Semiconductor device preparation apparatus and semiconductor device preparation system
By designing a semiconductor device preparation device with air blowing holes with gradually increasing apertures and robotic arm control, the problem of gas extraction film formation caused by instability of nitrogen flow is solved, the stability and uniformity of the air flow are achieved, and the film quality is improved.
Patent Information
- Application Number
- CN202422210766.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-10
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-09-10
AI Technical Summary
Existing semiconductor device preparation devices cannot provide a stable and effective nitrogen gas flow, making it difficult to achieve gas extraction film formation, affecting the quality and structure of the film.
A semiconductor device preparation device is designed, including a substrate fixing assembly and an air blowing assembly. The air outlet section aperture of the air blowing hole gradually increases in the direction of the air flow, the axis is perpendicular to the support surface of the substrate tray, and a vertical air flow is transported to the film forming surface of the substrate through the air blowing hole, and a robotic arm is equipped to control the movement of the air blowing member.
It ensures the stability and uniformity of the air flow, improves the effect of gas extraction film formation, and ensures the uniformity and density of the film.
Smart Images
Figure CN223123874U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor preparation, and specifically provides a semiconductor device preparation apparatus and a semiconductor device preparation system. Background Art
[0002] During the preparation of semiconductor devices, it is very important to keep the preparation environment clean because dust and impurities will have a negative impact on the preparation of semiconductor devices. The most commonly used cleaning method in manual experiments is gas purging, that is, using a nitrogen gun for purging to blow away impurities and dust from the surface of the glass substrate to ensure a clean environment. At the same time, during the preparation of semiconductor devices, the atmosphere control in the spin coater chamber is very important. Poor atmosphere control will directly lead to problems such as poor film formation quality and poor compactness of the device. During the manual preparation process, a nitrogen gun is usually placed in the glove box, and the experimenter manually purges with the nitrogen gun to displace the atmosphere in the spin coater chamber. The nitrogen gun is connected to an external nitrogen source, and the air flow of the nitrogen gun is controlled by the switch valve of the nitrogen source. The nitrogen flow rate cannot be accurately controlled, and the size of the nitrogen flow rate is also affected by the external nitrogen storage. When the external nitrogen storage is less, the air flow rate will also become smaller, which has an adverse effect on the operation effect.
[0003] In addition, the film-forming methods currently used in most laboratory manual experiments are mainly natural film formation and anti-solvent film formation. However, in the manufacturing industry, the film-forming method for preparing thin films on the production line has begun to generally adopt the gas extraction film-forming method. Gas extraction film formation is a method of preparing thin films using gas extraction technology. Its principle is based on the interaction of gas with the surface of solid or liquid under specific conditions to form a thin film on a glass substrate. This method is usually used to prepare nano-scale films, and this method can prepare films with specific functions and structures, such as ultra-thin, transparent, conductive or insulating properties. The key to gas extraction film-forming technology is to precisely control the conditions of the gas phase reaction to ensure the quality and uniformity of the film. Based on this, in order to shorten the distance between the laboratory manufacturing plan and the production line, better adapt to industrialization, and to obtain more experimental data and device performance formed by a variety of film-forming methods, it is necessary to introduce gas extraction film formation in laboratory device preparation. However, the large jet equipment used for gas extraction film formation on the production line cannot be used in the laboratory. In manual experiments in the laboratory, experimenters usually use nitrogen guns for gas extraction experiments. However, the airflow of the nitrogen gun cannot accurately control the nitrogen flow rate, and the gas flow rate of the sprayed gas is also unstable. In this way, it is also difficult to control the distance and angle between the outlet and the substrate. Therefore, it is often impossible to form a uniform airflow for effective nitrogen purge, which leads to adverse effects on the quality and structure of the formed film, and then adversely affects the performance of the film. Therefore, it cannot be used for large-area film formation; and the use of nitrogen guns for gas extraction film formation easily leads to lines on the surface of the formed film, and the quality of the film cannot be guaranteed. Especially in the preparation process of high-throughput devices, due to the limitations of the running path of the robot arm and the robot gripper, it is even impossible to solve the above problems by manual nitrogen purge.
[0004] Accordingly, the art needs a new semiconductor device manufacturing apparatus and a semiconductor device manufacturing system to solve or alleviate the above technical problems to a certain extent. Utility Model Content
[0005] The utility model aims to solve or alleviate to a certain extent the above technical problem, that is, the existing semiconductor device preparation equipment cannot provide a stable and effective nitrogen flow, and thus it is difficult to achieve gas extraction film formation.
[0006] In a first aspect, the utility model provides a semiconductor device manufacturing device, the semiconductor device manufacturing device comprising a substrate fixing component and an air blowing component,
[0007] The substrate fixing assembly includes a substrate tray, and the substrate fixing assembly fixes the substrate through the substrate tray.
[0008] The air-blowing assembly includes an air-blowing member provided with at least one air-blowing hole. The aperture of the air outlet section of the air-blowing hole gradually increases along the air flow direction, and the axis direction of the air-blowing hole is perpendicular to the supporting surface of the substrate tray, so that the air-blowing assembly can convey vertical air flow to the film-forming surface of the substrate through the air-blowing hole.
[0009] In a preferred technical solution of the above semiconductor device manufacturing apparatus, the apertures of each part of the air inlet section of the air-blowing hole are equal, and the aperture at the connection of the air inlet section and the air outlet section is equal.
[0010] In a preferred technical solution of the above semiconductor device manufacturing apparatus, the cross-sectional shapes of the air inlet section and the air outlet section are the same and are one of a circle and a polygon; and / or
[0011] The axial length of the air outlet section is greater than five times the axial length of the air inlet section.
[0012] In a preferred technical solution of the above semiconductor device manufacturing apparatus, the air-blowing assembly further includes a nitrogen supply member, and the nitrogen supply member is communicated with the air-blowing hole to supply nitrogen gas flow.
[0013] In a preferred technical solution of the above semiconductor device manufacturing apparatus, the air-blowing assembly further includes an air flow regulating member, and the air flow regulating member is arranged upstream of the air-blowing hole.
[0014] In a preferred technical solution of the above semiconductor device manufacturing apparatus, the air-blowing member is further provided with a threaded connection hole communicated with the air-blowing hole, and the air flow regulating member is provided with a threaded structure to be connected to the threaded connection hole.
[0015] In a preferred technical solution of the above semiconductor device manufacturing apparatus, the substrate fixing assembly further includes a bearing member.
[0016] The substrate tray is used to fix the bearing member, and a plurality of mounting grooves are arranged on the bearing member, and the substrate can be placed in the mounting grooves.
[0017] A plurality of the air-blowing holes are arranged on the air-blowing member, and the air-blowing holes and the mounting grooves are arranged in one-to-one correspondence.
[0018] In a preferred technical solution of the above semiconductor device manufacturing apparatus, the air-blowing member is further provided with a diversion cavity, and the ports of the air inlet sections of the plurality of air-blowing holes are all communicated with the diversion cavity, and the air flow regulating member is arranged at the inlet of the diversion cavity.
[0019] In a second aspect, the present utility model further provides a semiconductor device manufacturing system, which includes a robotic arm and the semiconductor device manufacturing apparatus described in any one of the above preferred technical solutions. The robotic arm is capable of gripping the air-blowing member and controlling the movement of the air-blowing member.
[0020] In a preferred technical solution of the above semiconductor device manufacturing system, the air-blowing member includes a first air-blowing member and a second air-blowing member, and the first air-blowing member and the second air-blowing member can be detachably connected to the gripping end of the robotic arm alternatively.
[0021] In the case of adopting the above technical solution, the semiconductor device manufacturing apparatus of the present utility model is provided with a substrate fixing assembly and an air-blowing assembly. Among them, the substrate fixing assembly includes a substrate tray, and the substrate fixing assembly fixes the substrate through the substrate tray. At least one air-blowing hole is provided on the air-blowing member of the air-blowing assembly, and the aperture of the air outlet section of the air-blowing hole gradually increases along the air flow direction. The axis direction of the air-blowing hole is perpendicular to the supporting surface of the substrate tray, so that the air-blowing assembly can deliver vertical air flow to the film-forming surface of the substrate through the air-blowing hole. By adding an air-blowing assembly, the semiconductor device manufacturing apparatus of the present utility model enables the air-blowing assembly to deliver vertical air flow to the film-forming surface of the substrate through the air-blowing hole. Based on this, the distance and angle between the air-blowing hole and the substrate are effectively guaranteed, and thus the stability of the air flow is ensured. Moreover, the present utility model also sets the aperture of the air outlet section of the air-blowing hole to gradually increase along the air flow direction, so that the air flow has a uniform and stable diffusion process before contacting the film-forming surface of the substrate, better ensuring the stability and uniformity of the air flow, and thus effectively guaranteeing the effect of air extraction film formation. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] Referring to the accompanying drawings, the disclosure of the present utility model will become more easily understandable. It is easy for those skilled in the art to understand that these drawings are only for illustrative purposes and are not intended to limit the protection scope of the present utility model. In addition, similar numbers in the figures are used to represent similar components, where:
[0023] Figure 1 shows a partial structural schematic diagram of the semiconductor device manufacturing system of the present utility model;
[0024] Figure 2 shows an overall structural schematic diagram of the first embodiment of the air-blowing member of the present utility model;
[0025] Figure 3 shows a front view of the second embodiment of the air-blowing member of the present utility model;
[0026] Figure 4 shows a cross-sectional view of the second embodiment of the air-blowing member of the present utility model;
[0027] Figure 5 Shows a cross-sectional view of the third embodiment of the air-blowing member of the present utility model;
[0028] Reference numerals:
[0029] 11, spin coater; 111, substrate fixing assembly;
[0030] 12, robotic arm; 121, gripper;
[0031] 131, air-blowing member; 1311, air-blowing holes; 13111, air inlet section; 13112, air outlet section; 1312, threaded connection hole; 1313, diversion cavity; 13131, inlet. Detailed implementation manners
[0032] The optional implementation manners of the present utility model will be described below with reference to the accompanying drawings. Those skilled in the art should understand that these implementation manners are only used to explain the technical principle of the present utility model and are not intended to limit the protection scope of the present utility model. Those skilled in the art can make adjustments according to needs to adapt to specific application scenarios. For example, although this embodiment is described in the context of preparing high-throughput devices using a semiconductor device manufacturing system, it is obvious that the semiconductor device manufacturing system of the present utility model can also be used to manufacture other types of semiconductor devices, which are not restrictive, and those skilled in the art can set them according to actual usage situations. Such a change in the specific application object does not deviate from the basic principle of the present utility model and thus will fall within the protection scope of the present utility model.
[0033] It should be noted that in the description of the present utility model, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection; it can be directly connected or indirectly connected through an intermediate medium, and it can also be the communication inside two components. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations. In addition, in the description of the present utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0034] In addition, it should be noted that in the description of the present utility model, terms indicating the direction or positional relationship such as "middle", "upper", "lower", "inner", "outer", etc. are based on the direction or positional relationship shown in the drawings. This is only for convenience of description and does not indicate or imply that the structure must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. Additionally, words such as "vertical" refer to vertical within the process error range, not absolute vertical. The process error can be within ±10% or within ±5%. For example, if a straight line is perpendicular to a plane, it can be understood that the angle between the straight line and the plane can be 90° ± 5°.
[0035] Based on the problem that the semiconductor device manufacturing apparatus in the prior art cannot provide a stable and effective nitrogen gas flow, and thus it is difficult to achieve gas extraction film formation. To solve this technical problem, the present utility model provides a semiconductor device manufacturing apparatus and a semiconductor device manufacturing system. The semiconductor device manufacturing apparatus includes a substrate fixing assembly and a gas blowing assembly. The substrate fixing assembly includes a substrate tray, and the substrate fixing assembly fixes the substrate through the substrate tray. The gas blowing assembly includes a gas blowing member, and at least one gas blowing hole is provided on the gas blowing member. The aperture of the air outlet section of the gas blowing hole gradually increases along the gas flow direction, and the axial direction of the gas blowing hole is perpendicular to the supporting surface of the substrate tray, so that the gas blowing assembly can deliver a vertical gas flow to the film forming surface of the substrate through the gas blowing hole. The semiconductor device manufacturing system includes a robotic arm and the above-mentioned semiconductor device manufacturing apparatus, and the robotic arm can hold the gas blowing member and control the movement of the gas blowing member. By adding a gas blowing assembly, the present utility model enables the gas blowing assembly to deliver a vertical gas flow to the film forming surface of the substrate through the gas blowing hole. Based on this, the distance and angle between the gas blowing hole and the substrate are effectively guaranteed, and thus the stability of the gas flow is guaranteed. Moreover, the present utility model also sets the aperture of the air outlet section of the gas blowing hole to gradually increase along the gas flow direction, so that the gas flow has a uniform and stable diffusion process before contacting the film forming surface of the substrate, better guaranteeing the stability and uniformity of the gas flow, and thus effectively guaranteeing the effect of gas extraction film formation.
[0036] First refer to Figure 1, in this embodiment, the substrate fixing assembly 111 is a part of the spin coater 11. Obviously, the substrate fixing assembly 111 can also be a part of other equipment or a separate part, as long as it can fix the substrate, and the specific way of the substrate fixing assembly 111 to fix the substrate is not limited and can be set according to actual usage requirements. Specifically, a spin coating chamber is formed on the main body part of the spin coater 11, and the cover part of the spin coater 11 is rotatably connected to the main body part to realize the opening and closing function. Based on this, in the case where the cover part is closed in place, the cover part and the main body part together form a relatively closed spin coating chamber for the spin coating process. The substrate fixing assembly 111 is arranged at the center of the bottom of the spin coating chamber. As the part of the spin coater 11 for fixing the substrate, the substrate fixing assembly 111 can not only fix the substrate, but also drive the substrate to rotate, so as to realize the spin coating function.
[0037] It can be understood that the substrate fixing assembly 111 may only include a substrate tray ( Figure 1 The situation of only including a substrate tray is shown in the figure). The substrate is directly fixed by the claws of the substrate tray, and the spin coating chamber of the spin coater 11 is used for gas extraction film formation. The substrate fixing assembly 111 may also include a bearing member (not shown in the figure). The substrate tray is used to fix the bearing member. The main body part of the bearing member may be a plate-like structure, a block-like structure or a bracket structure, etc. A plurality of mounting grooves are provided thereon. The specific structure, the number of settings and the distribution mode of the mounting grooves are not limited. The shape of the mounting groove matches the shape of the substrate so that the substrate can be placed in the mounting groove, that is, multiple substrates can be fixed by the bearing member at the same time, so as to perform gas extraction film formation on multiple substrates simultaneously by means of the air blowing assembly.
[0038] Next, refer to Figures 2 to 4 , as Figures 2 to 4 shown, in the first embodiment and the second embodiment of the air blowing member 131, only one air blowing hole 1311 is provided on the air blowing member 131. It should be noted that Figure 2 and Figure 3 are not sectioned, and only the external structure of the air blowing member 131 can be shown. Therefore, the reference numerals in the figure also correspond to the outer walls of the corresponding hole segments. This is only for better showing the positional relationship of each hole segment. For the internal structure of the hole, please refer to Figure 4. The aperture of the air outlet section 13112 of the air blowing hole 1311 gradually increases along the direction of the airflow, and is trumpet-shaped as a whole. This arrangement can effectively slow down the flow rate of the airflow when it is sprayed onto the substrate, effectively prevent the problem of substrate displacement caused by excessive airflow, and also enable the airflow to be sprayed onto the substrate more evenly, so that the film formation is more uniform and denser. It can be understood that the aperture here refers to the width of the cross section of the air outlet section 13112, that is, the width of the cross section perpendicular to the direction of the airflow, and does not limit the shape of the cross section of the air outlet section 13112 to be circular; for example, when the cross-sectional shape of the air outlet section 13112 is square, it means that the length and width of the square gradually increase, presenting the shape of a square funnel as a whole.
[0039] Furthermore, the axial direction of the air blowing hole 1311 (that is, the outlet direction of the air flow) is perpendicular to the supporting surface of the substrate tray, so that the air blowing component can deliver a vertical airflow to the film-forming surface of the substrate through the air blowing hole 1311, that is, the air blowing component can blow air directly to the film-forming surface of the substrate through the air blowing hole 1311. Based on this, a fixed distance and angle can be maintained between the air outlet of the air blowing hole 1311 and the film-forming surface of the substrate, and the air blowing component can continuously and stably output a vertical airflow to the film-forming surface of the substrate, thereby forming an effective airflow purge, thereby effectively ensuring the film-forming effect. It should be noted that the source of the airflow can be obtained with the aid of external equipment, or it can be realized by equipment provided by the semiconductor device preparation device itself, and its airflow usually uses nitrogen flow. Of course, other inert gases can also be used according to actual use requirements, which are not restrictive.
[0040] As a preferred setting mode, the air blowing assembly in the utility model is itself equipped with a nitrogen supply component (not shown in the figure), and the nitrogen supply component is connected to the air blowing hole 1311 to supply nitrogen flow. It can be understood that the nitrogen supply component can be a nitrogen generating device or a nitrogen storage device; it can be directly connected to the air blowing hole 1311, or it can be connected to the air blowing hole 1311 by means of other pipes, which is not restrictive; preferably, a liquid nitrogen tank is used. An independently arranged airflow supply device can provide a more stable airflow, and after the diffusion effect of the air outlet section 13112, it can be output more stably and evenly, which better ensures the purging effect.
[0041] Continue reading Figure 4, As a preferred setting method, the apertures of each part of the air inlet section 13111 of the air blowing hole 1311 are equal, that is, the cavity of the air inlet section 13111 is in a columnar structure as a whole, and the cross-sectional shapes of each part of the columnar structure are exactly the same. The apertures at the connection between the air inlet section 13111 and the air outlet section 13112 are equal, that is, there is no situation of variable diameter connection (such as a stepped surface) at the connection between the air inlet section 13111 and the air outlet section 13112, ensuring the smoothness of the air flow. Of course, the above setting method is only a preferred setting method to better ensure the uniformity and stability of the air flow. The aperture of the air inlet section 13111 of the air blowing hole 1311 can also be set to gradually decrease along the air flow direction to accelerate the air flow through the air inlet section 13111 of the air blowing hole 1311 and ensure the jet speed of the air flow. These are not restrictive.
[0042] As Figures 2 to 4 shown, the difference between the first embodiment and the second embodiment of the air blowing hole 1311 lies only in the different cross-sectional shapes of the air inlet section 13111 and the air outlet section 13112 of the air blowing hole 1311, that is, the cross-sectional shapes perpendicular to the air flow direction are different. Specifically, in the first embodiment, the cross-sectional shapes of both the air inlet section 13111 and the air outlet section 13112 of the air blowing hole 1311 are polygons. The cross-sections of each part of the air inlet section 13111 are all polygons with exactly the same shape, and its cavity is in a prismatic shape as a whole. The cross-section of the air outlet section 13112 is a polygon with a gradually increasing size along the air flow direction, and its cavity is in a frustum shape as a whole. Based on this setting method, the air mixing effect of the air blowing hole 1311 is better, which is more conducive to the uniformity of the output air flow. In the second embodiment, the cross-sectional shapes of both the air inlet section 13111 and the air outlet section 13112 of the air blowing hole 1311 are circles. The cross-sections of each part of the air inlet section 13111 are all circles with exactly the same shape, and its cavity is in a cylindrical shape as a whole. The cross-section of the air outlet section 13112 is a circle with a gradually increasing diameter along the air flow direction, and its cavity is in a frustum shape as a whole. Based on this setting method, the diffusion effect of the air blowing hole 1311 is better, which is more conducive to the stability of the output air flow.
[0043] Furthermore, as a preferred setting method for the axial lengths of the air inlet section 13111 and the air outlet section 13112 of the air blowing hole 1311, the axial length of the air outlet section 13112 is greater than five times the axial length of the air inlet section 13111, that is, the axial length of the air outlet section 13112 is at least greater than five times the axial length of the air inlet section 13111, so that the air outlet section 13112 can achieve the effect of uniform air flow to the greatest extent. Of course, those skilled in the art can also set the specific lengths of the air inlet section 13111 and the air outlet section 13112 and their relative relationships according to actual usage requirements.
[0044] In addition, in a preferred setting, the air-blowing assembly further includes an air-flow regulating member (not shown in the figure), which is arranged upstream of the air-blowing hole 1311 to control the magnitude of the air flow passing through the air-blowing hole 1311. The specific type of the air-flow regulating member is not limited, and those skilled in the art can select it according to actual usage requirements. Preferably, an air-flow regulating valve is adopted. Based on the setting of the air-flow regulating member, when the air-blowing assembly is used to clean the sample or the atmosphere in the spin-coating chamber, a large-flow air flow can be used to effectively ensure the cleaning effect; when the air-blowing assembly is used for air extraction film formation, the flow rate can be controlled according to the experimental process parameters. When it is necessary to control the parameters of the air-flow regulating member, the flow rate parameters can be directly input on the corresponding computer terminal, and the air-flow regulating member can automatically adjust the magnitude of the air flow to achieve precise control of the air flow. Based on this setting, only by means of drag-and-drop programming can the air-blowing control program be placed in the preparation process, which is beneficial to the automatic control of the equipment.
[0045] Of course, the specific setting position and setting method of the air-flow regulating member are not limited, as long as the air-flow regulating member is arranged upstream of the air-blowing hole 1311. As a preferred setting method of the air-flow regulating member, a threaded connection hole 1312 communicating with the air-blowing hole 1311 can be arranged on the air-blowing member 131, and a threaded structure is arranged on the air-flow regulating member to be connected to the threaded connection hole, that is, the air-flow regulating member is arranged at the upstream port of the air-blowing hole 1311 to achieve the best air-flow regulating effect.
[0046] Next, refer to Figure 5 , as Figure 5 shown, in the third embodiment of the air-blowing member 131, a plurality of air-blowing holes 1311 are arranged on the air-blowing member 131, and the number of the arranged air-blowing holes 1311 is equal to the number of the mounting grooves arranged on the carrying member, so that the air-blowing holes 1311 can be arranged in one-to-one correspondence with the mounting grooves, and a substrate is correspondingly arranged in each mounting groove; based on this, each air-blowing hole 1311 can output air flow facing a substrate, so that air extraction film formation can be simultaneously carried out on multiple substrates. It can be understood that the specific number and distribution mode of the air-blowing holes 1311 are not restrictive, and those skilled in the art can adjust them according to the setting mode of the mounting grooves on the carrying member used in combination.
[0047] Further, in the third embodiment of the air-blowing member 131, a diversion cavity 1313 is further provided on the air-blowing member 131. The ports of the air inlet sections 13111 of the plurality of air-blowing holes 1311 are all connected to the diversion cavity 1313. That is, the nitrogen gas flow supplied by the nitrogen gas supply member first enters the diversion cavity 1313 and then is delivered to the plurality of air-blowing holes 1311 through the diversion cavity 1313. The air flow regulating member is arranged at the inlet 13131 of the diversion cavity 1313. The nitrogen gas supply member is connected to the air flow regulating member and communicates with the diversion cavity 1313 through the air flow regulating member arranged at the inlet 13131, and then communicates with the air-blowing holes 1311 through the diversion cavity 1313. As Figure 5 shown, the diversion wall of the diversion cavity 1313 is preferably an arc surface. That is, the air flow enters the diversion cavity 1313 through the inlet 13131, and after being diverted by the arc-shaped diversion wall, it is output through the plurality of air-blowing holes 1311, so as to effectively ensure that each air-blowing hole 1311 can output a uniform and stable air flow. Of course, this is only a preferred setting method. Those skilled in the art can also set the shape of the diversion cavity 1313 according to actual use requirements, or not set the diversion cavity 1313, but directly supply air flow to each air-blowing hole 1311 separately. These are not restrictive.
[0048] Based on the above embodiments, the air-blowing member 131 can be in various structural forms. When the air-blowing member 131 includes a first air-blowing member and a second air-blowing member with different structural forms, the gripper 121 of the robotic arm 12 (as Figure 1 shown) can selectively grasp one of the first air-blowing member and the second air-blowing member and move it above the substrate fixing assembly 111 to facilitate the air extraction film formation. The nitrogen gas supply member can selectively connect to one of the first air-blowing member and the second air-blowing member according to actual use requirements, or can also be connected to both air-blowing members at the same time, and control its connection relationship by controlling the respective air flow regulating members provided. The robotic arm 12 can adjust the distance and angle between the air-blowing holes 1311 and the substrate during the movement process, and this robotic arm 12 can be shared with the robotic arm for grasping the substrate to automatically adapt to the high-throughput experimental platform and better play a synergistic effect, effectively ensuring the safe progress of the air extraction film formation. Based on this, the air extraction film formation method can be introduced into the laboratory preparation process to shorten the gap between laboratory devices and industrial production lines.
[0049] So far, the technical solutions of the present invention have been described in conjunction with the optional embodiments shown in the drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of the present invention.
Claims
1. A semiconductor device manufacturing apparatus, characterized in that, The semiconductor device manufacturing apparatus includes a substrate fixing assembly and a gas blowing assembly. The substrate fixing assembly includes a substrate tray, and the substrate fixing assembly fixes the substrate through the substrate tray. The gas blowing assembly includes a gas blowing member, and at least one gas blowing hole is provided on the gas blowing member. The aperture of the air outlet section of the gas blowing hole gradually increases along the air flow direction, and the axial direction of the gas blowing hole is perpendicular to the supporting surface of the substrate tray, so that the gas blowing assembly can deliver vertical air flow to the film forming surface of the substrate through the gas blowing hole.
2. The semiconductor device manufacturing apparatus according to claim 1, wherein The apertures of each part of the air inlet section of the gas blowing hole are equal, and the aperture at the connection of the air inlet section and the air outlet section is equal.
3. The semiconductor device manufacturing apparatus according to claim 2, wherein The cross-sectional shapes of the air inlet section and the air outlet section are the same and are one of a circle and a polygon; and / or The axial length of the air outlet section is greater than five times the axial length of the air inlet section.
4. The semiconductor device manufacturing apparatus according to claim 1, wherein The gas blowing assembly further includes a nitrogen supply member, and the nitrogen supply member is communicated with the gas blowing hole to supply nitrogen gas flow.
5. The semiconductor device manufacturing apparatus according to any one of claims 1 to 4, characterized in that, The gas blowing assembly further includes an air flow regulating member, and the air flow regulating member is arranged upstream of the gas blowing hole.
6. The semiconductor device manufacturing apparatus according to claim 5, wherein, The gas blowing member is further provided with a threaded connection hole communicated with the gas blowing hole, and the air flow regulating member is provided with a threaded structure to be connected to the threaded connection hole.
7. The semiconductor device manufacturing apparatus according to claim 5, wherein, The substrate fixing assembly further includes a carrying member. The substrate tray is used to fix the carrying member. A plurality of mounting grooves are provided on the carrying member, and the substrate can be placed in the mounting grooves. A plurality of the gas blowing holes are provided on the gas blowing member, and the gas blowing holes and the mounting grooves are arranged in one-to-one correspondence.
8. The semiconductor device manufacturing apparatus according to claim 7, wherein, The gas blowing member is further provided with a diversion cavity, and the ports of the air inlet sections of the plurality of gas blowing holes are all communicated with the diversion cavity, and the air flow regulating member is arranged at the inlet of the diversion cavity.
9. A semiconductor device manufacturing system, characterized in that, The semiconductor device manufacturing system includes a robotic arm and the semiconductor device manufacturing apparatus according to any one of claims 1 to 8. The robotic arm can clamp the gas blowing member and control the movement of the gas blowing member.
10. The semiconductor device manufacturing system according to claim 9, wherein, The gas blowing member includes a first gas blowing member and a second gas blowing member, and the first gas blowing member and the second gas blowing member can be detachably connected to the clamping end of the robotic arm alternatively.