Wet flower basket capable of reducing silicon wafer wet flower basket marks

By setting a diversion groove on the basket teeth of the wet flower basket, the problem of uneven reaction of the silicon wafer is solved, the uniformity and stability of the silicon wafer reaction are achieved, and the quality of the battery is improved.

CN223123879UActive Publication Date: 2025-07-18EGING PHOTOVOLTAIC TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202422257470.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-14
Publication Date
2025-07-18
Estimated Expiration
2034-09-14

AI Technical Summary

Technical Problem

In solar cell production, the uneven reaction of silicon wafers in wet baskets leads to the mark of the basket, affecting the yield and efficiency of the battery cells.

Method used

A flow guide groove is provided on the basket teeth of the wet flower basket. The flow guide groove penetrates the upper and lower sides of the end surface to reduce the contact area between the silicon wafer and the basket teeth, increase the contact area between the silicon wafer and the reaction liquid, and optimize the design of the flow guide groove to ensure reaction uniformity and liquid flow, and avoid liquid residue.

Benefits of technology

The uniformity and stability of silicon wafer reaction are achieved, the formation of flower basket marks is avoided, and the yield and efficiency of the battery cell are improved.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223123879U_ABST
    Figure CN223123879U_ABST
Patent Text Reader

Abstract

The utility model provides a wet flower basket capable of reducing silicon wafer wet flower basket marks, which comprises a toothed bar, a plurality of basket teeth which are arranged at intervals and are linear in configuration are arranged on the toothed bar, silicon wafers are inserted among the basket teeth, and diversion trenches are arranged on the end surfaces of the basket teeth in contact with the silicon wafers; the diversion trench penetrates through the upper and lower sides of the end face. The flow guide grooves are filled with reaction liquid, so that the contact area of the silicon wafer and the basket teeth is reduced, the contact area of the silicon wafer and the reaction liquid is increased, and the silicon wafer reacts more uniformly and does not form basket marks in a wet process; the diversion trenches penetrate through the upper side and the lower side of the end face, so that liquid residues cannot be formed at the joints of the silicon wafers and the basket teeth, and defects at the joints of the silicon wafers and the basket teeth are avoided.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model relates to the technical field of wet flower baskets, in particular to a wet flower basket for reducing the marks of silicon wafers in a wet flower basket. Background Art

[0002] In the production of solar cells, silicon wafers are generally placed in a wet flower basket and then wet processes are carried out to remove the damaged layer on the surface of the silicon wafers, remove dirt, perform surface texturing, etching or polishing, etc.

[0003] However, due to uneven reactions at the basket teeth or defects accompanied by residual liquid during the reaction process, it is easy to form flower basket marks on the surface of the silicon wafers, affecting the yield and efficiency of the solar cells. Summary of the Utility Model

[0004] In order to solve the technical problems in the background art, the utility model discloses a wet flower basket for reducing the marks of silicon wafers in a wet flower basket.

[0005] The utility model provides a wet flower basket for reducing the marks of silicon wafers in a wet flower basket, which includes a tooth bar. A plurality of linearly configured basket teeth are arranged at intervals on the tooth bar, and silicon wafers are inserted between the basket teeth. Flow guiding grooves are formed on the end faces of the basket teeth in contact with the silicon wafers; the flow guiding grooves penetrate through the upper and lower sides of the end faces.

[0006] With the arrangement of the flow guiding grooves, reaction liquid will be filled in them, thus reducing the contact area between the silicon wafers and the basket teeth and increasing the contact area between the silicon wafers and the reaction liquid. As a result, when the silicon wafers are in the wet process, the reaction is more uniform and flower basket marks will not be formed; the arrangement that the flow guiding grooves penetrate through the upper and lower sides of the end faces enables no liquid residue to form at the connection between the silicon wafers and the basket teeth, thus avoiding defects at the connection between the silicon wafers and the basket teeth.

[0007] If the flow guiding grooves are too short, the contact area between the silicon wafers and the basket teeth is large; if the flow guiding grooves are too long, the flow rate of the liquid in the flow guiding grooves is slow, and it is easy to stagnate in the flow guiding grooves, and defects are likely to form on the surface of the silicon wafers. Based on this, a further improvement lies in: the flow guiding grooves form an angle with the horizontal plane. Specifically: the flow guiding grooves form an angle of 45 - 60° with the horizontal plane.

[0008] Furthermore, a plurality of flow guiding grooves are arranged in the horizontal direction and at intervals. With this arrangement, the contact area between the silicon wafers and the basket teeth is further reduced, the uniformity of the reaction of the silicon wafers is improved, and the interval arrangement of the flow guiding grooves does not affect the position stability of the silicon wafers.

[0009] In order to further reduce the contact area between the silicon wafers and the basket teeth and improve the uniformity of the reaction of the silicon wafers, specifically: the flow guiding grooves are composed of symmetrically arranged forward flow guiding grooves and reverse flow guiding grooves.

[0010] The position settings of the forward flow guide groove and the reverse flow guide groove directly affect the number of flow guide grooves, the ratio of the flow guide grooves covering the end face, the contact area between the silicon wafer and the end face, and the uniformity of the silicon wafer reaction. Based on this, a further improvement is that the forward flow guide groove and the reverse flow guide groove are arranged in a cross pattern.

[0011] Since the connection between the silicon wafer and the toothed rod is prone to uneven reaction, based on this, a further improvement is that one end of the forward flow guide groove closest to the root of the basket tooth covers one end of the end face; one end of the reverse flow guide groove closest to the root of the basket tooth covers the other end of the end face. With this setting, the liquid will flow into the connection between the silicon wafer and the toothed rod along the forward flow guide groove and the reverse flow guide groove closest to the root of the basket tooth. Description of the Drawings

[0012] The present utility model will be further described below in conjunction with the drawings and embodiments.

[0013] Figure 1 is a schematic diagram of the connection structure of the toothed rod and the basket tooth;

[0014] Figure 2 is the front view of the basket tooth;

[0015] In the figure: 1, toothed rod; 2, basket tooth; 3, end face; 4, flow guide groove; 41, forward flow guide groove; 42, reverse flow guide groove. Detailed Embodiment

[0016] Now the present utility model will be further described in detail in conjunction with the drawings. These drawings are all simplified schematic diagrams, only showing the basic structure of the present utility model in a schematic way, so they only show the components related to the present utility model.

[0017] As Figure 1 and Figure 2 shown, the present utility model discloses a wet basket for reducing the marks on the wet basket of silicon wafers, including a toothed rod 1, on which a plurality of basket teeth 2 are arranged at intervals and configured linearly, the silicon wafers are inserted between the basket teeth 2, and flow guide grooves 4 are opened on the end face 3 of the basket teeth 2 in contact with the silicon wafers; the flow guide grooves 4 penetrate through the upper and lower sides of the end face 3.

[0018] If the flow guide groove 4 is too short, the contact area between the silicon wafer and the basket tooth 2 is large; if the flow guide groove 4 is too long, the flow rate of the liquid in the flow guide groove 4 is slow, and it is easy to stagnate in the flow guide groove 4, and defects are likely to form on the surface of the silicon wafer. Therefore, the following design is made: the flow guide groove 4 forms an angle of 45 - 60° with the horizontal plane.

[0019] The diversion groove 4 is composed of a forward diversion groove 41 and a reverse diversion groove 42 which are symmetrically arranged. The forward diversion groove 41 and the reverse diversion groove 42 are both provided in multiple numbers in the horizontal direction, and the forward diversion groove 41 and the reverse diversion groove 42 are arranged in a cross pattern. With such an arrangement, the contact area between the silicon wafer and the basket teeth 2 is further reduced, the uniformity of the silicon wafer reaction is improved, and the diversion grooves 4 are arranged at intervals, which will not affect the position stability of the silicon wafer.

[0020] Since the connection between the silicon wafer and the toothed rod 1

[0021] is prone to uneven reaction, one end of the forward diversion groove 41 closest to the root of the basket teeth 2 covers one end of the end face 3; one end of the reverse diversion groove 42 closest to the root of the basket teeth 2 covers the other end of the end face 3. With such an arrangement, the liquid will flow into the connection between the silicon wafer and the toothed rod 1 along the forward diversion groove 41 and the reverse diversion groove 42 closest to the root of the basket teeth 2.

[0022] The setting of the diversion groove 4 reduces the contact area between the silicon wafer and the basket teeth 2 and increases the contact area between the silicon wafer and the reaction liquid, so that when the silicon wafer is in the wet process, the reaction is more uniform and no basket marks will be formed; the setting that the diversion groove 4 penetrates through the upper and lower sides of the end face 3 makes the liquid not form liquid residues at the connection between the silicon wafer and the basket teeth 2, thus avoiding defects at the connection between the silicon wafer and the basket teeth 2.

[0023] Taking the ideal embodiments according to the present utility model as the inspiration, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this utility model. The technical scope of this utility model is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A wet flower basket for reducing wet flower basket marks on silicon wafers, comprising a toothed rod (1), wherein a plurality of linearly configured basket teeth (2) are arranged at intervals on the toothed rod (1), and the silicon wafers are inserted between the basket teeth (2). It is characterized in that: A diversion groove (4) is formed on the end face (3) of the basket tooth (2) in contact with the silicon wafer; The diversion groove (4) penetrates through the upper and lower sides of the end face (3).

2. The wet flower basket for reducing the imprint of silicon wafers in the wet flower basket according to claim 1, wherein: The diversion groove (4) forms an angle with the horizontal plane.

3. The wet flower basket for reducing the imprint of the silicon wafer wet flower basket according to claim 2, wherein: The diversion groove (4) forms an angle of 45-60° with the horizontal plane.

4. A wet flower basket for reducing wet flower basket imprints on silicon wafers according to claim 3, characterized in that: A plurality of the diversion grooves (4) are arranged in the horizontal direction and are spaced apart.

5. The wet basket for reducing the imprint on the silicon wafer according to claim 4, wherein: The diversion groove (4) is composed of a forward diversion groove (41) and a reverse diversion groove (42) which are symmetrically arranged.

6. The wet flower basket for reducing the imprint of the silicon wafer on the wet flower basket according to claim 5, wherein: The forward diversion groove (41) and the reverse diversion groove (42) are arranged in a crosswise manner.

7. A wet basket for reducing wet basket imprints on silicon wafers according to claim 6, characterized in that: One end of the forward diversion groove (41) closest to the root of the basket tooth (2) covers one end of the end face (3); One end of the reverse diversion groove (42) closest to the root of the basket tooth (2) covers the other end of the end face (3).