Moving ring height measuring device and semiconductor equipment

Abstract

The utility model provides a moving ring height measuring device and a semiconductor device. One end of a fixing structure of the moving ring height measuring device is fixedly connected with the bottom of a measuring ruler body, and the other end is a detachable fixing piece. The movable ruler frame slidably sleeves the measuring ruler body, and the clamping structure controls the friction force between the movable ruler frame and the measuring ruler body. The first scale line of the measuring ruler body is used for measuring the position of the positioning mark of the movable ruler frame on the measuring ruler body. According to the utility model, the measuring ruler body and the movable ruler frame can slide relative to each other, and the horizontal state of the movable ring can be accurately and directly measured through the position of the movable ruler frame, which is pressed by the movable ring, after the measuring ruler body slides down; meanwhile, the friction force between the measuring ruler body and the movable ruler frame is adjusted by the clamping structure, so that the movable ring is prevented from being damaged in the measuring process; a positioning mark is arranged as a second scale line, so that the measurement precision is improved; and finally, a protection pad is arranged on the movable ruler frame to prevent the movable ring from being pressed down to damage the movable ring height measuring device, and the measuring accuracy is ensured.

Description

Technical Field

[0001] The utility model belongs to the field of semiconductor equipment, and particularly relates to a moving ring height measuring device and a semiconductor equipment. Background Art

[0002] In the current semiconductor process, a MR (Moving Ring) is required inside the cavity of a RIE (Reactive Ion Etching) machine. The moving ring has the function of moving up and down. When it is necessary to introduce a wafer into the cavity or take out the wafer from the cavity, the moving ring can be lifted to a high position; when in the etching process, the moving ring can be lowered to a low position, so as to play a role in constraining the plasma, so that the plasma can be maintained above the wafer. The moving ring is generally hung on three shafts passing through a telescopic bellow, and the three bellows are connected together by a steering wheel-shaped structure, and the movement of the moving ring is driven by a cylinder.

[0003] However, when the horizontal heights of different positions of the moving ring are different, it will cause different plasma constraint effects at different positions of the moving ring at different heights, affecting the uneven pumping speed of the pump for the plasma and reaction by-products at each position below the moving ring, thus affecting the particle distribution and ER (Etch Rate) in the cavity. Therefore, it is very crucial in the RIE process to measure the horizontal height of each position of the moving ring when it is pressed down to the low position, and then adjust the horizontal state of the moving ring by changing the height of the shafts in the three bellows so that the horizontal heights of each position of the moving ring are the same.

[0004] In the prior art, generally two methods are used to measure the horizontal state of the moving ring: one is to measure the height of the shaft connected to the moving ring by measuring the height of the shaft in the bellow above the surface of the moving ring after the moving ring is pressed down with an altimeter, so as to indirectly characterize the relative horizontal height of each position of the moving ring. The disadvantage of this method is that it can only measure the relative height of external related components to indirectly reflect the height of the moving ring, and cannot actually measure the relative horizontal height of the moving ring inside the cavity, resulting in a large measurement error; the other method is to set a cylindrical tool with variable height under the position where the moving ring is pressed down in the cavity, lift the moving ring after it is pressed down, and then open the cavity to measure the height of the cylindrical tool pressed down to measure the horizontal height of each position of the moving ring. This method requires a large force to squeeze, which may cause damage to the quartz moving ring, and the cylindrical tool is prone to displacement under the influence of the moving ring during the measurement process, and reliable measurement results cannot be obtained either.

[0005] Therefore, there is an urgent need for a measurement structure that can directly and accurately measure the horizontal state of the moving ring.

[0006] It should be noted that the above introduction of the technical background is only for the convenience of clearly and completely explaining the technical solution of the present application and facilitating the understanding of those skilled in the art, and it cannot be considered that the above technical solutions are well-known to those skilled in the art just because these solutions are described in the background art part of the present application. Summary of the Invention

[0007] In view of the above-mentioned disadvantages of the prior art, the purpose of the present utility model is to provide a moving ring height measuring device and a semiconductor device, which are used to solve the problems that the horizontal state of the moving ring cannot be directly measured and the measurement result is unreliable in the prior art.

[0008] To achieve the above purpose and other related purposes, the present utility model provides the following technical solutions:

[0009] In a first aspect, the present utility model provides a moving ring height measuring device, which includes: a measuring scale body, a moving scale frame, a fixing structure, and a clamping structure;

[0010] One end of the fixing structure is fixedly connected to the bottom of the measuring scale body, and the other end of the fixing structure is a detachable fixing member; the moving scale frame is sleeved on the measuring scale body so as to be slidable up and down in a first direction, and the moving scale frame includes a coincident area that is always in contact with the measuring scale body during the sliding process in the first direction. A clamping structure is arranged in the coincident area of the moving scale frame, and the clamping structure is used to control the magnitude of the friction force between the moving scale frame and the measuring scale body;

[0011] The measuring scale body is marked with first scale lines in the first direction, and a positioning mark is marked at a position of the moving scale frame close to the first scale lines. The first scale lines are used to measure the position of the positioning mark on the measuring scale body.

[0012] Optionally, the positioning mark is a second scale line.

[0013] Optionally, the detachable fixing member is a fixing screw.

[0014] Optionally, the fixing structure and the measuring scale body are an integrated structure.

[0015] Optionally, the clamping structure is a clamping screw and a clamping screw hole. The clamping screw hole penetrates through the moving scale frame in a direction perpendicular to the first direction and exposes the measuring scale body. The clamping screw is threadedly connected to the clamping screw hole, and the depth of the clamping screw screwed into the clamping screw hole controls the magnitude of the friction force between the measuring scale body and the moving scale frame.

[0016] Optionally, a protective pad with a flat surface is provided on the top of the movable scale frame.

[0017] Optionally, the hardness of the protective pad is greater than or equal to the hardness of the movable ring to be measured by the movable ring height measuring device.

[0018] Optionally, the material of the protective pad is polystyrene.

[0019] In a second aspect, the present invention provides a semiconductor device, which includes a movable ring, and the semiconductor device uses any one of the above-mentioned movable ring height measuring devices to measure the horizontal height of a preset position of the movable ring.

[0020] Optionally, a stepped surface is provided below the movable ring of the semiconductor device, and a positioning structure detachably fixed to the detachable fixing member of the fixing structure of the movable ring height measuring device is provided at a preset position of the stepped surface. One or more of the movable ring height measuring devices are fixed to the positioning structure of the stepped surface through the fixing structure according to a preset distribution.

[0021] As described above, the movable ring height measuring device and the semiconductor device of the present invention have the following beneficial effects:

[0022] In the present invention, by setting the slidable up and down between the measuring scale body and the movable scale frame, the relative height of each position of the movable ring can be accurately and directly measured by the position of the movable scale frame sliding down after being pressed by the movable ring, so that the horizontal state of the movable ring can be accurately measured;

[0023] In the present invention, by adjusting the friction force between the measuring scale body and the movable scale frame through the clamping structure, the measurement accuracy is ensured and the damage to the movable ring during the measurement process is avoided;

[0024] In the present invention, by setting the positioning mark of the movable scale frame as the second scale line, the measurement accuracy is further improved;

[0025] In the present invention, by providing a protective pad on the movable scale frame, the stress generated by the downward pressure of the movable ring is avoided from damaging the movable ring height measuring device, and the measurement accuracy is ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It shows a schematic structural diagram of the movable ring height measuring device in the present invention.

[0027] Figure 2 It shows a schematic structural distribution diagram of the movable ring in the cavity of the semiconductor device in the prior art.

[0028] Figure 3 It shows a schematic structural diagram of the movable ring height measuring device in the process of measuring the movable ring in the present invention.

[0029] Figure 4 It shows a schematic diagram of a partial top view of the interior of the semiconductor device in the present utility model.

[0030] Element label description

[0031] 10. Moving ring height measuring device; 11. Fixing structure; 111. Detachable fixing part; 112. Fixing screw; 12. Measuring scale body; 121. First scale line; 13. Moving scale frame; 131. Coincidence area; 132. Clamping screw; 133. Clamping screw hole; 134. Positioning mark; 135. Second scale line; 14. Protective pad;

[0032] 20. Cavity; 21. Moving ring; 22. Bellows; 23. Shaft; 24. Step surface; 25. FEIS ring; 26. Fixing screw hole. Specific implementation mode

[0033] The following uses specific specific examples to illustrate the implementation mode of the present utility model. Those skilled in the art can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. The present utility model can also be implemented or applied through other different specific implementation modes, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present utility model.

[0034] When detailing the embodiments of the present utility model, for the convenience of description, the schematic diagrams showing the device structure will be enlarged locally in a non-general proportion, and the schematic diagrams are only examples and should not limit the protection scope of the present utility model here. In addition, in actual production, three-dimensional spatial dimensions including length, width, and depth should be included.

[0035] For the convenience of description, spatial relationship terms such as "below", "beneath", "lower than", "under", "above", "on" may be used herein to describe the relationship between one element or feature shown in the drawings and other elements or features. It will be understood that these spatial relationship terms are intended to encompass other directions of the device in use or operation in addition to the directions depicted in the drawings.

[0036] In the context of the present application, the structure in which the first feature is "above" the second feature may include embodiments in which the first and second features are formed in direct contact, and may also include embodiments in which additional features are formed between the first and second features, such that the first and second features may not be in direct contact.

[0037] It should be noted that the illustrations provided in this embodiment only schematically illustrate the basic concept of the present utility model. Therefore, only the components related to the present utility model are shown in the illustrations, rather than being drawn according to the number, shape, and size of the components in actual implementation. The type, quantity, and ratio of each component in actual implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0038] As Figure 1 shown, the present utility model provides a mobile ring height measuring device 10, and the mobile ring height measuring device 10 includes: a measuring scale body 12, a moving scale frame 13, a fixing structure 11, and a clamping structure;

[0039] One end of the fixing structure 11 is fixedly connected to the bottom of the measuring scale body 12, and the other end of the fixing structure 11 is a detachable fixing member 111; the moving scale frame 13 is sleeved on the measuring scale body 12 so as to be slidable up and down in a first direction. The moving scale frame 13 includes a coincidence area 131 that always contacts the measuring scale body 12 during the sliding process in the first direction. A clamping structure is arranged in the coincidence area 131 of the moving scale frame 13, and the clamping structure is used to control the friction force between the moving scale frame 13 and the measuring scale body 12;

[0040] The measuring scale body 12 is marked with a first scale line 121 in the first direction, and a positioning mark 134 is marked at a position of the moving scale frame 13 close to the first scale line 121. The first scale line 121 is used to measure the position of the positioning mark 134 on the measuring scale body 12.

[0041] As Figure 2As shown in the figure, in the prior art, it is necessary to ensure that the horizontal height of the moving ring 21 is the same at various positions placed in the cavity 20, so as to ensure that the plasma extraction and reaction by-product extraction speeds at various positions below the moving ring 21 are evenly distributed, and to ensure the uniformity of the process effect. Among the current methods in the industry for measuring the horizontal state of the moving ring 21, one method is to use an altimeter to measure the height of the inner shaft 23 in the bellows 22 above the surface of the moving ring 21 after the moving ring 21 is pressed down, so as to obtain the height of the shaft 23 connected to the moving ring 21, thereby indirectly characterizing the relative horizontal height of each position of the moving ring 21. The disadvantage of this method is that it can only measure the relative height of external related components to indirectly reflect the height of the moving ring 21, and it is impossible to actually measure the relative horizontal height of the moving ring 21 inside the cavity 20, resulting in a large measurement error; another method is to set a cylindrical tool with a variable height under the position where the moving ring 21 is pressed down in the cavity 20. After the moving ring 21 is pressed down and then lifted, the cavity is opened to measure the height of the cylindrical tool pressed down, so as to measure the horizontal height of each position of the moving ring 21. This method requires a large force to squeeze, which may cause damage to the quartz moving ring 21, and the cylindrical tool is prone to displacement under the influence of the moving ring 21 during the measurement process, and reliable measurement results cannot be obtained either.

[0042] As Figure 3 shown, in the present utility model, by setting that the measuring scale body 12 and the moving scale frame 13 can slide up and down relative to each other, the relative height of each position of the moving ring 21 can be accurately and directly measured by the position of the moving scale frame 13 sliding down on the measuring scale body 12 under the pressing of the moving ring 21, so that the horizontal state of the moving ring 21 can be accurately measured; at the same time, since the measuring scale body 12 and the moving scale frame 13 can slide relative to each other by themselves, a large squeezing force does not need to be used, and only by normally lowering the moving ring 21, the horizontal state of the moving ring 21 can be measured, and the moving ring 21 will not be damaged; in addition, a fixing structure 11 including a detachable fixing member 111 is fixedly connected to the measuring scale body 12, so that when the moving ring height measuring device 10 measures the horizontal state of the moving ring 21 in the cavity 20, it can be fixed on the step surface 24 in the cavity 20, ensuring that the moving ring height measuring device 10 will not cause unreliable measurement results due to displacement during the measurement process.

[0043] In one embodiment, as Figure 1 shown, the positioning mark 134 is the second scale line 135.

[0044] By setting the positioning mark 134 as the second scale line 135 in the present utility model, the positioning measurement between the second scale line 135 and the first scale line 121 can be more accurate, and the accuracy of measuring the horizontal state of the moving ring 21 is improved.

[0045] Specifically, the positioning mark 134 can also be other marks, as long as the position of the movable scale frame 13 on the measuring scale body 12 can be confirmed, which are all within the protection scope of the present utility model.

[0046] In one embodiment, as Figure 1 shown, the detachable fixing member 111 is a fixing screw 112.

[0047] By setting the detachable fixing member 111 as the fixing screw 112 in the present utility model, only by setting fixing screw holes 26 corresponding to the fixing screw 112 at the position of the movable ring height measuring device 10 in the cavity 20, the fixed connection and simple disassembly of the movable ring height measuring device 10 can be realized. The structure is simple, the installation is convenient, and at the same time, the fixing reliability of the movable ring height measuring device 10 during the measurement process is ensured.

[0048] In one embodiment, as Figure 1 shown, the fixing structure 11 and the measuring scale body 12 are of an integral structure.

[0049] By setting the fixing structure 11 and the measuring scale body 12 to be integral in the present utility model, the deviation between the measurement results at different positions caused by the difference in the fixed connection between the fixing structures 11 at different positions and the measuring scale body 12 can be further reduced, and the reliability of the measurement results can be further improved.

[0050] In one embodiment, as Figure 1 shown, the clamping structure is a clamping screw 132 and a clamping screw hole 133. The clamping screw hole 133 penetrates through the movable scale frame 13 along a direction perpendicular to the first direction and exposes the measuring scale body 12. The clamping screw 132 is threadedly connected with the clamping screw hole 133, and the depth of the clamping screw 132 screwed into the clamping screw hole 133 controls the frictional force between the measuring scale body 12 and the movable scale frame 13.

[0051] By setting the clamping structure as the clamping screw 132 and the clamping screw hole 133 in the present utility model, with a simple structure and not occupying too much space, the frictional force between the measuring scale body 12 and the movable scale frame 13 can be adjusted by adjusting the depth of the clamping screw 132 screwed into the clamping screw hole 133. Thus, it can be ensured that the frictional force between the measuring scale body 12 and the movable scale frame 13 is not too large, and normal sliding can be realized when the movable ring 21 is normally pressed down, avoiding damage to the movable ring 21 caused by the need for too much pressure to press down the movable ring 21. At the same time, it is ensured that the frictional force between the movable scale frame 13 and the measuring scale body 12 is not too small, and the movable scale frame 13 will not continuously slide due to the acceleration of the movable ring 21 being pressed down, avoiding affecting the measurement result of the actual horizontal state of the movable ring 21.

[0052] In one embodiment, as Figure 1 shown, a protective pad 14 with a flat surface is provided on the top of the movable scale frame 13.

[0053] By providing the protective pad 14 on the top of the movable scale frame 13 in the present utility model, damage to the moving ring height measuring device 10 during the downward pressing of the moving ring 21 can be avoided, so as to ensure the measurement accuracy of the moving ring height measuring device 10.

[0054] Specifically, the thickness of the protective pad 14 and the slidable range between the movable scale frame 13 and the measuring scale body 12 need to ensure that the positioning mark 134 of the movable scale frame 13 can always move within the first scale line 121 without being stuck during the process of the moving ring 21 being pressed down to the lowest position, so as to ensure that the measurable height of the moving ring height measuring device 10 is within the horizontal height range of the moving ring 21, and the moving ring 21 or the moving ring height measuring device 10 will not be damaged during the measurement process.

[0055] In one embodiment, the hardness of the protective pad 14 is greater than or equal to the hardness of the moving ring 21 to be measured by the moving ring height measuring device 10.

[0056] By setting the hardness of the protective pad 14 in the present utility model, it is ensured that the protective pad 14 will not be deformed or damaged by the extrusion of the moving ring 21, and the measurement accuracy and reliability of the moving ring height measuring device 10 are ensured.

[0057] In one embodiment, the material of the protective pad 14 is polystyrene.

[0058] By setting the material of the protective pad 14 as polystyrene in the present utility model, it can ensure that the moving ring height measuring device 10 is not damaged by the downward pressing of the moving ring 21, and at the same time, the moving ring 21 will not be damaged, thereby improving the measurement quality and reliability of the moving ring height measuring device 10. Specifically, the protective pad 14 can also be made of any other suitable material, which is within the protection scope of the present utility model.

[0059] The present utility model also provides a semiconductor device, as Figure 4 shown as a partial top view of the interior of the semiconductor device. The semiconductor device includes a moving ring 21, and the semiconductor device measures the horizontal height of a preset position of the moving ring 21 by using any one of the above-mentioned moving ring height measuring devices 10.

[0060] In one embodiment, the semiconductor device is a reactive ion etching device.

[0061] Specifically, the present utility model can also be used in any other device that needs to measure the horizontal state of the moving ring 21, which is within the protection scope of the present utility model.

[0062] In one embodiment, as Figure 4 shown, a stepped surface 24 is provided below the moving ring 21 of the semiconductor device. A positioning structure that can be detachably fixed to the detachable fixing member 111 of the fixing structure 11 of the moving ring height measuring device 10 is provided at a preset position of the stepped surface 24. Greater than or equal to 1 moving ring height measuring device 10 is fixed to the positioning structure of the stepped surface 24 through the fixing structure 11 according to a preset distribution.

[0063] In one embodiment, as Figure 4 shown, 3 moving ring height measuring devices 10 are provided, which are respectively distributed directly below 3 shafts 23 to which the moving ring 21 is connected through a bellows 22. Specifically, Figure 4 each moving ring height measuring device 10 has fixing screw holes 26 (not shown) below it for fixedly connecting with the moving ring height measuring device 10. The shown fixing screw holes 26 are not yet fixed to the moving ring height measuring device 10 and can be used for the installation of more moving ring height measuring devices 10.

[0064] Specifically, according to the requirements for the horizontal state of the moving ring 21, the corresponding number and distribution of moving ring height measuring devices 10 are set to measure the horizontal height of each expected position of the moving ring 21, so as to adapt to the usage scenarios with different requirements for the horizontal state of the moving ring 21, and the application flexibility is stronger.

[0065] Specifically, when the detachable fixing member 111 of the moving ring height measuring device 10 is a fixing screw 112 and the stepped surface 24 is provided with corresponding fixing screw holes 26, the torques of the fixing screws 112 corresponding to each moving ring height measuring device 10 screwed into the fixing screw holes 26 on the corresponding stepped surface 24 are the same, so as to ensure that the initial heights of the moving ring height measuring devices 10 fixed on the stepped surface 24 are the same, and to ensure the accuracy and reliability of the measurement results.

[0066] In one embodiment, the torques of the fixing screws 112 corresponding to each moving ring height measuring device 10 screwed into the fixing screw holes 26 on the corresponding stepped surface 24 are the same, which is 20 kg·F·cm.

[0067] Specifically, the stepped surface 24 is the position where the FEIS ring 25 (plasma confinement ring) is placed below the moving ring 21. Before measurement, the FEIS ring 25 can be disassembled, and then the moving ring height measuring device 10 is fixed to the stepped surface 24 through the detachable fixing member 111 of the fixing structure 11 of the moving ring height measuring device 10.

[0068] In one embodiment, the method of using the moving ring height measuring device 10 is as follows: Remove the FEIS ring 25 on the lower step surface 24 of the moving ring 21 from the step surface 24; Install the three measuring scale bodies 12 fixed to the fixed structure 11 into the corresponding three fixed screw holes 26 on the step surface 24 through the fixing screws 112 of the fixed structure 11 respectively. The torque of each fixing screw 112 during installation is the same. The three fixed screw holes 26 are respectively directly below the three shafts 23 to which the moving ring 21 is connected through the bellows 22; Adjust the clamping screw 132 to make the friction between the measuring scale body 12 and the moving scale frame 13 appropriate; Press down the moving ring 21 to the lowest position, and then move the moving ring 21 up to the highest position, and observe the position of the positioning mark 134 of the moving scale frame 13 of each moving ring height measuring device 10 on the first scale line 121 of the measuring scale body 12; Adjust the horizontal height of each position of the moving ring 21 until the positions of the positioning marks 134 of the moving scale frames 13 of each moving ring height measuring device 10 measured on the first scale line 121 of the measuring scale body 12 are the same.

[0069] In summary, for the moving ring height measuring device and the semiconductor device of the present invention, by setting that the measuring scale body and the moving scale frame can slide up and down, the relative height of each position of the moving ring can be accurately and directly measured by the position of the moving scale frame sliding down on the measuring scale body under the downward pressure of the moving ring, so that the horizontal state of the moving ring can be accurately measured; At the same time, by adjusting the friction between the measuring scale body and the moving scale frame through the clamping structure, the measurement accuracy is guaranteed and damage to the moving ring during the measurement process is avoided; In addition, by setting the positioning mark of the moving scale frame as the second scale line, the measurement accuracy is further improved; Finally, by setting a protective pad on the moving scale frame, the stress generated by the downward pressure of the moving ring is avoided from damaging the moving ring height measuring device, ensuring the measurement accuracy.

[0070] Therefore, the present invention effectively overcomes various disadvantages in the prior art and has high industrial utilization value.

[0071] The above embodiments are only illustrative of the principles and effects of the present invention, and are not used to limit the present invention. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present invention should still be covered by the claims of the present invention.

Claims

1. A mobile ring height measuring device, characterized in that, The mobile ring height measuring device includes: a measuring scale body, a movable scale frame, a fixing structure, and a clamping structure; One end of the fixing structure is fixedly connected to the bottom of the measuring scale body, and the other end of the fixing structure is a detachable fixing member; the movable scale frame is sleeved on the measuring scale body and can slide up and down in a first direction. The movable scale frame includes a coincidence area that always contacts the measuring scale body during the sliding process in the first direction. The coincidence area of the movable scale frame is provided with the clamping structure, and the clamping structure is used to control the friction force between the movable scale frame and the measuring scale body; The measuring scale body is marked with first scale lines in the first direction, and a positioning mark is marked at a position of the movable scale frame close to the first scale lines. The first scale lines are used to measure the position of the positioning mark on the measuring scale body.

2. The mobile ring height measuring device according to claim 1, wherein: The positioning mark is a second scale line.

3. The mobile ring height measuring device according to claim 1, characterized in that: The detachable fixing member is a fixing screw.

4. The mobile ring height measuring device according to claim 1, characterized in that: The fixing structure and the measuring scale body are an integrated structure.

5. The mobile ring height measuring device according to claim 1, characterized in that: The clamping structure is a clamping screw and a clamping screw hole. The clamping screw hole penetrates through the movable scale frame in a direction perpendicular to the first direction and exposes the measuring scale body. The clamping screw is threadedly connected to the clamping screw hole, and the depth of the clamping screw screwed into the clamping screw hole controls the friction force between the measuring scale body and the movable scale frame.

6. The mobile ring height measuring device according to claim 1, wherein: A protective pad with a flat surface is provided at the top of the movable scale frame.

7. The mobile ring height measuring device according to claim 6, wherein: The hardness of the protective pad is greater than or equal to the hardness of the mobile ring to be measured by the mobile ring height measuring device.

8. The mobile ring height measuring device according to claim 6, wherein: The material of the protective pad is polystyrene.

9. A semiconductor device, characterized in that, The semiconductor device includes a mobile ring, and the semiconductor device uses the mobile ring height measuring device according to any one of claims 1-8 to measure the horizontal height of a preset position of the mobile ring.

10. The semiconductor device according to claim 9, wherein: A stepped surface is provided below the mobile ring of the semiconductor device. A positioning structure that can be detachably fixed to the detachable fixing member of the fixing structure of the mobile ring height measuring device is provided at a preset position of the stepped surface. Greater than or equal to 1 mobile ring height measuring device is fixed to the positioning structure of the stepped surface through the fixing structure according to a preset distribution.

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