Multi-microphone noise reduction circuit of headphone

Abstract

The utility model belongs to the technical field of Bluetooth earphones, and particularly relates to a multi-microphone noise reduction circuit of a headphone, which comprises two control modules and a power supply module. The two control modules are in communication connection, each control module comprises a Bluetooth chip assembly, a power supply assembly, a loudspeaker assembly and a microphone assembly, the power supply assembly is connected with the Bluetooth chip assembly, the loudspeaker assembly is connected with the Bluetooth chip assembly, and the microphone assembly is connected with the Bluetooth chip assembly; the power supply module is connected with the power supply assemblies of the two control modules. According to the utility model, the Bluetooth chip assemblies are arranged on the left and right sides of the earphone, and signals are directly output to the loudspeaker assemblies connected with the Bluetooth chip assemblies, so that the problem that the signals are transmitted between the loudspeaker assemblies on the two sides through long wires and are interfered by the signals, and thus the sound received by the left and right ears is different is solved. Meanwhile, compared with a single Bluetooth chip in the prior art, a DSP module needs to be additionally arranged to expand a microphone channel, and the production cost is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of Bluetooth headsets, and particularly relates to a multi-microphone noise reduction circuit for a head-mounted headset. Background Art

[0002] A Bluetooth headset is a small device based on Bluetooth technology. By simply hiding this lightweight device near the earphone, free calls and audio listening can be achieved without directly using a communication device. A Bluetooth headset applies Bluetooth technology to a hands-free headset, allowing users to be free from the entanglement of wires and easily make calls and listen to audio in various ways.

[0003] Currently, many head-mounted Bluetooth headsets have emerged on the market. Due to their comfortable wearing experience and good sound effects, head-mounted Bluetooth headsets are increasingly popular among people. However, most existing head-mounted Bluetooth headsets only have one Bluetooth chip, resulting in the need to connect many long wires between the left and right earphone control boards. The signal circuit is easily interfered by external noise, which in turn causes differences in the sounds received by the left and right ears, affecting the user experience. Therefore, it is necessary to improve the existing technology to solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a multi-microphone noise reduction circuit for a head-mounted headset, aiming to solve the technical problem in the existing technology that only a single Bluetooth headset is set for a head-mounted headset, resulting in the need to connect many long wires between the left and right earphone control boards, and the signal circuit is easily interfered by external noise, which in turn causes differences in the sounds received by the left and right ears.

[0005] To achieve the above purpose, an embodiment of the utility model provides a multi-microphone noise reduction circuit for a head-mounted headset, which includes two control modules and a power supply module; the two control modules are communicatively connected, and each control module includes a Bluetooth chip assembly, a power supply assembly, a speaker assembly, and a microphone assembly. The power supply assembly is connected to the Bluetooth chip assembly, the speaker assembly is connected to the Bluetooth chip assembly, and the microphone assembly is connected to the Bluetooth chip assembly; the power supply module is connected to the power supply assemblies of the two control modules.

[0006] As a preferred solution, the Bluetooth chip assembly includes a connection unit, a frequency division debugging unit, and a digital-to-analog conversion unit; the connection unit is communicatively connected to the connection unit of the other control module, the frequency division debugging unit is connected to the connection unit, and the digital-to-analog conversion unit is connected to the frequency division debugging unit and the speaker assembly.

[0007] As a preferred solution, the Bluetooth chip assembly further includes a DSP noise reduction unit, and the DSP noise reduction unit is connected to the microphone assembly and the digital-to-analog conversion unit.

[0008] As a preferred solution, the Bluetooth chip component further includes an ENC unit, and the ENC unit is connected to the microphone component.

[0009] As a preferred solution, the power supply component includes an interface unit, a protection unit, and a management unit. The interface unit is used to connect to an external charging device. The protection unit is connected to the interface unit and the Bluetooth chip component. The management unit is connected to the protection unit, the Bluetooth chip component, and the power module.

[0010] As a preferred solution, the control module further includes a button component, and the button component is connected to the Bluetooth chip component.

[0011] As a preferred solution, the control module further includes an indicator light component, and the indicator light component is connected to the Bluetooth chip component.

[0012] As a preferred solution, the model of the Bluetooth chip component is JL7006F6.

[0013] One or more of the above technical solutions in the multi-microphone noise reduction circuit of the headphone provided by the embodiment of the present invention at least have one of the following technical effects:

[0014] In the present invention, Bluetooth chip components are arranged on both the left and right sides of the headphone, and the signals are directly output to the respective connected speaker components, thereby avoiding signal interference caused by signal transmission between the two speaker components through long wires, and further avoiding the problem of different sounds received by the left and right ears. At the same time, arranging Bluetooth chip components on both the left and right sides of the headphone can increase the interfaces of the microphone components. Compared with the single Bluetooth chip in the prior art that requires an additional DSP module to expand the microphone channels, the dual Bluetooth chip components have multiple microphone channels without an external DSP module, effectively reducing the production cost. Description of the Drawings

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0016] Figure 1 It is the overall structural block diagram of the multi-microphone noise reduction circuit of the headphone provided by the embodiment of the present invention;

[0017] Figure 2 It is the circuit schematic diagram of the Bluetooth chip component provided by the embodiment of the present invention;

[0018] Figure 3 It is the internal structure block diagram of the Bluetooth chip component provided by the embodiment of the present utility model;

[0019] Among them, each reference numeral in the figure:

[0020] 100 - Control module; 110 - Bluetooth chip component; 111 - Connection unit; 112 - Frequency division debugging unit; 113 - Digital - to - analog conversion unit; 114 - DSP noise reduction unit; 115 - ENC unit; 120 - Power supply component; 130 - Speaker component; 140 - Microphone component; 150 - Button component; 160 - Indicator light component; 200 - Power module. Detailed implementation manners

[0021] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions from beginning to end. The embodiments described below with reference to the drawings are exemplary and are intended to explain the embodiments of the present utility model, and should not be construed as a limitation to the present utility model.

[0022] In the description of the embodiments of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the embodiments of the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0023] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present utility model, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0024] In the embodiments of the present utility model, unless otherwise clearly specified and limited, the terms "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present utility model can be understood according to specific situations.

[0025] In an embodiment of the present utility model, as Figures 1 - 3 shown, a multi-microphone noise reduction circuit for a head-mounted earphone is provided, which includes two control modules 100 and a power supply module 200. The two control modules 100 are communicatively connected, and the power supply module 200 is connected to the two control modules 100.

[0026] Each of the control modules 100 includes a Bluetooth chip assembly 110, a power supply assembly 120, a speaker assembly 130, and a microphone assembly 140. The power supply assembly 120 is connected to the Bluetooth chip assembly 110, the speaker assembly 130 is connected to the Bluetooth chip assembly 110, and the microphone assembly 140 is connected to the Bluetooth chip assembly 110; the power supply module 100 is connected to the power supply assemblies 120 of the two control modules 100.

[0027] In this embodiment, as Figure 3 shown, the Bluetooth chip assembly 110 includes a connection unit 111, a frequency division debugging unit 112, and a digital-to-analog conversion unit 113. The connection unit 111 is communicatively connected to the connection unit of another control module 100. The frequency division debugging unit 112 is connected to the connection unit 111. The output of a conventional Bluetooth chip is divided into left / right channels. 2. The output of a normal Bluetooth chip is the sound of the left / right channels, and different EQ parameters can be adjusted for the left / right channels respectively inside. The left / right channels of the chip can be customized by software. In this embodiment, the original left / right channels are all defined as single left treble / left bass or right treble / right bass, and then digital frequency division is realized through the EQ debugging performed by the frequency division debugging unit 112. The digital-to-analog conversion unit 113 is connected to the frequency division debugging unit 112 and the speaker assembly 130. The digital-to-analog conversion unit 113 is used for the conversion between digital signals and analog signals, and the mixing process of the signals collected by the microphone unit 140. In this embodiment, the model of the Bluetooth chip assembly 110 is preferably JL7006F6, or other chips of the same type.

[0028] In an embodiment of the present utility model, the Bluetooth chip assembly 110 further includes a DSP noise reduction unit 114. The DSP noise reduction unit 114 is connected to the microphone assembly 140 and the digital-to-analog conversion unit 113. The DSP noise reduction unit is used for performing DSP noise reduction and transparency algorithm processing on the sound signals collected by the microphone assembly 140, and sending the processed signals to the digital-to-analog conversion unit 113 to be mixed with the signals after frequency division debugging and then output to the speaker assembly 130.

[0029] In an embodiment of the present utility model, the Bluetooth chip assembly 110 further includes an ENC unit 115, the ENC unit 115 is connected to the microphone assembly 140, and the ENC unit 115 is used to perform ENC noise reduction on the sound signals collected by the microphone assembly 140.

[0030] The power supply assembly 120 includes an interface unit 121, a protection unit 122, and a management unit 123. The interface unit 121 is used to connect to an external 5V USB charging device to charge the power module 200. The protection unit 122 is connected to the interface unit 121 and the Bluetooth chip assembly 110. In this embodiment, the protection unit 122 is an LP5308 chip, or other chips of the same type are also acceptable. The management unit 123 is connected to the protection unit 122, the Bluetooth chip assembly 110, and the power module 200. In this embodiment, the management unit 123 is a CL4054 chip, or other chips of the same type are also acceptable.

[0031] In an embodiment of the present utility model, the control module 100 further includes a button assembly 150, the button assembly 150 is connected to the Bluetooth chip assembly 110, and the button assembly 150 is used to enable a user to control the working state of the Bluetooth chip assembly 110.

[0032] In an embodiment of the present utility model, the control module 100 further includes an indicator light assembly 160, the indicator light assembly 160 is connected to the Bluetooth chip assembly 110, and the indicator light assembly 160 is used to display the working state of the Bluetooth chip assembly 110 and the usage status of the power module 200.

[0033] By arranging the Bluetooth chip assemblies 110 on both the left and right sides of the earphone, the present utility model directly outputs signals to the respective connected speaker assemblies 130, thereby avoiding signal interference caused by signal transmission between the two speaker assemblies 130 through long wires, and further avoiding the problem of different sounds received by the left and right ears. At the same time, arranging the Bluetooth chip assemblies 110 on both the left and right sides of the earphone can increase the interfaces of the microphone assembly 140. Compared with the prior art where a single Bluetooth chip requires an additional DSP module to expand the microphone channels, the two Bluetooth chip assemblies 110 have multiple microphone channels and can achieve multi-signal input noise reduction without an external DSP module, effectively reducing the production cost.

[0034] It should be noted that the chips provided in this application are only examples, and those skilled in the art can also select other chips as needed. It should be noted that this application aims to protect the circuit structure. For the program control part, those skilled in the art should reasonably select appropriate circuits and chips according to the chip models in this application or as needed and perform appropriate programming to realize the corresponding program control functions in this utility model. Therefore, this part is a mature and established technology in the prior art and is not the focus of protection of this application. Therefore, this application does not specifically elaborate on this control part.

[0035] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A multi-microphone noise reduction circuit for a head-mounted earphone, characterized in that, It includes two control modules and a power supply module; the two control modules are communicatively connected. Each control module includes a Bluetooth chip component, a power supply component, a speaker component, and a microphone component. The power supply component is connected to the Bluetooth chip component, the speaker component is connected to the Bluetooth chip component, and the microphone component is connected to the Bluetooth chip component; the power supply module is connected to the power supply components of the two control modules.

2. The multi-microphone noise reduction circuit for the headset according to claim 1, wherein The Bluetooth chip component includes a connection unit, a frequency division debugging unit, and a digital-to-analog conversion unit; the connection unit is communicatively connected to the connection unit of the other control module, the frequency division debugging unit is connected to the connection unit, and the digital-to-analog conversion unit is connected to the frequency division debugging unit and the speaker component.

3. The multi-microphone noise reduction circuit for the head-mounted earphone according to claim 2, wherein The Bluetooth chip component further includes a DSP noise reduction unit, and the DSP noise reduction unit is connected to the microphone component and the digital-to-analog conversion unit.

4. The multi-microphone noise reduction circuit for the head-mounted earphone according to claim 3, wherein The Bluetooth chip component further includes an ENC unit, and the ENC unit is connected to the microphone component.

5. The multi-microphone noise reduction circuit for the head-mounted earphone according to any one of claims 1-4, characterized in that, The power supply component includes an interface unit, a protection unit, and a management unit. The interface unit is used to connect an external charging device. The protection unit is connected to the interface unit and the Bluetooth chip component, and the management unit is connected to the protection unit, the Bluetooth chip component, and the power supply module.

6. The multi-microphone noise reduction circuit for a head-mounted earphone according to any one of claims 1-4, characterized in that, The control module further includes a button component, and the button component is connected to the Bluetooth chip component.

7. The multi-microphone noise reduction circuit for a headset according to any one of claims 1-4, characterized in that The control module further includes an indicator light component, and the indicator light component is connected to the Bluetooth chip component.

8. The multi-microphone noise reduction circuit for a headset according to any one of claims 1-4, characterized in that The model of the Bluetooth chip component is JL7006F6.

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