting member 200. A part of the fixing bracket 410 extends to the outside of the connecting member 100, and an installation through hole 411 is formed thereon, which facilitates the heat dissipation device 10 to be fixed after the screw 500 passes through the installation through hole 411.

[0069] It should be noted that, in some embodiments, the installation portion 401 can also be constructed as, for example, a snap structure. Correspondingly, a card slot is arranged on the electronic device, and the heat dissipation device 10 can also be fixed in a snap connection manner.

[0070] In order to better fixedly connect the heat conducting member 200 to the electronic device when the heat dissipation device 10 is fixed, in some embodiments, the installation through hole 411 of a part of the fixing bracket 410 extends to the heat conducting member 200, and a mating hole 201 corresponding to the installation through hole 411 is formed on the heat conducting member 200, so that the screw 500 can pass through the mating hole 201 and the installation through hole 411 to fix the connecting member 100 and the heat conducting member 200. A part of the structure of the fixing bracket 410 with the installation through hole 411 coincides with the heat conducting member 200. For example, this part can be a transition portion 230, and a mating hole 201 corresponding to the installation through hole 411 is provided on the heat conducting member 200. Therefore, when the screw 500 passes through the mating hole 201 and the installation through hole 411 and then connects to the installation station of the electronic device, the connection of the heat conducting member 200 can be better realized.

[0071] The fixing member 400 is connected to the second side surface of the connecting member 100. Therefore, in order to avoid a gap between the heat conducting member 200 and the connecting member 100 due to the presence of the fixing member 400, that is, to occupy the dimension in the third direction, in some embodiments, an installation space 110 recessed toward the first side surface is formed on the second side surface of the connecting member 100. The fixing member 400 is disposed in the installation space 110, and the fixing member 400 is located between the connecting member 100 and the heat conducting member 200. By constructing the installation space 110, the fixing member 400 can be arranged inside the installation space 110, reducing the space occupied in the third direction. Preferably, the dimension of the installation space 110 in the third direction is equivalent to the thickness of the fixing member 400, enabling the fixing member 400 to support the connecting member 100 without occupying much height in the third direction.

[0072] Optionally, there are two installation spaces 110, which are arranged at intervals in the second direction, and one fixing member 400 is disposed in each installation space 110; the fixing member 400 is respectively formed with an installation portion 401 in the third direction, and the installation portion 401 extends to the outside of the connecting member 100, and one installation portion 401 extends to the transition portion 230 of the heat conducting member 200.

[0073] An installation space 110 can be respectively arranged on the opposite sides of the connecting member 100 in the second direction. One fixing member 400 is arranged in each installation space 110, and each fixing member 400 is formed with two installation portions 401, that is, installation through holes 411. The two installation through holes 411 are respectively located on both sides of the fixing member 400 in the third direction. The two installation through holes 411 both extend to the outside of the connecting member 100. One is located on the side of the connecting member 100 away from the heat dissipation portion 220 of the heat conducting member 200, and the other extends toward the heat dissipation portion 220 of the heat conducting member 200 and corresponds to the mating hole 201 of the transition portion 230. Thus, a total of four installation portions 401 are provided for the two fixing members 400, and the four installation portions 401 are distributed at the four corners of the connecting member 100. When fixedly connected to the connection structure of the electronic device, the heat dissipation device 10 can be better fixed.

[0074] For the convenience of connection with the device to be cooled, such as Figure 4 and Figure 7As shown, in some embodiments, a first mounting position 120 for disposing a first thermal conductive adhesive 610 is formed on the first side surface of the connecting member 100, and the first mounting position 120 is located between two mounting spaces 110. The first thermal conductive adhesive 610 is used to connect with the device to be cooled. Wherein, the first mounting position 120 can be marked with any suitable mark. For example, two right-angled shapes arranged diagonally are provided on the first side surface to limit the arrangement position of the first thermal conductive adhesive 610. It should be noted that the first mounting position 120 can also be other shapes, such as polygons, circles or ellipses, and can be arranged according to the shape of the device to be cooled.

[0075] In other embodiments, second thermal conductive adhesives 620 are further provided on the first side surface of the connecting member 100 corresponding to the positions of the mounting spaces 110. The second thermal conductive adhesives 620 can be arranged on the opposite sides in the second direction of the first mounting position 120 and are used to connect with the device to be cooled or the fixing structure on the side of the device to be cooled, and can also play the role of transferring heat.

[0076] It should be noted that the first thermal conductive adhesive 610 and the second thermal conductive adhesives 620 can be thermal conductive gels, thermal conductive greases, etc.

[0077] The heat dissipation member 300 can be constructed with any suitable structure. Optionally, the heat dissipation member 300 includes a plurality of heat dissipation air ducts 310 for allowing air flow to pass through. It should be noted that the heat dissipation member 300 can be made of a metal material, such as steel, aluminum or copper, etc. Preferably, the heat dissipation member 300 is made of aluminum and aluminum alloy materials, which has better thermal conductivity while achieving light weight.

[0078] As Figure 1 As shown, in some embodiments, the plurality of heat dissipation air ducts 310 extend in the third direction and are arranged at intervals in the second direction. With such an arrangement, it is convenient to arrange a heat dissipation fan 30 on one side of the heat dissipation member 300 in the third direction, and the heat dissipation fan 30 faces one end of the heat dissipation air duct 310. The air flow blown out by the heat dissipation fan 30 can enter from one end of the heat dissipation air duct 310 and be discharged from the other end, thereby taking away the heat of the heat dissipation member 300 to achieve the heat dissipation purpose.

[0079] It should be noted that a buffer member 700, such as a sponge, can be arranged behind the heat dissipation member 300 and away from the side surface of the heat dissipation part 220 to fill the gap between it and the internal structure of the electronic device and improve stability. It should be noted that the buffer member 700 can also be arranged on the side surface of the heat dissipation part 220 facing away from the heat dissipation member 300 to fill the gap between this side and the internal structure of the electronic device.

[0080] As Figure 9As shown, according to the second aspect of the present disclosure, an electronic device is further provided. The electronic device includes a device to be cooled and the above-mentioned heat dissipation device 10; the connection part of the heat dissipation device 10 is connected to the device to be cooled. Therefore, the connecting member 100 of the heat dissipation device 10 can transfer the heat of the device to be cooled to the heat absorption part 210 of the heat conducting member 200, and be transferred by the heat conducting member 200 to the heat dissipation part 220, and then the heat dissipation member 300 installed on the heat dissipation part 220 transfers the heat to the outside, thereby realizing the cooling of the device to be cooled.

[0081] It should be noted that the electronic device can be a laptop computer, a tablet computer, etc., or can be a mobile phone, a learning machine, etc. It should be pointed out that this heat dissipation structure has a better effect on electronic devices with thickness size requirements, and can meet the customer's demand for lightness and thinness.

[0082] In order to quickly discharge the heat of the heat dissipation member 300 to the outside, in some embodiments, the electronic device may further include a heat dissipation fan 30. The heat dissipation fan 30 corresponds to the heat dissipation member 300 and faces the heat dissipation member 300, so that the wind blown by the heat dissipation fan 30 can act on the heat dissipation member 300, thereby improving the heat dissipation efficiency of the heat dissipation member 300.

[0083] It can be understood that when there are multiple heat dissipation members 300, a heat dissipation fan 30 can be provided separately for each heat dissipation member 300. Of course, a heat dissipation fan 30 that can cover multiple heat dissipation members 300 can also be provided.

[0084] Optionally, the electronic device is a laptop computer, the device to be cooled can be the CPU of the laptop computer, and the heat dissipation device 10 is used for CPU heat dissipation. Among them, the heat absorption part 210 of the heat conducting member 200 is connected to the CPU through the connecting member 100. At the same time, the laptop computer further includes a heat dissipation fan 30, and the heat dissipation fan 30 corresponds to the heat dissipation part 220 and the heat dissipation member 300 of the heat conducting member 200, for better heat dissipation.

[0085] In some embodiments, the electronic device includes a housing 20, and an air inlet 21 and an air outlet 22 are provided on the housing 20; the heat dissipation member 300 is disposed close to the air outlet 22. Through the above settings, when the wind blown by the heat dissipation fan 30 acts on the heat dissipation member 300, it can be discharged through the air outlet 22 along the shortest path, avoiding affecting the heat dissipation efficiency due to a long path.

[0086] Optionally, there are two air inlets 21, and the two air inlets 21 are respectively located on opposite sides in the second direction of the housing 20, and the air outlet 22 is located on one side in the third direction of the housing 20. As Figure 9As shown, there is an air inlet 21 provided on each of the left and right sides of the housing 20 of the laptop in the left-right direction, and an air outlet 22 is provided at the rear side of the housing 20. When the cooling fan 30 operates, the cold air from the outside can enter the interior of the housing 20 through the two air inlets 21 on both sides, and the hot air blown by the cooling fan 30 towards the heat sink 300 to absorb heat can be discharged from the air outlet 22 at the rear of the housing 20.

[0087] The heat dissipation device 10 and the electronic device of the present disclosure, the heat dissipation device 10 includes a connecting member 100, a heat conducting member 200 and a heat sink 300. Among them, the heat conducting member 200 includes a heat absorption portion 210 and a heat dissipation portion 220 that are greater than being in the same plane, and the heat dissipation portion 220 is located on the side of the heat absorption portion 210. When the connecting member 100 is connected to the heat absorption portion 210 and the heat sink 300 is connected to the heat dissipation portion 220, the projections of the connecting member 100 and the heat sink 300 on the heat conducting member 200 are staggered. Therefore, the space occupied in the thickness direction of the heat conducting member 200 can be saved, and the thickness of the electronic device to which it is applied can be reduced to a certain extent.

[0088] The preferred embodiments of the present disclosure have been described in detail above in conjunction with the accompanying drawings. However, the present disclosure is not limited to the specific details in the above embodiments. Within the scope of the technical concept of the present disclosure, various simple modifications can be made to the technical solutions of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0089] In addition, it should be noted that, among the various specific technical features described in the above specific embodiments, they can be combined in any suitable manner without conflict. To avoid unnecessary repetition, the present disclosure will not separately describe various possible combination methods.

[0090] In addition, any combination can be made between various different embodiments of the present disclosure, as long as it does not violate the idea of the present disclosure, it should also be regarded as the content disclosed by the present disclosure.

Claims

1. A heat dissipation device for an electronic device, characterized in that, Comprising: A connecting member for connecting with a device to be cooled; A heat conducting member including a heat absorbing portion and a heat dissipating portion, the heat absorbing portion and the heat dissipating portion being substantially in the same plane, and the heat dissipating portion being located laterally of the heat absorbing portion, the connecting member being connected to the heat absorbing portion; And A heat dissipating member connected to the heat dissipating portion.

2. The heat dissipation device according to claim 1, characterized in that, The heat conducting member is a VC heat pipe; and / or The connecting member and the heat dissipating member are respectively connected to the same side of the heat conducting member in a first direction.

3. The heat dissipation device according to claim 1, wherein The connecting member is configured as a plate, the connecting member including a first side surface and a second side surface opposite to each other in the first direction, the first side surface being for connecting with the device to be cooled, and the heat absorbing portion being connected to the second side surface.

4. The heat dissipation device according to claim 1, wherein, There are a plurality of the heat dissipating portions; The heat conducting member further includes a transition portion, and the plurality of heat dissipating portions are connected to the heat absorbing portion through the transition portion, and one heat dissipating member is arranged for each heat absorbing portion.

5. The heat dissipation device according to claim 4, characterized in that, The plurality of heat dissipating portions are arranged at intervals in a second direction, and the plurality of heat dissipating portions are spaced from the heat absorbing portion in a third direction; Wherein, the second direction is perpendicular to the third direction.

6. The heat dissipation device according to claim 5, wherein There are two heat dissipating portions, the two heat dissipating portions being arranged at intervals in the second direction and located on opposite sides of the heat absorbing portion.

7. The heat dissipation device according to claim 1, wherein The heat dissipation device further includes a fixing member connected to the connecting member and the heat conducting member, the fixing member being formed with a mounting portion for fixedly mounting the heat dissipation device.

8. The heat dissipation device according to claim 7, wherein, The fixing member is configured as a fixing bracket, and the fixing bracket is formed with mounting through holes for screws to pass through, and the mounting through holes form the mounting portion.

9. The heat dissipation device according to claim 8, wherein The mounting through holes of a part of the fixing bracket extend to the heat conducting member, and the heat conducting member is formed with mating holes corresponding to the mounting through holes, so that screws can pass through the mating holes and the mounting through holes to fix the connecting member and the heat conducting member.

10. The heat dissipation device according to claim 7, wherein The second side surface of the connecting member is formed with a mounting space recessed towards the first side surface direction, the fixing member is arranged in the mounting space, and the fixing member is located between the connecting member and the heat conducting member.

11. The heat dissipation device according to claim 10, wherein, There are two mounting spaces, and they are arranged at intervals in the second direction, and one fixing member is arranged in each mounting space; The fixing member respectively forms a mounting portion in the third direction, the mounting portion extends to the outside of the connecting member, and one mounting portion extends to the transition portion of the heat conducting member.

12. The heat dissipation device according to claim 11, wherein, The first side surface of the connecting member is formed with a first mounting position for arranging a first heat conducting adhesive, and the first mounting position is between the two mounting spaces, and the first heat conducting adhesive is for connecting with the device to be cooled.

13. The heat dissipation device according to claim 12, wherein A second heat conducting adhesive is further provided at the position of the first side surface of the connecting member corresponding to the mounting space.

14. The heat dissipation device according to any one of claims 1-13, characterized in that, The heat dissipating member includes a plurality of heat dissipation air ducts for allowing air flow to pass through.

15. The heat dissipation device according to claim 14, wherein The plurality of heat dissipation air ducts extend in the third direction and are arranged at intervals in the second direction.

16. An electronic device, characterized in that, The electronic device includes a device to be cooled and the heat dissipation device according to any one of claims 1-15; The connecting portion of the heat dissipation device is connected to the device to be cooled.

17. The electronic device according to claim 16, wherein The electronic device further includes a heat dissipation fan, and the heat dissipation fan corresponds to the heat dissipating member and faces the heat dissipating member.

18. The electronic device according to claim 16, wherein The electronic device is a laptop computer.

19. The electronic device according to any one of claims 16-18, characterized in that, The electronic device includes a housing, and an air inlet and an air outlet are provided on the housing; The heat dissipation member is disposed near the air outlet.

20. The electronic device according to claim 19, wherein, There are two air inlets, and the two air inlets are respectively located on opposite sides in the second direction of the housing, and the air outlet is located on one side in the third direction of the housing.

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