Miniature solid laser amplifier

Abstract

The utility model discloses a miniature solid laser amplifier, which particularly relates to the field of laser amplifiers and comprises a tube shell and an outer chamber positioned at the end part of the tube shell, an inner chamber is mounted in an inner cavity of the tube shell, a vacuum cavity vapor chamber is attached to the bottom of the inner chamber, and a solid laser component is mounted on the surface of the vacuum cavity vapor chamber. A plurality of layers of heat-conducting fins are installed on the outer wall of the inner chamber, the two sides of the vacuum cavity vapor chamber penetrate through the inner chamber and extend to the outer side to be attached to the heat-conducting fins, a plurality of heat-conducting copper pipes are inserted among the multiple layers of heat-conducting fins, the multiple heat-conducting copper pipes are located on the two sides of the inner chamber, and the ends of the multiple heat-conducting copper pipes extend into the outer chamber. By means of multiple heat conduction and heat dissipation means, heat generated in the working process of the solid laser assembly can be rapidly conducted to the outside, the influence of the heat on a laser beam is reduced, heat management of the micro solid laser amplifier is facilitated, the probability of heat loss of a laser gain medium is reduced, and the service life of the laser is prolonged. The performance of the laser is improved; and the service life is prolonged.

Description

Technical Field

[0001] The utility model relates to the field of laser amplifiers, and more specifically, to a micro solid laser amplifier. Background Art

[0002] A micro solid laser amplifier is a miniaturized laser amplification device that uses a solid material as the gain medium to amplify the laser signal. This amplifier is usually designed for specific applications such as integrated optical systems, optical communication, lidar (LIDAR), precision measurement, and scientific research. The characteristics of the micro solid laser amplifier are small size, light weight, easy integration, and portability.

[0003] Although the micro solid laser amplifier has the advantages of small size, easy integration, and portability, there are also some defects and limitations:

[0004] The solid laser medium will generate heat during the amplification process, which may lead to the thermal lens effect and thermal distortion, affecting the quality of the laser beam and the efficiency of the amplifier;

[0005] Due to its small size, the thermal management of the micro solid laser amplifier may be more difficult;

[0006] Under high-power operation, the gain medium may suffer from thermal damage, which limits the performance and lifespan of the amplifier. Summary of the Utility Model

[0007] To solve the above technical problems, the utility model provides a micro solid laser amplifier, which includes a tube shell and an outer chamber located at the end of the tube shell. An inner chamber is installed in the inner cavity of the tube shell. A vacuum chamber heat sink is attached to the bottom of the inner chamber. A solid laser component is installed on the surface of the vacuum chamber heat sink. A plurality of layers of heat conducting fins are installed on the outer wall of the inner chamber. The two sides of the vacuum chamber heat sink penetrate through the inner chamber and extend to the outside to be attached to the heat conducting fins. A plurality of heat conducting copper tubes are inserted between the plurality of layers of heat conducting fins. The plurality of heat conducting copper tubes are located on both sides of the inner chamber and their ends extend into the interior of the outer chamber.

[0008] In a preferred embodiment, a through optical path groove is opened on the side of the heat conducting fin away from the outer chamber. An optical path tube is arranged in the optical path groove. The optical path tube penetrates through the tube shell and extends to the outside of the tube shell. An optical path hole is opened on the inner chamber and is on the same straight line as the optical path tube.

[0009] In a preferred embodiment, two heat conducting copper columns are installed inside the outer chamber. The plurality of heat conducting copper tubes on both sides of the inner chamber extend into the interior of the outer chamber and are inserted into the interiors of the two heat conducting copper columns. A semiconductor refrigerating sheet is attached to the outer walls of the two heat conducting copper columns.

[0010] In a preferred embodiment, a first fan and a second fan are embedded on the outer wall of the outer chamber, and the rotation directions of the first fan and the second fan are opposite.

[0011] In a preferred embodiment, a cover is provided at the top of the shell, and the top end and the lowermost heat conducting fin of the inner chamber are attached to the bottom of the cover.

[0012] In a preferred embodiment, a partition is inserted between the several layers of heat conducting fins. The outer side of the partition is fixed to the inner wall of the outer chamber. The top and bottom of the partition are respectively attached to the cover and the bottom of the outer chamber, and several heat conducting copper tubes penetrate through the partition.

[0013] In a preferred embodiment, a third fan and a fourth fan are respectively embedded on the outer wall of the outer chamber. The third fan and the fourth fan are symmetrically arranged by the partition, and the rotation directions of the third fan and the fourth fan are opposite.

[0014] The technical effects and advantages of the present utility model:

[0015] Through multiple heat conduction and heat dissipation means, the heat generated by the solid laser assembly during operation can be quickly conducted to the outside, reducing the influence of heat on the laser beam, facilitating the thermal management of the micro solid laser amplifier, reducing the probability of thermal loss of the laser gain medium, improving the performance of the laser and extending the service life. Description of the Drawings

[0016] Figure 1 is a schematic diagram of the overall structure of the present utility model;

[0017] Figure 2 is a schematic diagram of the right view structure of the present utility model;

[0018] Figure 3 is a schematic diagram of the overall structure of the present utility model from another angle;

[0019] Figure 4 is a schematic diagram of the internal structure of the present utility model;

[0020] Figure 5 is a schematic diagram of the internal top view structure of the present utility model;

[0021] Figure 6 is a schematic diagram of the internal sectional view structure of the present utility model.

[0022] Description of the reference numerals: 1 shell, 2 outer chamber, 3 inner chamber, 4 vacuum chamber heat equalizing plate, 5 solid laser assembly, 6 heat conducting fin, 7 heat conducting copper tube, 8 optical path groove, 9 optical path tube, 10 optical path hole, 11 heat conducting copper column, 12 semiconductor refrigerating sheet, 13 first fan, 14 second fan, 15 cover, 16 partition, 17 third fan, 18 fourth fan. Detailed implementation manners

[0023] The present utility model will be further described in detail below in conjunction with the accompanying drawings and specific implementation manners. The embodiments of the present utility model are given for the purpose of illustration and description, and are not exhaustive or limit the present utility model to the disclosed form. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments are selected and described to better illustrate the principles and practical applications of the present utility model, and enable those of ordinary skill in the art to understand the present utility model and thus design various embodiments with various modifications suitable for specific purposes.

[0024] As Figure 1-6 shown, a micro solid laser amplifier includes a tube shell 1 and an outer chamber 2 located at the end of the tube shell 1. An inner chamber 3 is installed in the inner cavity of the tube shell 1. A vacuum chamber heat sink 4 is attached to the bottom of the inner chamber 3. A solid laser assembly 5 is installed on the surface of the vacuum chamber heat sink 4. A plurality of layers of heat conduction fins 6 are installed on the outer wall of the inner chamber 3. Both sides of the vacuum chamber heat sink 4 penetrate through the inner chamber 3 and extend to the outside to be attached to the heat conduction fins 6. A plurality of heat conduction copper tubes 7 are inserted between the plurality of layers of heat conduction fins 6. The plurality of heat conduction copper tubes 7 are located on both sides of the inner chamber 3 and the ends extend into the interior of the outer chamber 2;

[0025] Among them, the solid laser assembly 5 includes components such as a pump source, a solid gain medium, and a plurality of lenses. An inner chamber 3 is separately provided inside the tube shell 1 to isolate the solid laser assembly 5. The solid laser assembly 5 is placed on the vacuum chamber heat sink 4. During the working process, the generated heat will be conducted through the vacuum chamber heat sink 4 to the plurality of layers of heat conduction fins 6 outside the inner chamber 3 for heat dissipation, avoiding the accumulation of heat inside the inner chamber 3 and causing the temperature of the solid laser assembly 5 to be too high.

[0026] An optical path groove 8 is provided on the side of the heat conduction fin 6 away from the outer chamber 2. An optical path tube 9 is provided in the optical path groove 8. The optical path tube 9 penetrates through the tube shell 1 and extends to the outside of the tube shell 1. An optical path hole 10 is provided on the inner chamber 3 and is on the same straight line as the optical path tube 9;

[0027] Furthermore, the laser generated by the solid laser assembly 5 enters the optical path tube 9 from the optical path hole 10 and is emitted to the outside. A medium of a transparent material is filled in the optical path tube 9 to isolate the inside of the inner chamber 3 from the outside, avoiding the entry of dust, water vapor, etc. into the inside of the inner chamber 3.

[0028] Two heat conduction copper columns 11 are installed inside the outer chamber 2. The plurality of heat conduction copper tubes 7 on both sides of the inner chamber 3 extend into the interior of the outer chamber 2 and are inserted into the interiors of the two heat conduction copper columns 11. A semiconductor refrigeration sheet 12 is attached to the outer walls of the two heat conduction copper columns 11;

[0029] Furthermore, the heat-conducting copper column 11 is connected to a plurality of heat-conducting copper tubes 7 by a reflow soldering process, so that the plurality of heat-conducting copper tubes 7 are closely connected to the heat-conducting copper column 11. The heat-conducting copper tubes 7 can conduct the heat on the heat-conducting fins 6 into the heat-conducting copper column 11 inside the outer chamber 2. A semiconductor refrigeration chip 12 is installed on the heat-conducting copper column 11, and the cold end of the semiconductor refrigeration chip 12 is attached to the heat-conducting copper column 11 to cool it, so that the heat generated by the solid laser assembly 5 inside the inner chamber 3 can be quickly dissipated when it is conducted into the outer chamber 2.

[0030] A first fan 13 and a second fan 14 are embedded on the outer wall of the outer chamber 2, and the rotation directions of the first fan 13 and the second fan 14 are opposite;

[0031] During the operation of the semiconductor refrigeration chip 12, its cold end is attached to the outer wall of the heat-conducting copper column 11, and the hot end is exposed inside the outer chamber 2. By using the two first fans 13 and second fans 14 with opposite rotation directions, the air inside the outer chamber 2 is continuously circulated with the outside air, and the heat of the hot end part is conducted to the outside, improving the heat dissipation efficiency of the hot end part. Furthermore, the refrigeration effect of the cold end of the semiconductor refrigeration chip 12 is improved, enabling the heat-conducting copper column 11 to cool down more quickly, and realizing the heat transfer and dissipation of the heat-conducting copper tubes 7 and the heat-conducting fins 6.

[0032] A cover 15 is provided at the top of the tube shell 1, and the top end and the lowermost heat-conducting fin 6 of the inner chamber 3 are attached to the bottom of the cover 15;

[0033] A partition 16 is inserted between the several layers of heat-conducting fins 6. The outside of the partition 16 is fixed to the inner wall of the outer chamber 2. The top and bottom of the partition 16 are respectively attached to the cover 15 and the bottom of the outer chamber 2, and a plurality of heat-conducting copper tubes 7 penetrate through the partition 16;

[0034] Based on the above, the top end and the top heat-conducting fin 6 of the inner chamber 3 are attached to the cover 15, forming a "hui"-shaped air duct between the inside of the tube shell 1 and the outside of the inner decoration.

[0035] A third fan 17 and a fourth fan 18 are respectively embedded on the outer wall of the outer chamber 2. The third fan 17 and the fourth fan 18 are symmetrically arranged through the partition 16, and the rotation directions of the third fan 17 and the fourth fan 18 are opposite.

[0036] Further, when the third fan 17 and the fourth fan 18 are working, the air in the air duct between the inside of the shell 1 and the outside of the inner chamber 3 flows. Since the air duct path is divided by the partition plate 16, and the third fan 17 and the fourth fan 18 are arranged on both sides of the partition plate 16. Therefore, during the operation of the fans, the external air is driven to enter the air duct from one of the fans, and the air inside the air duct is discharged from the other fan to the outside of the shell 1. During this continuous air flow process, the air flow efficiency between the multi-layer heat conducting fins 6 is improved, and the heat is prevented from accumulating in the gaps between the heat conducting fins 6 for a long time, resulting in a high temperature. Furthermore, the heat dissipation and heat conduction effects between the heat conducting fins 6 and the heat conducting copper tube 7 are improved, and the heat generated by the operation of the solid laser component 5 inside the interior is accelerated to be conducted outwards.

[0037] Based on the above, through multiple heat conduction and heat dissipation means, the heat generated during the operation of the solid laser component 5 can be quickly conducted to the outside, reducing the influence of heat on the laser beam, facilitating the thermal management of the micro solid laser amplifier, reducing the probability of thermal loss of the laser gain medium, improving the performance of the laser, and extending the service life.

[0038] Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art and related fields without creative work shall fall within the protection scope of the present invention. The structures, devices, and operation methods not specifically described and explained in the present invention shall be implemented according to the conventional means in the art without special instructions and limitations.

Claims

1. A micro solid-state laser amplifier, characterized in that, It includes a shell and an outer chamber located at the end of the shell. An inner chamber is installed in the inner cavity of the shell. A vacuum chamber heat pipe is attached to the bottom of the inner chamber. A solid laser component is installed on the surface of the vacuum chamber heat pipe. Several layers of heat conducting fins are installed on the outer wall of the inner chamber. Both sides of the vacuum chamber heat pipe penetrate the inner chamber and extend to the outside to be attached to the heat conducting fins. Several heat conducting copper tubes are inserted between the several layers of heat conducting fins. The several heat conducting copper tubes are located on both sides of the inner chamber and their ends extend to the inside of the outer chamber.

2. A miniature solid-state laser amplifier according to claim 1, characterized in that: A through optical path groove is provided on the side of the heat conducting fin away from the outer chamber. An optical path tube is provided in the optical path groove. The optical path tube penetrates the shell and extends to the outside of the shell. An optical path hole is provided on the inner chamber and is on the same straight line as the optical path tube.

3. A miniature solid-state laser amplifier according to claim 1, characterized in that: Two heat conducting copper columns are installed inside the outer chamber. The several heat conducting copper tubes on both sides of the inner chamber extend to the inside of the outer chamber and are inserted into the inside of the two heat conducting copper columns. A semiconductor refrigeration sheet is attached to the outer walls of the two heat conducting copper columns.

4. A miniature solid-state laser amplifier according to claim 3, characterized in that: A first fan and a second fan are embedded on the outer wall of the outer chamber. The rotation directions of the first fan and the second fan are opposite.

5. A miniature solid-state laser amplifier according to claim 1, characterized in that: A cover is provided at the top of the shell. The top of the inner chamber and the lowermost heat conducting fin are attached to the bottom of the cover.

6. A miniature solid-state laser amplifier according to claim 1, characterized in that: A partition is inserted between the several layers of heat conducting fins. The outside of the partition is fixed to the inner wall of the outer chamber. The top and bottom of the partition are respectively attached to the cover and the bottom of the outer chamber. Several heat conducting copper tubes penetrate the partition.

7. A micro solid laser amplifier according to claim 6, characterized in that: A third fan and a fourth fan are respectively embedded on the outer wall of the outer chamber. The third fan and the fourth fan are symmetrically arranged through the partition. The rotation directions of the third fan and the fourth fan are opposite.

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