Heat dissipation device for printed circuit board

Abstract

The utility model discloses a heat dissipation device for a printed circuit board, which comprises a shell module and an internal circuit board module, the internal circuit board module is arranged in the shell module, the shell module comprises a heat dissipation cover plate and a heat dissipation frame body, the heat dissipation cover plate is fixedly connected with the heat dissipation frame body, and the heat dissipation cover plate is fixedly connected with the heat dissipation frame body. The side, close to the heat dissipation frame body, of the heat dissipation cover plate is provided with a plurality of first power part heat dissipation attaching strips, a plurality of first power part heat dissipation attaching blocks and a plurality of first part installation grooves. According to the heat dissipation device for the printed circuit board disclosed by the utility model, the shell module and the internal circuit board module are linked, heat generated by a power piece is quickly transmitted and conducted in an attached conduction mode, and a large number of heat dissipation teeth are arranged on the surface of the heat dissipation frame body, so that the heat dissipation area is increased, and meanwhile, an air duct is formed to accelerate heat dissipation; the LED lamp has the advantages of good heat dissipation effect, high structural strength, high practicability and the like.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation of printed circuit boards, and in particular relates to a heat dissipation device for printed circuit boards. Background Art

[0002] With the development of the electronic countermeasure industry, the processing function of the single machine is also enhanced, and the power consumption is increased. The number of high-power devices on the module PCB board in the single machine is also increasing, and the size is getting larger and larger. In order to ensure the normal operation of the single machine, the module is required to reduce the size, and the high-power devices on the printed circuit board are required to have strong heat dissipation capabilities. In addition, the space environment of the single machine is usually limited, and the miniaturization of the module is also a trend.

[0003] Therefore, further improvements are made to the above problems. Utility Model Content

[0004] The main purpose of the utility model is to provide a heat dissipation device for a printed circuit board, which is linked by a shell module and an internal circuit board module, and the heat generated by the power component is quickly transmitted and conducted by means of bonding conduction. A large number of heat dissipation teeth are provided on the surface of the heat dissipation frame to increase the heat dissipation area, and at the same time, an air duct is formed to accelerate the heat dissipation. The utility model has the advantages of good heat dissipation effect, high structural strength and high practicality.

[0005] In order to achieve the above object, the utility model provides a heat dissipation device for a printed circuit board, comprising a housing module and an internal circuit board module, wherein the internal circuit board module is built into the housing module, wherein:

[0006] The housing module comprises a heat dissipation cover plate and a heat dissipation frame, wherein the heat dissipation cover plate and the heat dissipation frame are fixedly connected, and a side of the heat dissipation cover plate close to the heat dissipation frame is provided with a plurality of first power component heat dissipation bonding strips, a plurality of first power component heat dissipation bonding blocks and a plurality of first component installation grooves; a side of the heat dissipation frame close to the heat dissipation cover plate is provided with a plurality of second power component heat dissipation bonding strips, a plurality of second power component heat dissipation bonding blocks, a plurality of power component heat dissipation bonding grooves and a plurality of second component installation grooves, and a side of the heat dissipation frame away from the heat dissipation cover plate is provided with a plurality of heat dissipation tooth structures;

[0007] On one side of the internal circuit board module close to the heat dissipation cover plate, there are several first power components, several first power single pieces, and several first components. The first power components are closely attached to the first power component heat dissipation bonding strip, the first power single pieces are closely attached to the first power component heat dissipation bonding block, and the first components are installed in the first component installation groove. On one side of the internal circuit board module close to the heat dissipation frame, there are a second power component, several second power single pieces, several third power single pieces, and several second components. The second power component is closely attached to the second power component heat dissipation bonding strip, the second power single pieces are closely attached to the second power component heat dissipation bonding block, the third power single pieces are installed in the power component heat dissipation bonding groove, and the second components are installed in the second component installation groove.

[0008] As a further preferred technical solution of the above technical solution, the heat dissipation cover plate is provided with several first mounting holes and several second mounting holes. The first bolt is fixedly installed on the heat dissipation frame through the first mounting hole, and the second bolt is fixedly installed on the heat dissipation frame through the second mounting hole and the internal circuit board module in sequence (so that a firm connection is achieved between the heat dissipation cover plate and the heat dissipation frame, as well as between the heat dissipation cover plate, the internal circuit board module, and the heat dissipation frame, improving the structural stability).

[0009] As a further preferred technical solution of the above technical solution, it further includes a plug-in module, and the plug-in module is connected to the internal circuit board module.

[0010] As a further preferred technical solution of the above technical solution, it further includes a first installation locking part and a second installation locking part, and the first installation locking part and the second installation locking part are respectively fixedly installed on the heat dissipation frame (for connection).

[0011] As a further preferred technical solution of the above technical solution, the plug-in module is provided with several connection ends. Description of the Drawings

[0012] Figure 1 It is a schematic structural diagram of a heat dissipation device for a printed circuit board of the present invention.

[0013] Figure 2 It is a schematic structural diagram of a heat dissipation device for a printed circuit board of the present invention.

[0014] Figure 3 It is a schematic structural diagram of a heat dissipation device for a printed circuit board of the present invention (with the heat dissipation cover plate hidden).

[0015] Figure 4 It is a schematic structural diagram of the heat dissipation cover plate of a heat dissipation device for a printed circuit board of the present invention.

[0016] Figure 5 This is a schematic structural diagram of a heat dissipation device for a printed circuit board according to the present utility model (the heat dissipation frame is hidden).

[0017] Figure 6 This is a schematic structural diagram of the heat dissipation frame of a heat dissipation device for a printed circuit board according to the present utility model.

[0018] Reference numerals include: 100, housing module; 110, heat dissipation cover plate; 111, first power component heat dissipation bonding strip; 112, first power component heat dissipation bonding block; 113, first component installation groove; 114, first installation hole; 115, second installation hole; 120, heat dissipation frame; 121, second power component heat dissipation bonding strip; 122, second power component heat dissipation bonding block; 123, power component heat dissipation bonding groove; 124, second component installation groove; 125, heat dissipation tooth structure; 200, internal circuit board module; 210, first power component; 220, first power single piece; 230, first component; 240, second power component; 250, several second power single pieces; 260, third power single piece; 270, second component; 300, plug-in module; 310, connection end; 400, first installation locking piece; 500, second installation locking piece. Detailed implementation manners

[0019] The following description is used to disclose the present utility model so that those skilled in the art can implement the present utility model. The preferred embodiments described below are only examples, and those skilled in the art can think of other obvious variations. The basic principles defined in the following description of the present utility model can be applied to other implementation manners, variation schemes, improvement schemes, equivalent schemes, and other technical schemes that do not depart from the spirit and scope of the present utility model.

[0020] The present utility model discloses a heat dissipation device for a printed circuit board. The specific embodiments of the utility model will be further described below in conjunction with the preferred embodiments.

[0021] In the embodiments of the present utility model, those skilled in the art should note that the connection ends and the like involved in the present utility model can be regarded as the prior art.

[0022] Preferred embodiment.

[0023] As Figure 1-6 shown, the present utility model discloses a heat dissipation device for a printed circuit board, including a housing module 100 and an internal circuit board module 200, wherein the internal circuit board module 200 is disposed inside the housing module 100, and:

[0024] The housing module 100 includes a heat dissipation cover plate 110 and a heat dissipation frame 120. The heat dissipation cover plate 110 and the heat dissipation frame 120 are fixedly connected. On one side of the heat dissipation cover plate 110 close to the heat dissipation frame 120, there are provided a plurality of first power component heat dissipation bonding strips 111, a plurality of first power component heat dissipation bonding blocks 112, and a plurality of first component mounting grooves 113. On one side of the heat dissipation frame 120 close to the heat dissipation cover plate 121, there are provided a plurality of second power component heat dissipation bonding strips 121, a plurality of second power component heat dissipation bonding blocks 122, a plurality of power component heat dissipation bonding grooves 123, and a plurality of second component mounting grooves 124. And on one side of the heat dissipation frame 120 away from the heat dissipation cover plate 110, there are provided a plurality of heat dissipation tooth structures 125.

[0025] On one side of the internal circuit board module 200 close to the heat dissipation cover plate 110, there are provided a plurality of first power components 210, a plurality of first power single pieces 220, and a plurality of first components 230. The first power components 210 are in close contact with the first power component heat dissipation bonding strips 111, the first power single pieces 220 are in close contact with the first power component heat dissipation bonding blocks 112, and the first components 230 are mounted in the first component mounting grooves 113. On one side of the internal circuit board module 200 close to the heat dissipation frame 120, there are provided a second power component 240, a plurality of second power single pieces 250, a plurality of third power single pieces 260, and a plurality of second components 270. The second power component 240 is in close contact with the second power component heat dissipation bonding strips 121, the second power single pieces 250 are in close contact with the second power component heat dissipation bonding blocks 122, the third power single pieces 260 are mounted in the power component heat dissipation bonding grooves 123, and the second components 270 are mounted in the second component mounting grooves 1242.

[0026] Specifically, the heat dissipation cover plate 110 is provided with a plurality of first mounting holes 114 and a plurality of second mounting holes 115. The first bolts are fixedly installed on the heat dissipation frame 120 through the first mounting holes 114, and the second bolts are fixedly installed on the heat dissipation frame 120 through the second mounting holes 115 and the internal circuit board module 200 in sequence (so as to stably connect between the heat dissipation cover plate and the heat dissipation frame, and between the heat dissipation cover plate, the internal circuit board module and the heat dissipation frame, improving the structural stability).

[0027] More specifically, it further includes a plug-in module 300, and the plug-in module 300 is connected to the internal circuit board module 200.

[0028] Furthermore, it further includes a first mounting locking member 400 and a second mounting locking member 500, and the first mounting locking member 400 and the second mounting locking member 500 are respectively fixedly installed on the heat dissipation frame 120 (for connection).

[0029] Furthermore, the plug-in module 300 is provided with a plurality of connection terminals 310.

[0030] Regarding the present utility model:

[0031] Power components (high-power devices) are arranged as evenly as possible on the circuit board, which is beneficial to the heat conduction of the devices. High-power devices refer to devices with a power of 3W or more. The high-power devices conduct heat through the way of fitting conduction, that is, one side of the internal circuit board module is fitted with the heat dissipation cover plate, and the other side is fitted with the heat dissipation frame. When the power components are working, the power components on both sides of the internal circuit board module conduct heat quickly through their respective fitting structures for heat transfer and heat dissipation. In order to make the high-power devices conduct heat better, a heat-conducting material (not shown in the figure) is added, and the position of the heat-conducting material is between the fitting surfaces of the high-power devices and the heat dissipation structure components. The circuit board and the heat dissipation structure (the heat dissipation cover plate and the heat dissipation frame, made of aluminum plate to improve the heat dissipation performance) are fixed by bolts to ensure complete fitting. The heat dissipation frame is the main heat dissipation structure component, with a large number of heat dissipation teeth on the surface, increasing the heat dissipation area and forming an air duct to accelerate heat dissipation, solving the heat dissipation problem of high-power devices, greatly improving the reliability of the thermal design, and reducing the external shape of the module single machine.

[0032] It is worth mentioning that the technical features such as the connection terminals involved in the patent application of the present utility model should be regarded as the prior art. The specific structures, working principles, and possible control methods and spatial arrangement methods involved in these technical features can be selected conventionally in the art, and should not be regarded as the inventive points of the patent of the present utility model. The patent of the present utility model will not be further specifically elaborated.

[0033] For those skilled in the art, it is still possible to modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims

1. A heat dissipation device for a printed circuit board, characterized in that, It includes a housing module and an internal circuit board module, and the internal circuit board module is built in the housing module, where: The housing module includes a heat dissipation cover plate and a heat dissipation frame body. The heat dissipation cover plate and the heat dissipation frame body are fixedly connected. On one side of the heat dissipation cover plate close to the heat dissipation frame body, there are provided a number of first power component heat dissipation bonding strips, a number of first power component heat dissipation bonding blocks and a number of first component mounting grooves; on one side of the heat dissipation frame body close to the heat dissipation cover plate, there are provided a number of second power component heat dissipation bonding strips, a number of second power component heat dissipation bonding blocks, a number of power component heat dissipation bonding grooves and a number of second component mounting grooves, and on the side of the heat dissipation frame body away from the heat dissipation cover plate, there are provided a number of heat dissipation tooth structures; On one side of the internal circuit board module close to the heat dissipation cover plate, there are provided a number of first power components, a number of first power single parts and a number of first components. The first power components are in close contact with the first power component heat dissipation bonding strips, the first power single parts are in close contact with the first power component heat dissipation bonding blocks, and the first components are mounted in the first component mounting grooves; on one side of the internal circuit board module close to the heat dissipation frame body, there are provided second power components, a number of second power single parts, a number of third power single parts and a number of second components. The second power components are in close contact with the second power component heat dissipation bonding strips, the second power single parts are in close contact with the second power component heat dissipation bonding blocks, the third power single parts are mounted in the power component heat dissipation bonding grooves, and the second components are mounted in the second component mounting grooves.

2. The heat dissipation device for a printed circuit board according to claim 1, characterized in that, The heat dissipation cover plate is provided with a number of first mounting holes and a number of second mounting holes. The first bolts are fixedly mounted on the heat dissipation frame body through the first mounting holes, and the second bolts are fixedly mounted on the heat dissipation frame body through the second mounting holes and the internal circuit board module in sequence.

3. The heat dissipation device for a printed circuit board according to claim 2, wherein, It further includes a plug-in module, and the plug-in module is connected to the internal circuit board module.

4. The heat dissipation device for a printed circuit board according to claim 3, characterized in that, It further includes a first mounting locking part and a second mounting locking part, and the first mounting locking part and the second mounting locking part are respectively fixedly mounted on the heat dissipation frame body.

5. A heat dissipation device for a printed circuit board according to claim 4, characterized in that, The plug-in module is provided with a number of connection ends.

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