Electronic device

Abstract

The utility model provides electronic equipment, and belongs to the technical field of electronic equipment, and the electronic equipment comprises a frame body which is provided with a mounting groove; the camera assembly is arranged in the mounting groove; the circuit board is arranged on the frame body and is adjacent to the camera assembly; the camera assembly comprises a camera body and a support, the support surrounds the camera body, a first groove is formed in the side, facing the camera body, of the support, a second groove is formed in the side, facing the circuit board, of the support, the first groove is used for dispensing, and the second groove is used for avoiding the circuit board. The first groove and the second groove are arranged in a staggered mode.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to an electronic device. Background Art

[0002] In order to improve the photographing quality of electronic devices, periscope cameras have gradually become a common configuration in electronic devices. In related technologies, a groove is provided on the frame of the electronic device, the periscope camera is arranged in the groove, the circuit board is arranged on the frame and is adjacent to the groove, and is electrically connected to the periscope camera through a flexible circuit board.

[0003] The periscope camera includes a camera body and a bracket. The bracket is provided with a dispensing groove for fixing the camera. Due to the existence of the dispensing groove, to ensure the strength of the bracket, there are certain requirements for the thickness of the bracket. Thus, the overall space occupied by the periscope camera is relatively large, which is not conducive to the layout of internal components of the electronic device. Utility Model Content

[0004] The purpose of the embodiments of this application is to provide an electronic device, which can reduce the space occupied by the camera and improve the space utilization rate inside the electronic device.

[0005] In a first aspect, the embodiments of this application provide an electronic device, including:

[0006] A frame, on which an installation groove is provided;

[0007] A camera assembly, which is arranged in the installation groove;

[0008] A circuit board, which is arranged on the frame and is adjacent to the camera assembly;

[0009] Wherein, the camera assembly includes a camera body and a bracket. The bracket surrounds the camera body. A first groove is provided on the side of the bracket facing the camera body, and a second groove is provided on the side of the bracket facing the circuit board. The first groove is used for dispensing, and the second groove is used for avoiding the circuit board. In the direction along the optical axis of the camera body, the first groove and the second groove are arranged in a staggered manner.

[0010] As a possible implementation manner, the circuit board protrudes from the edge of the installation groove towards the bracket, and the circuit board is opposite to the second groove.

[0011] As a possible implementation manner, in the direction along the optical axis of the camera body, the size of the second groove is larger than the thickness of the circuit board.

[0012] As a possible implementation manner, the circuit board is embedded in the second groove, and the side wall of the second groove away from the frame is spaced from the circuit board.

[0013] As a possible implementation manner, the orthographic projection of the circuit board on the side facing the bracket is located at the bottom of the second groove, and the value range of the first distance between the circuit board and the bottom of the second groove is from 0.3 mm to 1 mm.

[0014] As a possible implementation manner, the first groove is provided at the edge of at least one end of the bracket;

[0015] The number of the first grooves is at least two, and the at least two first grooves are distributed on the circumferential side of the bracket.

[0016] As a possible implementation manner, the camera assembly further includes:

[0017] A heat dissipation member, the heat dissipation member is provided on the camera body and the bracket, a part of the heat dissipation member is located between the bracket and the circuit board, and the heat dissipation member is at least partially located in the second groove.

[0018] As a possible implementation manner, the heat dissipation member protrudes from the bracket, and the installation groove has a support portion for supporting the camera assembly.

[0019] As a possible implementation manner, the camera body has a flexible circuit board, the flexible circuit board is connected to the circuit board, and a spacer is provided on the heat dissipation member, and the spacer is located between the flexible circuit board and the heat dissipation member.

[0020] As a possible implementation manner, for the spacer, the heat dissipation member is wrapped on the spacer, the camera body has a flexible circuit board, the flexible circuit board is connected to the circuit board, and the spacer and the flexible circuit board are opposite to each other.

[0021] In the embodiment of the present application, the electronic device includes a frame body, a camera assembly and a circuit board. The camera assembly and the circuit board are provided on the frame body. The frame body has an installation groove, and the camera assembly is provided in the installation groove to ensure that the camera assembly has sufficient accommodation space. The circuit board is disposed adjacent to the camera assembly, so that the components in the electronic device are compact.

[0022] Among them, the camera module includes a camera body and a bracket. The bracket surrounds the periphery of the camera body. On the side of the bracket facing the camera body, a first groove is provided. The first groove is used for dispensing glue, that is, filling adhesive in the first groove to connect the bracket and the camera body. Since glue is dispensed in the first groove, the contact area between the adhesive and the bracket is increased. That is, the adhesive contacts the outer wall of the camera body, the side wall and the bottom surface of the first groove of the bracket on three sides, thereby increasing the bonding strength between the bracket and the camera body, ensuring the adhesion between the camera body and the bracket, reducing the possibility of loosening between the camera body and the bracket. Moreover, since the amount of adhesive can be increased, it is easier to control the amount of adhesive, and the accommodation space for the adhesive is increased, reducing the possibility of adhesive overflow, making the external dimension accuracy of the camera module higher and the assembly tolerance smaller, and meeting the centering requirement for the assembly of the camera module.

[0023] On the side of the bracket facing the circuit board, a second groove is provided. The second groove is used to avoid the circuit board, so that while maintaining the distance between the bracket and the circuit board, the size of the circuit board is increased, the layout area of the circuit board is improved, and it is convenient for arranging circuits and electronic devices on the circuit board.

[0024] Moreover, in the direction of the optical axis of the camera body, the first groove and the second groove are arranged in a staggered manner, so as to avoid the side wall of the bracket from being too thin, improve the strength of the bracket, and at the same time reduce the occupation of the lateral space by the bracket, and improve the space utilization rate inside the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and / or additional aspects and advantages of the present application will become apparent and easy to understand from the description of the embodiments in conjunction with the following drawings, in which:

[0026] Figure 1 A cross-sectional view of an electronic device provided by an embodiment of the present application is shown;

[0027] Figure 2 A schematic diagram of a partial structure of an electronic device provided by an embodiment of the present application is shown;

[0028] Figure 3 A schematic diagram of a partial structure of an electronic device provided by an embodiment of the present application is shown;

[0029] Figure 4 A schematic diagram of a partial structure of an electronic device provided by an embodiment of the present application is shown;

[0030] Figure 5 A schematic diagram of a partial structure of an electronic device provided by an embodiment of the present application is shown;

[0031] Figure 6Shows an exploded view of a camera module in an electronic device provided by an embodiment of the present application;

[0032] Figure 7 Shows a schematic diagram of a partial structure of a camera module in an electronic device provided by an embodiment of the present application;

[0033] Figure 8 Shows a cross-sectional view of a partial structure of a bracket in an electronic device provided by an embodiment of the present application;

[0034] Figure 9 Shows a cross-sectional view of a partial structure of a heat dissipation member and a spacer in an electronic device provided by an embodiment of the present application;

[0035] Figure 10 Shows a cross-sectional view of a housing in an electronic device provided by an embodiment of the present application.

[0036] Figures 1 to 10 Reference numerals:

[0037] 100 Electronic device, 110 Housing, 112 Mounting groove, 114 Support portion, 120 Camera module, 122 Camera body, 1222 Flexible circuit board, 124 Bracket, 1242 First groove, 1244 Second groove, 1246 Groove bottom, 126 Heat dissipation member, 128 Spacer, 130 Circuit board, 140 Adhesive. Detailed description of the specific embodiment

[0038] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present application and should not be construed as limiting the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application.

[0039] The terms "first" and "second" in the specification and claims of the present application may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, "a plurality of" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the related objects before and after.

[0040] In the description of the present application, it should be understood that the orientation or positional relationship indicated by terms such as "upper" and "inner" is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0041] In the description of the present application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0042] The following will describe the electronic device 100 according to an embodiment of the present application in conjunction with Figures 1 to 10 Figure

[0043] In a first aspect, as shown in Figure 1 and Figure 10 an embodiment of the present application provides an electronic device 100, including: a housing 110, on which an installation groove 112 is provided; a camera assembly 120, which is disposed in the installation groove 112; a circuit board 130, which is disposed on the housing 110 and is adjacent to the camera assembly 120; wherein, the camera assembly 120 includes a camera body 122 and a bracket 124, the bracket 124 is disposed around the camera body 122, as shown in Figure 8 a first groove 1242 is provided on a side of the bracket 124 facing the camera body 122, a second groove 1244 is provided on a side of the bracket 124 facing the circuit board 130, the first groove 1242 is used for dispensing glue, the second groove 1244 is used for avoiding the circuit board 130, and in the optical axis direction G of the camera body 122, the first groove 1242 and the second groove 1244 are arranged in a staggered manner.

[0044] The camera assembly in the embodiment of the present application can be a periscope camera or other types of cameras. The camera assembly 120 generally includes a camera body 122 and a bracket 124, and the bracket 124 is disposed around the camera body 122 to realize the installation and protection of the camera body 122. In order to improve the strength of the bracket 124 and thus effectively protect the camera body 122, the thickness of the bracket 124 needs to meet certain requirements. However, if the thickness of the bracket 124 is too large, it will cause the camera assembly to occupy too much lateral space, which is not conducive to the layout inside the electronic device.

[0045] As shown in Figure 8As shown in the figure, a first groove 1242 is provided on one side of the bracket 124 facing the camera body 122. The first groove 1242 is used for dispensing glue to fix the bracket 124. In order to ensure the thickness of the groove wall of the dispensing groove, it is often necessary to increase the overall thickness of the bracket, resulting in a relatively large space occupied by the bracket 124. In the embodiment of the present application, a second groove is provided on the side of the bracket 124 facing away from the camera body 122 for avoiding the circuit board. In this way, the lateral space occupied by the camera assembly 120 and the circuit board 130 can be reduced. At the same time, since the first groove 1242 and the second groove 1244 are arranged in a staggered manner, the overall strength of the bracket 124 can be ensured, and the structural stability of the bracket 124 can be improved.

[0046] In the embodiment of the present application, the electronic device 100 includes a housing 110, a camera assembly 120, and a circuit board 130. The camera assembly 120 and the circuit board 130 are disposed on the housing 110, as Figure 10 shown, the housing 110 has a mounting groove 112, and the camera assembly 120 is disposed in the mounting groove 112 to ensure that the camera assembly 120 has sufficient accommodation space. The circuit board 130 is disposed adjacent to the camera assembly 120, so that the components in the electronic device 100 are compact.

[0047] Among them, the camera assembly 120 includes a camera body 122 and a bracket 124. The bracket 124 surrounds the circumferential side of the camera body 122, as Figure 8 shown, a first groove 1242 is provided on one side of the bracket 124 facing the camera body 122. The first groove 1242 is used for dispensing glue, that is, filling the adhesive 140 in the first groove 1242 to connect the bracket 124 and the camera body 122. Since glue is dispensed in the first groove 1242, the contact area between the adhesive 140 and the bracket 124 is increased. That is, the adhesive 140 is in contact with the outer wall of the camera body 122, the side wall and the bottom surface of the first groove 1242 of the bracket 124, thereby increasing the bonding strength between the bracket 124 and the camera body 122, ensuring the adhesive force between the camera body 122 and the bracket 124, reducing the possibility of loosening between the camera body 122 and the bracket 124, and, since the amount of the adhesive 140 can be increased, it is easier to control the amount of the adhesive 140, and, increasing the accommodation space for the adhesive 140, reducing the possibility of the adhesive 140 overflowing, making the outer dimension accuracy of the camera assembly 120 higher and the assembly tolerance smaller, and meeting the centering requirement for the assembly of the camera assembly 120.

[0048] As Figure 8As shown, on the side of the bracket 124 facing the circuit board 130, a second groove 1244 is provided. The second groove 1244 is used to avoid the circuit board 130, so that while maintaining the distance between the bracket 124 and the circuit board 130, the size of the circuit board 130 is increased, the layout area of the circuit board 130 is improved, and it is convenient for the layout of circuits and electronic devices on the circuit board 130.

[0049] That is, as Figure 3 and Figure 4 shown, by providing the second groove 1244 on the outer side of the bracket 124, the second groove 1244 avoids the circuit board 130, the layout area of the circuit board 130 can be increased. The distance between the bracket 124 and the circuit board 130 is the first distance A, and the distance between the lower end of the bracket 124 and the groove wall of the mounting groove 112 is the second distance B. When the first distance A and the second distance B meet the requirements, it can ensure that the circuit board 130 has a relatively wide width. After the circuit board 130 is widened, with the second distance B unchanged, the overall width of the frame 110 can be reduced as the circuit board 130 is widened, which is more conducive to improving the space utilization rate inside the electronic device 100. The widening of the circuit board 130 allows more devices and traces to be arranged on the circuit board 130.

[0050] And, as Figure 8 shown, in the optical axis direction G of the camera body 122, the first groove 1242 and the second groove 1244 are arranged in a staggered manner, so as to avoid the side wall of the bracket 124 from being too thin and improve the strength of the bracket 124.

[0051] Among them, the bracket 124 can be a metal bracket or a plastic bracket, etc.

[0052] As Figure 3 and Figure 4 shown, as a possible implementation manner, the circuit board 130 protrudes from the edge of the mounting groove 112 towards the bracket 124, and the circuit board 130 is opposite to the second groove 1244.

[0053] Optionally, the circuit board 130 protrudes from the edge of the mounting groove 112 towards the bracket 124, and the circuit board 130 is opposite to the second groove 1244. Furthermore, by using the space vacated by the second groove 1244, the size of the circuit board 130 is further increased, and the layout area of the circuit board 130 is improved.

[0054] As Figure 4 shown, as a possible implementation manner, in the optical axis direction G of the camera body 122, the size W1 of the second groove 1244 is greater than the thickness W2 of the circuit board 130.

[0055] Optionally, in the optical axis direction G of the camera body 122, the size W1 of the second groove 1244 is greater than the thickness W2 of the circuit board 130, that is, the size W1 of the second groove 1244 is increased, so as to ensure that the distance between the circuit board 130 and the bracket 124 meets the requirements.

[0056] As Figure 4 shown, as a possible implementation manner, the circuit board 130 is embedded in the second groove 1244, and the side wall of the second groove 1244 away from the frame body 110 is spaced apart from the circuit board 130.

[0057] Optionally, the circuit board 130 is embedded in the second groove 1244, so as to further increase the size of the circuit board 130 and the circuit board layout area. Moreover, the side wall of the second groove 1244 away from the frame body 110 is spaced apart from the circuit board 130, so as to reduce the possibility of contact between the camera body 122 and the circuit board 130 during installation, and reduce the possibility of damage to the camera assembly 120 and the circuit board 130, thus facilitating the installation of the electronic device 100. That is, during installation, the circuit board 130 can be installed first, and then the camera body 122 can be installed obliquely. The large-sized second groove 1244 is used to avoid the circuit board 130 and prevent interference between the camera body 122 and the circuit board 130.

[0058] That is, the depth of the second groove 1244 is deepened, and at the same time, in the optical axis direction G of the camera body 122, the height of the second groove 1244 is increased to facilitate the assembly of the camera assembly 120. That is, in the direction of the circuit board 130 and the bracket 124, it protrudes from the groove wall of the installation groove 112. The assembly method can be changed to first assemble the circuit board 130 onto the frame body 110, and then obliquely assemble the camera assembly 120. The increased height of the second groove 1244 can ensure that the bracket 124 will not touch the circuit board 130 during oblique assembly.

[0059] Optionally, a part of the circuit board 130 is located in the second groove 1244.

[0060] As Figure 3 and Figure 4 shown, as a possible implementation manner, the orthographic projection of the side of the circuit board 130 facing the bracket 124 on the bracket 124 is located at the bottom 1246 of the second groove 1244, and the value range of the first distance between the circuit board 130 and the bottom 1246 of the second groove 1244 is 0.3 mm to 1 mm.

[0061] Optionally, the orthographic projection of the side of the circuit board 130 facing the bracket 124 on the bracket 124 is located at the bottom 1246 of the second groove 1244, that is, the side of the circuit board 130 facing the bracket 124 is directly opposite to the bottom 1246 of the second groove 1244. The value range of the first distance A between the circuit board 130 and the bottom 1246 of the second groove 1244 is from 0.3 mm to 1 mm, so as to ensure that the distance between the circuit board 130 and the bracket 124 meets the requirements.

[0062] The circuit board 130 is assembled on the housing 110 and needs to avoid interference with the bracket 124. The first distance A between the bracket 124 and the circuit board 130 needs to meet the requirements of 0.3 mm to 1 mm. Optionally, the value of the first distance A can be 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm or 1 mm.

[0063] Such as Figure 2 , Figure 6 and Figure 7 As shown in

[0064] Optionally, the first groove 1242 is provided at the edge of at least one end of the bracket 124, so as to reduce the operation difficulty of dispensing glue in the first groove 1242.

[0065] Moreover, the number of the first grooves 1242 is at least two, and at least two first grooves 1242 are distributed on the circumferential side of the bracket 124, so as to improve the connection and fixing position between the bracket 124 and the camera body 122 and enhance the connection strength between the camera body 122 and the bracket 124.

[0066] That is, by using the method of dispensing glue in the first groove 1242, the fixing reliability between the camera body 122 and the bracket 124 can be improved, and the centering degree of the assembly of the camera body 122 can be ensured.

[0067] Moreover, the dispensing position is not limited to the first groove 1242, and glue can also be dispensed at other positions between the bracket 124 and the camera body 122.

[0068] Such as Figure 5 , Figure 6 and Figure 7As shown, as a possible implementation, the camera assembly 120 further includes: a heat dissipation member 126, which is disposed on the camera body 122 and the bracket 124. A part of the heat dissipation member 126 is located between the bracket 124 and the circuit board 130, and at least a part of the heat dissipation member 126 is located in the second groove 1244.

[0069] Optionally, the camera assembly 120 further includes a heat dissipation member 126, which is disposed on the camera body 122 and the bracket 124, so as to facilitate heat dissipation of the camera assembly 120. Moreover, at least a part of the heat dissipation member 126 is located between the bracket 124 and the circuit board 130, and this part of the heat dissipation member 126 is located in the second groove 1244, thereby increasing the contact area between the heat dissipation member 126 and the bracket 124 and enhancing the heat dissipation effect of the camera assembly 120.

[0070] A part of the heat dissipation member 126 is attached to the camera body 122, and another part of the heat dissipation member 126 is attached to the bracket 124, thereby enhancing the heat dissipation effect of the bracket 124 and the camera body 122. Among them, the part of the heat dissipation member 126 attached to the bracket 124 corresponds to the chip of the camera body 122, facilitating heat dissipation of the chip.

[0071] Among them, the heat dissipation member 126 can be a graphite heat dissipation film, an aluminum heat dissipation film, a copper heat dissipation film or other heat dissipation films; the camera body 122 can be a periscope camera.

[0072] As Figure 1 、 Figure 2 、 Figure 3 and Figure 4 shown, as a possible implementation, the heat dissipation member 126 protrudes from the bracket 124, and a support portion 114 is provided in the mounting groove 112, and the support portion 114 is used to support the camera assembly 120.

[0073] Optionally, the heat dissipation member 126 protrudes from the bracket 124, and a support portion 114 is provided in the mounting groove 112. The support portion 114 supports the camera assembly 120, that is, the support portion 114 supports the bracket 124, which is beneficial to reducing the increased thickness of the electronic device 100 and facilitating heat dissipation of the camera assembly 120.

[0074] As described above, the bracket 124 is in a retracted state, and then the support portion 114 is provided to support the bracket 124, which can ensure the stability of the camera assembly 120.

[0075] As Figure 1 、 Figure 5 and Figure 6As shown, as a possible implementation, the camera body 122 has a flexible circuit board 1222. The flexible circuit board 1222 is connected to the circuit board 130. A spacer 128 is provided on the heat sink 126, and the spacer 128 is located between the flexible circuit board 1222 and the heat sink 126.

[0076] Optionally, the camera body 122 has a flexible circuit board 1222. The camera assembly 120 further includes a spacer 128 provided on the heat sink 126. The spacer 128 is provided on the heat sink 126 at a portion where the heat sink 126 is in contact with the bracket 124. The spacer 128 is located between the heat sink 126 and the flexible circuit board 1222, so that the heat sink 126 and the flexible circuit board 1222 are separated, reducing the possibility of interference between the flexible circuit board 1222 and the camera body 122.

[0077] Wherein, a connector is provided on the flexible circuit board 1222, and the connector is snapped onto the circuit board 130. The larger the area of the heat sink 126, the better the heat dissipation effect. However, when the heat sink 126 extends to the position of the flexible circuit board 1222 of the camera body 122, since the flexible circuit board 1222 is movable, the flexible circuit board 1222 may come into contact with the heat sink 126. If the flexible circuit board 1222 contacts the heat sink 126, it will cause interference to the camera body 122. Therefore, the spacer 128 is provided to isolate the heat sink 126 and the flexible circuit board 1222, which can reduce the possibility of interference to the camera body 122.

[0078] As Figure 9 shown, as a possible implementation, the camera assembly 120 further includes: a spacer 128. The heat sink 126 covers the spacer 128. The camera body 122 has a flexible circuit board 1222. The flexible circuit board 1222 is connected to the circuit board 130. The spacer 128 is located between the flexible circuit board 1222 and the bracket 124.

[0079] Optionally, the camera assembly 120 further includes a spacer 128. The heat sink 126 covers the spacer 128. The camera body 122 has a flexible circuit board 1222. The flexible circuit board 1222 is connected to the circuit board 130. The spacer 128 is located between the flexible circuit board 1222 and the bracket 124, so that the heat sink 126 and the flexible circuit board 1222 are separated, reducing the possibility of interference between the flexible circuit board 1222 and the camera body 122.

[0080] Among them, a connector is provided on the flexible circuit board 1222, and the connector is buckled on the circuit board 130. The larger the area of the heat dissipation member 126, the better the heat dissipation effect. However, when the heat dissipation member 126 extends to the position of the flexible circuit board 1222 of the camera body 122, since the flexible circuit board 1222 is movable, the flexible circuit board 1222 may come into contact with the heat dissipation member 126. If the flexible circuit board 1222 contacts the heat dissipation member 126, it will cause interference to the camera body 122. Therefore, a spacer 128 is provided to isolate the heat dissipation member 126 and the flexible circuit board 1222, which can reduce the possibility of interference to the camera body 122.

[0081] As Figure 2 , Figure 3 and Figure 4 shown, as a possible implementation, the value range of the second distance B between the bracket 124 and the groove wall of the mounting groove 112 is 0.02 mm to 0.1 mm.

[0082] Optionally, the camera assembly 120 is assembled on the housing 110. To ensure the reliability of the limit, the second distance B between the bracket 124 and the groove wall of the mounting groove 112 needs to meet the requirement of 0.02 mm to 0.1 mm. Optionally, the value of the second distance B can be 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm or 0.1 mm.

[0083] Among them, the value range of the first distance A between the side of the circuit board 130 facing the bracket 124 and the bracket 124 is 0.3 mm to 1 mm.

[0084] The electronic device 100 can be a mobile phone, a tablet computer, a laptop computer, a television or other electronic devices 100 capable of shooting.

[0085] In the description of this specification, the description referring to terms such as "one embodiment" or "specific embodiment" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0086] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and purposes of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, Comprising: A housing, on which an installation groove is provided; A camera assembly, which is arranged in the installation groove; A circuit board, which is arranged on the housing and is adjacent to the camera assembly; Wherein, the camera assembly includes a camera body and a bracket, the bracket is arranged around the camera body, a first groove is arranged on one side of the bracket facing the camera body, a second groove is arranged on one side of the bracket facing the circuit board, the first groove is used for dispensing glue, the second groove is used for avoiding the circuit board, and in the direction of the optical axis of the camera body, the first groove and the second groove are arranged in a staggered manner.

2. The electronic device according to claim 1, wherein The circuit board protrudes from the edge of the installation groove towards the bracket, the circuit board is opposite to the second groove, the circuit board is embedded in the second groove, and the side wall of the second groove far away from the housing is spaced from the circuit board.

3. The electronic device according to claim 2, wherein In the direction of the optical axis of the camera body, the size of the second groove is larger than the thickness of the circuit board.

4. The electronic device according to claim 1, wherein The camera assembly is a periscope camera assembly.

5. The electronic device according to any one of claims 1 to 4, wherein The orthographic projection of the circuit board on the bracket on the side facing the bracket is located at the bottom of the second groove, and the value range of the first distance between the circuit board and the bottom of the second groove is from 0.3 mm to 1 mm.

6. The electronic device according to any one of claims 1 to 4, wherein The first groove is arranged at the edge of at least one end of the bracket; The number of the first grooves is at least two, and at least two of the first grooves are distributed on the circumferential side of the bracket.

7. The electronic device according to any one of claims 1 to 4, characterized in that The camera assembly further includes: A heat dissipation member, which is arranged on the camera body and the bracket, a part of the heat dissipation member is located between the bracket and the circuit board, and the heat dissipation member is at least partially located in the second groove.

8. The electronic device according to claim 7, wherein The heat dissipation member protrudes from the bracket, and a support portion is provided in the installation groove, and the support portion is used for supporting the camera assembly.

9. The electronic device according to claim 7, characterized in that, The camera body has a flexible circuit board, the flexible circuit board is connected to the circuit board, and a spacer is arranged on the heat dissipation member, and the spacer is located between the flexible circuit board and the heat dissipation member.

10. The electronic device according to claim 7, wherein, The camera assembly further includes: A spacer, the heat dissipation member wraps the spacer therein, the camera body has a flexible circuit board, the flexible circuit board is connected to the circuit board, and the spacer is located between the flexible circuit board and the bracket.

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